Patent application number | Description | Published |
20120149152 | METHOD TO PREVENT METAL PAD DAMAGE IN WAFER LEVEL PACKAGE - The present disclosure provide a method of manufacturing a microelectronic device. The method includes forming a bonding pad on a first substrate; forming wiring pads on the first substrate; forming a protection material layer on the first substrate, on sidewalls and top surfaces of the wiring pads, and on sidewalls of the bonding pad, such that a top surface of the bonding pad is at least partially exposed; bonding the first substrate to a second substrate through the bonding pad; opening the second substrate to expose the wiring pads; and removing the protection material layer. | 06-14-2012 |
20120161582 | MEMS KINETIC ENERGY CONVERSION - The present disclosure provides a micro device. The device has a micro-electro-mechanical systems (MEMS) movable structure, a plurality of metal loops over the MEMS movable structure, and a piezoelectric element over the MEMS movable structure. Frontside and backside capping wafers are bonded to the MEMS structure, with the frontside and backside capping wafers encapsulating the MEMS movable structure, the plurality of metal loops, and the piezoelectric element. The device further includes a magnet disposed on the frontside capping wafer over the plurality of metal loops. | 06-28-2012 |
20120235647 | SENSOR WITH ENERGY-HARVESTING DEVICE - In some embodiments of the present disclosure, a sensor comprises a substrate, a sensor element and an energy-harvesting device. The sensor element comprises a plate, and the plate is moveable with respect to the substrate. The energy-harvesting device is formed on the plate of the sensor element. | 09-20-2012 |
20130037891 | MEMS DEVICE AND METHOD OF FORMATION THEREOF - The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (MEMS) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate. The bonding site is recessed from the first surface. Thus, a top surface of the bond pad may lie below the plane of the top surface of the substrate. A device with recessed connective element(s) (e.g., bond pad) is also described. In further embodiments, a protective layer is formed on the recessed connective element during dicing of a substrate. | 02-14-2013 |
20130147317 | MEMS KINETIC ENERGY CONVERSION - The present disclosure provides a micro device. The device has a micro-electro-mechanical systems (MEMS) movable structure, a plurality of metal loops over the MEMS movable structure, a piezoelectric element over the MEMS movable structure, and a magnet disposed over the plurality of metal loops. The MEMS movable structure, the plurality of metal loops, and the piezoelectric element are encapsulated. | 06-13-2013 |
20140208580 | SENSOR WITH ENERGY-HARVESTING DEVICE - A method of fabricating a device includes forming a moveable plate over a substrate, and forming an energy harvesting coil in the moveable plate. The method further includes forming at least one connector connecting the movable plate with the energy harvesting coil, wherein a portion of the energy harvesting coil extends along the at least one connector. The method further includes forming electrodes around the moveable plate, the electrodes adapted to sense motion of the moveable plate. | 07-31-2014 |
20140231967 | SYSTEMS AND METHODS FOR POST-BONDING WAFER EDGE SEAL - A method for fabricating a semiconductor device is disclosed. A first substrate is arranged over a second substrate. A wafer bonding process is performed on the semiconductor device. First regions of the device are enclosed by the bonding process. Second regions of the device remain exposed. One or more processes are performed on the exposed second regions, after performing the wafer bonding process. The one or more processes include a fill process that forms a fill material within the exposed second regions. An edge seal material is applied on the first and second substrates after performing the one or more processes. | 08-21-2014 |
20140248730 | MEMS Device and Method of Formation Thereof - The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (MEMS) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate. The bonding site is recessed from the first surface. Thus, a top surface of the bond pad may lie below the plane of the top surface of the substrate. A device with recessed connective element(s) (e.g., bond pad) is also described. In further embodiments, a protective layer is formed on the recessed connective element during dicing of a substrate. | 09-04-2014 |
20140270272 | Structure and Method for Integrated Microphone - The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate; a silicon oxide layer formed on one side of the first silicon substrate; a second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates; and a diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates, wherein the first plate and the diaphragm are configured to form a capacitive microphone. | 09-18-2014 |