Yi-Hung
Yi-Hung Chen, Taipei TW
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20100109501 | CONNECTOR AND LIGHT SOURCE APPARATUS - A connector adapted to be disposed on a carrier and electrically connected to the carrier is provided. The connector includes an insulating base and two electrodes. The insulating base has a first side surface, a second side surface, a bottom surface, and two through holes. The bottom surface connects the first and the second side surfaces. The through holes extend from the first side surface to the second side surface. The electrodes respectively penetrate the through holes. Each electrode has a bar portion and a bending portion extending from the bar portion. The bar portion is located in the corresponding through hole and protrudes away from the first side surface. The bending portion extends on the second side surface and toward the carrier. An end of the bending portion penetrates through the carrier and is electrically connected to the carrier. A light source apparatus is also provided. | 05-06-2010 |
20100110685 | LIGHT TUBE - A light tube including a heat sink, a light transmissive cover disposed on the heat sink, and at least one light source module is provided. A containing space is formed between the heat sink and the light transmissive cover. The light source module includes a carrier, a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of non-light-emitting passive devices. The carrier is disposed on the heat sink. The first light-emitting devices are arranged on the carrier along a first straight reference line to form a first line of light-emitting devices. The second emitting devices are arranged on the carrier along a second straight reference line to form a second line of light-emitting devices. The non-light-emitting passive devices are disposed on the carrier and between the first and second lines of light-emitting devices and electrically connected to the first and the second light-emitting devices. | 05-06-2010 |
20110074268 | LIGHT SOURCE MODULE - A light source module including a heat dissipation block, a light emitting diode (LED) package and a circuit board is provided. The heat dissipation block has a surface and the LED package is disposed on the surface of the heat dissipation block. The circuit board is electrically connected to the LED package, and the circuit board and the LED package are located at two opposite sides of the heat dissipation block respectively. | 03-31-2011 |
20110097944 | Connector and Light Source Apparatus - A connector adapted to be disposed on a carrier and electrically connected to the carrier is provided. The connector includes an insulating base and two electrodes. The insulating base has a first side surface, a second side surface, a bottom surface, and two through holes. The bottom surface connects the first and the second side surfaces. The through holes extend from the first side surface to the second side surface. The electrodes respectively penetrate the through holes. Each electrode has a bar portion and a bending portion extending from the bar portion. The bar portion is located in the corresponding through hole and protrudes away from the first side surface. The bending portion extends on the second side surface and toward the carrier. An end of the bending portion penetrates through the carrier and is electrically connected to the carrier. A light source apparatus is also provided. | 04-28-2011 |
Yi-Hung Chen, Kaohsiung TW
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20150349001 | SEMICONDUCTOR ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF - The present disclosure provides a method for manufacturing a semiconductor isolation structure, including providing a substrate with a top surface; forming a patterned mask over the top surface; forming a trench through the patterned mask in the substrate by a directional etch comprising nitrogen-containing substance, wherein an aspect ratio of the trench is formed to be greater than about 18, and a ratio of a width of a narrowest portion and a width of a widest portion of the isolation region is formed to be greater than about 0.7; and filling the trench with insulating materials. The present disclosure also provides an image sensing device, including a radiation sensing region with a first isolation region separating adjacent radiation detecting units and a peripheral region, wherein an aspect ratio of the first isolation region is greater than about 18. | 12-03-2015 |
Yi-Hung Chen, Kaohsiung City TW
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20100242348 | METHOD OF INCREASING TRANSESTERIFICATION CONVERSION OF OILS - A method that can effectively increase the transesterification conversion of oils comprises the following steps of setting a rotating packed bed reactor for performing centrifugal rotation, centrifugally rotating the rotating packed bed to rotate relative to the container by the drive shaft; heating the oils and additives being heated to arrive at a temperature range approximately between 40 degrees Celsius to 100 degrees Celsius before entering the rotating packed bed; injecting the oils and the additives; performing the transesterification reaction, wherein the oils and the additives are delivered by a centrifugal force to pass through the stainless steel filler in the packed reaction region; performing the transesterification reaction with a rotation speed range of approximately 300 rpm to 1500 rpm; inducing a phase separation; and collecting the effluent at the outlet of the rotating packed bed reactor. | 09-30-2010 |
Yi-Hung Chen, Hsinchu City TW
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20140050099 | Network Device and Method for Loop Detection - A network device for loop detection in a network environment, which includes a broadcast frame detection unit for detecting a broadcast storm condition, a loop detection frame generation unit for generating and transmitting a loop detection frame if the broadcast storm condition detected by the broadcast frame detection unit indicates a broadcast storm happens, a frame parser unit for parsing a network frame received by the network device to obtain an information from the network frame, and a loop checking unit for comparing the network frame with the loop detection frame based on the information obtained from the network frame. | 02-20-2014 |
Yi-Hung Chiu, Yilan County TW
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20120267715 | HIGH VOLTAGE SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A high voltage semiconductor device is provided. The device includes a semiconductor substrate having a high voltage well with a first conductivity type therein. A gate structure is disposed on the semiconductor substrate of the high voltage well. A source doped region and a drain doped region are in the high voltage well on both sides of the gate structure, respectively. A lightly doped region with the first conductivity type is between the source and drain doped regions and relatively near to the source doped region. The disclosure also presents a method for fabricating a high voltage semiconductor device. | 10-25-2012 |
Yi-Hung Chiu, Yilan City TW
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20150054071 | HIGH VOLTAGE SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A high voltage semiconductor device is provided. The device includes a semiconductor substrate having a high voltage well with a first conductivity type therein. A gate structure is disposed on the semiconductor substrate of the high voltage well. A source doped region and a drain doped region are in the high voltage well on both sides of the gate structure, respectively. A lightly doped region with the first conductivity type is between the source and drain doped regions and relatively near to the source doped region. The disclosure also presents a method for fabricating a high voltage semiconductor device. | 02-26-2015 |
Yi-Hung Ho, Taipei City TW
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20150368021 | Vacuum Storage Container - A vacuum storage container includes a container housing, a drawer mounted in the container housing and movable between a close position and an open position, a rotary knob pivotally mounted in a door cover of the drawer, a clockwork coupled to the rotary knob, a drive gear affixed to the rotary knob, a transmission gear set rotatable by the drive gear, an eccentric wheel rotatable by the transmission gear set, a pumping pump mounted in the drawer and coupled to the eccentric wheel for creating a vacuum in the container housing, an ejection mechanism adapted for ejecting the drawer out of the container housing, and an operating member control mechanism adapted for locking the drawer to the container housing and operable to unlock the drawer for enabling the drawer to be ejected out of the container housing by the ejection mechanism. | 12-24-2015 |
Yi-Hung Ho, Taipei TW
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20140062942 | Capacitive Touch Pen - A capacitive touch pen includes a shaft, and a tip formed of a multilateral elastic conductor and located at the bottom side of the shaft for touching a touch screen to induce a signal. Preferably, the tip has the maximum width in the range of 2.5 mm˜4 mm. | 03-06-2014 |
Yi-Hung Ho, Miao-Li County TW
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20150103053 | TOUCH DISPLAY PANEL, TOUCH DISPLAY DEVICE AND DISPLAY DEVICE - A touch display panel includes a display panel, a touch panel, an optical film and an adhesive layer. The display panel includes a first substrate and a second substrate. The first substrate and the second substrate are disposed oppositely along a first direction. The touch panel is disposed over the display panel along the first direction. The optical film is disposed between the second substrate and the touch panel along the first direction. The adhesive layer is disposed on the outside of the optical film and adheres to the second substrate and the touch panel. A touch display device and a display device are also disclosed. | 04-16-2015 |
Yi-Hung Hsu, New Taipei City TW
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20110236232 | AIR COMPRESSION DEVICE - An air compression device is applied in an air compressor. A rotatable pressure regulating disk and a valve are disposed in a rotor set. When external air enters an air chamber in the rotor set, the air is exhausted after being compressed through rotation of a first rotor and a second rotor. When the two rotors compress the air, a user may control the pressure regulating disk to rotate to advance or postpone exhaust of the air from the valve, so as to change an exhaust pressure in the air chamber to adjust an exhaust volume output by the rotor set. An adjustable air intake disk may further be added, so that timing adjustment can be performed during both air intake and exhaust. | 09-29-2011 |
20140169936 | METHOD FOR DETECTING HEAT-DISSIPATING AIR FLOW AND ELECTRONIC DEVICE USING THE SAME - A method for detecting heat-dissipating air flow is disclosed. The method includes the following steps: detecting whether a reset command is input; if the reset command is input, resetting a wind pressure standard value according to the reset command; if the reset command is not input, controlling a fan to operate at full speed according to a start signal; detecting the wind pressure of a heat-dissipating air flow after controlling the fan to operate at full speed to acquire a wind pressure value; determining whether the wind pressure value is equal to the wind pressure standard value; and generating a warning signal if the wind pressure value is not equal to the wind pressure standard value. | 06-19-2014 |
Yi-Hung Li, Hsinchu City TW
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20150091073 | NONVOLATILE MEMORY STRUCTURE AND FABRICATION METHOD THEREOF - According to one embodiment, a single-poly nonvolatile memory (NVM) cell includes a PMOS select transistor on a semiconductor substrate and a PMOS floating gate transistor series connected to the PMOS select transistor. The PMOS floating gate transistor comprises a floating gate and a gate oxide layer between the floating gate and the semiconductor substrate. A protector oxide layer covers and is in direct contact with the floating gate. A contact etch stop layer is disposed on the protector oxide layer such that the floating gate is isolated from the contact etch stop layer by the protector oxide layer. | 04-02-2015 |
Yi-Hung Liao, Erlun Township TW
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20130016547 | Simplified Multilevel DC Converter Circuit StructureAANM Liao; Yi-HungAACI Erlun TownshipAACO TWAAGP Liao; Yi-Hung Erlun Township TWAANM Lai; Ching-MingAACI Taichung CityAACO TWAAGP Lai; Ching-Ming Taichung City TW - A simplified multilevel DC converter circuit structure comprises a dual input DC power supply, a power control module and an AC side low-pass filter, wherein each of the dual input DC power supply supplies half of the rated DC voltage to the power control module, and the power control module is composed of six power switches, and different switching combinations of each power switch are controlled to convert a DC voltage to an output of an AC voltage, and two of the power switches of the power control module perform a low-frequency switching twice every cycle of the output voltage, and the withstand voltage is equal to the input voltage, and the remaining power switches perform the switching by a high frequency, and the withstand voltage is only half of the input voltage, such that a multilevel voltage can be outputted, and a low harmonic AC waveform can be outputted from the AC side low-pass filter. | 01-17-2013 |
Yi-Hung Liao, Yunlin County TW
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20100270179 | METHOD FOR MEASURING PH VALUE OF SAMPLE SOLUTION AND SYSTEM THEREOF - The invention provides a method for measuring a pH value of a sample solution, which is performed by a pH sensing device, including: providing a pH sensing device and a sample solution, wherein the pH sensing device includes a pH sensor array, and the pH sensor array comprises m pH sensors, and m is an integer greater than 1; measuring the sample solution with the pH sensor array for n times, wherein n is an integer greater than 1, n measurement values are generated, each pH sensor generates a measurement value for each measurement, and the total amount of measurement values generated is n×m; and generating a pH value of the sample solution by all of the measurement values generated by the pH sensor array. | 10-28-2010 |
Yi-Hung Lin, Taichung TW
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20120280384 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF - A fabrication method of a semiconductor structure includes providing a chip having at least an electrode pad, forming a titanium layer on the electrode pad, forming a dielectric layer on the chip and a portion of the titanium layer, forming a copper layer on the dielectric layer and the titanium layer, forming a conductive pillar on the copper layer corresponding in position to the titanium layer, and removing a portion of the copper layer that is not covered by the conductive pillar. When the portion of the copper layer is removed by etching, undercutting of the titanium layer is avoided since the titanium layer is covered by the dielectric layer, thereby providing an improved support for the conductive pillar to increase product reliability. | 11-08-2012 |
20150072517 | FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE - A fabrication method of a semiconductor structure includes providing a chip having at least an electrode pad, forming a titanium layer on the electrode pad, forming a dielectric layer on the chip and a portion of the titanium layer, forming a copper layer on the dielectric layer and the titanium layer, forming a conductive pillar on the copper layer corresponding in position to the titanium layer, and removing a portion of the copper layer that is not covered by the conductive pillar. When the portion of the copper layer is removed by etching, undercutting of the titanium layer is avoided since the titanium layer is covered by the dielectric layer, thereby providing an improved support for the conductive pillar to increase product reliability. | 03-12-2015 |
Yi-Hung Lin, Chungli City TW
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20100295696 | Digital Display Apparatus for Fastener Pulling Tool - A digital display apparatus for a fastener pulling tool to set a fastener (e.g., rivet, blind rivet or blind threaded insert), driven by pneumatic, hydraulic or pneudraulic power, includes a power supply, a CPU, a pressure sensor, position sensors, a display, and an input means; wherein the pressure sensor is operable to sense pressure of hydraulic or pneumatic fluid entering the fastener pulling tool; the CPU includes a pressure and pulling force calculation module an unit conversion module, an over pressure determination module, a cycle times counting module, and an abnormal stroke detecting module; and the display includes a pressure display zone for showing hydraulic or pneumatic pressure and a pulling force display zone for showing pulling force, a non-resettable over pressure display zone showing the highest inlet pressure, and a cycle time display zone for showing non-resettable accumulated working cycles of the tool. | 11-25-2010 |
Yi-Hung Lin, Zhonghe City TW
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20120206354 | INTEGRATED INPUT APPARATUS - An integrated input apparatus includes a panel, a sensing layer, a backlight layer, and a bottom layer. The panel includes a plurality of hot key patterns, a typing key group pattern, a cursor control pattern, and a response key pattern (a left key and a right key). When anyone of the hot key patterns, the typing key group pattern, the cursor control pattern, or the response key pattern is touched, a sensing control signal is sensed by the sensing layer and sent to a computer host for further processing. | 08-16-2012 |
Yi-Hung Lin, Hsinchu County TW
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20090112266 | SPINAL DYNAMIC STABILIZATION DEVICE - A spinal dynamic stabilization device for maintaining an anatomical height between two adjacent vertebras is provided. Each vertebra includes a spinous process and two symmetric pedicles. The spinal dynamic stabilization device includes a supporting member, at least one anchoring member, and at least one connecting member. The supporting member is disposed between the spinous processes. The anchoring member is fixed in one of the vertebra via one of the pedicles. The connecting member connects the supporting member to the anchoring member, fixing a relative position between the supporting member and the anchoring member, further fixing a relative position between the vertebras. | 04-30-2009 |
20120004675 | DEVICE FOR FIXING SOFT TISSUE - A device for fixing soft tissue. A sleeve is detachably connected to a self-drilling tapping screw, moving and rotating the self-drilling tapping screw. A guide bar is detachably connected to the self-drilling tapping screw and fit in the sleeve. A fixing pin is fit in a washer and connected to the self-drilling tapping screw. The guide bar is detachably fit in the fixing pin. The fixing pin abuts the washer and the self-drilling tapping screw. | 01-05-2012 |
20130059382 | BIOMEDICAL MATERIALS FOR TISSUE ENGINEERING - In an embodiment of the disclosure, a biomedical material is provided. The biomedical material includes a biocompatible material having a surface and a carrier distributed over the surface of the biocompatible material, wherein both of the biocompatible material and the carrier have no charges, one of them has charges or both of them have charges with different electricity. The biomedical material is utilized for dentistry, orthopedics, wound healing or medical beauty and applied in the repair and regeneration of various soft and hard tissues. | 03-07-2013 |
Yi-Hung Lin, Taipei TW
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20110287611 | Reducing Variation by Using Combination Epitaxy Growth - A method for forming a semiconductor structure includes forming a gate stack over a semiconductor substrate in a wafer; forming a recess in the semiconductor substrate and adjacent the gate stack; and performing a selective epitaxial growth to grow a semiconductor material in the recess to form an epitaxy region. The step of performing the selective epitaxial growth includes performing a first growth stage with a first growth-to-etching (E/G) ratio of process gases used in the first growth stage; and performing a second growth stage with a second E/G ratio of process gases used in the second growth stage different from the first E/G ratio. | 11-24-2011 |
20130084682 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF - A method for fabricating a semiconductor device is disclosed. A strained material is formed in a cavity of a substrate and adjacent to an isolation structure in the substrate. The strained material has a corner above the surface of the substrate. The disclosed method provides an improved method for forming the strained material adjacent to the isolation structure with an increased portion in the cavity of a substrate to enhance carrier mobility and upgrade the device performance. In an embodiment, the improved formation method is achieved using an etching process to redistribute the strained material by removing at least a portion of the corner to be located in the cavity. | 04-04-2013 |
20130130184 | Apparatus and Method for Controlling Wafer Temperature - A wafer temperature control apparatus comprises a first temperature sensor and a second temperature sensor. The first temperature sensor is configured to receive a first temperature signal from a center portion of a backside of a susceptor. The second temperature sensor is configured to receive a second temperature signal from an edge portion of the susceptor. A plurality of controllers are configured to adjust each heating source's output based upon the first temperature signal and the second temperature signal. | 05-23-2013 |
20130252189 | Wafer Holder With Varying Surface Property - An apparatus, a system and a method are disclosed. An exemplary apparatus includes a first portion configured to hold an overlying wafer. The first portion includes a central region and an edge region circumscribing the central region. The first portion further including an upper surface and a lower surface. The apparatus further includes a second portion extending beyond an outer radius of the wafer. The second portion including an upper surface and a lower surface. The lower surface of the first portion in the central region has a first reflective characteristic. The lower surface of the first portion in the edge region and the second portion have a second reflective characteristic. | 09-26-2013 |
20130252424 | WAFER HOLDER WITH TAPERED REGION - An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer holder including a first portion and a second portion. The first and second portions are formed of the same continuous material. The first portion includes a first upper surface and a first lower surface, and the second portion including a second upper surface and a second lower surface. The apparatus further includes an interface between the first and second portions. The interface provides for a transition such that the first upper surface of the first portion tends toward the second upper surface of the second portion. The apparatus further includes a tapered region formed in the first portion. The tapered region starts at a radial distance from a center line of the wafer holder and terminates at the interface. The tapered region has an initial thickness that gradually decreases to a final thickness. | 09-26-2013 |
20130256292 | Honey Cone Heaters for Integrated Circuit Manufacturing - A honey cone heater includes a lamp housing having an outer edge that forms a partial circle. The lamp housing has an opening extending from a top surface to a bottom surface of the lamp housing. The opening further extends from the outer edge into a center region of the lamp housing. A plurality of lamps is distributed throughout the lamp housing, and is configured to emit light out of the top surface of the lamp housing. | 10-03-2013 |
20130277760 | Dummy FinFET Structure and Method of Making Same - A FinFET device may include a dummy FinFET structure laterally adjacent an active FinFET structure to reduce stress imbalance and the effects of stress imbalance on the active FinFET structure. The FinFET device comprises an active FinFET comprising a plurality of semiconductor fins, and a dummy FinFET comprising a plurality of semiconductor fins. The active FinFET and the dummy FinFET are laterally spaced from each other by a spacing that is related to the fin pitch of the active FinFET. | 10-24-2013 |
20140170319 | INJECTOR FOR FORMING FILMS RESPECTIVELY ON A STACK OF WAFERS - An injector for forming films respectively on a stack of wafers is provided. The injector includes a plurality of hole structures. Every adjacent two of the wafers have therebetween a wafer spacing, and each of the wafers has a working surface. The hole structures respectively correspond to the respective wafer spacings. The working surface and a respective hole structure have therebetween a parallel distance. The parallel distance is larger than a half of the wafer spacing. A wafer processing apparatus and a method for forming films respectively on a stack of wafers are also provided. | 06-19-2014 |
20140342522 | Reducing Variation by Using Combination Epitaxy Growth - A method for forming a semiconductor structure includes forming a gate stack over a semiconductor substrate in a wafer; forming a recess in the semiconductor substrate and adjacent the gate stack; and performing a selective epitaxial growth to grow a semiconductor material in the recess to form an epitaxy region. The step of performing the selective epitaxial growth includes performing a first growth stage with a first growth-to-etching (E/G) ratio of process gases used in the first growth stage; and performing a second growth stage with a second E/G ratio of process gases used in the second growth stage different from the first E/G ratio. | 11-20-2014 |
20140367768 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF - A method for fabricating a semiconductor device includes forming an isolation feature in a substrate, forming a gate stack over the substrate, forming a source/drain (S/D) recess cavity in the substrate, where the S/D recess cavity is positioned between the gate stack and the isolation feature. The method further includes forming an epitaxial (epi) material in the S/D recess cavity, where the epi material has an upper surface which including a first crystal plane. Additionally, the method includes performing a redistribution process to the epi material in the S/D recess cavity using a chlorine-containing gas, where the first crystal plane is transformed to a second crystal plane after the redistribution. | 12-18-2014 |
20150191820 | INJECTOR FOR FORMING FILMS RESPECTIVELY ON A STACK OF WAFERS - An injector for forming films respectively on a stack of wafers is provided. The injector includes a plurality of hole structures. Every adjacent two of the wafers have therebetween a wafer spacing, and each of the wafers has a working surface. The hole structures respectively correspond to the respective wafer spacings. The working surface and a respective hole structure have therebetween a parallel distance. The parallel distance is larger than a half of the wafer spacing. A wafer processing apparatus and a method for forming films respectively on a stack of wafers are also provided. | 07-09-2015 |
20150279632 | DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE - A device includes a pedestal. The pedestal includes a ground electrode, a central portion, and a peripheral portion. The ground electrode includes a top surface from which the peripheral portion is projected, thereby having a height difference between the central portion and the peripheral portion. | 10-01-2015 |
20150296564 | WAFER HOLDER WITH TAPERED REGION - An apparatus, a system and a method are disclosed. An exemplary method includes providing a wafer process chamber and a plurality of radiant heat elements under the wafer process chamber, receiving a wafer holder configured to be used in the wafer process chamber, and processing a wafer located on the wafer holder in the wafer process chamber. The wafer holder includes: a wafer contact portion including an upper surface and a lower surface, an exterior portion including an upper surface and a lower surface, and a tapered region formed in the wafer contact portion. | 10-15-2015 |
Yi-Hung Lin, Hsinchu TW
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20130298972 | OPTOELECTRONIC DEVICE AND THE MANUFACTURING METHOD THEREOF - A method for manufacturing an optoelectronic device includes steps of: providing an optoelectronic structure; forming a first contact layer having a pattern on the upper surface of the optoelectronic structure; forming a dielectric layer on the first contact layer and the optoelectronic structure; removing the dielectric layer on the first contact layer; and forming an electrode structure on the first contact layer. | 11-14-2013 |
20140001509 | OPTOELECTRONIC SEMICONDUCTOR DEVICE AND THE MANUFACTURING METHOD THEREOF | 01-02-2014 |
20140150858 | OPTOELECTRONIC DEVICE AND THE MANUFACTURING METHOD THEREOF - An optoelectronic device comprises an optoelectronic semiconductor stack layer; a conductive layer on the optoelectronic semiconductor stack layer, the conductive layer comprising a top surface, a bottom surface opposite to the top surface, and a side surface; a first barrier layer covering the top surface; a second barrier layer covering the bottom surface; and a first metal oxide layer, wherein the first metal oxide layer covers the side surface, the first barrier layer, and the second barrier layer. | 06-05-2014 |
20140196782 | METHOD FOR MAKING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MADE THEREBY - Disclosed is a method for yield enhancement of making a semiconductor device. The method for yield enhancement of making a semiconductor device comprises the steps of: providing the semiconductor device comprising an epitaxial layer including a defect; forming a dielectric layer on the epitaxial layer; detecting and identifying a location of the defect; and etching the dielectric layer and leaving a part of the dielectric layer to cover an area substantially corresponding to the detected defect. The semiconductor device made by the method is also disclosed. | 07-17-2014 |
20150034155 | OPTOELECTRONIC DEVICE AND THE MANUFACTURING METHOD THEREOF - An optoelectronic device includes: a semiconductor stack including an upper surface and a side surface; a first electrode formed on the upper surface of the semiconductor stack; a first anti-reflection structure formed on the first electrode and the upper surface; and a second anti-reflection structure different from the first anti-reflection structure formed on the side surface. | 02-05-2015 |
20150222094 | LIGHT-EMITTING ARRAY - A light-emitting array comprises a plurality of light-emitting elements, wherein each of the plurality of light-emitting elements comprises a first semiconductor stack; and a plurality of bridge structures connected to the plurality of light-emitting elements, wherein the plurality of light-emitting elements are spaced apart by the plurality of bridge structures, wherein each of the plurality of bridge structures comprise a second semiconductor stack which has the same epitaxial stack as the first semiconductor stack. | 08-06-2015 |
Yi-Hung Lin, Zhubei City TW
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20150147722 | BIONIC FIXING APPARATUS - A bionic fixing apparatus is provided. The bionic fixing apparatus includes a flexible portion having at least one trench. The trench is disposed on the surface of the flexible portion and has a first end and a second end. An interval is disposed between the first end and the second end. The trench is disposed for spreading the stress applied on the bionic fixing apparatus and preventing stress concentration and stress shielding. | 05-28-2015 |
20150150557 | BIONIC FIXING APPARATUS AND APPARATUS FOR PULLING OUT THE SAME - A bionic fixing apparatus is provided. The bionic fixing apparatus includes a body having a through hole and at least one slit. The through hole penetrates the body from the top surface to the bottom surface to form a top opening and a bottom opening. An inner diameter of the top opening is larger than an inner diameter of the bottom opening. The slit is connected to the bottom opening and extends upwardly from the bottom surface of the body, such that the body has a flexible bottom portion. | 06-04-2015 |
20150150614 | BIONIC FIXING APPARATUS - A bionic apparatus is provided. The bionic apparatus includes a flexible portion having a plurality of pores, a rigid portion connected with the flexible portion, and a supporting element disposed in the flexible portion. The pore size of each pore is between 50 μm to 500 μm. The flexible portion, the rigid portion and the supporting element are one-piece formed by a additive manufacturing process. | 06-04-2015 |
Yi-Hung Lin, New Taipei City TW
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20150273794 | PREPREG ELEMENT WITH IMPROVED STRUCTURE - A prepreg element with improved structure comprises at least two layers of filament sheet that are stacked on top of each other, wherein each layer of filament sheet is filled with materials having a linear pattern in a unitary orientation in horizontal plane, and is further coated with resin on its surface; when stacked up, two layers of filament sheet that are adjacent to each other have the linear patterns in different orientations; the at least two layers of filament sheet with different orientations is subsequently processed through coating, yarn expanding and laminating to provide tensile strength in multiple orientations in horizontal plane, and increase the overall structural strength with no extra thickness being added to the material, nor is added to overall appearance of the prepreg element, so as to achieve the improvement of structural strength and toughness without adding extra thickness. | 10-01-2015 |
Yi-Hung Lin, Taichung City TW
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20120272793 | RATCHET WRENCH - A ratchet wrench includes a handle; a wrench head comprising a first cavity and a second cavity communicating therewith; a drive gear and socket combination rotatably disposed in the first cavity and comprising surface teeth; a reversing pawl comprising pawl teeth on one surface, the pawl teeth meshed with the teeth of the drive gear and socket; a pivotal unit pivotably disposed in the second cavity, the pivotal unit urging against the other surface of the reversing pawl and being adapted to reciprocally pivot about the reversing pawl; and a reversing button assembly moveably disposed on the wrench hand and aligned with an axial direction of the handle. The reversing button assembly is adapted to manually move along a straight line to activate the pivotal unit which pivots the reversing pawl so as to permit the drive gear and socket combination to rotate clockwise or counterclockwise. | 11-01-2012 |
20130240391 | TOOL HANDLE AND TOOL BOX COMPRISING THE SAME - A tool box of the present invention comprises a tool handle, a case, and cap. The tool handle comprises a housing, a battery assembly, a luminous source, and a conductive element. The luminous source comprises a first leg and a second leg. One of the anode and the cathode electrically connects to the first leg. A top surface of the cap is formed with an engaging groove. The housing of the tool handle engages in the engaging groove. Wherein either the other one of the anode and the cathode or the second leg electrically connects to the conductive element when a tool inserts to the housing and pushes the conductive element to move to the second position. As such, the tool handle can turn on and off the luminous without disposing any switch. An interior of the case has enough space for receiving tools. | 09-19-2013 |
Yi-Hung Peng, Miaoli TW
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20130212368 | DATA PROTECTING METHOD, MEMORY CONTROLLER AND MEMORY STORAGE DEVICE - A data protecting method for a rewritable non-volatile memory module having a first storage area and a second storage area and a memory controller and a memory storage device using the same are provided. The method includes providing default configuration information in response to a boot command from a host system, wherein the host system cannot recognize the second storage area according to the default configuration information. The method also includes requesting the host system to re-boot when a user identification code and a user password receiving from the host system pass an authentication procedure, and providing first configuration information to the host system after re-booting the host system. The host system can recognize the second storage area according to the first configuration information. Accordingly, the method can effectively protect data stored in the rewritable non-volatile memory module. | 08-15-2013 |
Yi-Hung Tsai, Dashu Township TW
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20110260292 | Bipolar Junction Transistor Having a Carrier Trapping Layer - A bipolar junction transistor having a carrier trapping layer, comprises a semi-conductor substrate including a well with a first type ions formed thereon; two impurity regions with a second type ions formed opposite with each other over the well; an insulation layer over the well, and edges extend over the second two impurity regions; and a carrier trapping layer formed over the insulation layer. | 10-27-2011 |
Yi-Hung Tsai, Tu Cheng City TW
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20090293984 | Hand Tool - This invention relates to a hand tool capable of clipping wires of different diameters. The hand tool of the present invention comprises a main body, at least one first clipping piece, at least one second clipping piece, and at least one elastic element. The at least one first clipping piece is pivoted to the main body, and the at least one first clipping piece forms a first clipping area. The at least one second clipping piece, which is stacked next to the at least one first clipping piece, is pivoted to the main body, and the at least one second clipping piece forms a second clipping area that is different from the first clipping area. The at least one elastic element provides clipping force to the at least one first clipping piece. By the above structure, a wire can be clipped at the first clipping area or at the second clipping area. | 12-03-2009 |
Yi-Hung Tsai, Hsinchu City TW
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20140084374 | CELL DESIGN - One or more techniques or systems for designing a cell are provided. The cell generally includes one or more transistors, such as a pass gate transistor, a pull up transistor, or a pull down transistor, respectively associated one or more gate to gate distances. In some embodiments, a second gate to gate distance is selected based on a first gate to gate distance. For example, the first gate to gate distance and the second gate to gate distance are associated with a first transistor. In another example, the first gate to gate distance is associated with a first transistor and the second gate to gate distance is associated with a second transistor. In this manner, a cell design is provided to improve a static noise margin (SNM) or a write margin (WM) for the cell, for example. | 03-27-2014 |
Yi-Hung Tsai, Taichung City TW
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20150362056 | HARMONIC DRIVE ACHIEVING A HIGH MESHING EFFICIENCY - A harmonic drive includes a circular spline, a flexspline meshed with the circular spline, and a wave generator abutted against the flexspline. Through a special parameter design to correct the perimeter curve of the wave generator, the meshing efficiency between the circular spline and the flexspline is increased, thereby improving the transmission accuracy and reducing the average load. | 12-17-2015 |
Yi-Hung Tseng, San Diego, CA US
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20150364170 | DISTRIBUTED CLOCK SYNCHRONIZATION - A memory controller is provided that drives data and a corresponding first data strobe to a plurality of endpoints. Each endpoint is configured to register the received data from the memory controller responsive to the first data strobe and then to re-register the received data responsive to a second data strobe. A clock synchronization circuit functions to keep the received first data strobe at one of the endpoints sufficiently synchronous with the second data strobe. | 12-17-2015 |
Yi-Hung Wu, Taipei City TW
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20100047452 | CAPILLARY COATING DEVICES AND METHODS - A discontinuous capillary coating device. At least one capillary tube is filled with a coating material. At least one coating substrate receives a liquid coating film. At least one capillary tube holder holds the capillary tube, guiding movement of the capillary tube. At least one traversing mechanism drives the capillary tube holder or coating substrate to move. | 02-25-2010 |
Yi-Hung Yu, New Taipei City TW
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20150087185 | ACCESSORY CONNECTOR - An accessory connector generally includes a plurality of metal conductive terminals, which is arranged not to contact each other so as to form individual pins; a first insertion port, which is formed at one end of the accessory connector; and a second insertion port, which is formed at an opposite end of the accessory connector and is in electrical connection with the first insertion port. The first and second insertion ports can be respectively in a plug form or a socket form. When it is desired to make a conversion into a different type of insertion port, the conversion can be achieved through electrical connection of the first insertion port to the second insertion port via the metal conductive terminals so as to achieve the purpose of conversion of connector. | 03-26-2015 |
20150091380 | POWER CONVERSION DEVICE WITH MULTIPLE INTERFACES - A power conversion device with multiple interfaces generally includes at least one multiple-in-one connector, at least one circuit board, and a power supply module. The multiple-in-one connector and the power supply module are electrically connected to the circuit board. The power supply module satisfies the standard of an electric main socket or an automobile socket. Further, the multiple-in-one connector can be of a multiple-in-one connector that has a single plugging port and includes a USB interface combined with a card type interface or a signal connector interface or alternatively simultaneously combined with a battery module, a storage module, and a wireless transmission module to achieve an advantage of having multiple interfaces. | 04-02-2015 |
20150099382 | MULTIPLE-IN-ONE INTERFACE CONNECTOR - A multiple-in-one interface connector includes a shielding casing, an insulation body received in the shielding casing, a micro card receiving zone formed on a surface of the insulation body and a micro USB connection zone, a card ejection bar movably arranged at one side of the insulation body, and a card ejector rotatably mounted to the insulation body and operatively coupled to the card ejection bar. The insulation body includes a micro card receiving port and a micro USB connection port respectively in the micro card receiving zone and the micro USB connection zone. A micro card and a micro USB male connector can be respectively inserted to the micro card receiving zone and the micro USB connection port. To eject the micro card, the card ejection bar is pushed to move the card ejector so as to eject the micro card out of the micro card receiving zone. | 04-09-2015 |