Yee, KR
Cassian Yee, Seoul KR
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20150152387 | METHOD FOR THE INDUCTION AND EXPANSION OF NATURAL KILLER CELLS DERIVED FROM PERIPHERAL BLOOD MONONUCLEAR CELLS - The present invention relates to a method for inducing and expanding natural killer cells derived from peripheral blood mononuclear cells, which comprises co-culturing, as feeder cells, irradiated Jurkat cells and irradiated Epstein-Barr virus transformed lymphocyte continuous line (EBV-LCL) cells in the presence of cytokines, along with peripheral blood mononuclear cells. According to the present invention, a large quantity of natural killer cells can be induced and proliferated from a small quantity of peripheral blood mononuclear cells even without the use of high-cost equipment or various kinds of expensive cytokines, thereby making it possible to significantly improve the efficiency and efficacy of the prevention and treatment of cancer using the natural killer cells. | 06-04-2015 |
Dae-Su Yee, Daejeon KR
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20110192978 | TERAHERTZ WAVE APPARATUS - Provided is a terahertz wave apparatus. The terahertz wave apparatus includes: a wavelength-fixed laser emitting a first laser light having a fixed first wavelength; a wavelength-swept laser emitting a second laser light having a tunable second wavelength; a coupler coupling the first laser light with the second laser light; and a generator converting a mixed light emitted from the coupler into a terahertz wave, wherein a frequency of the terahertz wave is continuously tunable. | 08-11-2011 |
Dong-Su Yee, Yongin-City KR
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20100101856 | ORGANIC LIGHT EMITTING DIODE DISPLAY - An organic light emitting diode (OLED) display is disclosed. One aspect includes a display panel assembly, a support member supporting edges of the display panel assembly and including an opening exposing a rear surface of the display panel assembly, and a buffer member attached to the rear surface of the display panel assembly exposed through the opening of the support member. | 04-29-2010 |
20100103641 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING THE SAME - An OLED display and a manufacturing method thereof. The OLED includes: a cover window; a guide frame disposed on the cover window; an adhesive layer disposed on the cover window, within the guide frame, and a display panel attached to the cover window, via the adhesive layer. | 04-29-2010 |
20100142172 | FLAT PANEL DISPLAY DEVICE - A flat panel display device having improved drop characteristics, that minimize a drop shock of the flat panel display device by controlling the size of a shock-absorbing tape, the flat panel display device including: a display panel having a display part to display an image and a pad part; a supporting member configured to support the display panel; and the shock-absorbing tape disposed between the display panel and the supporting member. The shock-absorbing tape is in contact with the display part of the display panel and ⅓ to ⅚ of the pad part of the display panel. | 06-10-2010 |
20110080695 | FLAT PANEL DISPLAY - A flat panel display device including a display panel, a bezel having a substrate to support the display panel and configured to receive the display panel, and a bonding agent disposed between the substrate of the bezel and the display panel. Further, the substrate of the bezel and the display panel may be bonded and fixed to each other. Therefore, it is possible to provide a flat panel display device having a small thickness and capable of improving strength against an external pressure. | 04-07-2011 |
20120056530 | Organic Light-emitting Display Device and Method of Manufacturing the Same - In an organic light-emitting display device which is thin and has excellent mechanical strength and a method of manufacturing the organic light-emitting display device, the organic light-emitting display device comprises: a panel including a first substrate and a second substrate coupled to each other by a sealing resin interposed between an internal surface of the first substrate and an internal surface of the second substrate, wherein a first concave portion is formed in an outer surface of the first substrate, and a second concave portion is formed in an outer surface of the second substrate; and a buffer cushion disposed in the first concave portion, wherein the density of an edge portion of the buffer cushion is greater than the density of a center portion of the buffer cushion. | 03-08-2012 |
20120098736 | ORGANIC LIGHT EMITTING DIODE (OLED) DISPLAY - An organic light emitting diode (OLED) display is disclosed. In one embodiment, the display includes 1) a display panel including i) a display area configured to display an image and ii) a pad area adjacent to the display area and configured not to display an image, 2) a bezel configured to receive the display panel and 3) a reinforcing member positioned between the pad area of the display panel and the bezel. According to at least one embodiment, the deformation of the portion corresponding to the pad area of the display panel among the bezel may be prevented during an external impact, and thereby the twisting strength and the bending strength may be improved. | 04-26-2012 |
20120099251 | DISPLAY DEVICE - A display device is disclosed. In one embodiment, the device includes a display panel displaying an image and an integrated receiving member supporting the display panel. The integrated receiving member includes a press molding portion including a bottom portion and a side wall portion bent and extended from the bottom portion and having a through-hole formed therein and an injection molding portion including a frame portion integrally attached to at least one side of the press molding portion, facing the display panel and a flange portion extended from the frame portion and protruding through the through-hole. The flange portion of the injection molding portion is wholly or partially separated from the side wall portion of the press molding portion within the through-hole. | 04-26-2012 |
20120170244 | Organic Light Emitting Diode Display - An organic light emitting diode display having a display panel comprising a first substrate and a second substrate disposed facing the first substrate, the first substrate comprising a display area and a pad area, a buffer member disposed on one surface of the first substrate, the buffering member having a buffer layer and an adhesive layer formed on at least one surface of the buffer layer, and a bezel or a case accommodating the display panel and buffer member. | 07-05-2012 |
20120212966 | ELECTRONIC DEVICE HAVING ORGANIC LIGHT EMITTING DIODE DISPLAY - An electronic device improves an impact-resistance characteristic of an organic light emitting diode (OLED) display. The electronic device includes an organic light emitting diode (OLED) display including a panel assembly for forming an organic light emitting element, and a housing including a housing main body for receiving the organic light emitting diode (OLED) display. The housing includes a housing main body including a first space for receiving the panel assembly and a second space for receiving a printed circuit board, an upper cover, and a lower cover. The housing main body includes a bottom formed to distinguish a first space and a second space in the housing, and also includes a bent unit on an edge, and a side wall in which the bent unit is buried to be combined with the edge of the bottom. | 08-23-2012 |
Hyo Jae Yee, Gyeonggi-Do KR
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20140061908 | PLASTIC BALL GRID ARRAY PACKAGE HAVING REINFORCEMENT RESIN - A plastic ball grid array package having a reinforcement resin that may address the problem of delamination and cracks in a boundary region between a sealing resin and a substrate. The reinforcement resin is formed at an outer region of a sealing resin and has a height that is lower than that of the sealing resin. The reinforcement resin may be formed of the same material used to form the sealing resin and has a structure completely covering a first surface of the substrate. Accordingly, cracks and delamination defects of the semiconductor package may be reduced by absorbing stress that occurs by physical impact in a boundary region between the substrate and the sealing resin. | 03-06-2014 |
Jaehak Yee, Seoul KR
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20140175639 | Semiconductor Device and Method of Simultaneous Molding and Thermalcompression Bonding - A semiconductor device has a semiconductor die disposed over a substrate. The semiconductor die and substrate are placed in a chase mold. An encapsulant is deposited over and between the semiconductor die and substrate simultaneous with bonding the semiconductor die to the substrate in the chase mold. The semiconductor die is bonded to the substrate using thermocompression by application of force and elevated temperature. An electrical interconnect structure, such as a bump, pillar bump, or stud bump, is formed over the semiconductor die. A flux material is deposited over the interconnect structure. A solder paste or SOP is deposited over a conductive layer of the substrate. The flux material and SOP provide temporary bond between the semiconductor die and substrate. The interconnect structure is bonded to the SOP. Alternatively, the interconnect structure can be bonded directly to the conductive layer of the substrate, with or without the flux material. | 06-26-2014 |
20140175640 | Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form - A semiconductor device has a plurality of semiconductor die disposed over a carrier. An electrical interconnect, such as a stud bump, is formed over the semiconductor die. The stud bumps are trimmed to a uniform height. A substrate includes a bump over the substrate. The electrical interconnect of the semiconductor die is bonded to the bumps of the substrate while the semiconductor die is disposed over the carrier. An underfill material is deposited between the semiconductor die and substrate. Alternatively, an encapsulant is deposited over the semiconductor die and substrate using a chase mold. The bonding of stud bumps of the semiconductor die to bumps of the substrate is performed using gang reflow or thermocompression while the semiconductor die are in reconstituted wafer form and attached to the carrier to provide a high throughput of the flipchip type interconnect to the substrate. | 06-26-2014 |
20140175661 | Semiconductor Device and Method of Making Bumpless Flipchip Interconnect Structures - A semiconductor device includes a substrate with contact pads. A mask is disposed over the substrate. Aluminum-wettable conductive paste is printed over the contact pads of the substrate. A semiconductor die is disposed over the aluminum-wettable conductive paste. The aluminum-wettable conductive paste is reflowed to form an interconnect structure over the contact pads of the substrate. The contact pads include aluminum. Contact pads of the semiconductor die are disposed over the aluminum-wettable conductive paste. The aluminum-wettable conductive paste is reflowed to form an interconnect structure between the contact pads of the semiconductor die and the contact pads of the substrate. The interconnect structure is formed directly on the contact pads of the substrate and semiconductor die. The contact pads of the semiconductor die are etched prior to reflowing the aluminum-wettable conductive paste. An epoxy pre-dot to maintain a separation between the semiconductor die and substrate. | 06-26-2014 |
Ki Ju Yee, Daejeon KR
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20150316741 | APPARATUS FOR FIXING SOLID IMMERSION LENS - Provided is an apparatus for fixing a solid immersion lens (SIL) in an optical system. The apparatus includes a first adapter; a second adapter screw-coupled to the inner surface of the first adapter and screw-coupled to the outer surface of a third adapter to pressurize a first O-ring; the third adapter screw-coupled to the inner surfaces of the second adapter and a fourth adapter; the fourth adapter screw-coupled to the outer surface of the third adapter to pressurize a second O-ring; the first and second O-rings elastically fixing an outer surface of a barrel of an infrared ray (IR) objective lens; and an SIL holder mounting the SIL onto the first adapter. | 11-05-2015 |
Moonky Yee, Goyang-Si KR
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20110111542 | METHOD OF FABRICATING ORGANIC LIGHT EMITTING DIODE DISPLAY - A method of fabricating an OLED display, includes sequentially forming a TFT array, first electrodes, and a first related layer on a first substrate, respectively forming heat-generating elements on second and third substrates, forming a red organic emission pattern on the second substrate, and forming a green organic emission pattern on the third substrate, aligning and attaching the first and second substrates, applying a voltage to heat-generating elements to transfer the red organic emission pattern to red pixel regions, thereby forming red organic emission layers, aligning and attaching the first and third substrates, applying a voltage to the heat-generating elements to transfer the green organic emission pattern to green pixel regions, thereby forming green organic emission layers, entirely depositing a blue organic emission material on the first substrate, thereby forming a blue organic emission layer, and sequentially forming a second related layer and a second electrode on the first substrate. | 05-12-2011 |
Moonky Yee, Gyeonggi-Do KR
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20110068331 | ORGANIC LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - An organic light emitting device comprises a first substrate, a first electrode formed on the first substrate, a hole transporting layer formed on the first electrode, a light emitting layer formed on the hole transporting layer, a second electrode formed on the light emitting layer; and a mixture layer formed between the hole transporting layer and the light emitting layer, where the mixture layer including a hole transporting functioning material, wherein the hole transporting functioning material and the light emitting functioning material have concentration gradient respectively. | 03-24-2011 |
Moon Ky Yee, Gyeonggi-Do KR
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20090174318 | Organic electro-luminescence display device - An OLED device adapted to improve its life span and reliability is disclosed. The OLED device includes: a first electrode disposed on a substrate; an organic light emission layer disposed on the first electrode; a second electrode disposed on the organic light emission layer; an auxiliary electrode disposed on the second electrode; and a getter electrode, disposed on the auxiliary electrode, to remove at least one of moisture and oxygen. | 07-09-2009 |
Young Jon Yee, Seoul KR
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20080298624 | MODULE AND APPARATUS FOR TRANSMITTING AND RECEIVING SOUND - The module and apparatus for transmitting and receiving sound are disclosed in which a first channel is connected to an insertion of a microphone, a second channel is connected to a speaker insertion, such that sounds from the first and second channel are independently transmitted to prevent a first sound transmitted to the microphone and a second sound outputted from the speaker from being mixed, whereby noise generation can be obviated to improve characteristics of the module and the apparatus. | 12-04-2008 |
Youngjoo Yee, Gyeonggi-Do KR
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20120327683 | LIQUID MICRO-SHUTTER DISPLAY DEVICE - Disclosed is a display device. In detail, a liquid micro-shutter display device includes a light source emitting light, a transparent lower substrate positioned in an light path of the light source, an optical conversion unit performing at least one of a function of converting light from the light source into light having a different wavelength band corresponding to a sub-pixel and a function of reflecting ambient light corresponding to a sub-pixel, a transparent upper substrate positioned in an light path of light output from the optical conversion unit, and a liquid micro-shutter positioned between the transparent lower substrate and the transparent upper substrate and opening and closing the path of light or adjusting an open area. | 12-27-2012 |
20130088469 | MICRO-SHUTTER DISPLAY DEVICE - Disclosed is a display device and, more particularly, a micro-shutter display device including: a light source emitting light; a lower substrate having an optical conversion unit performing at least any one of a function of converting back light output from a light source into primary colors corresponding to sub-pixels and a function of reflecting ambient light having a primary color band corresponding to sub-pixels; a micro-shutter opening and closing a path of light output from the optical conversion unit; and a driving circuit supplying a driving signal to a movable unit electrode or a fixed counter electrode, wherein the micro-shutter includes: a shutter micro-structure comprised of a shutter blade blocking light output from the optical conversion unit and a shutter aperture allowing light output from the optical conversion unit to be transmitted therethrough; an elastic element connected to the shutter micro-structure to provide elastic restoring force when the shutter micro-structure structure is driven; a movable unit electrode configured to be connected to the shutter micro-structure; and a fixed counter electrode spaced apart by a certain interval from the movable unit electrode. | 04-11-2013 |
Young Joo Yee, Seoul KR
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20130016499 | OPTICAL DEVICE AND LIGHT EMITTING DIODE PACKAGE USING THE SAME, AND BACKLIGHT APPARATUSAANM Yee; Young JooAACI SeoulAACO KRAAGP Yee; Young Joo Seoul KRAANM Song; Ki ChangAACI SeoulAACO KRAAGP Song; Ki Chang Seoul KR - An optical device and an LED package using the same, and a backlight apparatus are provided, the optical device including a substrate, a first transparent thin film layer formed at one surface of the substrate, a quantum dot layer formed at an upper surface of the first transparent thin film layer and made of quantum dot particles, a protective layer formed on at least one of an upper surface or a bottom surface of the quantum dot layer and formed with metallic oxide nano particles, and a barrier member formed on the upper surface of the first transparent thin film layer for establishing an area formed with the quantum dot layer and the protective layer. | 01-17-2013 |
Young Joo Yee, Seongnam-Si KR
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20080212815 | APPARATUS FOR TRANSMITTING AND RECEIVING SOUND - The apparatus for transmitting and receiving sound is disclosed, wherein a directional microphone for detecting sound for transmission is applied and a sound output unit for outputting the received sound is arranged at a side of the directional microphone where sensitivity is low, thereby preventing sound coupling for received sound and sound for transmission without recourse to complicated signal processing to attenuate the echo and howling. | 09-04-2008 |
20080238317 | OPTICAL SHEET FOR PLASMA DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME - Disclosed are an optical sheet for a plasma display panel, a method for manufacturing the same and a plasma display panel employing the same. More particularly, provided are an optical sheet for a plasma display panel to improve a contrast ratio and a method for manufacturing the same. The optical sheet for a plasma display panel comprises a transparent substrate, a plurality of light-transmitting structures arranged on the transparent substrate, a reflective film arranged on the side of each of the light-transmitting structures, a black matrix arranged on the reflective film, and a cover part arranged on the black matrix. | 10-02-2008 |