Yen-Yi
Yen-Yi Chen, Taipei County 241 TW
Patent application number | Description | Published |
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20120119305 | LAYOUT OF POWER MOSFET - A layout of a power MOSFET includes a first zigzag gate structure located on a substrate of the power MOSFET and having a first side and a second side, a first contact located on the substrate and at the first side of the first zigzag gate structure, and a second contact structure located on the substrate and at the second side of the first zigzag gate structure. | 05-17-2012 |
Yen-Yi Chen, Taipei County TW
Patent application number | Description | Published |
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20120127671 | MULTI-CHIP MODULE - A multi-chip module is disclosed to include a pin frame, an electric power switch chip, and a battery protection chip. The pin frame has a chip placement region and six pins. The second pin and the fifth pin are electrically connected at the chip placement region, and the other pins are set electrically isolated from each other. A bottom surface of the electric power switch chip is electrically connected at the chip placement region, and a top surface thereof is electrically connected to the first pin and the third pin. A bottom surface of the battery protection chip is disposed at the top surface of the electric power switch chip in an electrically isolated fashion. A top surface of the battery protection chip is electrically connected to the top surface of the electric power switch chip, the first pin, the fourth pin, and the sixth pin. | 05-24-2012 |
20120139569 | CIRCUIT APPARATUS - A circuit apparatus includes an input end, an output end, an enable module, a first function module and a second function module. The enable module couples to the input end for receiving an input voltage and outputs an enable signal while the input voltage falls within a first voltage scope. The first function module couples to the enable module and the output end, and performs a test mode according to the enable signal so as to output a test result to the output end. The second function module couples to the input end for receiving the input voltage via the input end and performs a standard mode while the input voltage falls within a second voltage scope. | 06-07-2012 |
Yen-Yi Wu, Kao-Hsiung City TW
Patent application number | Description | Published |
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20140312496 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE - The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted. | 10-23-2014 |