Patent application number | Description | Published |
20150034903 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a first layer made of a group III nitride semiconductor of a first conductivity type, a second layer made of a group III nitride semiconductor of a second conductivity type on a first surface of the first layer, a third layer made of a group III nitride semiconductor of the first conductivity type on a first region of a surface of the second layer, a gate electrode extending through the second layer and the third layer and the first surface of the first layer, and insulated from the first, second, and third layers, a first electrode in contact with the third layer, a second electrode in contact with a second region of the surface of the second layer that is different from the first region, and a third electrode provided on a side of a second surface of the first layer. | 02-05-2015 |
20150069405 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device according to one embodiment includes an n-type first GaN-based semiconductor layer, a p-type second GaN-based semiconductor layer on the first GaN-based semiconductor layer. The second GaN-based semiconductor layer includes a low impurity concentration region and a high impurity concentration region. An n-type third GaN-based semiconductor layer is provided on the second GaN-based semiconductor layer. The device includes a gate electrode being located adjacent to the third GaN-based semiconductor layer, the low impurity concentration region, and the first GaN-based semiconductor layer intervening a gate insulating film. The device includes a first electrode on the third GaN-based semiconductor layer, a second electrode on the high impurity concentration region, and a third electrode on the opposite side of the first GaN-based semiconductor layer from the second GaN-based semiconductor layer. | 03-12-2015 |
20150076506 | SEMICONDUCTOR DEVICE - This disclosure provides a semiconductor device which includes a GaN-based semiconductor layer having a surface with an angle of not less than 0 degree and not more than 5 degrees with respect to an m-plane or an a-plane, a first electrode provided above the surface and having a first end, and a second electrode provided above the surface to space apart from the first electrode, having a second end facing the first end, and a direction of a segment connecting an arbitrary point of the first end and an arbitrary point of the second end is different from a c-axis direction of the GaN-based semiconductor layer. | 03-19-2015 |
20150263103 | SEMICONDUCTOR DEVICE - A semiconductor device according to an embodiment includes a first semiconductor layer including a first nitride semiconductor, a second semiconductor layer on the first semiconductor layer including a second nitride semiconductor, a source electrode, a drain electrode, a first gate electrode provided on the second semiconductor layer between the source electrode and the drain electrode having a schottky junction, a second gate electrode provided above the second semiconductor layer intervening an insulating film, provided between the source electrode and the first gate electrode, electrically connected with the first gate electrode, and a third gate electrode provided above the second semiconductor layer intervening an insulating film, provided between the drain electrode and the first gate electrode, electrically connected with the first gate electrode. A first transistor structure has a first threshold value, a second transistor structure has a second threshold value, and a third transistor structure has a third threshold value. | 09-17-2015 |
Patent application number | Description | Published |
20150263001 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first semiconductor layer and a second semiconductor layer formed on the first semiconductor layer. A first control electrode is on the first semiconductor layer with a first insulating layer between the first control electrode and the first semiconductor layer. A second control electrode is on the first semiconductor layer with a second insulating layer between the second control electrode and the first semiconductor layer, a distance between the first control electrode and the first semiconductor layer is less than a distance between the second control electrode. A wiring electrically connects the first control electrode and the second control electrode. | 09-17-2015 |
20150263101 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME - In one embodiment, a semiconductor device includes a semiconductor chip including a nitride semiconductor layer, and including a control electrode, a first electrode and a second electrode provided on the nitride semiconductor layer. The device further includes a support including a substrate, and including a control terminal, a first terminal and a second terminal provided on the substrate. The semiconductor chip is provided on the support such that the control electrode, the first electrode and the second electrode face the support. The control electrode, the first electrode and the second electrode of the semiconductor chip are electrically connected to the control terminal, the first terminal and the second terminal of the support, respectively. | 09-17-2015 |
20150263104 | SEMICONDUCTOR DEVICE - A semiconductor device of this embodiment includes: a first semiconductor layer including Al | 09-17-2015 |
20150263152 | SEMICONDUCTOR DEVICE - A semiconductor device includes a GaN-based semiconductor layer, a source electrode on the GaN-based semiconductor layer, a drain electrode on the GaN-based semiconductor layer, and a gate electrode formed on the GaN-based semiconductor layer between the source electrode and the drain electrode. A first layer is in contact with the GaN-based semiconductor layer between the gate electrode and the drain electrode. | 09-17-2015 |
20150263630 | POWER SUPPLY CIRCUIT - In one embodiment, a power supply circuit includes a first circuit including one or more first switching devices, and a first controller configured to control the first switching devices, the first circuit being configured to output a first voltage. The power supply circuit further includes a second circuit including one or more second switching devices which include a normally-on device, and a second controller configured to control the second switching devices, the second circuit being configured to output a second voltage generated from the first voltage. The second controller transmits a first signal for allowing the first circuit to output the first voltage, based on a value of a voltage or a current at a first node in the second circuit. The first controller allows the first circuit to output the first voltage by controlling the first switching devices in accordance with the first signal. | 09-17-2015 |
20150263700 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a GaN-based semiconductor layer, a resonator that uses a first portion of the GaN-based semiconductor layer as a piezoelectric layer to resonate, and a transistor that uses a second portion of the GaN-based semiconductor layer as a channel layer. | 09-17-2015 |