Ying-Chih
Ying-Chih Chan, Taoyuan City TW
Patent application number | Description | Published |
---|---|---|
20160113114 | CARRIER SUBSTRATE - A carrier substrate includes a dielectric layer, a first circuit layer, an insulation layer, conductive blocks, and a first conductive structure. The dielectric layer has a first surface, a second surface, and blind vias. The first circuit layer is embedded in the first surface and the blind vias extend from the second surface to the first circuit layer. The insulation layer is disposed on the first surface and has a third surface, a fourth surface, and first openings exposing the first circuit layer. The conductive blocks fill the first openings and connect with the first circuit layer. A top surface of each of the conductive blocks is higher than the third surface of the insulation layer. The first conductive structure includes conductive vias filling the blind vias and a second circuit layer disposed on a portion of the second surface. | 04-21-2016 |
Ying-Chih Chan, Sinfong Township TW
Patent application number | Description | Published |
---|---|---|
20100096750 | Packaging substrate - A packaging substrate is disclosed, which comprises: a substrate body, wherein a surface thereof has a plurality of conductive pads and a solder mask disposed on the surface and having a plurality of openings to expose the conductive pads; dielectric rings disposed on the inner walls of the openings and extending to parts of the surface of the solder mask surrounding the openings; and metal bumps disposed in the openings and on the conductive pads exposed thereby, and combined with the dielectric rings. | 04-22-2010 |
Ying-Chih Chan, Taoyuan TW
Patent application number | Description | Published |
---|---|---|
20130147041 | STACK PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A stack package structure is provided, including: a substrate; an insulating layer formed on the substrate and having openings for exposing die attach pads and conductive pads of the substrate, respectively; a plurality of first and second conductive terminals formed on the insulating layer and electrically connected to the die attach pads and the conductive pads, respectively; a dielectric layer formed on the insulating layer and having a cavity for exposing the first conductive terminals and a plurality of openings exposing the second conductive terminals; copper pillars formed respectively in the openings of the dielectric layer; a semiconductor chip disposed in the cavity and electrically connected to the first conductive terminals; solder balls formed respectively on the copper pillars that are located proximate to the die attach area; and a package structure disposed on and electrically connected to the solder balls. | 06-13-2013 |
20130249083 | PACKAGING SUBSTRATE - A packaging substrate is provided, wherein a plurality of conductive posts together with a conductive bonding layer formed thereon form a plurality of external connection structures with the same height, thereby preventing tilted stack structures and poor coplanarity in a subsequent stacking process. | 09-26-2013 |
20140027925 | THROUGH-HOLED INTERPOSER, PACKAGING SUBSTRATE, AND METHODS OF FABRICATING THE SAME - A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer. | 01-30-2014 |
20140182912 | PACKAGING SUBSTRATE - A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied. | 07-03-2014 |
20150179475 | METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A THROUGH-HOLED INTERPOSER - A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer. | 06-25-2015 |
20150179476 | METHOD OF FABRICATING A THROUGH-HOLED INTERPOSER - A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer. | 06-25-2015 |
20150187692 | PACKAGING SUBSTRATE HAVING A THROUGH-HOLED INTERPOSER - A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer. | 07-02-2015 |
Ying-Chih Chang, Taipei TW
Patent application number | Description | Published |
---|---|---|
20140120537 | Collection and Concentration System for Biologic Substance of Interest and Use Thereof - A system and method thereof for collecting and concentrating a biologic substance of interest is provided. The biologic of interest obtained from a biologic sample present at an initial low concentration (or low number counts) can be captured and released through a collection device of the system to an intermediate second concentration, and further recovered through a concentration device of the system to a third concentration, thereby facilitating subsequent detection, characterization, enumeration, immunostaining, inspection, imaging, culturing, molecular analysis, and/or other assays. | 05-01-2014 |
20140255976 | CAPTURE, PURIFICATION, AND RELEASE OF BIOLOGICAL SUBSTANCES USING A SURFACE COATING - This invention relates to a surface coating for capture circulating rare cells, comprising a nonfouling composition to prevent the binding of non-specific cells and adsorption of serum components; a bioactive composition for binding the biological substance, such as circulating tumor cells; with or without a linker composition that binds the nonfouling and bioactive compositions. The invention also provide a surface coating for capture and purification of a biological substance, comprising a releasable composition to release the non-specific cells and other serum components; a bioactive composition for binding the biological substance, such as circulating tumor cells; with or without a linker composition that binds the releasable and bioactive compositions. The present invention also discloses a novel microfluidic chip, with specific patterned microstructures to create a flow disturbance and increase the capture rate of the biological substance. | 09-11-2014 |
20160059234 | COLLECTOR ARCHITECTURE LAYOUT DESIGN - The disclosure provides for compositions and methods for the collection of rare cells using an interspersed microstructure design. | 03-03-2016 |
Ying-Chih Chen, Tu-Cheng TW
Patent application number | Description | Published |
---|---|---|
20080307626 | METHOD FOR ASSEMBLING CAMERA MODULE - An exemplary method for assembling a lens unit and a light-receiving unit into a camera module is provided. The lens unit includes a mountable surface. The light-receiving unit includes a light-receiving surface and a mounting surface. The method includes a mountable surface detecting step, a mountable surface repositioning step, a mounting surface detecting step, a mounting surface repositioning step, and a mounting step. The mountable surface detecting and repositioning steps detect and reposition the lens unit to make the mountable surface perpendicular to the optical axis of the lens unit. The mounting surface detecting repositioning steps detect and reposition the light-receiving unit to make the mounting surface parallel to the light-receiving surface. The mounting step mounts the light-receiving unit to the lens unit in the manner that the mounting surface parallel to the light-receiving surface is biased against the mountable surface perpendicular to the optical axis. | 12-18-2008 |
Ying-Chih Chen, Kaohsiung City TW
Patent application number | Description | Published |
---|---|---|
20150333039 | BONDING PAD ARRANGMENT DESIGN FOR MULTI-DIE SEMICONDUCTOR PACKAGE STRUCTURE - A semiconductor package structure includes a base. A first die is mounted on the base. The first die comprises a plurality of first pads with a first pad area arranged in a first tier. A plurality of second pads with a second pad area is arranged in a second tier. A second die is mounted on the base. The second die includes a plurality of third pads arranged in a third tier. A first bonding wire has two terminals respectively coupled to one of the first pads and one of the third pads. A second bonding wire has two terminals respectively coupled to one of the third pads and one of the second pads. | 11-19-2015 |
Ying-Chih Chen, Taipei City TW
Patent application number | Description | Published |
---|---|---|
20150028864 | VEHICLE DOOR HANDLE AND SENSOR DEVICE THEREOF - A vehicle door handle includes a case, a first detector and a second detector. The first detector includes a core and a coil that is wound around the core. The second detector is disposed side by side with the first detector, and includes a sensor electrode that has a wavy geometry and that has an axis substantially parallel to the axis of the core. The sensor electrode includes a first wavy segment and a second wavy segment. The first wavy segment corresponds in position to the coil and has a first linear density, and the second wavy segment has a second linear density that is greater than the first linear density. | 01-29-2015 |
Ying-Chih Hsu, Hsinchu TW
Patent application number | Description | Published |
---|---|---|
20110089916 | LDO REGULATORS FOR INTEGRATED APPLICATIONS - Embodiments of the invention are related to LDO regulators. In an embodiment, an amplifier drives the gate of a master source follower and of at least one slave source follower to form an LDO regulator. In an alternative embodiment, a charge pump drives the master source follower to form the regulator. Additional slave source followers may be used in conjunction with the charge pump and the master source follower to improve the regulator performance. Other embodiments are also disclosed. | 04-21-2011 |
Ying-Chih Huang, New Taipei City TW
Patent application number | Description | Published |
---|---|---|
20150308643 | ELECTRONIC LIGHT-EMITTING DEVICE - An electronic light-emitting device includes a housing. An upper end of the housing has an opening, and a positioning rod is connected to an upper inner side of the housing. The positioning rod is mounted by a holder via a through hole. An upper end of the holder has a flame decoration sheet extended to expose outside the opening. A light-emitting unit is provided at the inner side of the opening of the housing to radiate the flame decoration sheet. A lower inner side of the housing has a swinging member and a driving member. A lower end of the housing is connected to a seat. The swinging member has a magnetic element, and an extension section at an upper end thereof that touches and pushes the lower end of the holder. The driving member is disposed to correspond to the magnetic element. | 10-29-2015 |
Ying-Chih Lai, Taipei City TW
Patent application number | Description | Published |
---|---|---|
20150273737 | FLEXIBLE AND STRETCHABLE GRAPHENE FILM AND PREPARING METHOD OF THE SAME - The present invention relates to a flexible and stretchable graphene film, comprising a graphene layer and a functional layer formed on the graphene layer; a preparing method of the graphene film. The present invention further relates to a method of producing a graphene film, comprising: (a) providing a carrier, and a graphene layer is formed on the surface of the carrier, (b) forming a functional layer containing an insulating polymer and a conductive material on a top portion of the graphene film; and (c) dissolving the carrier by an etchant. Without harsh synthesis and complicated fabrication steps, the graphene film of the present invention is able to transfer onto various substrates, and is largely beneficial to various electronic applications. | 10-01-2015 |
Ying-Chih Liao, Taipei TW
Patent application number | Description | Published |
---|---|---|
20110084997 | DETERMINING A HEALTHY FLUID EJECTION NOZZLE - A method of determining a healthy fluid ejection nozzle includes measuring changes in impedance across the nozzle as fluid passes through it. A printhead includes a metal probe that intersects an ink nozzle and an integrated circuit to sense a change in impedance across the nozzle through the metal probe. | 04-14-2011 |
Ying-Chih Liu, Hsinchu TW
Patent application number | Description | Published |
---|---|---|
20120083138 | Electronic Device - An electronic device is provided. The electronic device includes a substrate and a joint. The substrate includes a first surface and a second surface, wherein a substrate signal contact, two ground contacts and two positioning openings are formed on the substrate, and the positioning openings are respectively formed on the ground contact and pass through the substrate. The joint includes a connection port, a joint signal contact and two ground structure, wherein the connection port is electrically connected to the joint signal contact, the joint signal contact is connected to the substrate signal contact, and the joint signal contact is located between the two ground structures, and the ground structures are respectively inserted into the positioning openings to be electrically connected to the ground contacts. | 04-05-2012 |
Ying-Chih Wang, Kuei Shan Hsiang TW
Patent application number | Description | Published |
---|---|---|
20120154230 | MULTI-BAND ANTENNA - A multi-band antenna includes a feed-in section, a loop conductor, a first conductor arm, a second conductor arm, and a third conductor arm. The feed-in section includes a feed-in point for feeding of signals. The loop conductor extends from the feed-in section and has a grounding point disposed adjacent to the feed-in point. The first conductor arm is configured to resonate in a first frequency band and extends from the feed-in section. The second conductor arm is configured to resonate in a second frequency band and extends from the feed-in section. The third conductor arm is configured to resonate in a third frequency band and extends from the feed-in section. At least one of the loop conductor, the first conductor arm, the second conductor arm, and the third conductor arm is bent so as to be disposed in different planes. | 06-21-2012 |
Ying-Chih Wang, Keller, TX US
Patent application number | Description | Published |
---|---|---|
20150038372 | METHODS, MICROFLUIDIC DEVICES, AND SYSTEMS FOR DETECTION OF AN ACTIVE ENZYMATIC AGENT - Embodiments of the present invention provide methods, microfluidic devices, and systems for the detection of an active target agent in a fluid sample. A substrate molecule is used that contains a sequence which may cleave in the presence of an active target agent. A SNAP25 sequence is described, for example, that may be cleaved in the presence of Botulinum Neurotoxin. The substrate molecule includes a reporter moiety. The substrate molecule is exposed to the sample, and resulting reaction products separated using electrophoretic separation. The elution time of the reporter moiety may be utilized to identify the presence or absence of the active target agent. | 02-05-2015 |
Ying-Chih Wang, Yilan County TW
Patent application number | Description | Published |
---|---|---|
20090104686 | Apparatus for Thin-Layer Cell Smear Preparation and In-situ Hybridization - The present invention discloses an apparatus for thin-layer cell smear preparation and in-situ hybridization, comprising at least one positioning device and a sealing device. The positioning device comprises at least one first opening. When the positioning device is set on a carrier device, the wall of the first opening and the carrier device form a cavity. The cavity is used to accommodate a cell suspension. The sealing device is provided on the positioning device for sealing the cavity to form an enclosed space. | 04-23-2009 |
Ying-Chih Wang, Taoyuan Shien TW
Patent application number | Description | Published |
---|---|---|
20120262344 | PORTABLE ELECTRICAL DEVICE AND ITS MANUFACTURING METHOD - A portable electrical device includes a chassis, a plurality of conductive bodies, a wireless RF module and a cable. The chassis includes a casing layer and a radiator layer stacked with each other. The conductive bodies are embedded inside the casing layer, in which one end of each conductive body exposes outwards one surface of the plastic casing layer, and the other end of each conductive body exposes outwards the other surface of the casing layer and electrically conducts the radiator layer. The cable is electrically conducted with the conductive bodies and the wireless RF module. | 10-18-2012 |
Ying-Chih Wang, Taoyuan County TW
Patent application number | Description | Published |
---|---|---|
20130207846 | MOBILE DEVICE AND MANUFACTURING METHOD THEREOF - A mobile device includes a substrate, a ground element, and a radiation branch. The ground element includes a ground branch, wherein an edge of the ground element has a notch extending into the interior of the ground element so as to form a slot region, and the ground branch partially surrounds the slot region. The radiation branch is substantially inside the slot region, and is coupled to the ground branch of the ground element. The ground branch and the radiation branch form an antenna structure. | 08-15-2013 |
20140062818 | MOBILE DEVICE AND ANTENNA STRUCTURE - A mobile device includes a ground plane, a grounding branch, and a feeding element. The grounding branch is coupled to the ground plane, wherein a slot is formed between the ground plane and the grounding branch. The feeding element extends across the slot. The feeding element is coupled between the grounding branch and a signal source. An antenna structure is formed by the feeding element and the grounding branch. | 03-06-2014 |
Ying-Chih Wang, Tao Yuan Shien TW
Patent application number | Description | Published |
---|---|---|
20110260931 | Antenna Module, and Electronic Apparatus Including the Antenna Module - An antenna module is adapted for disposing in an electronic apparatus that includes first and second housing members and that is operable in a tablet mode, in which the first and second housing members are disposed in a manner that the first housing member overlaps the second housing member. The antenna module includes: a first antenna element to be disposed in the first housing member; and a second antenna element to be disposed in the second housing member, and corresponding substantially in position and proximate to the first antenna element for electromagnetic coupling therewith when the electronic apparatus is operated in the tablet mode. | 10-27-2011 |
20120139802 | Multi-band antenna - A multi-band antenna includes a loop conductor, a first conductor arm, and a second conductor arm. The loop conductor is configured to resonate in a first frequency band and includes a feed-in end for feeding of signals and a main body that extends from the feed-in end, and that has a grounding point disposed adjacent to the feed-in end. The first conductor arm is configured to resonate in a second frequency band and extends from the feed-in end. The second conductor arm is configured to resonate in a third frequency band and extends from the feed-in end. At least one of the loop conductor, the first conductor arm, and the second conductor arm is bent so as to be disposed in different planes. | 06-07-2012 |
Ying-Chih Wang, Livermore, CA US
Patent application number | Description | Published |
---|---|---|
20130231609 | DEVICE FOR MIXING AND DELIVERING FLUIDS FOR TISSUE REPAIR - A device for mixing and delivering a mixture of fluids to a target site includes a tube for containing the mixture. A compressible auger for mixing the fluids is movably disposed within the tube, one end of the auger being free at the distal end of the tube. A plunger is also movable within the tube in communication with the other end of the auger. When the plunger is moved axially within the tube the auger also moves axially and the auger is compressed to dispense the fluid. The mixing and delivery device can be used with an apparatus for the arthroscopic delivery of a tissue repair material to a repair site. The apparatus includes a first sheath and a second sheath removably attached to the first sheath for delivering the tissue repair material to the repair site. | 09-05-2013 |