Yi-Chang
Yi-Chang Chan, San Chung City TW
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20090300847 | Automobile windshield installation device - The present invention is an automobile windshield installation device, two of which can be operated by a single operator to install or dismantle a windshield by two sucking discs in a DIY way. A single installation device includes a main rod, two extension tubes, an extension rod, three positioning seats, a branch tube and a grip device. A lower end of the main rod can be provided with a stand to support the installation device, the extension tubes and the extension rod can ascend or descend depending on practical needs, and the sucking disc at a side of the grip device can attach the windshield. | 12-10-2009 |
20100000038 | Multi-functional cleaning and neatening tool - A multi-functional cleaning and neatening tool includes a body which is easy to carry and operate. Below the body is connected with a wipe board. In a normal day, a bottom lid is covered on the wipe board and can be removed when cleaning or neatening an automobile. In collaboration with different cleaning solution in the body and the wipe board of a variety of material, scratches on a body or glass of the automobile can be dealt with, the automobile can be waxed or washed with bubbles. | 01-07-2010 |
Yi-Chang Chang, Yuanlin TW
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20090268718 | COMMUNICATION METHOD AND SYSTEM OF INTERNET - An Internet communication system including a first access point, a second access point, a first caller and a first callee is provided. The first access point and the second access point are respectively located in a first LAN and a second LAN. The first caller, having a probing-based mechanism, accesses the Internet via the first access point and has voice packets with a first transmission priority. The first callee accesses the Internet via the second access point. The first caller transmits a simulation packet to the first callee for probing a transmission quality of an end-to-end transmission path of the first caller and the first callee to determine whether to invite the first callee to communicate via the Internet. | 10-29-2009 |
Yi-Chang Chang, Hsin-Chu TW
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20140210069 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - The present invention discloses a chip package and a manufacturing method thereof. The chip package includes: a semiconductor chip having an upper surface and a lower surface opposite to each other; a metal heat conductive layer formed on the lower surface, for conducting or absorbing heat generated by the semiconductor chip; and a bond pad formed on the upper surface, for electrically connecting to a circuit in the semiconductor chip. | 07-31-2014 |
Yi-Chang Chang, Hsin-Chu County TW
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20150325616 | FRONT SIDE ILLUMINATED SEMICONDUCTOR STRUCTURE WITH IMPROVED LIGHT ABSORPTION EFFICIENCY AND MANUFACTURING METHOD THEREOF - There is provided a front side illuminated (FSI) semiconductor structure with improved light absorption efficiency which is configured to provide a reflecting layer on a bottom of the FSI semiconductor structure to enhance the light absorption efficiency, wherein the reflecting layer is manufactured in the packaging process or the semiconductor process. | 11-12-2015 |
Yi-Chang Chen, Taoyuan County TW
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20120101780 | Method of Measuring Radiation Doses on Different Directions - The present disclosure measures radiation doses on different directions. A partition is used, which has a certain attenuation ratio. With the partition, radiation doses on different directions can be determined without knowing the thickness or material of the partition. | 04-26-2012 |
Yi-Chang Chen, Hsinchu County TW
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20110267572 | ACTIVE DEVICE ARRAY SUBSTRATE - An active device array substrate includes a substrate, first scan lines, second scan lines, data lines, display units and a meshed common line. The first and second scan lines are alternately arranged on the substrate. Each of the display units is respectively located between two adjacent data lines and respectively includes a first pixel and a second pixel, wherein the first pixel is electrically connected to one of the first scan lines, the second pixel is electrically connected to one of the second scan lines, and the first and second pixels are respectively electrically connected to a different data line. In addition, the meshed common line includes ring-shaped patterns, wherein each ring-shaped pattern includes two semi-ring-shaped patterns connected to each other and respectively located at both sides of a single data line, and the two semi-ring-shaped patterns of a same ring-shaped pattern are respectively located under different display units. | 11-03-2011 |
Yi-Chang Chen, New Taipei City TW
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20140363372 | METHODS FOR SUPPRESSING CANCER BY INHIBITION OF TMCC3 - A method for treating cancer includes administering to a subject in need thereof an antibody against a transmembrane and coiled-coil domains protein 3 (TMCC3), wherein the antibody binds to an epitope in an extracellular domain of TMCC3. The antibody binds to an epitope in an intercoil domain of TMCC3. A method of diagnosing or assessing a cancer condition includes assessing a level of expression or activity of a transmembrane and coiled-coil domains protein 3 (TMCC3) in a sample, wherein an increase in the level of expression of activity of TMCC3 as compared to a standard indicates the presence of cancer stem cells in the sample. | 12-11-2014 |
Yi-Chang Chen, Hsinchu City TW
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20100254459 | INTRA PREDICTION MODE SELECTING APPARATUS AND METHOD THEREOF - An intra prediction mode selecting method is disclosed. First, a compress profile and a frame resolution of a frame data are received. Next, a plurality of corresponding prediction modes are selected according to the compress profile and the frame resolution, and the selected prediction modes are scheduled for sequentially calculating a plurality of corresponding cost functions. Finally, the cost functions are compared to select one of the prediction modes to serve as a prediction mode of the frame data. | 10-07-2010 |
20110295610 | METHOD FOR CONFIGURING INSTALLATION CAPACITIES OF HYBRID ENERGY GENERATION SYSTEM - A method for installation capacities of a hybrid energy generation system is disclosed. The hybrid energy generation system may include a plurality of power systems. According to the environment factors and practical requirements of the installation site, the mechanism of the present invention may find the golden ratio of the installation capacities among the different power systems. Furthermore, the present invention may obtain the combination of installation capacities associated with the minimum recovery period, thereby further decreasing the installation cost and the efficiency of the hybrid energy generation system. | 12-01-2011 |
20160049736 | ANTENNA APPARATUS AND THE MIMO COMMUNICATION DEVICE USING THE SAME - The present invention discloses an antenna apparatus. The antenna apparatus includes a first antenna array and a second antenna array. The first antenna array includes multiple first radiating elements for transmitting radio signals of a first frequency. The second antenna array includes multiple second radiating elements for transmitting radio signals of a second frequency, wherein the first and second radiating elements are arranged in a staggered manner; wherein each of the first radiating elements is disposed between two of the second radiating elements; and wherein each of the second radiating elements is disposed between two of the first radiating elements. | 02-18-2016 |
Yi-Chang Chen, Zhonghe City TW
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20110073186 | TARGET FOR A SPUTTERING PROCESS FOR MAKING A COMPOUND FILM LAYER OF A THIN SOLAR CELL, METHOD OF MAKING THE THIN FILM SOLAR CELL, AND THIN FILM SOLAR CELL MADE THEREBY - A target adapted for a sputtering process for making a compound film layer of a thin film solar cell includes a composition having a formula of CuB | 03-31-2011 |
Yi-Chang Chen, Taipei City TW
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20120131493 | COMPUTER INFORMATION DISPLAY METHOD AND COMPUTER SYSTEM USING THE SAME - A computer system and a computer information display method thereof are provided. In the method, a computer information management unit stores computer information of an application program in a storage unit. During a system login process of the computer system, a processing unit reads the computer information form the storage unit, and displays the computer information and a login dialog on a screen unit. | 05-24-2012 |
20120213272 | METHOD AND SYSTEM FOR ADJUSTING VIDEO AND AUDIO QUALITY OF VIDEO STREAM - In a method for adjusting video or audio quality of a video stream, a video stream request for requesting an original target video stream from a client is received. Then, information about a connection bandwidth of the client is obtained, and a step is performed for determining if the connection bandwidth of the client is sufficient for receiving the target video stream. When it is determined that the connection bandwidth of the client is insufficient, at least one video or audio parameter is selected according to the information about the connection bandwidth of the client to adjust and reduce the video or audio quality of the target video stream, and the quality-reduced target video stream is transmitted to the client. Information about connection bandwidth of the client is continually obtained for transmitting all of the target video stream to the client. | 08-23-2012 |
20120233451 | METHOD FOR FAST RESUMING COMPUTER SYSTEM AND COMPUTER SYSTEM - A method for fast resuming a computer system from a shutdown state is provided. The computer system comprises a basic input output system (BIOS), a system memory and a storage device storing a system memory data of the system memory and a used system memory block address table before the computer system enters the shutdown state. The method comprises receiving a starting signal for power supplying the computer system and starting the storage device. A fast boot built-in program of the BIOS is started and, according to the used system memory block address table, the fast boot built-in program sequentially reads the stored system memory data from the storage device and writes the read system memory data into the system memory with a use of an optimized read-and-write block size as a read-and-write unit. The computer system enters a suspended state and is resumed from the suspended state. | 09-13-2012 |
20130162503 | DUAL DISPLAY STRUCTURE - A dual display structure including a light source, a light guide plate, a first display module and a second display module is provided. The light guide plate includes a light incident surface, a first light exiting surface and a second light exiting surface. The first and second display modules are respectively disposed at one side of the first and second exiting surfaces in parallel and back to each other. Light emitted from the light source enters the light guide plate through the light incident surface and emits to the first display module and the second display module through the first light exiting surface and the second light exiting surface. | 06-27-2013 |
20130314884 | ASSEMBLING METHOD OF DISPLAY DEVICE AND DISPLAY DEVICE - An assembling method of a display device and a display device are provided. The assembling method of the display device includes following steps: providing a first frame, wherein a first display module is disposed at the first frame; providing a bracket, wherein the bracket includes a positioning structure and a second display module is disposed at the bracket; and assembling the bracket and the first frame together via the positioning structure, so that the first display module and the second display module are partly overlapped. | 11-28-2013 |
20140045220 | COMPOSITION FOR BIOSAMPLE TREATMENT AND METHOD FOR NUCLEIC ACID AMPLIFICATION USING THE SAME - A composition for a biosample treatment and method for nucleic acid amplification using the same are provided. The composition for biosample treatment includes at least one halocarbon, at least one polyether and at least one surfactant. The composition contains 1˜70% by weight of the halocarbon based on the total weight of the composition. Accordingly, a biosample can be lysed and homogenized in a single tube at one step. Furthermore, reagents for use in nucleic acid amplification can be directly added in the same tube for nucleic acid amplification at the next step. The process, operation periods and risks of contamination can be therefore reduced and a result of nucleic acid amplification with less background noises can be therefore obtained as well. | 02-13-2014 |
20140046050 | METHOD FOR ISOLATING NUCLEIC ACIDS AND COMPOSITION USED THEREFOR - The disclosure provides a composition and method for isolating nucleic acids, in which the composition includes at least one halocarbon, at least one salt and at least one surfactant. Mixing the composition and a biosample to form a homogenized solution, nucleic acids in the solution can be easily isolated with a simple treatment and good yield. | 02-13-2014 |
20140155278 | SYSTEM AND METHOD FOR DETECTING BIOLOGICAL MATERIALS - A method of identifying a target biological material by using captures and probes. Each capture is specific for a kind of target. Each probe is designed to distinguish the type of the target. The captures and probes are each labeled with one or more detectable labels. | 06-05-2014 |
20140181996 | COMPUTER READABLE STORAGE MEDIUM FOR STORING APPLICATION PROGRAM FOR NETWORK CERTIFICATION - The present invention discloses a computer readable storage medium for storing an application program for network certification. The application program is implemented by an electrical device to execute a network certification process. The network certification process includes the following steps: a network module of the electrical device is driven to receive a certification code, which is broadcasted by a network access point (AP). Determine if the certification code is in an identified list. When the certification code is not in the identified list, the application program executes an action to limit communication between the electrical device and the network AP. | 06-26-2014 |
Yi-Chang Chen, Taichung City TW
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20150200514 | METHOD FOR CALIBRATING A PLURALITY OF PINCETTES OF A WAFER CONVEYER - Calibrating a plurality of pincettes of a wafer conveyer includes installing a first pincette on two first components moveably installed on two first guiding tracks formed along a horizontal direction, installing a second pincette on two second components moveably installed on two second guiding tracks formed along the horizontal direction, disposing a first disc formed with three positioning components on a first holding portion of the first pincette, disposing a second disc formed with three positioning rings on a second holding portion of the second pincette, positioning three poles on the three positioning components through the three positioning rings, and fine tuning relative positions between the first pincette and the two first components and relative positions between the second pincette and the two second components to position the first pincette and the second pincette to horizontal levels according to indications of inclinometers disposed on three beams connecting the three poles. | 07-16-2015 |
Yi-Chang Chen, Hsinchu TW
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20080304017 | IMAGING DISPLACEMENT MODULE - An imaging displacement module including a frame, an optical element, a carrier, a connecting portion and at least a first actuator is provided. The frame has a first opening, and the optical element, the carrier, the connecting portion and the first actuator are all disposed in the first opening. The carrier is capable of carrying the optical element, and the connecting portion connects between the frame and the carrier and capable of generating an elastic torsion around an axis. The first actuator is disposed at a side of the carrier and capable of driving the carrier to vibrate periodically. | 12-11-2008 |
20090046339 | OPTICAL LENS MODULE - An optical lens module including a foundation, at least one actuator, a lens base, an optical lens, at least one shaft, and at least one rocker arm is provided. The actuator is disposed in an accommodation space, defined inside the foundation, and fixed on the foundation. The lens base is disposed in the accommodation space and beside the actuator. The optical lens is disposed on the lens base. The shaft has a first end and a second end opposite to the first end. The first end is solidly connected to the lens base. The second end is connected to the foundation. The rocker arm has a third end and a fourth end opposite to the third end. The third end is solidly connected to a portion of the shaft between the first end and the second end. The fourth end is connected to the actuator. | 02-19-2009 |
20120073000 | EMBEDDED ANTI-THIEF SYSTEM AND ANTI-THIEF METHOD THEREOF - The present invention relates to an embedded anti-thief system and a method thereof for executing anti-thief procedures, the embedded anti-thief system comprises: a core firmware module, an embedded system module and a cloud server module, wherein the core firmware module is disposed in a firmware device of a portable computer and capable of automatically inspecting the security status of the portable computer when the portable computer is booted. The embedded system module is disposed on a hard disk device of the portable computer and able to communicate with the core firmware module and the cloud server module, so as to confirm the security status of the portable computer. Through the method, the core firmware module and the embedded system module can be loaded and effectively cooperate with the cloud server module for executing the anti-theft procedures for the portable computer at any time. | 03-22-2012 |
Yi-Chang Chen, Xinbei City TW
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20110260200 | METHOD OF FABRICATING NON-METAL LED SUBSTRATE AND NON-METAL LED SUBSTRATE AND METHOD OF FABRICATING LED DEVICE USING THE NON-METAL LED SUBSTRATE AND LED DEVICE WITH THE NON-METAL LED SUBSTRATE - The present invention discloses a method of fabricating non-metal substrate having steps of (a) providing a non-metal board having two opposite first and second surfaces; (b) drilling at least one second through hole through the non-metal board; (c) electroplating copper on outsides of non-metal board and an inside of each of at least one second through hole to form copper films outside of the non-metal board and at least one solid copper pole in corresponding to the at lest one second through hole; and (d) patterning the copper films to form line pattern. The non-metal substrate has high thermal conductivity and the solid copper poles therein are integrated with the line pattern formed outside thereof, so the connection strength among the die pad, solid copper poles and heat conduction pad is good. | 10-27-2011 |
Yi-Chang Chen, Jhonghe TW
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20120322306 | ELECTRICAL CONNECTOR - An electrical connector for mating with a complementary connector includes an insulating housing, a shielding shell covering the insulating housing and a plurality of contacts received in the insulating housing. The insulating housing includes a main body and a mating tongue extending forwardly from the main body. The mating tongue defines a number of channels extending therealong. The contacts have one pair of contacts configured to be a differential coupled signal pair. The insulating housing defines one recess located between the differential coupled signal pair to improve the signal transmission performance. | 12-20-2012 |
20140004753 | ELECTRICAL CONNECTOR WITH IMPROVED SIGNAL TRANSMISSION QUALITY | 01-02-2014 |
Yi-Chang Chung, Jhubei City TW
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20130135850 | Lamp Board Wiring Structure for Light Emitting Diode (LED) Lamp Tube - An improved lamp board wiring structure for light emitting diode (LED) lamp tube, wherein the LED lamp tube comprises a lampshade, at least an LED lamp strap installed inside the lampshade, and at least a left side drive circuit structure and a right side drive circuit structure installed inside the lampshade. The left side drive circuit structure and the right side drive circuit structure are respectively positioned on the left and right side of the LED lamp strap. Also, at least a transmission line connecting the left side and the right side drive circuit structures is provided on any side of the lamp board part in the LED lamp strap such that the left side drive circuit structure and the right side drive circuit structure commonly drive the same LED lamp strap. | 05-30-2013 |
Yi-Chang Hsieh, Cammeray AU
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20140040998 | PROVIDING AN OPERATIONAL DASHBOARD - Systems, methods, and devices for providing an operational dashboard are described herein. One method includes receiving operational data associated with a system, receiving credentials associated with a user of a user device including a number of display elements configurable by the user, and determining a particular portion of the operational data to provide to the user via the display elements of the user device based, at least in part, on the credentials. | 02-06-2014 |
20140365976 | FRAMEWORKS, DEVICES AND METHODS CONFIGURED FOR ENABLING GESTURE-BASED CONTROLLED DISPLAY FOR FACILITY INFORMATION AND CONTENT IN RESPECT OF A MULTI-LEVEL FACILITY - Described herein are frameworks, devices and methods configured for enabling display for facility information and content, in some cases via touch/gesture controlled interfaces. Embodiments of the invention have been particularly developed for allowing an operator to conveniently access a wide range of information relating to a facility via, for example, one or more wall mounted displays. While some embodiments will be described herein with particular reference to that application, it will be appreciated that the invention is not limited to such a field of use, and is applicable in broader contexts. | 12-11-2014 |
Yi-Chang Hsu, Taipei TW
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20100169697 | Control Device Having Output Pin Expansion Function and Output Pin Expansion Method - A control device having an output pin expansion function and an output pin expansion method thereof are provided. The method includes: connecting at least a shift register unit having a plurality of data transmission pins to a control unit such that the shift register unit can receive strobe signals, a multi-bit data stream, clock signals and enable signals generated by the control unit; sending an enable signal by the control unit so as to allow the shift register unit to shift and store each bit of a multi-bit data stream according to a clock signal generated by the control unit; and sending a strobe signal by the control unit so as to allow the shift register unit to output the multi-bit data in parallel format as opposed to the received serial format through the plurality of data transmission pins, thereby allowing a processing device to interface with more devices (such as LED state indicators) than its fixed number of dedicated output pins would conveniently allow, thus saving costs and board space. | 07-01-2010 |
Yi-Chang Huang, Xindian City TW
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20090215508 | PORTABLE ELECTRONIC APPARATUS - A portable electronic apparatus comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing and comprises a substrate and a first electronic device, wherein the first electronic device is disposed on the substrate. The heat-conduction structure is disposed on the circuit board, and dissipates heat from the first electronic device. The heat-dissipation structure is disposed on the housing and connected to the heat-conduction structure, wherein the heat passes the heat-conduction structure and the heat-dissipation structure, and is dissipated out of the housing. | 08-27-2009 |
Yi-Chang Lai, Tauyuan Hsien TW
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20110291913 | Coaxial antenna device for use with non-magnetic option coupler - An antenna device includes a housing having a lower portion for coupling to a non-magnetic option coupler of a vehicle, an insulating member engaged in an upper chamber of the housing, a conductor member engaged into a central bore of the insulating member for engaging with the non-magnetic option coupler, a conductive coupling element having a lower portion engaged into the housing, and a coaxial radiating assembly includes a coaxial radiating device having a central radiating member for connecting to the conductor member, and a peripheral radiating member for connecting to the conductive coupling element, and an insulating element mounted between the central radiating member and the cylindrical radiating member. | 12-01-2011 |
Yi-Chang Lee, Hsinchu TW
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20100007001 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - Semiconductor package structures and methods for manufacturing the same are provided. The semiconductor package structure comprises a substrate unit and a first chip stack structure. The substrate unit comprises a circuit structure having test pads. The first chip stack structure comprises chips, and each of the chips has a plurality of through silicon plugs. The through silicon plugs of two adjacent chips are electrically connected and further electrically connected to the test pads of the substrate unit for electrical testing. Another semiconductor package structure provided by the present invention comprises a first semiconductor chip and a second semiconductor chip. Each of the semiconductor chips has test pads for electrical testing and a plurality of through silicon plugs connecting to the test pads. The second semiconductor chip is mounted on the first semiconductor chip, and a portion of the through silicon plugs of two semiconductor chips are electrically connected with each other. | 01-14-2010 |
20110291268 | Semiconductor wafer structure and multi-chip stack structure - A semiconductor wafer structure comprises a first surface and a second surface opposite to the first surface, a plurality of chip areas formed on the first surface, a plurality of through-silicon holes formed in each of the plurality of chip areas connecting the first surface and the second surface, and a through-silicon-via (TSV) electrode structure formed in each through-silicon hole. Each through-silicon-via electrode structure comprises a dielectric layer formed on the inner wall of the through-silicon hole, a barrier layer formed on the inner wall of the dielectric layer and defining a vacancy therein, a filling metal layer filled into the vacancy, a first end of the filling metal layer being lower than the first surface forming a recess, and a soft metal cap connecting to and overlaying the first end of the filling metal layer, wherein a portion of the soft metal cap is formed in the recess and the soft metal cap protrudes out of the first surface. Hence, the reliability of multi-chip stack package structure can be enhanced with the application of these soft metal caps. | 12-01-2011 |
20130069228 | FLIP-CHIP PACKAGE STRUCTURE AND FORMING METHOD THEREOF - A flip-chip package structure comprising a substrate, a chip, a bump structure and a solder resist is provided. The substrate has a circuit layer disposed on the surface thereof. The chip comprises a central region and two edge regions disposed on the two sides of the central region. The bump structure is disposed on the central region of the chip and faces the substrate. The solder resist is disposed on the substrate to partially cover the circuit layer. The chip is electrically connected to the substrate by the bump structure, and the solder resist is adapted to come into contact with the two edge regions of the chip to support the chip with the bump structure when the chip is disposed on the substrate. | 03-21-2013 |
20130119530 | THERMALLY ENHANCED PACKAGING STRUCTURE - A thermally enhanced packaging structure includes a chip carrier; a high power chip disposed on the chip carrier; a molding compound covering the high power chip; a heat dissipating layer disposed on the molding compound, wherein the heat dissipating layer comprises a plurality of carbon nanocapsules (CNCs); and a non-fin type heat dissipating device, disposed either on the heat dissipating layer or between the molding compound and the heat dissipating layer. The molding compound can also comprise a plurality of CNCs. | 05-16-2013 |
Yi-Chang Lee US
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20090236741 | CONDUCTIVE STRUCTURE OF A CHIP AND METHOD FOR MANUFACTURING THE SAME - A conductive structure of a chip and a method for manufacturing the conductive structure are provided. An under bump metal (UBM) is formed on the redistribution layer (RDL) by performing an electroless plating process. Subsequently, the solder bump is formed on the under bump metal for electrical connection. Thus, the photomask can be economized and the cost of manufacturing can be reduced. | 09-24-2009 |
20090283905 | CONDUCTIVE STRUCTURE OF A CHIP - A conductive structure of a chip is provided. The conductive structure comprises a ground layer, a dielectric layer, a redistribution layer, an under bump metal and a solder bump. The ground layer electrically connects to the ground pad of the chip, while the dielectric layer overlays the ground layer. Thus, the conductive layer can result in impedance matching, and the packaged chip is adapted to transmit a high frequency signal. | 11-19-2009 |
Yi-Chang Lee, Hsinchu City TW
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20090114714 | RFID REAL-TIME INFORMATION SYSTEM ACCOMMODATED TO SEMICONDUCTOR SUPPLY CHAIN - This invention provides an RFID real-time information system accommodated to a semiconductor supply chain for exchanging real-time information. The RFID real-time information system is characterized by comprising an RFID middleware module for generating a stock and logistic information corresponding to a plurality of carriers and wafers from a tag information; a manufacturing information module for storing an object information corresponding to the plurality of wafers; a real-time information module for integrating the RFID middleware module with the manufacturing information module to generate real-time information corresponding to the plurality of wafers and carriers; and a business-to-business (B2B) e-commerce module comprising a plurality of B2B servers respectively disposed in vendors in the semiconductor supply chain for connecting and exchanging the real-time information through a standard protocol of e-commerce. | 05-07-2009 |
20110309495 | Multi-chip stack package structure - A multi-chip stack package structure comprises a substrate, which has a chip placement area defined on its upper surface and a plurality of contacts disposed outside the chip placement area; a first chip is disposed in the chip placement area with the rear surface, a plurality of first pads being disposed on the active surface and a plurality of first bumps each being formed on one of the first pads; a plurality of metal wires connect the first bumps to the contacts; a second chip with a plurality of second pads being disposed on the active surface and a plurality of second bumps each being formed on one of the second pads, the second chip being mounted to the first chip with its active surface facing the active surface of the first chip, wherein the second bumps correspondingly connect the metal wires and the first bumps respectively. | 12-22-2011 |
20110309496 | Multi-chip stack package structure - A multi-chip stack package structure comprises a substrate, which has a chip placement area defined on its upper surface and a plurality of contacts disposed outside the chip placement area; a first chip is disposed in the chip placement area with the rear surface, a plurality of first pads being disposed on the active surface and a plurality of first bumps each being formed on one of the first pads; a plurality of metal wires connect the first bumps to the contacts; a second chip with a plurality of second pads being disposed on the active surface and a plurality of second bumps each being formed on one of the second pads, the second chip being mounted to the first chip with its active surface facing the active surface of the first chip, wherein the second bumps correspondingly connect the metal wires and the first bumps respectively. | 12-22-2011 |
20110309497 | Multi-chip stack package structure - A multi-chip stack package structure comprises a substrate, which has a chip placement area defined on its upper surface and a plurality of contacts disposed outside the chip placement area; a first chip is disposed in the chip placement area with the rear surface, a plurality of first pads being disposed on the active surface and a plurality of first bumps each being formed on one of the first pads; a plurality of metal wires connect the first bumps to the contacts; a second chip with a plurality of second pads being disposed on the active surface and a plurality of second bumps each being formed on one of the second pads, the second chip being mounted to the first chip with its active surface facing the active surface of the first chip, wherein the second bumps correspondingly connect the metal wires and the first bumps respectively. | 12-22-2011 |
Yi-Chang Lee, Science-Based Industrial Park TW
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20110291267 | Semiconductor wafer structure and multi-chip stack structure - A semiconductor wafer structure comprises a first surface and a second surface opposite to the first surface, a plurality of chip areas formed on the first surface, a plurality of through-silicon holes formed in each of the plurality of chip areas connecting the first surface and the second surface, and a through-silicon-via (TSV) electrode structure formed in each through-silicon hole. Each through-silicon-via electrode structure comprises a dielectric layer formed on the inner wall of the through-silicon hole, a barrier layer formed on the inner wall of the dielectric layer and defining a vacancy therein, a filling metal layer filled into the vacancy, a first end of the filling metal layer being lower than the first surface forming a recess, and a soft metal cap connecting to and overlaying the first end of the filling metal layer, wherein a portion of the soft metal cap is formed in the recess and the soft metal cap protrudes out of the first surface. Hence, the reliability of multi-chip stack package structure can be enhanced with the application of these soft metal caps. | 12-01-2011 |
Yi-Chang Lee, Hsinchu County TW
Yi-Chang Lin, Taichung TW
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20090185043 | IMAGE CAPTURE METHODS - Image capture systems capable of ensuring clear images are provided, in which an image capture module senses at least one image, and an operational module performs a compensation to the image capture system according to a modulation transfer function (MTF) value corresponding to the image, such that the image capture system can be operated under an optimized total gain thereby ensuring clear images. | 07-23-2009 |
20090310952 | CAMERA - A camera having a shutter button, a photo sensor array, an anti-shake module controlled by an anti-shake enable signal, and a mechanical shutter. By pressing the shutter button, a first operation and a second operation are provided to trigger an auto-focus enable signal and an image exposure control signal, respectively. The anti-shake enable signal is enabled when the auto-focus enable signal has been triggered and the image exposure control signal is disabled or has just been triggered. The photo sensor array performs image exposure according to the image exposure control signal. The mechanical shutter is disabled and closed after the image exposure control signal is triggered for exposure period. | 12-17-2009 |
20100067888 | CONTROL SYSTEM AND METHOD FOR COMPENSATING FOR IMAGE SHAKE OF IMAGE CAPTURE DEVICE - A control system for compensating for image shake of an image capture device is provided, including a shake compensating module, a shake compensating switch, a control unit, and a shutter control element operated between a first operating stage and a second operating stage. The shake compensating switch is switched between an active state to enable the shake compensating module and an inactive state to disable the shake compensating module. The control unit enables the shake compensating module when the shake compensating switch is in the active state. The control unit produces a reset signal to disable the shake compensating module when the shutter control element is in the second operating stage before the shake compensating switch is switched to the inactive state. The control unit enables the shake compensating module after a specific period of time from when the shake compensating module was disabled. | 03-18-2010 |
Yi-Chang Lin, Hsinchu TW
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20150234103 | FILM STRUCTURE - A film structure including a substrate, a coating layer, and an adhesive layer is provided. The coating layer and the adhesive layer are respectively disposed on two opposite surfaces of the substrate. The adhesive layer includes a chemical composition for filtering a light ray. The adhesive layer cuts off the light ray in a specific wavelength range when the light ray passes through the adhesive layer. A cut-off rate of the light ray in a wavelength range of 380 nm to 420 nm is greater than 80%. | 08-20-2015 |
20150370122 | DISPLAY - A display including a backlight module, a liquid crystal module, and a first adhesive layer is provided. The backlight module includes a light source and a plurality of first optical films. The first optical films are stacked on the light source, and at least one first optical film has a hard-coat film layer. The liquid crystal module is disposed on the backlight module. The liquid crystal module includes a liquid crystal element, a plurality of first adhesive layers, and a plurality of second optical films. The second optical films are respectively disposed on two opposite surfaces of the liquid crystal element, wherein at least one second optical film has a hard-coat film layer. Each first adhesive layer is disposed between a second optical film and the liquid crystal element. | 12-24-2015 |
Yi-Chang Lin, Tantz Shiang TW
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20100123783 | GAIN CALIBRATION DEVICE AND METHOD OF GAIN CALIBRATION - A gain calibration device includes an integrator, a first register, a controller, and a second register. When an optical image stabilizer is activated, the controller determines whether a current magnification of an image processing equipment is the same as a previous magnification. When the current magnification is not the same as the previous magnification, the controller reads the current magnification. Then the first registers stores a reference magnification, which is corresponding to a reference gain value of the optical image stabilizer. The second register temporarily stores a current gain value. Based on the reference magnification, the reference gain value and the current magnification, the controller calculates the current gain value corresponding to the current magnification for compensating the optical image stabilizer. | 05-20-2010 |
20100134638 | Gain-Adjusting Apparatus For Optical Image Stabilizer And Method Thereof - A gain-adjusting apparatus and method thereof are described. The gain-adjusting apparatus includes an integrator, a first register, a control unit, and a second register. The integrator integrates the gyro signal data to generate the integral data. The control unit is coupled to the first register and the second register, respectively. The control unit determines whether the gyro signal data is either greater than an upper gyro threshold or less than a lower gyro threshold to detect the gyro signal data and decrease the gain value stored in the second register. | 06-03-2010 |
Yi-Chang Lin, Hsinchu City TW
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20150128863 | MECHANISMS FOR FURNACE APPARATUS AND WAFER BOAT - Embodiments of mechanisms of a furnace apparatus having a wafer boat are provided. The wafer boat includes a base plate and a support rod extended from the base plate. The wafer boat also includes a support finger including a finger body extended from the support rod and a curved end portion extended from the finger body. The wafer boat further includes a top plate supported on the support rod. A width of the support rod exceeds that of the support finger. | 05-14-2015 |
Yi-Chang Liu, Taoyuan County TW
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20130286877 | Method and Apparatus Reporting Channel Quality Indicator of Communication System - The present invention provides a method and apparatus reporting a channel quality indicator (CQI) of a communication system, including: detecting a first measurement reflecting a first communication quality of the communication system, providing first reference(s) respectively corresponding to indicator level(s), providing CQI according to the indicator level(s) and a relation between the first measurement and the first reference(s), and updating one (or more) first reference according to a second measurement reflecting a second communication quality of the communication system. For example, the first measurement can represent signal to interference ratio or mutual information, and the second measurement can represent data error rate or throughput. First reference(s) can be further adjusted according to a third measurement, e.g., a power scheduling of base station, such that CQI can be updated if base station schedules additional transmission power. | 10-31-2013 |
20140281843 | DECODING APPARATUS WITH ADAPTIVE CONTROL OVER EXTERNAL BUFFER INTERFACE AND TURBO DECODER AND RELATED DECODING METHOD THEREOF - A decoding apparatus has an on-chip buffer, an external buffer interface, and a turbo decoder. The on-chip buffer is arranged for buffering each code block to be decoded. The external buffer interface is arranged for accessing an off-chip buffer. The turbo decoder is arranged for decoding a specific code block read from the on-chip buffer. The specific code block is not transmitted from the on-chip buffer to the off-chip buffer via the external buffer interface unless decoding fail of the specific code block is identified. | 09-18-2014 |
Yi-Chang Liu, Dayuan Township TW
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20120021702 | INTELLIGENT TRANSMISSION ANTENNA SELECTION METHOD AND COMMUNICATIONS APPARATUS UTILIZING THE SAME - A communications apparatus. Multiple antennas are arranged to receive downlink signals and transmit uplink signals. A transceiver module is arranged to receive the downlink signals from the antennas and pass the uplink signals to an antenna selection device. The antenna selection device is coupled between the antennas and the transceiver module and arranged to receive the uplink signals to be transmitted from the transceiver module and dynamically pass the uplink signals to one of the antennas according to an antenna selection signal. A processor is arranged to receive the downlink signals from the transceiver module, calculate short-term signal qualities of the downlink signals and generate the antenna selection signal according to the short-term signal qualities. | 01-26-2012 |
Yi-Chang Lu, Linkou Township TW
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20110178778 | DETERMINING PROXIMITY EFFECT PARAMETERS FOR NON-RECTANGULAR SEMICONDUCTOR STRUCTURES - The present disclosure relates to a curve-fitting procedure for determining proximity effect device parameters in semiconductor fabrication. Methods presented herein are adapted to determine the impact of narrow width related edge effects on device characteristics by comparing two-dimensional (2D) and/or three-dimensional (3D) device simulations. Methods presented herein are adapted to determine the accuracy of conventional extraction methods utilizing non-rectangular gate device simulation. | 07-21-2011 |
20150324515 | Determining Proximity Effect Parameters for Non Rectangular Semiconductor Structures - The present disclosure relates to a curve-fitting procedure for determining proximity effect device parameters in semiconductor fabrication. Methods presented herein are adapted to determine the impact of narrow width related effects on device characteristics by comparing two-dimensional (2D) and/or three-dimensional (3D) device simulations. Methods presented herein are adapted to determine the accuracy of conventional extraction methods utilizing non-rectangular gate device simulation. | 11-12-2015 |
Yi-Chang Sung, Hsinchu County TW
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20100234992 | SEMICONDUCTOR WAFER ROBOT ALIGNMENT SYSTEM AND METHOD - A method and system for aligning robotic wafer transfer systems provides a wafer cassette having one or more wafer slots having portions covered with an electrically conductive material and a sensor that is in electrical communication with the electrically conductive material. When a wafer is loaded into a wafer cassette such as may be contained within a wafer transfer module such as a FOUP, an indication of position is delivered to the sensor which detects the alignment and indicates if the loaded wafer undesirably contacts either or both of the opposed grooves that form the wafer slot of the wafer cassette. An indication of the wafer's position may be provided from the sensor to a controller that delivers a signal for aligning the wafer transfer blade of the wafer transfer robot responsive to the signal indicative of position. | 09-16-2010 |
Yi-Chang Tsai, Hsinchu TW
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20090213560 | OPTICAL PROJECTOR - An optical projector includes a casing, a partition element, an optical projection module and a main board. The casing includes a main body, a first cover and a second cover. The partition element is disposed at the main body, and the first cover is detachably disposed on the main body. The first cover, the partition element and the main body together define a first accommodating space. The second cover is detachably disposed on the main body. The second cover, the partition element and the main body together define a second accommodating space. The optical projection module is disposed in the first accommodating space and the main board is disposed in the second accommodating space. | 08-27-2009 |
Yi-Chang Tsai, Hsichih TW
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20100153751 | Network equipment - A network equipment for a powered device of a PoE system is adapted to be connected to multiple network lines, each transmitting a network signal, and a DC power that is carried on the network signal, and that has a magnitude smaller than a power necessary for driving power-consuming components of the powered device. The network equipment includes: multiple Ethernet network ports, each coupled to a respective network line; a transformer module coupled to the Ethernet network ports, and configured to separate the DC powers from the network signals; a power module coupled to the transformer module for combining the DC powers into a supplying power; and a signal processing circuit coupled to the power module for receiving at least a portion of the supplying power, and coupled to the transformer module for processing the network signals. The supplying power has a magnitude sufficient for driving the power-consuming components. | 06-17-2010 |
Yi-Chang Wang, Hsinchu TW
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20150160474 | CORRECTIVE LENS PRESCRIPTION ADAPTATION SYSTEM FOR PERSONALIZED OPTOMETRY - A method, system, and computer program product for adapting a corrective lens prescription. The system includes: an image capturing device; a lighting control device; a display; a memory; and a processor communicatively coupled to the image capturing device, the light generating device, the display, and the memory, wherein the processor is configured to perform the steps of a method including: generating a digital simulation for optometry, wherein the simulation is generated based on at least one lighting parameter, at least one activity parameter, at least one duration parameter, at least one personal parameter, and at least one target vision condition; recording user pupillary movement during the simulation; analyzing the recorded pupillary movement to determine a visual comfort assessment; and generating a message of the visual comfort assessment. | 06-11-2015 |
Yi-Chang Wu, Tainan City TW
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20140053661 | NON-CONTACT TYPE TORQUE AND ANGLE OF ROTATION SENSING DEVICE AND MEASUREMENT METHOD USING SAME - A non-contact type torque and angle of rotation sensing device consisting of a magnetic member, sensing members and a computing unit for measuring a torque being applied to rotate a transmission member and the angle of rotation of said transmission member in a first axial direction is disclosed. The magnetic member defines a first center, and is mounted on and rotatable with the transmission member. The magnetic member deflects relative to the transmission member in a nonparallel manner relative to the first axial direction when rotating with the transmission member. Sensing members induce a magnetic field variation to output respective electrical signals that exhibit a phase difference there between. The computing unit receives and calculates the electrical signals of the sensing member to obtain the amplitude and to further translate the amplitude into torque value and angle of rotation. | 02-27-2014 |
20150364970 | AC MOTOR WITH REDUCTION MECHANISM - An AC motor with a reduction mechanism is disclosed. The AC motor has a stator unit, a rotor unit, and a reduction transmission unit. An axial space of the AC motor can be substantially reduced by providing the reduction transmission unit directly built in the AC motor, and a path of the power transmission between the rotor unit and an output shaft can be reduced, so that the loss of the mechanical energy can be lowered. | 12-17-2015 |
Yi-Chang Wu, Taipei City TW
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20140161293 | ELECTRONIC DEVICE - An electronic device includes a case, a speaker, a supporting stand, and a waterproof breathable membrane. The case includes a first inner space and a through hole connected to the first inner space. The speaker is disposed in the first inner space, and produces sound waves outwards from the through hole. The supporting stand connects the case to cover the through hole. The supporting stand includes a sound hole and a second inner space connected to the sound hole and the through hole. The waterproof breathable membrane covers one of the sound hole and the through hole. | 06-12-2014 |
Yi-Chang Wu, New Taipei City TW
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20160132407 | FAILOVER SYSTEM AND METHOD OF DECIDING MASTER-SLAVE RELATIONSHIP THEREFOR - A failover system and a method of deciding master-slave relationship therefor are provided. The failover system includes a first electronic device, a second electronic device, a decision circuit and at least two isolation modules. The decision circuit is coupled to the first electronic device and the second electronic device and configured to determine operating states of the first electronic device and the second electronic device and output a first selecting signal and a second selecting signal. The at least two isolation modules are coupled to the first electronic device, the second electronic device, and the decision circuit and configured to switch a master-slave relationship between the first electronic device and the second electronic device according to the first selecting signal and the second selecting signal. | 05-12-2016 |
Yi-Chang Wu, Taichung City TW
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20140209656 | NAIL GUN STRUCTURE - A nail gun structure includes a main body, a seat, an actuating button and a driving cable. The main body has a trigger member for shooting a nail. One end of the seat is assembled at a rear end of the main body. The actuating button is assembled at another end of the seat. One end of the driving cable is assembled to the trigger member of the main body, and another end of the driving cable is assembled to the actuating button. Under this arrangement, when a user holds the seat and presses down the actuating button, the actuating button drives the driving cable to trigger the trigger member so as to shoot the nail. | 07-31-2014 |
20150352701 | CONTROL MECHANISM CONTROLLABLE OVER SINGLE SHOT AND REPEAT SHOT - The present invention is a control mechanism controllable over single shot and repeating shot, which is mounted in a discharging device for carrying out single shot and repeating shot modes. The control mechanism comprises a safety pole, a trigger and a sliding hook block. By means of altering the operating order of the trigger and the safety pole, and accompanied by the restoration of the safety pole, the switching between the single shot and the repeating shot modes can be easily accomplished by the discharging device, indeed a product of practicality | 12-10-2015 |
Yi-Chang Yang, Hsinchu TW
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20100289068 | Thin Film Transistor Structure - A thin film transistor structure is provided. The thin film transistor structure includes a source and a drain. The corresponding opposite surfaces of the source and the drain are at least partially complementary and continuous convex-concave surfaces so that the charging ability of the thin film transistor would be increased due to an extending length of the continuous convex-concave surfaces. | 11-18-2010 |
Yi-Chang Yang, Taipei TW
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20100306980 | Clutching Jig - A clutching jig used to disassemble a lens module which includes a lens socket and a lens component mounted to the lens socket by a plurality of buckling pieces of the lens socket abutting to the lens component has a rectangular base. The base defines two opposite lateral surfaces, a bottom surface and a slot passing through the bottom surface and the two opposite lateral surfaces to divide the base into a first holding portion and a second holding portion. The bottom surface has a receiving recess at a center portion thereof for communicating with the slot. The receiving recess receives the lens component, with a circumferential dimension thereof lessened to clutch the lens component when the first holding portion and the second holding portion are urged to approach each other. | 12-09-2010 |
20100328792 | CLUTCHING JIG - A clutching jig used to disengage a lens socket and a lens component which has a base glued on a printed circuit board (PCB) and is fixed in the lens socket by a plurality of buckling pieces of the lens socket abutting on the lens component. The clutching jig defines a base plate. The base plate has an inserting hole at a middle portion thereof. A side of the base plate has a portion surrounding the inserting hole extended perpendicular to the base plate to form a plurality of inserting slices, enclosing a chamber for receiving the lens component. The inserting slices are adapted to insert into a gap between the lens component and the lens socket for pressing the buckling pieces away from the lens component, with distal ends of the inserting slices extending inwards beyond a junction of the base and the PCB. | 12-30-2010 |
20120249835 | Image Acquiring System and Driving Method for Camera Module - An image acquiring system including a camera module and a host is provided. The camera module for acquiring images includes a control unit and a first connector. The host includes a driver unit and a second connector. The driver unit is coupled to the second connector and stores an initializing data for initialize the camera module; and the second connector is adapted to be connected with the first connector. The set of initializing data is transferred from the second connector to the first connector when the second connector is coupled to the first connector, and the initializing data is then transferred to the control unit. A driving method of camera module for driving a camera module without any memory element is also described. | 10-04-2012 |
Yi-Chang Yeh, Hsichih TW
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20110038119 | Notebook computer - A notebook computer includes a base; a top cover pivotally coupled via a first rotary shaft to the base and including a display panel disposed at an inner side thereof; a first plate member provided on an outer side of the top cover, a third plate member pivotally coupled at an end to the base via a second rotary shaft; and a second plate member pivotally coupled at an end to the first plate member and slidably coupled at an opposing end to the third plate member, such that the second and the third plate member are displaceable relative to each other. When the top cover is pivotally turned to an operation position, the second end of the second plate member is pushed against the third plate member to restrict the top cover and the third plate member from turning further, and hold the top cover to the operation position. | 02-17-2011 |