Patent application number | Description | Published |
20080211529 | INTEGRATED CIRCUIT FOR BEING APPLIED TO ELECTRONIC DEVICE, AND ASSOCIATED TESTING SYSTEM - An integrated circuit (IC) for being applied to an electronic device includes: a control circuit for controlling the electronic device; and a signal generation unit coupled to the control circuit for generating at least one signal inside the IC as an output signal and outputting the output signal to another IC for testing. A testing system includes at least one testing device and a plurality of ICs that are tested by the testing device. The ICs are coupled to the testing device. Each IC of the ICs is for being applied to an electronic device and includes: a control circuit for controlling the electronic device; and a signal generation unit coupled to the control circuit for generating at least one signal inside the IC as an output signal and outputting the output signal to one of the other IC(s) for testing. | 09-04-2008 |
20080237321 | Storage Box that is Foldable When Not in Use - A storage box includes a flexible box body, a hard support board removably mounted in the box body to support the box body, and a cover removably mounted on the box body. The support board is receivable into the cover, and the box body is foldable when being compressed and receivable into the cover. Thus, the support board and the box body are received in the hollow inside of the cover to reduce the volume of the storage box to the minimum size so that the storage box has a smaller volume when not in use, thereby greatly saving the space of storage, and thereby facilitating packaging, storage and transportation of the storage box. | 10-02-2008 |
20080270634 | Management of Transfer of Commands - An optical storage device that includes a memory and a controller. The memory includes a command queue to store advanced technology attachment (ATA) commands sent by a host device. The controller executes the commands, in which at least a subset of the commands are executed in a sequence that is different from a sequence in which the commands are sent by the host device. | 10-30-2008 |
20080270657 | Management of Transfer of Commands - An optical storage device that includes a memory and a controller. The memory includes a command queue to store advanced technology attachment (ATA) commands sent by a host device. The controller executes the commands, in which at least a subset of the commands are executed in a sequence that is different from a sequence in which the commands are sent by the host device. | 10-30-2008 |
20080301358 | Electronic device that Downloads Operational Firmware from an External Host - An electronic device comprises an interface unit, a control circuit and a microprocessor. The interface unit receives a first operational firmware from a host. The control circuit transfers the first operational firmware to a memory. The microprocessor executes the first operational firmware which stored in the memory. The microprocessor controls operations of the electronic device according to the first operational firmware. And the control circuit is electrically coupled to a non-volatile memory which stores a second operational firmware for performing a specific function also performed by the first operational firmware. | 12-04-2008 |
Patent application number | Description | Published |
20110255225 | ELECTRONIC DEVICE WITH BIAXIAL PIVOTING MECHANISM - An electronic device includes a first housing, a first pivoting mechanism disposed on a side of the first housing, a second housing, a second pivoting mechanism disposed on a side of the second housing, and a bridging component. A first end and a second end of the bridging component are respectively pivoted on the first pivoting mechanism and the second pivoting mechanism. The bridging component includes a first contacting portion for contacting against the side of the first housing when the first pivoting mechanism pivots on the first end so that the first housing rotates around the second housing at a first angle, and a second contacting portion for contacting against the side of the second housing when the second end pivots on the second pivoting mechanism so that the first housing rotates around the second housing at a second angle greater than the first angle. | 10-20-2011 |
20130099680 | LIGHT SOURCE DRIVING DEVICE - A light source driving device includes a light source unit, a driving unit, a voltage converting unit, a detecting unit, and a feed-back control unit. The driving unit is used to receive an input signal, and convert the input signal to a driving signal for output according to an enable signal and a feed-back signal. The voltage converting unit is used to convert the driving signal to a driving voltage, so as to output the driving voltage to a first end of the light source unit. The detecting unit is coupled to a second end of the light source unit, and used to detect an output current of the light source unit, so as to generate a detecting voltage. The feed-back control unit generates the feed-back signal according to the detecting voltage and a pulse width modulation signal. | 04-25-2013 |
20150010172 | THROAT VIBRATION AUDIO WIRELESS TRANSMISSION APPARATUS - A throat vibration audio wireless transmission apparatus comprises a body, a throat vibration detection module and a wireless transmission module. The body includes a cap, a flexible base and a deformation holding member. The cap has multiple cover portions and at least one elastic bending portion bridging two neighboring cover portions. The deformation holding member can be pushed by forces to form an arched shape and drive the flexible base and cap to bend to allow the elastic bending portion to extend towards the cover portions at two sides thereof. The throat vibration detector detects a vibration wave and converts to an electric signal. The control circuit board receives the electric signal and converts to an audio signal which is then transmitted by the wireless transmission module. The apparatus can be adjusted according to a user's neck and attached thereon closely to receive sound without being interfered by environment. | 01-08-2015 |
Patent application number | Description | Published |
20100066250 | COMBINATION EMERGENCY LIGHT AND NIGHTLIGHT - A light device includes a nightlight unit adapted to operate in an automatic mode, an on mode, or an off mode; an illumination unit comprising a sensor, the illumination unit being removably secured to the nightlight unit; and a charging unit for charging the illumination unit. The lighting unit is adapted to come on automatically by operating in the automatic mode, continuously emit light by operating in the on mode, or stop emitting light by operating in the off mode. The illumination unit is adapted to come on automatically to emit light either when the sensor senses an activating condition in the form of an absence of AC or after removing from the nightlight unit. The sensor is adapted to disable the illumination unit either when sensing a termination of the activating condition or after placing the illumination unit in the nightlight unit and electrically connecting thereto. | 03-18-2010 |
20100067213 | EMERGENCY LIGHT WITH A ROTATABLE ELECTRICAL PLUG - An emergency light includes a charging unit comprising a housing, a prong support rotatably secured to the housing, and a prong assembly fixedly secured to the prong support and being adapted to mate with a conventional electrical outlet; an illumination unit releasably disposed in the housing to be electrically connect to the charging unit; and a lamp indicator unit electrically connected to the charging unit and comprising a plurality of LEDs for indicating a charging state of the illumination unit. The rotation of the prong support, i.e., the prong assembly, is 90 degrees, 180 degrees, or 270 degrees. The illumination unit can be used as a flashlight after removing from the housing. | 03-18-2010 |
Patent application number | Description | Published |
20120280129 | DUAL FUNCTION INJECTION TYPE ARRAY READOUT DEVICE AND CIRCUIT AND DUAL FUNCTION READOUT MODULE - A dual function injection type array readout device includes at least two sensor groups and a dual function injection type array readout circuit. Each sensor group has two sensors of different functions, and each sensor generates a sense current according to a corresponding sensed target. The dual function injection type array readout circuit includes at least two dual function readout modules, each having two readout units, each electrically coupled to a respective sensor of a corresponding sensor group. Each readout unit includes a current-to-voltage converter having an integration capacitor, and a sample-and-hold device electrically coupled to the current-to-voltage converter. A switch unit is electrically coupled to the integration capacitors of the readout units. | 11-08-2012 |
20140197878 | SWITCHABLE READOUT DEVICE - A readout device is adapted for dual-band sensing, and includes an amplifier, two direct injection (DI) readout circuits to be respectively connected to two sensors, and a switching module. Through operation of the switching module, one of the DI readout circuits can be electrically connected to the amplifier, and cooperate with the other DI readout circuit to achieve a dual-band sensing feature. | 07-17-2014 |
20150014534 | SWITCHABLE READOUT DEVICE - A readout device is adapted for dual-band sensing, and includes an amplifier, two direct injection (DI) readout circuits to be respectively connected to two sensors, and a switching module. Through operation of the switching module, one of the DI readout circuits can be electrically connected to the amplifier, and cooperate with the other DI readout circuit to achieve a dual-band sensing feature. | 01-15-2015 |
20150145539 | READOUT DEVICE, DUAL-FUNCTION READOUT DEVICE, AND DETECTING CIRCUIT THEREOF - A readout device includes a plurality of detecting circuits arranged in rows and columns to form a detecting array, and an output module. Each of the detecting circuits includes two transistors for generating a detection signal associated with impedance at a target site. Through selection of the rows and the columns of the detecting circuits, the output module outputs an output voltage signal having a magnitude positively correlated with magnitude of a selected one of the detection signals received from the detecting circuits. | 05-28-2015 |
20150153231 | DUAL-SWITCHING SENSING DEVICE, AND DUAL-FUNCTION SWITCHING CIRCUIT THEREOF - A dual-switching sensing device includes two sensor modules and a dual-function switching circuit with an operational amplifier and two integrator modules. Each of the integrator modules includes a transistor, an integrator capacitor and a switching unit. Through control of the switching unit, each of the integrator modules may operate in different modes, so that the dual-switching sensing device may be used to sense different targets. | 06-04-2015 |
Patent application number | Description | Published |
20140042625 | BONDING LAYER STRUCTURE AND METHOD FOR WAFER TO WAFER BONDING - A structure comprises a first semiconductor substrate, a first bonding layer deposited on a bonding side the first semiconductor substrate, a second semiconductor substrate stacked on top of the first semiconductor substrate and a second bonding layer deposited on a bonding side of the second semiconductor substrate, wherein the first bonding layer is of a horizontal length greater than a horizontal length of the second semiconductor substrate, and wherein there is a gap between an edge of the second bonding layer and a corresponding edge of the second semiconductor substrate. | 02-13-2014 |
20140220735 | Method and Apparatus for a Wafer Seal Ring - A wafer seal ring may be formed on a wafer having a pattern structure with a pattern density. The wafer seal ring pattern structure may include a plurality of lines having a width and a spacing that may be approximately equal to a width and a spacing of die bond rings on the wafer. The wafer having the wafer seal ring formed thereon may be bonded to a wafer that may not have a wafer seal ring. A pair of wafers may be formed with respective wafer seal rings formed in a corresponding manner. The pair of wafers may be bonded together with the wafer seal rings aligned and bonded together to form a seal ring structure between the bonded wafers. | 08-07-2014 |
20140231967 | SYSTEMS AND METHODS FOR POST-BONDING WAFER EDGE SEAL - A method for fabricating a semiconductor device is disclosed. A first substrate is arranged over a second substrate. A wafer bonding process is performed on the semiconductor device. First regions of the device are enclosed by the bonding process. Second regions of the device remain exposed. One or more processes are performed on the exposed second regions, after performing the wafer bonding process. The one or more processes include a fill process that forms a fill material within the exposed second regions. An edge seal material is applied on the first and second substrates after performing the one or more processes. | 08-21-2014 |
20150123129 | WAFER LEVEL PACKAGING TECHNIQUES - In a wafer level chip scale packaging technique for MEMS devices, a deep trench is etched on a scribe line area between two CMOS devices of a CMOS substrate at first. After bonding of the CMOS substrate with a MEMS substrate, the deep trench is opened by thin-down process so that CMOS substrate is singulated while MEMS substrate is not (partial singulation). Electrical test pad on MEMS substrate is exposed and protection material can be filled through the deep trench around bonding layers. After filling the protection material, the wafer is diced to form packaged individual chips with protection from environment outside bonding layer. | 05-07-2015 |
20150197419 | MEMS DEVICES AND METHODS FOR FORMING SAME - An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors. | 07-16-2015 |
20150251900 | SEMICONDUCTOR ARRANGEMENT WITH STRESS RELEASE CONFIGURATION - Among other things, one or more semiconductor arrangements and techniques for forming such semiconductor arrangements are provided herein. A semiconductor arrangement comprises a cap wafer, a microelectromechanical systems (MEMS) wafer, and a complementary metal-oxide-semiconductor (CMOS) wafer. The cap wafer comprises a first spring structure and the MEMS wafer comprises a second spring structure. The first spring structure and the second spring structure relieve stress as portions of the semiconductor arrangement, such as a membrane and a poly layer, move. An ambient pressure chamber is formed between the CMOS wafer and the MEMS wafer as a thermal insulation air gap to protect the MEMS wafer from heat originating from the CMOS wafer. The ambient pressure chamber is connected to ambient air, such as for CMOS outgassing relief. | 09-10-2015 |
20150251901 | SEMICONDUCTOR ARRANGEMENT WITH STRESS RELEASE AND THERMAL INSULATION - Among other things, one or more semiconductor arrangements and techniques for forming such semiconductor arrangements are provided herein. A semiconductor arrangement comprises a cap wafer, a microelectromechanical systems (MEMS) wafer, and a complementary metal-oxide-semiconductor (CMOS) wafer. The cap wafer comprises one or more spring structures, such as a first spring structure and a second spring structure. The first spring structure and the second spring structure relieve stress as portions of the semiconductor arrangement, such as a membrane and a poly layer, move. An ambient pressure chamber is formed between the CMOS wafer and the MEMS wafer, such as for CMOS outgassing relief. One or more thermal insulator structures are formed between the CMOS wafer and the MEMS wafer to protect the MEMS wafer from heat originating from the CMOS wafer. | 09-10-2015 |
20150274513 | SEMICONDUCTOR ARRANGEMENT WITH THERMAL INSULATION CONFIGURATION - Among other things, one or more semiconductor arrangements and techniques for forming such semiconductor arrangements are provided herein. A semiconductor arrangement comprises a cap wafer, a microelectromechanical systems (MEMS) wafer, and a complementary metal-oxide-semiconductor (CMOS) wafer. The MEMS wafer comprises a thermal insulator air gap formed between a sensing layer and a membrane. An ambient pressure chamber is formed between the CMOS wafer and the membrane of the MEMS wafer. The ambient pressure chamber is configured as a second thermal insulator air gap. The thermal insulator air gap and the second thermal insulator air gap protect portions of the semiconductor arrangement, such as the MEMS wafer, from heat originating from the CMOS wafer, which can otherwise damage such portions of the semiconductor arrangement. In some embodiments, one or more buffer layers are formed over the cap wafer as stress buffers. | 10-01-2015 |
20150329351 | Vacuum Sealed MEMS and CMOS Package - A vacuum sealed MEMS and CMOS package and a process for making the same may include a capping wafer having a surface with a plurality of first cavities, a first device having a first surface with a second plurality of second cavities, a hermetic seal between the first surface of the first device and the surface of the capping wafer, and a second device having a first surface bonded to a second surface of the first device. The second device is a CMOS device with conductive through vias connecting the first device to a second surface of the second device, and conductive bumps on the second surface of the second device. Conductive bumps connect to the conductive through vias and wherein a plurality of conductive bumps connect to the second device. The hermetic seal forms a plurality of micro chambers between the capping wafer and the first device. | 11-19-2015 |
20160002027 | SEMICONDUCTOR DEVICE WITH THROUGH MOLDING VIAS AND METHOD OF MAKING THE SAME - A method of forming a semiconductor device includes bonding a capping wafer and a base wafer to form a wafer package. The base wafer includes a first chip package portion, a second chip package portion, and a third chip package portion. The capping wafer includes a plurality of isolation trenches. Each isolation trench of the plurality of isolation trenches is substantially aligned with a corresponding trench region of one of the first chip package portion, the second chip package portion or the third chip package portion. The method also includes removing a portion of the capping wafer to expose a first chip package portion contact, a second chip package portion contact, and a third chip package portion contact. The method further includes separating the wafer package into a first chip package configured to perform a first operation, a second chip package configured to perform a second operation, and a third chip package configured to perform a third operation. | 01-07-2016 |