Patent application number | Description | Published |
20080268584 | ELECTRONIC DEVICES AND METHODS FOR FORMING THE SAME - Methods for forming electronic devices, such as those having a flexible substrate and printed material on the flexible substrate. In one embodiment, the method may include applying materials to a flexible substrate to form the electronic device. At least some of the materials applied to the flexible substrate may be applied using a printing apparatus. The substrate may be annealed when at least some of the materials are present on the flexible substrate. The resulting electronic device may have a high charge carrier mobility in the range from about 10 cm | 10-30-2008 |
20090094834 | Micro-fluid Ejection Device Having High Resistance Heater Film - A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen. | 04-16-2009 |
20090153622 | INK EJECTION DEVICE INCLUDING A SILICON CHIP HAVING A HEATER STACK POSITIONED OVER A CORRESPONDING POWER TRANSISTOR - A silicon chip has a plurality of inkjetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed. | 06-18-2009 |
20090233386 | METHOD FOR FORMING AN INK JETTING DEVICE - A method for forming an ink jetting device includes providing a silicon substrate having a first surface having formed thereon a plurality of electrical heater elements to form a first upper exposed surface; depositing a polymer over the first upper exposed surface to form a sacrificial polymer layer; patterning the sacrificial polymer layer to form a second exposed upper surface; depositing a conformal material over the second exposed upper surface to form a conformal nozzle layer; patterning the conformal nozzle layer to form a plurality of nozzle holes located over the electrical heater elements; patterning a mask layer to form an exposed region of the second surface of the silicon substrate that defines a location of a central ink via; etching the exposed region to form the central ink via; and removing a portion of a remainder of the polymer layer to form ink ejection chambers. | 09-17-2009 |
20090267996 | HEATER STACK WITH ENHANCED PROTECTIVE STRATA STRUCTURE AND METHODS FOR MAKING ENHANCED HEATER STACK - A heater stack includes first strata configured to support and form a heater element responsive to electrical activation and second strata overlying the first strata and having different thicknesses in various portions overlying the heater element to enhance its protection from adverse effects of cavitation occurrences on the second strata. A first portion of the second strata where adverse effects of cavitation occurrences are more likely overlies opposite ends of the heater element and has a first thickness. A second portion of the second strata where adverse effects of cavitation occurrences are less likely has a planar structure overlying and extending between the opposite ends of the heater element. The second portion also has a second thickness less than the first thickness of the first portion. The first portion has a step-like structure relative to and protruding above the planar structure of the second portion. | 10-29-2009 |
20100110145 | HEATER STACK AND METHOD FOR MAKING HEATER STACK WITH HEATER ELEMENT DECOUPLED FROM SUBSTRATE - A heater stack includes first strata configured to support and form a fluid heater element responsive to repetitive electrical activation and deactivation to produce cycles of fluid ejection and second strata overlying the first strata to protect the heater element. A decomposed sacrificial layer of a preselected polymer between the substrate and a heater substrata containing the heater element provides a decoupled relationship between them which, during a heat-up period of each cycle, results in the heater element buckling out of physical contact with substrate enabling the heater element to transfer heat energy for producing fluid ejection into the fluid without transferring any into the substrate whereas the decoupled relationship, during the next following cool-down period of each cycle, results in the heater element de-buckling back into physical contact with the substrate enabling the heater element transfer residual heat energy to the substrate. | 05-06-2010 |
20100110146 | HEATER STACK AND METHOD FOR MAKING HEATER STACK WITH CAVITY BETWEEN HEATER ELEMENT AND SUBSTRATE - A heater stack includes first strata configured to support and form a fluid heater element responsive to repetitive electrical activation and deactivation to produce repetitive cycles of fluid ejection from an ejection chamber above the heater element and second strata overlying the first strata and contiguous with the ejection chamber to protect the heater element. The first strata includes a substrate with a cavity formed either in or above the substrate, a heater substrata overlying the cavity and substrate, and a decomposed layer of material between the substrate and heater substrata and processed to provide the cavity substantially empty of the layer of material such that the cavity provides a means which, during repetitive electrical activation, enables the heater element to transfer heat energy into the fluid in the ejection chamber for producing ejection of fluid therefrom substantially without transferring heat energy into the substrate. | 05-06-2010 |
20100111509 | PLANAR HEATER STACK AND METHOD FOR MAKING PLANAR HEATER STACK WITH CAVITY WITHIN PLANAR HEATER SUBSTRATA ABOVE SUBSTRATE - A heater stuck includes first strata having a planar configuration supporting and forming a fluid heater element responsive to repetitive electrical activation and deactivation to produce repetitive cycles of fluid ejection from an ejection chamber above the heater element and second strata having a planar configuration coating the heater element of the first strata and being contiguous with the ejection chamber to protect the heater element. The first strata include a substrate and heater strata disposed on it and forming a cavity above the substrate and encompassed on three sides by the heater substrata. The heater substrata includes a pair of conductive layer portions constituting terminal leads disposed on the substrate at opposite sides of the cavity and a resistive layer disposed on the conductive layer portions and defining the fluid heater element that spans the top of the cavity. | 05-06-2010 |
20100165052 | Heater Stack Having Resistive Layer with Underlying Insulative Gap and Method for Making Heater Stack - A heater stack includes first strata configured to support and form a fluid heater element responsive to energy from repetitive electrical activation and deactivation to fire repetitive cycles of heating and ejecting fluid from an ejection chamber above the fluid heater element and second strata overlying the first strata and contiguous with the ejection chamber to provide protection of the fluid heater element. The first strata includes a substrate and a heater substrata overlying the substrate and including a resistive layer having lateral portions spaced apart, a central portion extending between the lateral portions and defining the fluid heater element, and transitional portions interconnecting the central portion and lateral portions and elevating the central portion relative to the lateral portions and above the substrate to form a gap between the lateral portions and between the central portion and substrate insulating the substrate from the fluid heater element. | 07-01-2010 |
20100165054 | Fin-Shaped Heater Stack And Method For Formation - A fin-shaped heater stack includes first strata configured to support and form fluid heater elements responsive to repetitive electrical activation and deactivation to produce repetitive cycles of ejection of a fluid, and second strata on the first strata to protect the fluid heater elements from adverse effects of the repetitive cycles of fluid ejection and of contact with the fluid. The first strata include a substrate having a front surface, and heater substrata supported on the front surface. The heater substrata have opposite facing side surfaces which extend approximately perpendicular to the front surface and an end surface interconnecting the side surfaces which extends approximately parallel to the front surface such that the heater substrata is provided in either an upright or inverted fin-shaped configuration on the substrate with the fluid heater elements forming the opposite facing side surfaces of the heat substrata. | 07-01-2010 |
20100165056 | Heater Stack In A Micro-Fluid Ejection Device And Method For Forming Floating Electrical Heater Element In The Heater Stack - A method for forming a floating heater element includes processing a silicon substrate to form a heater stack having the heater element on the substrate with peripheral edge portions, processing the heater stack by depositing and patterning a layer of photoresist or hard mask thereon to substantially mask the heater stack and form a trench through the photoresist or hard mask exposing a surface area of the substrate extending along the peripheral edge portions of the heater element, and processing the masked heater stack and exposed surface area of the substrate by sequentially removing the photoresist and portions of the substrate at the exposed surface area and that underlie the heater element so as to create a well in the substrate undercutting the heater element and open along the peripheral edge portions thereof, the well being capable of filling with a fluid so as to produce the floating heater element. | 07-01-2010 |
20100285411 | MICRO-FLUID EJECTION DEVICES WITH A POLYMERIC LAYER HAVING AN EMBEDDED CONDUCTIVE MATERIAL - Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material. | 11-11-2010 |
20100321447 | PROTECTIVE LAYERS FOR MICRO-FLUID EJECTION DEVICES AND METHODS FOR DEPOSITING SAME - Heater chips for a micro-fluid ejection device, such as those having a reduced energy requirement and more efficient production process therefor. One such heater chip includes a resistive layer deposited adjacent to a substrate and a protective layer deposited adjacent to the resistive layer. The protective layer can be a tantalum oxide protective layer, which has a high breakdown voltage. An optional cavitation layer of tantalum, which bonds well with the tantalum oxide layer, may be deposited adjacent to the protective layer. Alternatively, for example, the tantalum oxide layer may serve as both the protective layer and the cavitation layer. | 12-23-2010 |
20110094102 | Micro-Fluid Ejection Devices, Methods for Making Micro-Fluid Ejection Heads, And Micro-Fluid Ejection Head Having High Resistance Thin Film Heaters - Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms. | 04-28-2011 |
20110123932 | METHOD FOR FORMING A FLUID EJECTION DEVICE - Methods are described for forming a fluid ejection device on a substrate having a first surface and a second surface, the first surface having plurality of electrical heater elements. A sacrificial polymer layer is added over the first surface, a conformal material over the sacrificial polymer layer forms a nozzle layer, the sacrificial polymer is then removed to form ink ejection chambers, the nozzle layer is removed to form nozzle holes, a mask layer is used to form an exposed region and an unexposed region, the exposed region defining a central ink via, which is then etched to form the central ink via. | 05-26-2011 |
20110261115 | Capping Layer for Insulator in Micro-Fluid Ejection Heads - A micro-fluid ejection head has a resistor layer defining a heater element. An insulative layer underlies the heater element and a capping layer on the insulative layer substantially prevents ion mobility between the resistor and insulative layers. Resistance stability of the heater has been shown improved as has adhesion of the heater to the insulator. Representative layers include insulation of methyl silesquioxane (MSQ) in a thickness of about 5000 Angstroms or more, while the cap is a silicon nitride in a thickness of about 2000 Angstroms or less. Other capping layers include silicon carbide, silicon oxide or dielectrics. The resistor layer typifies TaAIN in a thickness of about 350 Angstroms, including overlying anode and cathode conductors that define the heater. Coating layers are also disclosed as are thermal barrier layers. | 10-27-2011 |
20120274707 | EJECTION DEVICES FOR INKJET PRINTERS AND METHOD FOR FABRICATING EJECTION DEVICES - Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device. | 11-01-2012 |
20130027477 | PIEZOELECTRIC INKJET PRINTHEADS AND METHODS FOR MONOLITHICALLY FORMING THE SAME - A piezoelectric inkjet printhead is monolithically fabricated on a substrate. The printhead includes a plurality of cavities formed into the substrate, piezoelectric actuators disposed over the top of the cavities, a fluidic structure and an ink supply channel. The piezoelectric actuators are formed over the cavities using a sacrificial material which fills the cavities and is removed after the actuators are formed. The fluidic structure defines pressurizing chambers and channels connected to the ink supply channel. The fluidic structure has a plurality of nozzle holes formed on the top surface. The cavities are connected to either a venting channel formed from the backside of the substrate or a venting chamber formed inside the fluidic structures. | 01-31-2013 |
20130076837 | PLANAR HEATER STACK AND METHOD FOR MAKING PLANAR HEATER STACK WITH CAVITY WITHIN PLANAR HEATER SUBSTRATA ABOVE SUBSTRATE - A heater stuck includes first strata having a planar configuration supporting and forming a fluid heater element responsive to repetitive electrical activation and deactivation to produce repetitive cycles of fluid ejection from an ejection chamber above the heater element and second strata having a planar configuration coating the heater element of the first strata and being contiguous with the ejection chamber to protect the heater element. The first strata include a substrate and heater strata disposed on it and forming a cavity above the substrate and encompassed on three sides by the heater substrata. The heater substrata includes a pair of conductive layer portions constituting terminal leads disposed on the substrate at opposite sides of the cavity and a resistive layer disposed on the conductive layer portions and defining the fluid heater element that spans the top of the cavity. | 03-28-2013 |
20130083130 | PLANAR HEATER STRUCTURES FOR EJECTION DEVICES - Disclosed is a method for fabricating a planar heater structure for an ejection device. The method includes providing a substrate wafer having a plurality of plugs configured therewithin. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures. | 04-04-2013 |
20130084662 | METHODS FOR FABRICATING PLANAR HEATER STRUCTURES FOR EJECTION DEVICES - Methods and apparatus teach a substrate wafer having a plurality of plugs configured there within. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures. | 04-04-2013 |
20130182022 | ON-CHIP FLUID RECIRCULATION PUMP FOR MICRO-FLUID APPLICATIONS - A micro-fluid ejection head has fluid ejection elements formed as thin film layers on a substrate. Fluid flow features on the substrate channel fluid from a fluid source to ejection chambers surrounding the ejection elements. A pump on the substrate circulates the fluid from the source to the ejection chambers and back again to the source. The flow refreshes the fluid in the chambers to minimize deleterious effects of evaporation. A controller coordinates the flow rate of the pump and other variables to optimize system productivity. Other embodiments contemplate pump locations, pump types, pump enumeration, and fluidic features, such as pathways, diffusers, chokes and dimensions, to name a few. | 07-18-2013 |
20130202278 | MICRO-FLUIDIC PUMP - A micro-fluidic pump comprises one or more channels having an array of resistive heaters, an inlet, outlet and a substrate as a heat sink and a means of cooling the device. The pump is operated with a fire-to-fire delay and/or a cycle-to-cycle delay to control the pumping rate and minimize heating of liquid inside the pump during its operation. | 08-08-2013 |
20130202453 | MICRO-FLUIDIC PUMP - A micro-fluidic pump comprises one or more channels having an array of resistive heaters, an inlet, outlet and a substrate as a heat sink and a means of cooling the device. The pump is operated with a fire-to-fire delay and/or a cycle-to-cycle delay to control the pumping rate and minimize heating of liquid inside the pump during its operation. | 08-08-2013 |
20130236374 | FLUID CARTRIDGE AND SYSTEM FOR DISPENSING FLUID - A fluid cartridge has a bottle to retain a volume of fluid. An ejector chip resides in fluid communication with the bottle and causes ejection of fluid upon activation of fluid ejectors. Control logic coordinates ejector activation with dose control logic and temperature control circuitry. The dose control logic pre-specifies an amount of fluid to be ejected and prevents further ejection upon reaching the amount. Meanwhile, the temperature control circuit inhibits any ejection until a temperature of the fluid is within a predefined acceptable range. Bottle modularity, fluid dispense-areas and group-control of the ejectors facilitate certain designs. | 09-12-2013 |
20130284694 | EJECTION DEVICES FOR INKJET PRINTERS AND METHOD FOR FABRICATING EJECTION DEVICES - Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device. | 10-31-2013 |
20140026783 | FORMULATION FOR SILICON-DOPED INK USED TO PREVENT CHIP ETCHING - An ink composition for used in an inkjet printer is provided. The ink composition includes a carrier medium, a colorant, and a silicon doping agent. The silicon doping agent may include silicic acid, silicon dioxide, or silicates. This silicon-doped ink reduces and prevents the etching of the silicon based components of the printhead. Silicon-doped inks protect the printhead from damage, thus improving printhead reliability and increasing printhead service life. | 01-30-2014 |
20140051159 | Micro-Fluidic Modules on a Chip for Diagnostic Applications - A chip having a substrate for amplifying genetic material includes a substrate heater having a plurality of substrate heating resistors. The heating resistors define a first temperature zone for maintaining a first temperature, a second temperature zone for maintaining a second temperature below the first temperature, and a third temperature zone for maintaining a third temperature between the first and second temperatures, on the substrate. A flow path formed on the substrate allows conveying of reactions to the first temperature zone, the third temperature zone, and the second temperature zone so as to undergo denaturing, annealing, and extension, respectively, according to a polymerase chain reaction process, for at least one cycle. | 02-20-2014 |
20140051161 | Micro-Fluidic Modules on a Chip for Diagnostic Applications - A micro-fluidic device includes a plurality of heaters on a substrate for heating the substrate. The plurality of heaters define a plurality of temperature regions having distinct temperatures on the substrate. A flow feature layer is formed above the substrate to define a channel extending across the substrate through each temperature region. As fluid is repeatedly pumped within the channel, it flows from one temperature region to a next temperature region to undergo thermal cycling. | 02-20-2014 |
20140142245 | THERMALLY INKJETTABLE ACRYLIC DIELECTRIC INK FORMULATION AND PROCESS - An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by 65 weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C. | 05-22-2014 |
20150037175 | Micro-Fluidic Pump - A micro-fluidic pump comprises one or more channels having an array of resistive heaters, an inlet, outlet and a substrate as a heat sink and a means of cooling the device. The pump is operated with a fire-to-fire delay and/or a cycle-to-cycle delay to control the pumping rate and minimize heating of liquid inside the pump during its operation. | 02-05-2015 |