Patent application number | Description | Published |
20120247392 | MULTICHAMBER THIN-FILM DEPOSITION APPARATUS AND GAS-EXHAUSTING MODULE - A gas-exhausting module for a multichamber thin-film deposition apparatus, which has one or more reactor chambers, includes a collecting chamber and a plurality of gas pipes. The collecting chamber includes an upper portion and a lower portion. The cross-sectional area of the lower portion is less than the cross-sectional area of the upper portion. One end of each gas pipe communicates with one of the reactor chambers. The other end of each gas pipe communicates with the upper portion in a tangential direction. During operation, a cyclonic airflow is provided within the collecting chamber to uniformly extract the exhaust gas from each reactor chamber. | 10-04-2012 |
20120321788 | ROTATION SYSTEM FOR THIN FILM FORMATION - A system for forming one or more layers of material on one or more substrates is disclosed. The system includes a susceptor that rotates around a central susceptor axis. One or more holder gears are located on the susceptor. The holder gears may rotate around the central susceptor axis with the susceptor. Teeth of at least two adjacent holder gears at least partially overlap without touching. A central gear engaged to the holder gears may cause the holder gears to rotate around holder axes of the respective holder gears while the holder gears rotate around the central susceptor axis. | 12-20-2012 |
20120321790 | ROTATION SYSTEM FOR THIN FILM FORMATION - A system for forming one or more layers of material on one or more substrates is disclosed. The system includes a susceptor that rotates around a central susceptor axis. One or more holder gears are located on the susceptor. The holder gears may rotate around the central susceptor axis with the susceptor. A central gear engaged to the holder gears may cause the holder gears to rotate around holder axes of the respective holder gears while the holder gears rotate around the central susceptor axis. The susceptor and the central gear may rotate independently. | 12-20-2012 |
20130108792 | LOADING AND UNLOADING SYSTEM FOR THIN FILM FORMATION AND METHOD THEREOF | 05-02-2013 |
20130291795 | THIN FILM DEPOSITION SYSTEM WITH COOLING MODULE - A film deposition apparatus is disclosed. The apparatus comprises: a reaction chamber, a susceptor, a heating module, a driving module, and a cooling module. The susceptor is used for bearing at least one wafer; the heating module is used for heating the wafer; the driving module is used for driving the susceptor to rotate. The cooling module is disposed between the heating module and the driving module. The cooling module is configured to make the temperature distribution between the heating module and the driving module discontinuous. | 11-07-2013 |
Patent application number | Description | Published |
20130249841 | HANDHELD DEVICE AND HOMESCREEN MANAGEMENT METHOD THEREOF - A handheld device and a homescreen management method thereof are provided. The handheld device comprises a touch screen and a processor electrically connected to the touch screen. The touch screen displays a user interface, and senses a long pressing of an object and generates a first touch signal. The processor executes a homescreen management program according to the first touch signal, and enables the touch screen to display a homescreen management interface corresponding to the homescreen management program. The homescreen management interface comprises a page navigation area and a candidate object area. The page navigation area comprises a first page image and the candidate object area comprises an object image. The touch screen further senses a pressing of the object and generates a second touch signal, and the processor adds the object image into the first page image according to the second touch signal. | 09-26-2013 |
20140101582 | MOBILE COMMUNICATIONS DEVICE, NON-TRANSITORY COMPUTER-READABLE MEDIUM AND METHOD OF CONFIGURING HOME SCREEN OF MOBILE COMMUNICATIONS DEVICE - A method of configuring and updating a home screen of a mobile communications device is provided. The home screen is configured and updated by a processor and displayed on a display panel of the mobile communications device. The method includes providing a plurality of tiles, each of the tiles displaying a feed from a corresponding one of feed sources; filling the tiles into the home screen that has a top page, one or more pages being addable immediately above the top page, each page having a layout of a plurality of slots, each of the slots being for accommodating a corresponding one of the tiles; and after an update that results in insertion of at least one new tile into the home screen occurs, placing the at least one new tile displaying a new feed on the top page, and moving at least one existing tile that was on the top page prior to the update to a new, different location of the home screen. A non-transitory computer-readable medium and a mobile communications device of configuring a home screen of a mobile communications device are also provided. | 04-10-2014 |
20140101597 | MOBILE COMMUNICATIONS DEVICE, NON-TRANSITORY COMPUTER-READABLE MEDIUM AND METHOD OF NAVIGATING BETWEEN A PLURALITY OF DIFFERENT VIEWS OF HOME SCREEN OF MOBILE COMMUNICATIONS DEVICE - A method of navigating between a plurality of different views of a home screen of a mobile communications device is provide. The mobile communications device includes a home button, a processor, and a display panel configured to cooperate with the processor to display one of the views of the home screen. The method includes selectively displaying one of the views of the home screen on the display panel based on a number of times the home button is activated within a predetermined time period. A non-transitory computer-readable medium and a mobile communications device of navigating between a plurality of different views of a home screen of a mobile communications device are also provided. | 04-10-2014 |
20140101609 | MOBILE COMMUNICATIONS DEVICE, NON-TRANSITORY COMPUTER-READABLE MEDIUM AND METHOD OF ACTIVATING UPDATE OF HOME SCREEN OF MOBILE COMMUNICATIONS DEVICE - A method of activating an update of a home screen of a mobile communications device is provided. The home screen is displayed on a display panel of the mobile communications device. The home screen includes a plurality of tiles displaying a plurality of feeds from one or more feed sources. The method includes performing one of updating the home screen or activating and displaying a menu bar on the display panel based on a distance of a downward scrolling on a top page of a home screen. A non-transitory computer-readable medium and a mobile communications device for activating an update of a home screen of a mobile communications device are also provided. | 04-10-2014 |
Patent application number | Description | Published |
20080224782 | Frequency jittering control circuit and method for using the same - A frequency jittering control circuit wherein by means of the characteristics of a PLL whose input switches between different frequencies, the output frequency of the PLL swings between the different frequencies to achieve the desired frequency jittering. | 09-18-2008 |
20080298605 | Half-Voltage Headphone Driver Circuit - The present invention discloses a half-voltage headphone driver circuit, comprising: at least one operational amplifier providing an output to a headphone speaker, and a charge pump receiving a supply voltage (VDD), generating a positive half-voltage and a negative half-voltage (VDD/2 and −VDD/2) based on the supply voltage, and supplying the positive half-voltage and negative half-voltage as high and low operation levels to the at least one operational amplifier. | 12-04-2008 |
20090115391 | Load-Dependent Frequency Jittering Circuit and Load-Dependent Frequency Jittering Method - The present invention discloses a load-dependent frequency jittering circuit, comprising: a load condition detection circuit for receiving a switching signal and generating an output according to a load condition; a number generator for receiving the output of the load condition detection circuit and generating a number; a digital to analog converter for converting the output of the number generator to an analog signal; and an oscillator for generating a jittered frequency according to the output of the digital to analog converter. | 05-07-2009 |
20090279713 | Multi-Voltage headphone drive circuit - The present invention discloses a multi-voltage headphone driver circuit comprising: at least one operational amplifier having an output supplied to a headphone speaker, the operational amplifier receiving a first power supply as its high operation voltage; a charge pump receiving a second power supply to generate a negative voltage corresponding to the second power supply in magnitude; and an m-fold circuit multiplying the negative voltage by m and providing the result to the operational amplifier as a low operation voltage thereof, wherein m is a real number. | 11-12-2009 |
20090285416 | Speaker Driver Circuit Driven By Postive and Negative Voltages - A speaker driver circuit driven by positive and negative voltages, comprising: at least one operational amplifier providing an output to a headphone speaker, and a voltage converter receiving a supplied voltage (VDD), generating r-fold positive and negative voltages (r·VDD and −r·VDD, wherein r is any positive real number except 1) according to the supplied voltage, and supplying the positive and negative voltages to the operational amplifier for its high and low operation voltage levels respectively. | 11-19-2009 |
Patent application number | Description | Published |
20100004103 | Scissors-like exercising apparatus - A scissors-like exercising apparatus includes two bodies intersecting with each other, a pivoting unit located between the two bodies, and two sliding units coupled to lower ends of the two bodies. To operate the present invention, the user grasps the tops of the two bodies and stands on the sliding units to retract and extend the two bodies inward and outward like the operation of a pair of scissors. | 01-07-2010 |
20140162860 | UPRIGHT HORSE RIDING EXERCISE MACHINE - An upright horse riding exercise machine includes a base, two pedals and two elastic units. The two pedals are respectively coupled on top of the two elastic units. When the user stands on the two pedals and jumps up and down, the elastic units provide elasticity to assist the user in exercising up and down to imitate horse riding or horse riding dance, providing exercise, bodybuilding and amusement objects. The present invention provides an interesting exercise apparatus, having product commercialization value. | 06-12-2014 |
20140349817 | STEPPING EXERCISER - A stepping exerciser includes a lower main body and an upper main body. The lower main body includes a bottom board. The bottom board has a lower resilient portion extending upward. The upper main body includes a top board. The top board has an upper resilient portion extending downward. The two ends of the upper resilient portion and the lower resilient portion are pivoted by shaft members to form an oval shape. The user can use one or two stepping exerciser as desired. When in use, the user wears the stepping exerciser to jump and step for exercise or amusement. This is beneficial for promoting gastrointestinal peristalsis and digesting. | 11-27-2014 |
Patent application number | Description | Published |
20110266541 | Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip - A semiconductor chip includes a circuit region and a corner stress relief (CSR) region. The CSR region is in a corner of the semiconductor chip. A device under test (DUT) structure or a functional circuit is disposed on the circuit region. A probe pad is disposed on the CSR region. A metal line extends from the circuit region to the CSR region to electrically connect the probe pad to the DUT structure or a functional circuit. | 11-03-2011 |
20110284843 | Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip - A semiconductor chip includes a corner stress relief (CSR) region. An enhanced structure connects sides of a seal ring structure to surround the CSR region. A device under test (DUT) structure is disposed on the CSR region. A set of probe pad structures is disposed on the CSR region. Two of the set of probe pad structures are electrically connect to the DUT structure. | 11-24-2011 |
20110309465 | SEAL RING STRUCTURE IN SEMICONDUCTOR DEVICES - The present disclosure provides a semiconductor device that includes a substrate having a seal ring region and a circuit region, a plurality of dummy gates disposed over the seal ring region of the substrate, and a seal ring structure disposed over the plurality of dummy gates in the seal ring region. A method of fabricating a semiconductor device is also provided, the method including providing a substrate having a seal ring region and a circuit region, forming a plurality of dummy gates over the seal ring region of the substrate, and forming a seal ring structure over the plurality of dummy gates over the seal ring region. | 12-22-2011 |
20120018877 | Package-on-Package Structures with Reduced Bump Bridging - A device includes a package substrate including a first non-reflowable metal bump extending over a top surface of the package substrate; a die over and bonded to the package substrate; and a package component over the die and bonded to the package substrate. The package component includes a second non-reflowable metal bump extending below a bottom surface of the package component. The package component is selected from the group consisting essentially of a device die, an additional package substrate, and combinations thereof. A solder bump bonds the first non-reflowable metal bump to the second non-reflowable metal bump. | 01-26-2012 |
20120104594 | GROUNDED SEAL RING STRUCTURE IN SEMICONDUCTOR DEVICES - A semiconductor device includes a substrate having a seal ring region and a circuit region, at least one corner bump disposed in the circuit region, a seal ring structure disposed in the seal ring region, and a connector electrically coupling a metal layer of the seal ring structure to the at least one corner bump. The at least one corner bump is configured to be coupled to a signal ground. A method of fabricating a semiconductor device includes providing a substrate having a seal ring region and a circuit region, providing at least one corner bump in a triangular corner bump zone in the circuit region, providing a seal ring structure in the seal ring region, electrically coupling a metal layer of the seal ring structure to the at least one corner bump, and electrically coupling the at least one corner bump to a signal ground. | 05-03-2012 |
20120126359 | Structure to Reduce Etching Residue - A structure for reducing partially etched materials is described. The structure includes a layout of an intersection area between two trenches. First, a large intersection area having a trapezoidal corner may be replaced with an orthogonal intersection between two trenches. The layout reduces the intersection area as well as the possibility of having partially etched materials left at the intersection area. The structure also includes an alternative way to fill the intersection area with either an un-etched small trapezoidal area or multiple un-etched square areas, so that the opening area at the intersection point is reduced and the possibility of having partially etched materials is reduced too. | 05-24-2012 |
20120175728 | SEAL RING STRUCTURE FOR INTEGRATED CIRCUIT CHIPS - A semiconductor device includes a substrate having a circuit region and a seal ring region. The seal ring region surrounds the circuit region. A seal ring structure is disposed over the seal ring region. The seal ring structure has a first portion and a second portion above the first portion. The first portion has a width W | 07-12-2012 |
20130087914 | WAFER LEVEL CHIP SCALE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A wafer level chip scale package (WLCSP) includes a semiconductor device including an active surface having a contact pad, and side surfaces. A mold covers the side surfaces of the semiconductor device. A RDL structure includes a first PPI line electrically connected to the contact pad and extending on the active surface of the semiconductor device. A UBM layer is formed over and electrically connected to the first PPI line. A seal ring structure extends around the upper periphery of the semiconductor device on the mold. The seal ring structure includes a seal layer extending on the same level as at least one of the first PPI line and the UBM layer. A method of manufacturing a WLCSP includes forming a re-routing laminated structure by simultaneously forming an interconnection line and a seal layer on the molded semiconductor devices. | 04-11-2013 |
20130270686 | METHODS AND APPARATUS FOR HEAT SPREADER ON SILICON - Apparatus and methods for forming a heat spreader on a substrate to release heat for a semi-conductor package are disclosed. The apparatus comprises a substrate. A dielectric layer is formed next to the substrate and in contact with a surface of the substrate. A heat spreader is formed next to the substrate and in contact with another surface of the substrate. A passivation layer is formed next to the dielectric layer. A connection pad is placed on top of the passivation layer. The substrate may comprise additional through-silicon-vias. The contact surface between the substrate and the heat spreader may be a scraggy surface. The packaging method further proceeds to connect a chip to the connection pad by way of a connection device such as a solder ball or a bump. | 10-17-2013 |
20130270710 | GUARD RING DESIGN STRUCTURE FOR SEMICONDUCTOR DEVICES - A customized seal ring for a semiconductor device is formed of multiple seal ring cells that are selected and arranged to produce a seal ring design. The cells include first cells that are coupled to ground and second cells that are not coupled to ground. The second cells that are not coupled to ground, include a higher density of metal features in an inner portion thereof, than the first seal ring cells. Dummy metal vias and other metal features that may be present in the inner portion of the second seal ring cells are absent from the inner portion of the first seal ring cells that are coupled to ground. The seal ring design may include various arrangements, including alternating and repeating sequences of the different seal ring cells. | 10-17-2013 |
20140091437 | CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A package includes a semiconductor device including an active surface having a contact pad. A redistribution layer (RDL) structure includes a first post-passivation interconnection (PPI) line electrically connected to the contact pad and extending on the active surface of the semiconductor device. An under-bump metallurgy (UBM) layer is formed over and electrically connected to the first PPI line. A seal ring structure extends around the upper periphery of the semiconductor device. The seal ring structure includes a seal layer extending on the same level as at least one of the first PPI line and the UBM layer. | 04-03-2014 |
20140315383 | METHODS OF MAKING INTEGRATED CIRCUITS - A method of making an integrated circuit including forming a seal ring structure around a circuit where the seal ring structure has a first portion and a tilted portion. The first portion of the seal ring structure is substantially parallel with an edge of the circuit. The tilted portion of the seal ring structure forms an obtuse angle with the first portion. The method further includes forming a first pad which is electrically coupled with the seal ring structure. The method further includes disposing a leakage current test structure in an area enclosed by the seal ring where at least one portion of the leakage current test structure is substantially parallel with the tilted portion of the seal ring structure. The method further includes forming a second pad which is electrically coupled with the leakage current test structure. | 10-23-2014 |
20150206817 | CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A package comprises a semiconductor device. The semiconductor device comprises an active surface and side surfaces. The active surface has a contact pad. The package also comprises a mold covering the side surfaces of the semiconductor device. The package further comprises an interconnection line coupled with the contact pad and extending over the active surface of the semiconductor device. The package additionally comprises an under-bump metallurgy (UBM) layer over the interconnection line. The package also comprises a seal ring structure extending around and outside an upper periphery of the semiconductor device on the mold, the seal ring structure comprising a seal layer extending on a same level as at least one of the interconnection line or the UBM layer. | 07-23-2015 |
Patent application number | Description | Published |
20120097986 | WAFER LEVEL REFLECTOR FOR LED PACKAGING - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 04-26-2012 |
20120249925 | LIGHT CAVITY THAT IMPROVES LIGHT OUTPUT UNIFORMITY - A radiation device is disclosed. The device includes a light cavity including a top surface, a bottom surface, and side walls. A light source array including at least one light source is formed on a first side wall. The device also includes a reflective coating formed on at least the bottom surface. The top surface allows light transmission and includes a light conversion layer. | 10-04-2012 |
20120299017 | BATWING LED WITH REMOTE PHOSPHOR CONFIGURATION - An LED emitter uses a molded lens with phosphor material embedded in a circumferential trench to generate a batwing beam pattern. After the lens is molded over a package substrate with connected LED dies thereon, the phosphor material is molded, injected, or dispensed into a circumferential trench. The molded lens is shaped such that a majority of the light emitted by the one or more LED dies is reflected by the top surface to the side surfaces through the phosphor material. | 11-29-2012 |
20120299018 | BAT-WING LENS DESIGN WITH MULTI-DIE - A batwing beam is produced from an optical emitter having a primary LED lens over a number of LED dies on a package substrate. The LED lens includes a batwing surface formed by rotating a parabolic arc about an end of the parabolic arc over a center of the optical emitter. A center of each of the LED dies is mounted to the package substrate about the focus of a parabola whose arc forms the batwing surface, for example, between about 0.5 to 1.5 of a focal distance from the vertex of the parabola. The batwing surface reflects light from the number of LED dies through total internal reflection (TIR) or through a reflectivity gel coating. | 11-29-2012 |
20130299855 | Wafer Level Reflector for LED Packaging - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 11-14-2013 |
20130309789 | Batwing LED with Remote Phosphor Configuration - A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board. | 11-21-2013 |
20140247578 | BATWING LED WITH REMOTE PHOSPHOR CONFIGURATION - A lighting apparatus includes a substrate. One or more light-emitting devices are disposed over the substrate. A lens is molded over the substrate and over the one or more light-emitting devices. A recess is disposed in the lens. The recess circumferentially surrounds the one or more light-emitting devices in a top view. The recess is at least partially filled with phosphor particles. | 09-04-2014 |
20140295592 | BAT-WING LENS DESIGN WITH MULTI-DI - A batwing beam is produced from an optical emitter having a primary LED lens over a number of LED dies on a package substrate. The LED lens includes a batwing surface formed by rotating a parabolic arc about an end of the parabolic arc over a center of the optical emitter. A center of each of the LED dies is mounted to the package substrate about the focus of a parabola whose arc forms the batwing surface, for example, between about 0.5 to 1.5 of a focal distance from the vertex of the parabola. The batwing surface reflects light from the number of LED dies through total internal reflection (TIR) or through a reflectivity gel coating. | 10-02-2014 |
20150118772 | BATWING LED WITH REMOTE PHOSPHOR CONFIGURATION - A lens is formed over one or more light-emitting devices disposed over a substrate. The lens includes a trench that circumferentially surrounds the one or more light-emitting devices. The trench is filled with a phosphor-containing material. | 04-30-2015 |
20150380616 | BATWING LED WITH REMOTE PHOSPHOR CONFIGURATION - A lens is formed over one or more light-emitting devices disposed over a substrate. The lens includes a trench that circumferentially surrounds the one or more light-emitting devices. The trench is filled with a phosphor-containing material. | 12-31-2015 |
Patent application number | Description | Published |
20130208139 | Exposure Value Adjustment Apparatus, Method, and Non-Transitory Tangible Machine-Readable Medium Thereof - An exposure value adjustment apparatus, method, and non-transitory tangible machine-readable medium thereof are provided. The exposure value adjustment apparatus includes a camera module and a processor. The camera module captures a reference image by a base exposure value. The processor generates a histogram of the reference image, divides the histogram into a low partial histogram, a middle partial histogram, and a high partial histogram by a first threshold and a second threshold, decides a high exposure value according to the low partial histogram and the middle partial histogram, decides a low exposure value according to the high partial histogram and the middle partial histogram, and decides a middle exposure value according to the high exposure value and the low exposure value. The low exposure value is lower than the high exposure value, and the middle exposure value is between the high exposure value and the low exposure value. | 08-15-2013 |
20130235232 | Electronic Apparatus and Adjustment Method Thereof - Electronic apparatuses and adjustment methods thereof are provided. The electronic apparatus includes a camera module and a processor. The camera module is enabled into an HDR mode and captures a reference frame according to a first exposure setting, wherein the reference frame corresponds to a plurality of luminance values. The processor calculates a weighted luminance value of the reference frame according to the luminance values, generates a comparison result by comparing the weighted luminance value and a luminance target of the HDR mode, and decides a second exposure setting according to the comparison result. | 09-12-2013 |
20150296114 | ELECTRONIC APPARATUS AND ADJUSTMENT METHOD THEREOF - Electronic apparatuses and adjustment methods thereof are provided. The electronic apparatus includes a camera module and a processor. The camera module is enabled into an HDR mode and captures a reference frame according to a first exposure setting, wherein the reference frame corresponds to a plurality of luminance values. The processor calculates a weighted luminance value of the reference frame according to the luminance values, generates a comparison result by comparing the weighted luminance value and a luminance target of the HDR mode, and decides a second exposure setting according to the comparison result. | 10-15-2015 |
20150304537 | ELECTRONIC APPARATUS AND ADJUSTMENT METHOD THEREOF - Electronic apparatuses and adjustment methods thereof are provided. The electronic apparatus includes an input interface and a processor. The input interface is configured to receive a reference frame, wherein the reference frame corresponds to a plurality of luminance values. The processor is electrically connected to the input interface and configured to adjust at least a portion of the luminance values that are greater than a predetermined threshold, calculate a weighted luminance value of the reference frame according to the luminance values, generate a comparison result by comparing the weighted luminance value and a luminance target, and decide the luminance values according to the comparison result. | 10-22-2015 |
Patent application number | Description | Published |
20100081669 | PRESSURE SENSITIVE ADHESIVE MATRIX DEVICE OR SYSTEM FOR THE TREATMENT OR PREVENTION OF ONYCHOMYCOSIS OR TINEA PEDIS - Disclosed is a pressure-sensitive adhesive matrix patch device for treatment or prevention of fungal toenails or fingernails or foot infections comprising an antifungal agent or two or more antifungals in combination and adhesively secured to a dorsal site of an infected palm or foot, rather than an area of infection and surrounding skin. A method for the transdermal treatment or prevention of fungal toenails or fingernails or foot infections with an antifungal agent is also disclosed, the method comprising adhesively securing to a dorsal site of an infected palm or foot a pressure-sensitive adhesive matrix patch device for a time sufficient to deliver an effective amount of the antifungal agent to an area of infection. | 04-01-2010 |
20110101553 | METHOD AND DEVICE FOR CONTINUOUSLY PREPARING MICROSPHERES, AND COLLECTION UNIT THEREOF - A method and a device for continuously preparing microspheres, and a collection unit thereof are provided. The collection unit for collecting microspheres in the solution comprises a tank and a first plate. The first plate is removably disposed in the tank. The first plate, when lay across the tank, has its two ends came in contact with the sidewall of the tank so as to divide the tank into a first chamber and a second chamber. The tank has an outlet located in the second chamber. After the solution with microspheres are input to the first chamber of the tank, the microspheres are deposited around the first plate, and the solution is caused to pass through or over the first plate to the second chamber and output from the outlet. | 05-05-2011 |
20120027853 | PROCESS FOR PREPARATION OF ANTI-TUBERCULAR COMBINATION AND PHARMACEUTICAL COMPOSITION PREPARED THEREFROM - This invention relates to a process for preparing a pharmaceutical composition comprising four antitubercular drugs: rifampin or a pharmaceutically acceptable salt thereof, isoniazid or a pharmaceutically acceptable salt thereof, pyrazinamide or a pharmaceutically acceptable salt thereof and ethambutol or a pharmaceutically acceptable salt thereof, wherein rifampin and isoniazid are in separate layers. The invention also provides a pharmaceutical composition prepared therefrom having advantageous stability and bioavailability. | 02-02-2012 |
20130078304 | CONTROLLED RELEASE FORMULATION FOR TREATING SLEEP DISORDERS - The invention relates to a controlled-release formulation for preventing and/or treating sleep disorders comprising Zaleplon or a pharmaceutically acceptable salt thereof in immediate release form and Zolpidem or a pharmaceutically acceptable salt thereof in sustained release form, wherein Zaleplon or a pharmaceutically acceptable salt thereof and Zolpidem or a pharmaceutically acceptable salt thereof are released in two phases where the first phase is a immediate release phase of Zaleplon or a pharmaceutically acceptable salt thereof and the second phase is a sustained release phase of Zolpidem or a pharmaceutically acceptable salt thereof. | 03-28-2013 |
20140052081 | DONEPEZIL TRANSDERMAL PATCH - The present invention relates to a donepezil transdermal patch comprising a backing layer and a pressure sensitive adhesive matrix layer, wherein the pressure sensitive adhesive matrix layer comprises donepezil free base and an acrylic pressure sensitive adhesive agent selected from the group consisting of a copolymer of 2-ethylhexyl acrylate and vinyl acetate and a copolymer of 2-ethylhexyl acrylate, vinyl acetate, and hydroxyl-containing monomers, and wherein 2-ethylhexyl acrylate is present in an amount of about 65% to about 75%, vinyl acetate is present in an amount of about 25% to about 35%, and the hydroxyl-containing monomers are in an amount of about 0% to about 10%, based on the total weight of the copolymer. | 02-20-2014 |
Patent application number | Description | Published |
20150049945 | IMAGE PROCESSING APPARATUS AND IMAGE PROCESSING METHOD - An image processing apparatus and an image processing method are provided. The image processing apparatus comprises a processor which divides an original image into a plurality of group images and rotates each of the group images by an angle to generate an output image. | 02-19-2015 |
20150271400 | HANDHELD ELECTRONIC DEVICE, PANORAMIC IMAGE FORMING METHOD AND NON-TRANSITORY MACHINE READABLE MEDIUM THEREOF - A handheld device, a panoramic image forming method and a non-transitory machine readable medium thereof are provided. The present invention discloses a handheld electronic device for generating a panoramic image formed by a plurality of sub images, the handheld electronic device comprise an input unit, a display unit, an image sensor and a processor. The input unit senses a control action to generate a panorama signal. The image sensor captures a specific sub image of the plurality of sub images according to the panorama signal. The processor determines that the specific sub image is fuzzy so that the processor executes an image re-capturing program to: enable the display unit to display an image re-capturing interface; enable the image sensor to capture a first auxiliary image corresponding to the specific sub image; and replace the specific sub image by the first auxiliary image. | 09-24-2015 |
20150325557 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - A chip package including a first substrate is provided. The first substrate includes a sensing device. A second substrate is attached onto the first substrate and includes an integrated circuit device. A first conductive structure is electrically connected to the sensing device and the integrated circuit device through a redistribution layer disposed on the first substrate. An insulating layer covers the first substrate, the second substrate and the redistribution layer. The insulating layer has a hole therein and a second conductive structure is disposed under the bottom of the hole. A method for forming the chip package is also provided. | 11-12-2015 |
20150341564 | IMAGE EDITING METHOD AND ELECTRONIC DEVICE USING THE SAME - An image editing method and an electronic device including a display unit are provided. In the method, a first image is captured and displayed on the display unit. A first object is extracted from the first image, and a second object in the first image is detected. A second image is captured and the second object in the second image is detected. A movement of the second object is obtained according to the first image and the second image, and the first object on the display unit is moved along with the movement of the second object. Accordingly, an object in a photo can be moved by using images. | 11-26-2015 |