Patent application number | Description | Published |
20080246132 | Semiconductor device and method of manufacturing semiconductor device - This semiconductor device includes a semiconductor chip, and a lead arranged around the semiconductor chip to extend in a direction intersecting with the side surface of the semiconductor chip, and having at least an end farther from the semiconductor chip bonded to a package board, wherein a joint surface to the package board and an end surface orthogonal to the joint surface are formed on the end of the lead farther from the semiconductor chip, and a metal plating layer made of a pure metal is formed on the end surface. | 10-09-2008 |
20090051049 | Semiconductor device, substrate and semiconductor device manufacturing method - The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane. | 02-26-2009 |
20090115050 | Interposer And Semiconductor Device - An interposer and a semiconductor device including the interposer are provided, which can prevent thermal warpage of an insulative substrate thereof. The interposer is to be provided together with a semiconductor chip in a semiconductor device and, when the semiconductor device is mounted on a mount board, disposed between the semiconductor chip and the mount board. The interposer includes: an insulative substrate of an insulative resin; an island provided on one surface of the insulative substrate to be bonded to a rear surface of the semiconductor chip via a bonding agent; a thermal pad provided on the other surface of the insulative substrate opposite from the one surface in generally opposed relation to the island with the intervention of the insulative substrate; and a thermal via extending through the insulative substrate from the one surface to the other surface to connect the island to the thermal pad in a thermally conductive manner. | 05-07-2009 |
20100006995 | RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD - A resin-encapsulated semiconductor device having a semiconductor chip which is prevented from being damaged. The resin-encapsulated semiconductor device comprises a semiconductor chip including a silicon substrate, a die pad to which the semiconductor chip is secured through a first solder layer, a resin-encapsulating layer encapsulating the semiconductor chip, and lead terminals electrically connected to the semiconductor chip and including inner lead portion covered with the resin-encapsulating layer. The lead terminals are made of copper or a copper alloy. The die pad is made of 42 alloy or a cover alloy and has a thickness (about 0.125 mm) less than the thickness (about 0.15 mm) of the lead terminals. | 01-14-2010 |
20100013069 | SEMICONDUCTOR DEVICE, LEAD FRAME AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device and a lead frame capable of preventing development of defective mounting resulting from a burr and a method of manufacturing a semiconductor device with the lead frame are provided. The semiconductor device includes a semiconductor chip and a lead arranged on the periphery of the semiconductor chip to extend in a direction intersecting with the side surface of the semiconductor chip, so that at least an end portion on the side farther from the semiconductor chip is bonded to a mounting substrate. A groove opened on a surface bonded to the mounting substrate and an end face on the side farther from the semiconductor chip is formed in the lead over the full width in the width direction orthogonal to the thickness direction and along the end face. An embedded body made of solder is embedded in the groove. | 01-21-2010 |
20100013095 | SEMICONDUCTOR DEVICE, PRODUCTION METHOD FOR THE SAME, AND SUBSTRATE - A semiconductor device is provided in which a semiconductor chip is bonded to a substrate with a sufficiently increased bonding strength and cracking is assuredly prevented which may otherwise occur due to heat shock, heat cycle and the like. The semiconductor device includes a semiconductor chip and a substrate having a bonding area to which the semiconductor chip is bonded via a metal layer. The metal layer includes an Au—Sn—Ni alloy layer and a solder layer provided on the Au—Sn—Ni alloy layer. Undulations are formed in an interface between the Au—Sn—Ni alloy layer and the solder layer. | 01-21-2010 |
20100270666 | Semiconductor device and method of manufacturing semiconductor device - The semiconductor device according to the present invention includes a semiconductor chip, a solid plate to which the semiconductor chip is bonded, and a bonding member made of a BiSn-based material interposed between the semiconductor chip and the solid plate, while the bonding member has a heat conduction path made of Ag for improving heat conductivity between the semiconductor chip and the solid plate. | 10-28-2010 |
20110115089 | Semiconductor device, production method for the same, and substrate - A semiconductor device is provided in which a semiconductor chip is bonded to a substrate with a sufficiently increased bonding strength and cracking is assuredly prevented which may otherwise occur due to heat shock, heat cycle and the like. The semiconductor device includes a semiconductor chip and a substrate having a bonding area to which the semiconductor chip is bonded via a metal layer. The metal layer includes an Au—Sn—Ni alloy layer and a solder layer provided on the Au—Sn—Ni alloy layer. Undulations are formed in an interface between the Au—Sn—Ni alloy layer and the solder layer. | 05-19-2011 |
20110140256 | SEMICONDUCTOR DEVICE, SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane. | 06-16-2011 |
20110156226 | INTERPOSER AND SEMICONDUCTOR DEVICE - An interposer and a semiconductor device including the interposer are provided, which can prevent thermal warpage of an insulative substrate thereof. The interposer is provided with a semiconductor chip in a semiconductor device andmay be disposed between the semiconductor chip and a mount board. The interposer includes: a substrate of an insulative resin; an island on one surface of the substrate to be bonded to a rear surface of the chip; a thermal pad on the other surface opposite the one surface opposed to the island with the intervention of the substrate; and a thermal via extending through the substrate from the one surface to the other surface to thermally connect the island to the thermal pad. | 06-30-2011 |
20120007247 | Resin-Encapsulated Semiconductor Device - A resin-sealed semiconductor device includes a semiconductor chip including a silicon substrate; a die pad on which the semiconductor chip is secured via a solder layer; a sealing resin layer sealing the semiconductor chip; and lead terminals connected electrically with the semiconductor chip. One end portion of the lead terminals is covered by the sealing resin layer. The die pad and the lead terminals are formed of copper and a copper alloy, and the die pad is formed with a thickness larger than a thickness of the lead terminals, which is a thickness of 0.25 mm or more. | 01-12-2012 |
20120153444 | SEMICONDUCTOR DEVICE - A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film. | 06-21-2012 |
20140312513 | SEMICONDUCTOR DEVICE, SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane. | 10-23-2014 |
20140332944 | RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD - A resin-encapsulated semiconductor device having a semiconductor chip which is prevented from being damaged. The resin-encapsulated semiconductor device ( | 11-13-2014 |