Yip
Chee Sang Yip, Perak MY
Patent application number | Description | Published |
---|---|---|
20090026594 | Thin Plastic Leadless Package with Exposed Metal Die Paddle - A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps. The electronic package includes a leadframe having a plurality of leads, wherein each of the leads has a lead tip, an opening formed within the leadframe, a die paddle that is disposed within the opening and is isolated from each of the lead tips, a tape that is adhered to a back side of the leadframe, leads, and die paddle, and a die, wherein the die is attached to the die paddle and is connected by wires to a bump disposed on each of the lead tips. | 01-29-2009 |
20160049357 | THIN PLASTIC LEADLESS PACKAGE WITH EXPOSED METAL DIE PADDLE - A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps. The electronic package includes a leadframe having a plurality of leads, wherein each of the leads has a lead tip, an opening formed within the leadframe, a die paddle that is disposed within the opening and is isolated from each of the lead tips, a tape that is adhered to a back side of the leadframe, leads, and die paddle, and a die, wherein the die is attached to the die paddle and is connected by wires to a bump disposed on each of the lead tips. | 02-18-2016 |
Chiu Ming Yip, Markham CA
Patent application number | Description | Published |
---|---|---|
20100019052 | LINE VOLTAGE THERMOSTAT WITH ENERGY MEASUREMENT MECHANISM - A thermostat with an energy measurement or calculation mechanism suitable for use with a line powered electric device or apparatus. According to an embodiment, the thermostat includes a switch, a controller and a sensing circuit. The switch is coupled between a power supply line and output line for powering the electric device and operatively connected to the controller. The thermostat includes a temperature sensing component and the controller operates the switch to power the electric device to achieve the desired temperature. The controller operates the sensing circuit to take voltage and/or current measurements which are then used to calculate power consumption and energy consumption values for the operation of the device. | 01-28-2010 |
Eric Yip, Suwon-Si KR
Patent application number | Description | Published |
---|---|---|
20150269365 | METHOD AND APPARATUS FOR PLAYING MEDIA CONTENT BASED ON DIGITAL RIGHTS MANAGEMENT - A method for playing content included in a media file in a playback apparatus is provided. The method includes obtaining file status indication information indicating a status of the media file from the media file, determining whether a Content Authentication Code (CAC) for playback of the content is included in the media file, if the file status indication information indicates that the content included in the media file is self-encoded content, and playing the content, if the CAC is not included in the media file. The self-encoded content is content that can be played without the CAC. | 09-24-2015 |
Hee Yan Yip, Singapore SG
Patent application number | Description | Published |
---|---|---|
20110182698 | SYSTEMS AND METHODS FOR OFFSHORE NATURAL GAS PRODUCTION, TRANSPORTATION AND DISTRIBUTION - Methods and systems disclosed provide a cost efficient supply chain for natural gas, thereby enabling monetization of smaller natural gas sources and supply of natural gas to regions with low demand. The method comprises transferring a hydrocarbon fluid to a production location, liquefying the hydrocarbon fluid, storing the hydrocarbon fluid in a plurality of transferable containers, moving the plurality of transferable containers having the hydrocarbon fluid from the production location to a marine vessel, transporting the plurality of transferable containers having the hydrocarbon fluid on the marine vessel, and offloading the hydrocarbon fluid at an import location. At the import location, the transferable containers may be moved from the marine vessel to the import location and distributed at least one vehicle from the import terminal to one or more user locations for vaporizing the liquefied fluid at the user location(s). | 07-28-2011 |
20120285358 | SIDE-BY-SIDE MOORING BAY - A mooring system may comprise a station keeping apparatus having a turntable rotatably mounted thereon. The station keeping apparatus is operable to movably couple to a first vessel and to a second vessel in a side-by-side configuration. The turntable is operable to freely rotate both the first and the second vessel about the station keeping apparatus. The station keeping apparatus is securable to the second vessel using a head mooring line having a length which is adjustable for aligning a heading of both the first and the second vessel with a prevailing weather direction. Further, the mooring system may comprise a rigid yoke or a soft yoke movably coupling the turntable to the first vessel for angular adjustment between the station keeping apparatus and a longitudinal center line of the first vessel. | 11-15-2012 |
Heng Keong Yip, Setia Alam, Shah Alam MY
Patent application number | Description | Published |
---|---|---|
20120025401 | INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR - An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor. | 02-02-2012 |
Heng Keong Yip, Darul Ehsan MY
Patent application number | Description | Published |
---|---|---|
20090152717 | METHOD OF FORMING STACKED DIE PACKAGE - A method of packaging semiconductor integrated circuits, including the steps of providing a transfer film and forming a patterned, conductive layer on a surface of the transfer film. A first semiconductor integrated circuit (IC) then is attached to the transfer film, where an active side of the first IC is attached to the transfer film. A second semiconductor IC then is attached to the first IC, where a bottom side of the second IC is attached to a bottom side of the first IC. Die pads on an active surface of the second IC are electrically connected to the conductive layer with wires and then a resin material is provided on one side of the transfer film to encapsulate the first and second ICs, the wires and a portion of the conductive layer. Next the transfer film is removed, which exposes the active side of the first IC and the conductive layer. An electrical distribution layer is formed over the active side of the first IC and the conductive layer and conductive balls are attached to the electrical distribution layer. The conductive balls allow electrical interconnection to the first and second integrated circuits. | 06-18-2009 |
Heng Keong Yip, Setia Alam MY
Patent application number | Description | Published |
---|---|---|
20140308779 | INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR - An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor. | 10-16-2014 |
Heng Keong Yip, Selangor MY
Patent application number | Description | Published |
---|---|---|
20080305584 | HEAT SPREADER FOR CENTER GATE MOLDING - A heat spreader for an integrated circuit has a base portion and a top portion. The base portion is attachable to a surface of the integrated circuit, and has at least one channel extending therethrough. The top portion that is larger than the base portion such that the heat spreader is generally T-shaped in cross-section. The top portion has a hole at its center that extends from a top surface of the top portion to the at least one channel of the base portion. Mold compound is injected through the hole and out through the channels. | 12-11-2008 |
Heng Keong Yip, Subang Jaya MY
Patent application number | Description | Published |
---|---|---|
20080258297 | METHOD OF MAKING SOLDER PAD - A method of making a solder pad includes providing a substrate having a metal layer formed on it, and applying a photo resist to the metal layer. The photo resist is patterned. A first etching operation is performed on the metal layer to form voids in the metal layer. A second etching operation is performed on the metal layer to form the solder pad. A solder mask is formed on the substrate and a portion of the solder pad. | 10-23-2008 |
Ian D. Yip, Burnaby CA
Patent application number | Description | Published |
---|---|---|
20090197686 | SYSTEM AND METHOD FOR DRIVING ARTIFICIAL INTELLIGENCE (AI) CHARACTERS HAVING CONTINUOUS REEVALUATION OF CURRENT GOALS AND HAVING NAVIGATION PATH - A method for driving an artificial intelligence (AI) character involving computing a navigational graph for a virtual environment and moving the AI character along a current path for an AI character from a current location to a current destination is disclosed. While moving the AI character along the current path the potential alternative destinations are continuously evaluated and a new destination or the current destination based upon a heuristic analysis of the alternative destinations and the current destination. The system also continuously determines whether the AI character can leave the current path. | 08-06-2009 |
Jasmine Yip, Hong Kong Sar CN
Patent application number | Description | Published |
---|---|---|
20130252511 | MOISTURIZING FABRIC MATERIAL, USE THEREOF IN MOISTURIZING BRAS, AND METHOD OF MANUFACTURE - Disclosed are moisturizing fabric materials for use in articles of wear such as bras. The moisturizing fabric materials include a moisturizer comprising plant oil, plant extract, and an emulsifier. The moisturizer is bonded to polymeric fabric material via a bonding agent to provide the moisturizing fabric material. Also disclosed is a method of manufacturing an article of wear such as a bra using moisturizing fabric material. | 09-26-2013 |
Jim Yip, Malvern GB
Patent application number | Description | Published |
---|---|---|
20140231117 | PACKAGE FOR HIGH FREQUENCY CIRCUITS - The present invention relates to integrated circuit packaging and methods of manufacturing these. In particular, but not exclusively the present invention relates to improvements in the suppression of spurious wave modes within cavity packages in which are mounted circuits operating at high frequencies, for example Monolithic Microwave Integrated Circuits (MMIC's). | 08-21-2014 |
Judy Yip, Edmonton CA
Patent application number | Description | Published |
---|---|---|
20110288063 | NOVEL FUSED BRIDGED BICYCLIC HETEROARYL SUBSTITUTED 6-ALKYLIDENE PENEMS AS POTENT BETA-LACTAMASE INHIBITORS - A compound of formula (I) or formula (Ia) | 11-24-2011 |
20150045340 | AMIDINE SUBSTITUTED BETA-LACTAM COMPOUNDS, THEIR PREPARATION AND USE AS ANTIBACTERIAL AGENTS - The present invention relates to novel β-lactam compounds, their preparation and use. In particular, this invention relates to novel β-lactam compounds which are amidine substituted monobactam derivatives useful as antimicrobial agents and their preparation. | 02-12-2015 |
Kai Fat Yip, Singapore SG
Patent application number | Description | Published |
---|---|---|
20130020193 | APPARATUS FOR ELECTROPLATING A TOOLING FOR USE IN SEMICONDUCTOR DEVICE ENCAPSULATION - An apparatus is disclosed for electroplating an inside wall of a transfer mold, the transfer mold being suitable for use in semiconductor device encapsulation. Specifically, the apparatus comprises a fixture, as well as a through-hole in the fixture for receiving an electrode to electroplate the inside wall of the transfer mold. In particular, the through-hole is configured to receive the electrode in a slide-fit to form a mutual interference fit for securing the electrode to the fixture. Upon fitting the electrode into the through-hole, the apparatus can then be used to electroplate the inside wall of the transfer mold by introducing the electrode into the space adjacent to the inside wall of the transfer mold. A device for use as an electrode in the apparatus is also disclosed. | 01-24-2013 |
Ka-Ming Yip, Fanling CN
Patent application number | Description | Published |
---|---|---|
20150322574 | PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME - A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating. | 11-12-2015 |
Kam Ming Yip, Selangor MY
Patent application number | Description | Published |
---|---|---|
20100324632 | Method and portable system for non-invasive, In-vivo blood irradiation light therapy - The present invention is a non-invasive apparatus, system, and method for performing irradiation light therapy upon blood circulating within the nostrils of a living mammalian subject. The merit and medical value of the invention resides in its ability to achieve a reversal of red blood cell aggregation in-vivo without invading the tissues or organs of the living subject—a clinical result which leads to lower blood viscosity and improved blood circulation. In this manner, the invention provides the living mammalian subject with an enhanced immunity from diseases, a reduced vulnerability to hypertension, and a reduced risk of a cardiovascular incident. Furthermore, by altering the wavelengths transmitted by the light generating unit(s) and controlling the light energy dosage, the method and system can also fine-tuned further as intervention for various diseases. | 12-23-2010 |
Kun-Wah Yip, Shanghai CN
Patent application number | Description | Published |
---|---|---|
20120098431 | GRID FOR ILLUMINATION APPARATUS - The invention relates to illumination, especially to a grid for illumination apparatus. This invention provides a grid ( | 04-26-2012 |
Kun Wah Stanley Yip, Shanghai CN
Patent application number | Description | Published |
---|---|---|
20090147873 | ROBUST INTEGER CARRIER FREQUENCY OFFSET ESTIMATOR - A robust integer carrier frequency offset estimation method for OFDM systems is disclosed. Compared with conventional methods which use either two consecutive OFDM symbols or only one training symbol, the method is insensitive to the timing offset as long as the channel spread is shorter than the OFDM cyclic prefix length. Most importantly, it does not require any information on the scrambling code used in systems such as STiMi. The method improves the accuracy of integer carrier frequency offset, especially in channels with long and strong echoes. It offers the receiver more freedom in setting the FFT window since it is insensitive to the timing offset. | 06-11-2009 |
20090150964 | RELIABILITY DETECTOR FOR TPS DATA DECODING, PARTICULARLY IN DIGITAL TELEVISIONS - For digital TVs, transmission parameter signaling (TPS) data are normally required to be decoded and checked in every signal frame. In the Chinese DTV-T standard, these TPS data are transmitted over subcarriers in a contiguous frequency band of width 72 kHz, with the result that the SNR for these subcarriers may drop to a very low value due to lack of frequency diversity. The TPS data decoding error rate may rise significantly, severely impacting the DTV performance. A reliability detector is used to provide a reliability indication of the decoded TPS data. If this indication indicates that the decoded TPS data are likely to be incorrect, the receiver may discard the presently decoded TPS data and use the previously decoded ones (obtained when the reliability measure was high) or may take other appropriate actions. The reliability detector may include an SNR estimator, a comparator, and possibly storage. The SNR estimator estimates the SNR based on the present set of intermediate results obtained through the TPS data decoder and possibly sets of intermediate results obtained at earlier times. | 06-11-2009 |
Li Juin Yip, Vallach AT
Patent application number | Description | Published |
---|---|---|
20160064477 | Semiconductor Device and a Method for Manufacturing a Semiconductor Device - A semiconductor device comprises a semiconductor substrate structure comprising a cell region and an edge termination region surrounding the cell region. Further it comprises a plurality of needle-shaped cell trenches within the cell region reaching from a surface of the semiconductor substrate structure into the substrate structure and an edge termination trench within the edge termination region surrounding the cell region at the surface of the semiconductor substrate structure. | 03-03-2016 |
Li Juin Yip, Villach AT
Patent application number | Description | Published |
---|---|---|
20140131792 | Semiconductor Device with Metal-Filled Groove in Polysilicon Gate Electrode - A semiconductor device includes a semiconductor substrate, a body region of a first conductivity type in the substrate, a source region of a second conductivity type opposite the first conductivity type adjacent the body region, and a trench extending into the substrate adjacent the source and body regions. The trench contains a polysilicon gate electrode insulated from the substrate. The device further includes a dielectric layer on the substrate, a gate metallization on the dielectric layer and covering part of the substrate and a source metallization on the dielectric layer and electrically connected to the source region. The source metallization is spaced apart from the gate metallization and covers a different part of the substrate than the gate metallization. A metal-filled groove in the polysilicon gate electrode is electrically connected to the gate metallization, and extends along a length of the trench underneath at least part of the source metallization. | 05-15-2014 |
20150179752 | Method and Contact Structure for Coupling a Doped Body Region to a Trench Electrode of a Semiconductor Device - A semiconductor body has a first surface, a second opposing surface, an edge, an active device region, and an edge termination region. A trench extends from the first surface into the semiconductor body in the edge termination region and includes sidewalls and an insulated electrode. A first conductivity type doped region extends from the first surface into the semiconductor body in the edge termination region and has a planar outer surface along the first surface that adjoins the trench at a corner of the trench sidewall and the first surface and has a side surface extending from the corner along the trench sidewall. A first interconnect contacts the trench electrode. A second interconnect contacts the outer surface and the side surface. A contact couples the first doped region to the trench electrode and has a bottom surface coplanar with the first surface from a contact edge to the corner. | 06-25-2015 |
20150295078 | Semiconductor Device with Metal-Filled Groove in Polysilicon Gate Electrode - A semiconductor device includes a semiconductor substrate, a body region of a first conductivity type in the substrate, a source region of a second conductivity type adjacent the body region, and a trench extending into the substrate. The trench contains a polysilicon gate electrode insulated from the substrate. The device further includes a dielectric layer on the substrate, a gate metallization on the dielectric layer and covering part of the substrate and a source metallization on the dielectric layer and electrically connected to the source region. The gate metallization includes two spaced apart fingers. The source metallization is spaced apart from the gate metallization and covers a different part of the substrate than the gate metallization. A metal-filled groove in the polysilicon gate electrode is electrically connected to the two spaced apart fingers, and extends along a length of the trench directly underneath at least part of the source metallization. | 10-15-2015 |
20160064496 | Semiconductor Device with Field Electrode and Contact Structure - A semiconductor device includes a field electrode structure with a field electrode and a field dielectric surrounding the field electrode. A semiconductor body includes a transistor section surrounding the field electrode structure and including a source zone, a first drift zone section and a body zone separating the source zone and the first drift zone section. The body zone forms a first pn junction with the source zone and a second pn junction with the first drift zone section. A gate structure surrounds the field electrode structure and includes a gate electrode and a gate dielectric separating the gate electrode and the body zone. A contact structure directly adjoins the source and body zones and surrounds the field electrode structure equably with respect to the field electrode structure. | 03-03-2016 |
Ngai Kain Yip, Singapore SG
Patent application number | Description | Published |
---|---|---|
20160072776 | METHOD AND SYSTEM FOR EXCHANGING ENCRYPTED MESSAGES BETWEEN COMPUTING DEVICES IN A COMMUNICATION NETWORK - A method for exchanging a message ( | 03-10-2016 |
Teck Hong Yip, Singapore SG
Patent application number | Description | Published |
---|---|---|
20120014241 | APPARATUS FOR VIBRATION REDUCTION IN A HARD DISK DRIVE - An apparatus for vibration reduction in a hard disk drive, the hard disk drive comprising at least one hard disk and at least one actuator arm. The apparatus comprises a flow mitigating device disposed on the at least one actuator arm, the flow mitigating device comprising at least one surface being inclined with respect to a reference plane of the actuator arm to generate streamwise vortices for interacting with and weakening vortex structures generated at a trailing edge of the actuator arm during spinning of the hard disk. | 01-19-2012 |
Tian Siang Yip, Singapore SG
Patent application number | Description | Published |
---|---|---|
20080258276 | Non-Leaded Semiconductor Package and a Method to Assemble the Same - A method to assemble a non-leaded semiconductor package ( | 10-23-2008 |
Tony Yip, Beijing CN
Patent application number | Description | Published |
---|---|---|
20100281473 | AUTOMATED SOFTWARE DEPLOYMENT TRIGGERED BY STATE DIFFERENCES IN DISTRIBUTED SYSTEMS - An automated arrangement for deploying software updates to a distributed system based on state differences is provided in which a manifest defines a target snapshot of the desired state of the system after it is updated. A snapshot of the current distributed system state is taken and a state difference between the current state and the target state is calculated. A rule-based engine applies pre-defined rules to generate a sequence of actions that when performed will bring the distributed system to the target state. Accordingly, rather than have to focus on how to change the distributed system, software developers and system administrators may instead specify the target distributed system state in the manifest and the present automated deployment arrangement will perform the required actions to deploy the updates and achieve the desired state. | 11-04-2010 |
Tsz Leung Yip, Kowloon CN
Wei Luen James Yip, Singapore SG
Patent application number | Description | Published |
---|---|---|
20130030455 | OCCLUSION DEVICE FOR CLOSING ANATOMICAL DEFECTS - The present invention generally relates to the field of transcatheter device closure techniques for closing an opening in a tissue and more particularly, to occlusion devices for closing anatomical defects in tissue. More particularly the present invention refers to occlusion devices for closing septal abnormalities such as atrial septal defects and patent foramen ovale, and to methods of closing an anatomical defect in a tissue. | 01-31-2013 |
20130046254 | OCCLUSION DEVICE FOR CLOSING ANATOMICAL DEFECTS - The present invention generally relates to the field of transcatheter device closure techniques for closing an opening in a tissue and more particularly, to occlusion devices for closing anatomical defects in tissue such as defects consisting of an opening connecting a front side and a back side of a tissue. More particularly the present invention relates to occlusion devices for closing septal abnormalities such as atrial septal defects and patent foramen ovale, delivering systems for such occlusion devices, kits comprising the occlusion devices and the delivering systems and to methods of closing an anatomical defect in a tissue consisting of an opening connecting a front side and a back side of a tissue. | 02-21-2013 |
William Yip, Doha QA
Patent application number | Description | Published |
---|---|---|
20150220358 | ARRANGEMENT AND METHOD FOR THE ALLOCATION OF RESOURCES OF A PLURALITY OF COMPUTING DEVICES - An arrangement configured to allocate resources of a host system to one or more virtual machines, the arrangement comprising: an interface configured to receive a first request from a client system for a first amount of a resource of a host system to be allocated to a first virtual machine and to transmit confirmation to the client system of the allocation of the first amount of the resource; and a hypervisor module configured to allocate an amount of the resource of the host system to the first virtual machine, wherein the amount of the resource allocated to the first virtual machine is less than the first amount of the resource, such that at least a part of the first amount of the resource is available for allocation to a second virtual machine. | 08-06-2015 |
20150229583 | ARRANGEMENT CONFIGURED TO ALLOCATE RESOURCES OF A PLURALITY OF DATA STORAGE MEDIA TO A PLURALITY VIRTUAL MACHINES AND ASSOCIATED METHOD - An arrangement configured to allocate resources of a plurality of data storage media to a plurality virtual machines, the arrangement comprising: an interface configured to receive a first data access rate requirement for a first of the plurality of virtual machines and a second data access rate requirement for a second of the plurality of virtual machines; and a hypervisor module configured to compare the first and second data access rate requirements to stored data access rates for a first and a second data storage media associated with the plurality of computing devices, and to allocate resources of at least one of the first and second data storage media to the first and second virtual machines such that the first and second data access requirements are met. | 08-13-2015 |
20150237066 | ARRANGEMENT CONFIGURED TO MIGRATE A VIRTUAL MACHINE IN THE EVENT OF AN ATTACK - An arrangement for use in managing resources of a plurality of computing devices in response to an attack, the arrangement comprising: an interface configured to receive an indication of a parameter associated with a first computing device of the plurality of computing devices; and a migration module configured to migrate a virtual machine, or part of a virtual machine, from the first computing device to a second computing device in response to the indication received by the interface, wherein the parameter includes an indicator of a symptom of an attack against the first computing device or a program operating on the first computing device. | 08-20-2015 |
20150244640 | ARRANGEMENT AND METHOD FOR USE IN MANAGING RESOURCES OF A PLURALITY OF COMPUTING DEVICES - An arrangement for use in managing resources of a plurality of computing devices, the arrangement comprising: an interface configured to receive an indication of a parameter associated with a first computing device of the plurality of computing devices; and a migration module configured to migrate a virtual machine, or part of a virtual machine, from the first computing device to a second computing device in response to the indication received by the interface. | 08-27-2015 |
20150296051 | METHODS, REMOTE ACCESS SYSTEMS, CLIENT COMPUTING DEVICES, AND SERVER DEVICES FOR USE IN REMOTE ACCESS SYSTEMS - A method of managing the execution of a computer program in a remote access system, comprising: connecting a client computing device to a server device; receiving a request from the client computing device to operate a computer program; determining a device on which to execute the computer program; and executing the computer program on the server device or the client computing device according to the determination, the computer program being executable on both the client computing device and the server device respectively. Furthermore: a method for selectively remotely installing programs; a method for remote access and assistance; a method for monitoring a remote user's activity; a method for distributing group policies. | 10-15-2015 |
20150304237 | METHODS AND SYSTEMS FOR MANAGING ACCESS TO A LOCATION INDICATED BY A LINK IN A REMOTE ACCESS SYSTEM - A method of managing access to a location indicated by a link in a remote access system, the method comprising: executing a first computer program using one or more resources of a client computing device or a server device, the execution of the first computer program resulting in the presentation of a link; receiving an instruction to access a storage location indicated by the link; determining whether to access the storage location indicated by the link using one or more resources of the client computing device or the server device based on one or more factors; and accessing the storage location indicated by the link using one or more resources of the client computing device or the server device in accordance with the determination. | 10-22-2015 |
20150304306 | STORAGE SYSTEM AND METHOD OF STORING AND MANAGING DATA - A system for and method of storing data comprising: encoding a file into a plurality of fragments; retrieving storage configuration data from a data management store including data associated with a plurality of remote storage volumes, the storage configuration data comprising an indication of a predefined data transmission size corresponding to each remote storage volume; using the storage configuration data to identify a storage strategy associating each fragment with a remote storage volume, wherein using the storage configuration data includes using the indications of the pre defined data transmission sizes; packaging one or more fragments each associated with a common identified remote storage volume as identified by the storage strategy to form a data bundle; communicating the data bundle to the respective common identified remote storage volume associated with the fragments in the data bundle; and storing the fragments at that identified remote storage volume. | 10-22-2015 |
20150312243 | STORAGE SYSTEM AND METHOD OF STORING AND MANAGING DATA - A system for and method of storing and managing data comprising: encoding a file into a plurality of fragments; retrieving storage configuration data from a data management store; retrieving encryption key data from a keystore; identifying a storage strategy using the storage configuration data, the storage strategy associating each fragment with a remote storage volume; and for each fragment: using the encryption key data to identify an encryption key associated with a remote storage volume identified in the storage strategy; encrypting the fragment using the identified encryption key; communicating the encrypted fragment to the associated remote storage volume as identified by the storage strategy; and storing the encrypted fragment at that identified remote storage volume. | 10-29-2015 |
20150339146 | AN ARRANGEMENT CONFIGURED TO ALLOCATE ONE OR MORE RESOURCES OF ONE OR MORE COMPUTING DEVICES TO A VIRTUAL MACHINE - An arrangement configured to allocate one or more resources of one or more computing devices to a virtual machine, the arrangement comprising: an interface configured to receive a request for the allocation of one or more resources to the virtual machine, the request including information regarding one or more computer programs to be operated by or as a part of the virtual machine; and a hypervisor module configured to use the information regarding one or more computer programs to identify economic information associated with at least one of the computer programs, and to allocate one or more resources to the virtual machine based at least in part on the economic information. | 11-26-2015 |
20150339147 | AN ARRANGEMENT CONFIGURED TO ALLOCATE NETWORK INTERFACE RESOURCES TO A VIRTUAL MACHINE - An arrangement configured to allocate network interface resources to a virtual machine, the arrangement comprising: an interface configured to receive a first network interface requirement for a first virtual machine; and a hypervisor module configured to compare the first network interface requirement to stored network interface information for one or more network interfaces associated one or more computing devices, and to allocate resources of at least one of the one or more network interfaces to the first virtual machine such that the first network interface requirement is met. | 11-26-2015 |
William Yip, Sea Mills GB
Patent application number | Description | Published |
---|---|---|
20130054677 | System and Method for Latency Monitoring - A method for monitoring remote access connection latency between a client device and a server device comprises using a virtual channel between the client device and the server device to determine a value for the latency in a network connection therebetween. | 02-28-2013 |
Wing Chiu Yip, Shenzhen CN
Patent application number | Description | Published |
---|---|---|
20120307363 | Photo-induced dichroic polarizers and fabrication methods thereof - A method of forming a polarizing material is provided including exposing a layer of dichroic material to activating light illumination to provide an ordered structure with a distinguished absorption axis and thus photo-induce polarization, and fixing the induced polarization by polymerization of the dichroic layer. Novel polarizing materials formed thereby are also provided. By selectively exposing regions of the dichroic material to differing activating radiation, different regions with different polarization axes can be created. The polarizing material can also be provided with a coating or coatings to alter the spectral responses, and a stack formed of a plurality if dichroic layers can be provided. | 12-06-2012 |