Patent application number | Description | Published |
20090168330 | ELECTRONIC DEVICE WITH AIRFLOW GUIDING DUCT - An electronic device includes an enclosure ( | 07-02-2009 |
20090185351 | MOUNTING APPARATUS FOR HEAT SINK - A mounting apparatus for mounting a heat sink on a board, includes a first locking hole defined in the heat sink, a second locking hole defined in the board, and a locking member. The locking member includes a base and a rod. The base defines a hole. A bottom of the base forms a pair of separated elastic claws around the hole. The elastic claws are inserted through the first and second locking holes. The rod includes an expanded portion. The rod slides in the hole of the base with the expanded portion located inbetween the claws to expand the claws outwards to be larger than the second locking hole to lock the locking member on the board and to mount the heat sink on the board. | 07-23-2009 |
20090190309 | ELECTRONIC APPARATUS WITH AIR GUIDING ELEMENT - An electronic apparatus includes an enclosure ( | 07-30-2009 |
20090213549 | HEAT SINK ASSEMBLY - A heat sink assembly includes a printed circuit board, an electronic component mounted on the printed circuit board, and a heat sink mounted on the printed circuit board for dissipating heat from the electronic component. The printed circuit board includes a heat-conduction layer. The heat sink includes a base configured to contact the heat-conduction layer, and a main body extending upward from the base configured to contact the electronic component. The cross section of the base is larger than the cross section of the main body. A plurality of fins extends from the main body. | 08-27-2009 |
20100002373 | HEAT DISSIPATING DEVICE FOR ELECTRONIC DEVICE - A heat dissipating device is provided. The heat dissipating device includes a seat and a plurality of fins secured on the seat. The fins are regularly aligned in a matrix. A first set of fins comprise of a convex profile. | 01-07-2010 |
20100014244 | THERMAL DEVICE FOR HEAT GENERATING SOURCE - A heat sink for dissipating heat from a heat source, includes a base configured to connect with a heat source, and a plurality of fins positioned on the base. A cutout is defined within the plurality of parallel fins. | 01-21-2010 |
20100097754 | COMPUTER ENCLOSURE WITH AIRFLOW GUIDE - A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis. | 04-22-2010 |
20100134971 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades. | 06-03-2010 |
20100147495 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted to the heat sink. The heat sink includes a base with a bottom surface for contacting the heat source, and a plurality of radial fins angling upwardly from a top surface of the base to form a truncated conical space in the middle of the heat sink. A cross section area of the truncated conical space gradually increases from the top surface of the base to top of the fins. | 06-17-2010 |
20100149749 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources. | 06-17-2010 |
20100230074 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a base with a bottom surface contacting a heat source, and a fin assembly disposed on a top surface of the base. The fin assembly includes a first heat dissipation member, and a second heat dissipation member symmetric with respect to a centerline of the fin assembly. Each heat dissipation member comprises a plurality of parallel fins vertically disposed on a top surface of the base, and a heat pipe passing through the plurality of parallel fins. | 09-16-2010 |
20110090647 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating module is disposed on the first heat generating element. The first heat dissipating module includes a heat sink and a first heat pipe. The first heat pipe includes a pipe body and an extending portion extending from the pipe body. The second heat dissipating module is disposed on the second heat generating element. The pipe body is connected to the heat sink and the extending portion is connected to the second heat dissipating module. | 04-21-2011 |
20110096502 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generating element. The heat sink and the back board are configured to be placed on opposite sides of the printed circuit board. The heat sink includes a first connecting heat pipe. The back board includes a second connecting heat pipe. The second connecting heat pipe contacts the first connecting heat pipe. The securing member thermally contacts the first connecting heat pipe and the second connecting heat pipe. | 04-28-2011 |
20110141688 | COMPUTER SYSTEM WITH AIRFLOW BLOCKING PLATE - A computer system includes a chassis and an airflow blocking plate. The chassis comprising a first chassis sidewall, a second chassis sidewall, and a drive bracket which is used to mount a disk drive. The drive bracket is secured in the chassis and abuts the first chassis sidewall, and the first chassis sidewall defines a first ventilation hole. The air flows into the chassis via the first ventilation hole. The airflow blocking plate secured in the chassis and located between the first chassis sidewall and the second chassis sidewall. The airflow blocking plate prevents the air from flowing back to the drive bracket. | 06-16-2011 |
20110292580 | AIRFLOW DUCT - An airflow duct for guiding air toward two heat sink apparatuses in computer includes a duct body fixed in a computer case, a first air guide channel and a second air guide channel defined in the duct body. The duct body has an air inlet and an air outlet. The first air guide channel forms a first air outlet, which opens towards a first heat sink apparatus in the computer case. The second air guide channel forms a second air outlet, which opens towards a second heat sink apparatus in the computer case. The first and second air guide channels guide air from the air inlet to the first and second heat sink apparatuses, through the first and second air outlet openings to dissipate heat respectively from the first and second heat sink apparatuses. A first air guide channel height is greater than that of the second air guide channel. | 12-01-2011 |
20110304978 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a bottom wall and a sidewall. A motherboard is mounted on the bottom wall. The motherboard includes a heat generation apparatus and a heat sink attached thereon. The heat sink is in contact with the heat generation apparatus, and is configured to transmit heat from the heat generation apparatus to the heat sink. The sidewall defines a number of vents, which are in alignment with the heat sink. A fan is mounted between the sidewall and the heat sink with an air inlet side of the fan directed towards the heat sink and an air outlet side of the fan directed towards the plurality of vents. | 12-15-2011 |
20110317363 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a bottom plate, a rear plate connected to the bottom plate, and a power supply unit. A heat generation apparatus is located on the bottom plate. An opening is defined in the rear plate. A power supply unit includes a wide first receiver portion and a narrow second receiver portion. A fan is mounted in the wide first receiver portion. The wide first receiver portion includes a rear wall located in the opening and a first front wall that is parallel to the rear wall. The first front wall and the rear wall define vent holes. The narrow second receiver portion includes a second side wall perpendicular to the first front wall. The second side wall and the heat generation apparatus form an air flow channel therebetween. The fan drives air flow through the air flow channel. | 12-29-2011 |
20120002365 | ALL-IN-ONE COMPUTER - A computer includes an enclosure and a mainframe module enclosed in the enclosure. The mainframe module includes a base board, a motherboard, a partition panel perpendicularly attached on the base board, and a fan. The motherboard and the fan are attached on the base board at opposite sides of the partition panel. The fan is capable of blowing air to the motherboard to cool heat generating components of the motherboard. | 01-05-2012 |
20120044634 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a computer case having a base plate, a motherboard positioned on the base plate, and a heat sink. The motherboard includes a first heat source positioned thereon. The heat sink is positioned on the first heat source and thermally contacts with the first heat source. The motherboard includes a second heat source located on a first side of the heat sink. An angle between the second heat source and a motherboard plane is greater than 0 degrees and less than 90 degrees. Airflow from outside of the computer case is able to flow through a top surface and a bottom surface of the second heat source to dissipate heat for the first and second heat sources. | 02-23-2012 |
20120044641 | ELECTRONIC DEVICE - An electronic device includes an enclosure. The enclosure includes a main body and a cover attached to the main body. A first air intake and a second air outlet are defined in the cover. A first heat device and a circuit board are attached to the main body. The first heat device includes a plurality of first fins. A second heat device is located on the circuit board and configured to dissipate heat from a CPU located on the circuit board. A heat pipe is located between the first heat device and the second heat device. A distance between adjacent first fins is in a range of 5.3-5.7 mm, and the second heat device, the first heat device and the first air outlet cooperatively define an airflow passage configured for directing air to flow through to the electronic device. | 02-23-2012 |
20120063088 | HEAT DISSIPATING APPARATUS - A heat dissipating apparatus comprises a base, an air duct, and a cooling fan. The base comprises a first cooling portion and a second cooling portion. The air duct covers the first cooling portion, and defines an air inlet and an air outlet. The cooling fan is secured to the first cooling portion, and located below the air inlet. A blocking board is secured between the first cooling portion and the second cooling portion to prevent air flowing from the first cooling portion to the second cooling portion. | 03-15-2012 |
20120067553 | HEAT DISSIPATING APPARATUS - A heat dissipating apparatus comprises a cooler, an air duct, and a cooling fan. a cooler secured to a circuit board of a host; the cooler is secured to a circuit board of a host; the air duct, covers the cooler, comprises a side tray that is substantially perpendicular to the circuit board; the cooling fan is secured to the cooler and located on a side of the cooler, and adjacent to the side tray; a gap is defined between the side tray and the cooler, an air guiding board is located in the gap and extends towards a VRM that is secured to the circuit board, and the air guiding board is configured to direct air flowing towards the VRM. | 03-22-2012 |
20120106064 | COMPUTER SYSTEM - A computer system includes a display, a computer case securing the display, a fan assembly and a cover. A motherboard is attached to the computer case. A chip, a heat dissipating device, and a system fan are located on the motherboard. The fan assembly includes a securing plate and a fan attached to the securing plate. The securing plate covers the plurality of the memory cards. The cover defines a plurality of air intakes and a plurality of air outlets. The plurality of air intakes, the fan, the heat dissipating device, the chip, the system fan and the plurality of air outlets together form an air path for moving air therethrough. | 05-03-2012 |
20120113580 | COMPUTER SYSTEM - A computer system includes a computer case, a cover, and an air duct. The computer case includes a display, a housing connected to the display. A motherboard is attached to the housing, and a fan module. The motherboard includes a heat generating component. A first input opening and an output opening is defined in the cover. The output opening corresponds to the fan module. The air duct is mounted on the heat generating component. A plurality first holes are defined in the air duct corresponding to the heat generating component. The air duct corresponds to the first input opening to guide air to flow to the heat generating component via the first input opening and the plurality of first holes. | 05-10-2012 |
20120120595 | COMPUTER SYSTEM WITH AIRFLOW GUIDING DUCT - A computer system includes a computer case and a heat dissipating device. The heat dissipating device includes a heat sink, a fan and an airflow guiding duct. The fan is attached to the heat sink, and the airflow guiding duct covers on the fan. The airflow guiding duct includes a bottom panel, two side panels and a blocking panel. Each side panel includes a first panel and a second panel connected to the first panel. The blocking panel is slanted and connected to the bottom panel and the second panel of each side panel, the blocking panel is adapted to allow the air to pass through the airflow guiding duct, and an inward direction of the airflows generated by the fan is substantially perpendicular or oblique to an outward direction of the airflow. | 05-17-2012 |
20120147546 | HEAT DISSIPATION SYSTEM - A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case. | 06-14-2012 |
20120170207 | ELECTRONIC DEVICE - An electronic device includes a display, a cover, and a blocking board. The display defines a rear side. A motherboard and a first cooling assembly are secured to the rear side of the display, and a second cooling assembly is secured to the motherboard. The cover is secured to the rear side for coving the rear side, and defines a number of air inlets and air outlets. The blocking board is secured to a side of the motherboard, and located between the first cooling assembly and the second cooling assembly. A first air path is defined by the air inlet, the display, the first cooling assembly, and the air outlet, and a second air path is defined by the air inlet, the motherboard, the second cooling assembly, and the air outlet. The first air path and the second air path are divided by the blocking board. | 07-05-2012 |
20130003293 | COMPUTER SYSTEM - A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a separating portion to divide the computer case into a first receiving area and a second area. The heat dissipating device includes a first heat sink, a second heat sink, a heat pipe and a fan. The first heat sink is attached to a chip, and the fan communicates with the second heat sink. The first heat sink and the fan are received in the first receiving area, and the second heat sink is received in the second receiving area. The heat pipe extends through the separating portion, and the plurality of ventilation holes, the first heat sink, the fan, the heat pipe, and the second heat sink together defines an air path for air flowing through. | 01-03-2013 |
20130003300 | ELECTRONIC DEVICE WITH CASE FOR ELECTRO MAGNETIC COMPATIBILITY - An electronic device includes a display module, a motherboard, a heat dissipating device, a case, and a cover. The motherboard is secured on the display module. A first heat generating member is secured to the motherboard. The heat dissipating device is secured to the motherboard. The heat dissipating device includes a heat sink and a heat pipe secured to the heat sink. The heat pipe capable of transferring heat generated from the first heat generating member to the heat sink. The case is secured to the display module and covers the motherboard. A fan module is secured to the case above the first heat generating member and capable of directing air out of the case. The cover is secured to the display module and covers the heat dissipating device and the case. The heat sink is located in the case and out of the cover. | 01-03-2013 |
20140033066 | METHOD AND DEVICE FOR UPLOADING AND DOWNLOADING FILE - Disclosed in the present invention are a method and a device for uploading and downloading files, which belongs to the technical field of computers. The method for uploading files includes, judging whether a local file which is dragged and stopped by a user is entering an activation area of a network file folder, prompting the user to choose whether the user confirms uploading the local file to the network file folder or not if it is, uploading the local file to the network file folder if a confirming uploading information chosen by the user according to the prompt is received. The method for downloading files includes, judging whether a network file dragged and stopped by the user is entering an activation area of a local file folder, prompting the user to choose whether the user confirms downloading the network file to the local file folder or not if it is, downloading the network file to the local file folder if a confirmation of downloading chosen by the user is received according to the prompt. The invention makes the user achieve the uploading or downloading tasks by using only one drag action, which leads to fewer response steps by user and more efficient. | 01-30-2014 |
20140250389 | METHOD AND DEVICE FOR SELECTING FRIENDS IN MICROBLOGGING - Method and device for selecting friends in microblogging are disclosed. The method includes steps of: the method comprising steps of: calling a friend-select interface and displaying a friend list, a friend address bar and a friend-confirm button on the friend-select interface in response to a detection of an event of a friend-select trigger button being clicked by a user account; adding friend identifiers corresponding to N friends into the friend address bar in response to a detection of an event of the N friends in the friend list being selected by the user account; and detecting an even of the friend-confirm button being clicked by the user account and thereby realizing a selection of the N friends in microblogging, wherein N is an integer greater than 1. Thus, the present invention provides an improved user experience when users try to perform a multi friend selection in microblogging. | 09-04-2014 |