Yasuta
Akira Yasuta, Osaka-Shi JP
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20160124575 | METHOD FOR INSPECTING TOUCH-PANEL ELECTRODE SUBSTRATE - Provided is a method for inspecting a touch panel with which method it is possible to perform an inspection with high accuracy and to allow an improvement in yield. A drive signal is supplied to either one of sensor electrodes ( | 05-05-2016 |
Akira Yasuta, Osaka JP
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20110234601 | INFORMATION PROCESSING APPARATUS - When a function is selected, and then, a character string to which the function is executed, an operation of selecting the character string is facilitated in order to reduce an operation burden of a user. | 09-29-2011 |
20110252062 | ELECTRONIC DEVICE FOR SEARCHING FOR ENTRY WORD IN DICTIONARY DATA, CONTROL METHOD THEREOF AND PROGRAM PRODUCT - An electronic dictionary searches for an entry word in dictionary data, and further conducts a search based on a keyword associated with image data. The electronic dictionary first searches for a keyword as described above, then extracts an image ID associated with the keyword found by the search, extracts an entry word associated in the dictionary data with the extracted image ID, and thereafter provides the entry word. | 10-13-2011 |
Hidehiko Yasuta, Yokohama-Shi JP
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20140299724 | TRAVERSING INCORE PROBE VALVE SUPPORT AND TRAVERSING INCORE PROBE SYSTEM - According to an embodiment, a traversing incore probe valve support has: a valve bed fixed to a traversing incore probe valve provided in a traversing incore probe guide tube extending to outside of a reactor containment vessel; a stand provided on a floor surface outside the reactor containment vessel; and a displacement allowing member that connects the stand and valve bed in such a manner that they can be displaced in an axial direction of the traversing incore probe guide tube. The displacement allowing member may include: a lower slide rail fixed to the stand valve bed and having an upward contact surface; and an upper slide rail fixed to the valve bed and having a downward contact surface that can be slid in the axial direction of the traversing incore probe guide tube while contacting the upward contact surface. | 10-09-2014 |
Hidehiko Yasuta, Kanagawa-Ken JP
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20120001012 | Traversing In-Core Probe Drive Unit and Method for Monitoring Friction of Inside of Guide Tubes - A TIP drive unit that calculates a cable drive torque stably is provided. In accordance with the invention, Traversing In-core Probe (TIP) drive unit includes a housing, a storage reel configured to storage the probe cable, a drive mechanism including a motor, and configured to feed the probe cable form the storage reel and spool the probe cable onto the storage reel, a motor controller configured to drive the motor at a predefined rotating speed, a processor configured to calculate a cable drive torque that is a torque necessary for moving the TIP and the probe cable by using a value of supply power necessary for driving the motor, a value of the predefined rotating speed of the motor, and a loss torque that is a torque necessary for driving the drive mechanism, and a noise filter configured to remove noise included in a signal indicating the value of the supply power. | 01-05-2012 |
Katsuo Yasuta, Musashino-Shi JP
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20130141127 | PROBE ASSEMBLY FOR INSPECTING POWER SEMICONDUCTOR DEVICES AND INSPECTION APPARATUS USING THE SAME - The present invention provides a probe assembly for inspecting power semiconductor devices, which comprises (1) a probe block having more than one probe holding hole, (2) more than one probe, each of which is contained in one of the probe holding holes with its outer surface being in contact with the inner surface of the probe holding hole, and which has lower end protruding from the probe block and coming into contact with the power semiconductor device on inspection, and (3) one or more cooling means which cool the probe block. According to the probe assembly and the inspection apparatus having the prove assembly of the present invention, it is possible to inspect characteristics of power semiconductor devices accurately by suppressing temperature rises of the probes as well as the power semiconductor device under test. | 06-06-2013 |
20130141132 | INSPECTION APPARATUS FOR SEMICONDUCTOR DEVICES AND CHUCK STAGE USED FOR THE INSPECTIONAPPARATUS - The present invention provides an inspection apparatus, which comprises probes for front side electrodes, probes for back side electrodes, and a chuck stage, wherein the probes for front side electrodes and the probes for back side electrodes are formed on the upper surface of the chuck stage, and the probe contact area electrically continues to the wafer holding area, and the probes for front side electrodes and the probes for back side electrodes are located leaving a distance in horizontal direction between them so that the probes for back side electrodes move relatively within the probe contact area when the probes for front side electrodes are moved relatively within the wafer under test by the movement of the chuck stage. According to the inspection apparatus of the present invention, it is possible to inspect characteristics of semiconductor devices having electrodes on both side of a wafer more accurately in wafer state. | 06-06-2013 |
Katsuo Yasuta, Hirosaki-Shi JP
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20080224723 | METHOD FOR TESTING A SEMICONDUCTOR WAFER AND APPARATUS THEREOF - Reliability of results of a test such as a wafer burn-in test is raised. The present invention is a method for testing a plurality of semiconductor devices in a semiconductor wafer held in a cartridge. Each of the semiconductor devices has electrodes and the cartridge has a lower cartridge portion provided with a chuck holding the semiconductor wafer thereon, and an upper cartridge portion provided with a probe assembly having probes capable of contacting said electrodes. After constituting the cartridge and before placing the cartridge in the thermostatic chamber, a contact check to determine whether or not electrical contact between the electrodes of the semiconductor devices in the cartridge and the probes of the probe assembly is appropriate is performed. | 09-18-2008 |
Katsuo Yasuta, Tokyo JP
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20100289514 | INSPECTION APPARATUS - An inspection apparatus is provided to perform an accurate temperature control, cut a noise wave, overcome contact failure, and improve inspection accuracy. The inspection apparatus includes a probe device having a contact for contacting with an electrode of an inspected object and having a built-in heater for correcting dislocation of the contact to the electrode caused by temperature difference between the probe device and the inspected object; a tester for testing probe device and supplying electric power to the heater; an electric power supply system, provided on the tester, for supplying electric power to the heater; and a temperature control unit for controlling electric power to the heater of the probe device through the electric power supply system, wherein the electric power supply system includes at least one open/close switch for switching on and off power supply to the heater. A connector including a male connector and a female connector provided on the other end are provided. A continuity-checking device checks to be able to supply electric power to the heater from the electric power supply system. | 11-18-2010 |
20110018564 | WAFER PROBER FOR SEMICONDUCTOR INSPECTION AND INSPECTION METHOD - A wafer prober is provided with a tray which supports a wafer at a set position, transports it to a processing position of the wafer and is placed at the processing position; one or more alignment units which position the wafer at the set position with respect to the tray; contact units arranged in number larger than that of the alignment units and performing inspection processing in contact with the wafer at the processing position; and a tray transport portion for transporting the tray supporting the wafer between the alignment unit and the contact unit. The tray is provided with three or more pin holes for allowing movement of the chuck pin in the XYZθ directions, an alignment mark for positioning the wafer, and an alignment portion for positioning the tray itself. | 01-27-2011 |
20120126844 | CHIP STACK DEVICE TESTING METHOD, CHIP STACK DEVICE REARRANGING UNIT, AND CHIP STACK DEVICE TESTING APPARATUS - A plurality of chip stack devices having different external sizes can be tested accurately and efficiently with low cost. The present invention provides a chip stack device testing method testing a chip stack device configured by stacking a plurality of chips separated by dicing a substrate under test tested in a testing unit. A tray for chip stack devices having equal shape and external dimension to those of the undiced substrate under test is used, one or a plurality of the chip stack devices are attached and supported to an adhesive layer of the tray for chip stack devices to align the chip stack devices with positions of the respective chips of the undiced substrate under test, the tray for chip stack devices is installed in the testing unit in a similar manner to that in a test of the substrate under test, and the respective chip stack devices are tested. | 05-24-2012 |
Koji Yasuta, Hiratsuka JP
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20090138630 | STORAGE SYSTEM AND EXTERNAL VOLUME CONNECTION PATH SEARCHING METHOD FOR STORAGE SYSTEM - In a storage system including: a host, a first storage apparatus, a second storage apparatus connected to the first storage apparatus via a communication line, and a management apparatus that manages the first storage apparatus and the second storage apparatus, the host and the first storage apparatus being connected to each other via the communication line; and the host using a volume in the second storage apparatus as an external volume for the first storage apparatus, the first storage apparatus includes: a port search processing unit that searches for communication ports of the second storage apparatus; and a volume search processing unit that searches for connection paths to a volume in the second storage apparatus by utilizing any of the communication ports found in the port search processing unit and outputs all the information about the found connection paths to the volume. | 05-28-2009 |
Mitsura Yasuta, Kaga JP
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20100222170 | DOUBLE-SIDED DRIVING SILENT CHAIN AND DOUBLE-SIDED DRIVING SILENT CHAIN TRANSMISSION USING THE SAME - A silent chain using double-sided driving link plates having symmetrical upper and lower teeth has a problem that it is unable to assure a required risky sectional area of the plates because a width between upper and lower crotches is narrow. The invention provides a silent chain using double-sided driving link plates whose required risky sectional area is maintained by using link plate whose back side is undercut and whose upper and lower parts are unsymmetrical even though its front side has a shape of a normal link plate. A distance from a line connecting centers of pin holes to a bottom of an upper-side crotch is equal to or more than ½ of a diameter of the pin hole to assure the risky sectional area. Teeth of the back side are cut away to form a flat surface to assure a contact area with a shoe and others. | 09-02-2010 |
Mitsuru Yasuta, Ishikawa JP
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20100120567 | WEAR-RESISTANT CHAIN - There is provided a wear-resistant chain having a high durability even in severe use environments such as those of a timing chain of an engine even though it is highly efficient and productive. A miniaturizing agent containing silicon is doped in a vanadium cementation process of a base material of steel. Vanadium carbide forming a surface-hardened layer contains a secondary phase composed of an amorphous structure containing silicon within crystal grains and a crystal grain size of the vanadium carbide is miniaturized to 1 μm or less. | 05-13-2010 |
Okinori Yasuta, Tokyo JP
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20110172013 | USER INTERFACE PROCESSING APPARATUS, METHOD OF PROCESSING USER INTERFACE, AND PROGRAM FOR PROCESSING USER INTERFACE - A user interface processing apparatus for controlling an application is provided. In the user interface processing apparatus, a touch on a display screen by means of a contact operation by a user on a touch panel is received. A touched position on the touch panel is detected when the touch on the display screen is received. The touched position is a position touched by the player on the display screen. A virtual controller is displayed at a predetermined position on the display screen corresponding to the detected touched position in a case where the touch on the display screen is received. An operation of the virtual controller displayed on the display screen is received from the player. The application is controlled in accordance with the operation received from the player. | 07-14-2011 |
Yoshinori Yasuta, Nirasaki City JP
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20140102638 | PLASMA PROCESSING APPARATUS - A plasma processing apparatus capable of optimizing a plasma process is provided. The plasma processing apparatus includes a control unit for controlling a minimum energy and a maximum energy of ions incident onto a substrate independently of each other such that ion energy of the ions are concentrated at a first energy band and a second energy band respectively. In the plasma processing apparatus, the oxide film is etched to form a hole within the oxide film, the first energy band is lower than a first energy value at which the oxide film is etched while the organic film is not etched, and the second energy band is higher than a second energy value at which an etching yield at an inclined surface of the hole is higher than an etching yield of an upper surface of the organic film. | 04-17-2014 |
Yoshinori Yasuta, Nirasaki JP
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20120214313 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS - There is provided a plasma processing apparatus capable of optimizing a plasma process in response to various requirements of a micro processing by effectively controlling a RF bias function. In this plasma processing apparatus, a high frequency power RF | 08-23-2012 |