Yang, Kaohsiung
Chao-Chi Yang, Kaohsiung TW
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20150089086 | A/V INFORMATION UPDATING CONTROL SYSTEM, CONTROL DEVICE AND CONTROL METHOD - An A/V information updating control system has an A/V host and a control device. The A/V host stores an A/V information. The control device is connected with multiple user-end apparatuses. The control device receives an A/V adjusting command from any one of the user-end apparatuses, and updates the A/V information of the A/V host according to the A/V adjusting command. The control device thus sends the updated A/V information to the user-end apparatuses. Hence, each user who has the user-end apparatus can review the updated A/V information in real time. | 03-26-2015 |
Charles Yang, Kaohsiung TW
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20090073632 | Package, packaging method and substrate thereof for sliding type thin fingerprint sensor - A sliding type thin fingerprint sensor package mainly comprises a substrate and a fingerprint sensor chip. The chip defined as a sliding region and a conductive portion comprises a dielectric layer, a circuit layer and a passivation layer. The circuit layer has a plurality of external contact pads and at least one electrostatic conductive pad close to a window of the dielectric layer. The passivation layer formed on the circuit layer has a plurality of first openings to expose the external contact pads and a second opening to expose the electrostatic conductive pad of the circuit layer and the window of the dielectric layer. The electrostatic conductive pad and the window are located at the sliding region and the external contact pads are located at the conductive portion. The fingerprint sensor chip is electronically connected with the substrate. A sensing region of the fingerprint sensor chip is exposed via the second opening of the passivation layer and the window of the dielectric layer. | 03-19-2009 |
Chau-Chin Yang, Kaohsiung TW
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20090298227 | METHOD OF FABRICATING A STACKED TYPE CHIP PACKAGE STRUCTURE AND A STACKED TYPE PACKAGE STRUCTURE - A method of fabricating a stacked type chip package structure is provided. The method includes following steps. First, a substrate, a first chip, and a second chip are provided. A number of bumps are disposed on a surface of the second chip. The second chip is then fixed on a surface of the first chip. Next, the second chip and the first chip on the substrate are turned upside down, and then the second chip is electrically connected to the substrate through the bumps by using a flip chip bonding technique. After that, the first chip is electrically connected to the substrate. Finally, a molding compound is formed on the substrate for encapsulating the first chip, the second chip, and the bumps. | 12-03-2009 |
Chieh-Jen Yang, Kaohsiung TW
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20130271045 | MOTOR CIRCUIT WITH POWER-OFF BRAKING FUNCTION - A motor circuit with power-off braking function includes a driving unit, a coil unit, and a braking unit. The driving unit includes a plurality of switch arms connected in parallel, with each switch arm having a series contact. The coil unit includes a plurality of coils and a central contact. Each coil includes an end connected to the series contact of one of the switch arms. The other end of each coil is connected to the central contact. The braking unit includes a brake loop switch coupled between the central contact of the coil unit and an end of the switch arms. When power is cut off, a plurality of brake loops is formed to share the transient current during braking. | 10-17-2013 |
Chih-Chiang Yang, Kaohsiung TW
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20120172544 | CURABLE ORGANOPOLYSILOXANE COMPOSITION AND METHOD FOR MANUFACTURING THE SAME - A curable organopolysiloxane composition comprises the following: (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups and having an average unit formula (I): (R | 07-05-2012 |
20140231861 | CURABLE COMPOSITION AND METHOD FOR MANUFACTURING THE SAME - A curable composition comprises the following: (A) a branched polymer having an average unit formula (I′): | 08-21-2014 |
20140231862 | CURABLE COMPOSITION AND METHOD FOR MANUFACTURING THE SAME - A curable composition comprises the following: (A) a polymer having at least two silicon-bonded alkenyl groups and having an average unit formula (I′): | 08-21-2014 |
Chih- Hsiung Yang, Kaohsiung TW
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20120255810 | Unmanned trackless order picking forklift system - An unmanned trackless order picking forklift system includes a vehicle-driving system, a vehicle-position-adjusting system and a pallet-scanning system each of which provided in a forklift truck and electrically connected with a CPU device. The vehicle-position-adjusting system is operated to detect a predetermined route so that the CPU device controls the vehicle-driving system to drive the forklift truck along the predetermined route from a first position to a second position. The pallet-scanning system is operated to scan a designated pallet along the predetermined route. | 10-11-2012 |
20120259461 | Hexapod Robot Device - A hexapod robot device includes a main body and six legs coupled thereto. Each leg has a first connecting rod pivotally connected with the main body, a first driver electrically pivotally connected between the main body and the first connecting rod, with the first driver controllably driving the first connecting rod to move forward and backward along a longitudinal direction, a second connecting rod pivotally connected with the first connecting rod, and a second driver pivotally connected between the first connecting rod and the second connecting rod, with the second driver controllably driving the second connecting rod to move upward and downward along a vertical direction. The second connecting rod further has an end to engage with the ground. | 10-11-2012 |
20130162396 | Automatically Controllable Smart Stroller or Wheelchair - A smart stroller or wheelchair device includes a frame, a body-movement detecting unit provided on the frame, a drive control unit and a drive unit. The drive control unit electrically connects with the body-movement detecting unit and the drive unit. The body-movement detecting unit is operated to detect a position and a distance of an operator, thereby the drive control unit synchronously controlling the drive unit to move the frame a predetermined distance. In an embodiment, the stroller or wheelchair device includes a light sensor unit, a canopy control unit and a canopy drive unit. In an alternative, the stroller or wheelchair device includes a backrest adjustment mechanism, a recognition system or a safety guard system. | 06-27-2013 |
Chin Cheng Yang, Kaohsiung TW
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20140017610 | LITHOGRAPHY PROCESS AND STRUCTURES - A photo resist layer includes a first region and a second region. A treatment layer is applied to the photo resist layer. | 01-16-2014 |
Chi-Yu Yang, Kaohsiung TW
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20130034611 | SUSTAINED PREPARATION OF FACTOR IX - The present invention provides a pharmaceutical preparation in powder-like form, comprising a therapeutically effective amount of a human Factor IX (hFIX) encapsulated by a lipophilic biodegradable polymer or copolymer to form a microsphere, whereby the pharmaceutical preparation provides a sustained release of hFIX and a prolonged biological activity. | 02-07-2013 |
Chun-Chu Yang, Kaohsiung TW
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20140373636 | SYNCHRONOUS PRE-TENSIONABLE SENSING SCREW WITH FIBER BRAGG GRATING DEVICES - An apparatus includes a sensing screw capable of providing synchronous both pre-drawing of fiber Bragg grating and pre-tightening of bolt with induced characteristics to detect feedback control of large scale public engineering structures or precise equipments to facilitate fabrication of precise elements to achieve more precise control and record fabrication processes. Through the sensing screw apparatus a precision system structure can be formed to meet expectation of improved product quality and comprehensive recording of complete production process and physical characteristics at important points of the production process. The invention can provide instant onsite status and accumulate data or make parameter pre-action to avoid error accumulation, thereby improve production yield or safety of large scale structures. | 12-25-2014 |
Chung-Hua Yang, Kaohsiung TW
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20120247558 | TRANSMITTANCE ENHANCEMENT FILM AND SOLAR CELL MODULE COMPRISING THE SAME - A transmittance enhancement film is provided, which includes a substrate and a coating layer on the substrate. The coating layer includes a plurality of organic particles and a binder. The organic particles have a refractive index of less than 1.5, and the refractive index ratio of the organic particles to the binder is in the range from 0.95 to 1.05. The transmittance enhancement film of the present invention is suitable for being used in a solar cell module, and is capable of enhancing the transmittance of light, thereby improving the power generation efficiency of the solar cell module. | 10-04-2012 |
Chun-Hung Yang, Kaohsiung TW
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20130004370 | QUANTITATIVE SENSOR AND MANUFACTURING METHOD THEREOF - A quantitative sensor and manufacture method thereof are disclosed. This quantitative sensor has a dual-mode film bulk acoustic resonator structure to achieve desirable performances in sensitivity, accuracy and efficiency. Furthermore, this quantitative sensor serves as a fluid sensor when a fluid detection metal layer is formed in a sample-receiving chamber; and this quantitative sensor may also serve as a bio sensor when biocompatible metal layer and a bio-sensing layer are formed in the sample-receiving chamber instead of the fluid detection metal layer. | 01-03-2013 |
Chun-Ming Yang, Kaohsiung TW
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20130147942 | ALIGNMENT METHOD FOR ASSEMBLING SUBSTRATES IN DIFFERENT SPACES WITHOUT FIDUCIAL MARK AND ITS SYSTEM - An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard character regions of two substrates; capturing at least two partially actual images of two substrates in different waiting spaces, respectively; comparing to obtain at least two partially actual character regions of the two substrates, respectively; building actual coordinate systems of the two substrates, respectively; comparing the actual coordinate systems of the two substrates with each other to obtain a set of offset values; moving the two substrates from the different waiting spaces to an alignment-and-installation space based on the set of offset values and a predetermined movement value, respectively; and stacking the two substrates with each other to finish the alignment and installation in the alignment-and-installation space. | 06-13-2013 |
20130148878 | ALIGNMENT METHOD FOR ASSEMBLING SUBSTRATES WITHOUT FIDUCIAL MARK - An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment. | 06-13-2013 |
Fu-Ching Yang, Kaohsiung TW
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20100117874 | BACKWARD COMPRESSION SYSTEM AND METHOD - A backward compression system and a backward compression method are provided. By using the system and the method, under limited memory space, a relationship between input data and previous data is identified in real time, the input data or previous data is encoded according to the relationship, and the order of data output is such that the encoded data is output first and the complete data is output second. When the output data is stored in circular memory and the memory gets full, the oldest encoded data is overwritten first, and the complete data is not overwritten until all the related encoded data is overwritten. Therefore, more original data can be preserved after decompression. Thus, system signals can be compressed and utilization of limited memory space can be improved. | 05-13-2010 |
20110023052 | COMPRESSED DATA MANAGING SYSTEM AND METHOD FOR CIRCULAR BUFFER - The invention relates to a compressed data managing system and method for circular buffer. By using the system and method of the invention, when storing the compressed data in a circular buffer and an event occurs, the hardware compression mechanism can stop immediately, without jeopardizing the decompression of the compressed data. Therefore, the system and method of the invention can overcome the following conventional problem: Conventional real-time tracers need several cycles to write the compressed data into the trace memory, which is unbeneficial to error diagnosis. Since when an error occurs, the system might enter the unstable state, this could cause that the tracers fail to write the last compressed data into the trace memory. | 01-27-2011 |
Hsin-Chih Yang, Kaohsiung TW
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20110083286 | METHOD FOR MANUFACTURING A ONE-PIECE SHOE SHELL - A method for manufacturing a one-piece shoe shell provides a method to produce a one-piece shoe shell having steps of: mounting a mold assembly on an injection molding machine; closing the mold assembly and forming a cavity that can produce a shoe shell having a sole, two lateral vamps and a quarter combined together; opening the mold assembly and ejecting the shoe shell. Because the sole, lateral vamps and quarter are integrally formed, a durability of the shoe shell is increased and the shoe shell is easily fabricated. | 04-14-2011 |
20120011742 | COMBINATION STRUCTURE FOR SHOE SHELL - A combination structure for a shoe shell has a shoe body, a toecap mounted on a front end of the shoe body and at least one connecting part disposed between the shoe body and the toecap. Each of the at least one connecting part has a female connector and a male connector formed respectively on the shoe body and the toecap and is mounted with each other. Connecting the toecap to the shoe body through the at least one connecting part is quick, process improvement and time saving. Furthermore, the toecap is attached securely to the shoe body and not easily detached from the shoe body. | 01-19-2012 |
Hsiu-Hsiung Yang, Kaohsiung TW
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20150132867 | SEMICONDUCTOR PROCESS - The present disclosure relates to a semiconductor process, which includes: (a) providing a semiconductor element; (b) attaching the semiconductor element to a carrier by an adhesive layer, so that the adhesive layer is sandwiched between the semiconductor element and the carrier; and (c) cutting the semiconductor element to form a plurality of semiconductor units. Thereby, the gaps between the semiconductor units are fixed after the cutting process, so as to facilitate testing the semiconductor units. | 05-14-2015 |
Hsiu-Wei Yang, Kaohsiung TW
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20110186268 | FLAT TYPE HEAT PIPE DEVICE - A flat type heat pipe device includes a packaging unit and a bonding member. The packaging unit further includes a first shell member and a second shell member. The first shell member has a work zone, a first joining part surrounding the work zone and an upright stop part disposed between the work zone and the joining part. The second shell member provides a shape corresponding to the first shell member to cover the first shell member and has a shell lid part spacing apart from the work zone and a second joining part disposed on the first joining part. The bonding member is disposed between the first joining part and the second joining part to adhere the first joining part to the second joining part. When the first shell member is pressingly fit with second shell member, the stop part is capable of preventing the bonding member from entering the packaging unit. | 08-04-2011 |
Hsueh-An Yang, Kaohsiung TW
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20100230759 | Silicon Chip Having Through Via and Method for Making the Same - The present invention relates to a silicon chip having a through via and a method for making the same. The silicon chip includes a silicon substrate, a passivation layer, at least one electrical device and at least one through via. The passivation layer is disposed on a first surface of the silicon substrate. The electrical device is disposed in the silicon substrate, and exposed to a second surface of the silicon substrate. The through via includes a barrier layer and a conductor, and penetrates the silicon substrate and the passivation layer. A first end of the through via is exposed to the surface of the passivation layer, and a second end of the through via connects the electrical device. When a redistribution layer is formed on the surface of the passivation layer, the redistribution layer will not contact the silicon substrate, thus avoiding a short circuit. Therefore, a lower resolution process can be used, which results in low manufacturing cost and simple manufacturing process. | 09-16-2010 |
20130032889 | Silicon Chip Having Through Via and Method for Making the Same - The present invention relates to a silicon chip including a silicon substrate, a passivation layer, at least one electrical device and at least one through via. The passivation layer is disposed on a first surface of the silicon substrate. The electrical device is disposed in the silicon substrate, and exposed to a second surface of the silicon substrate. The through via includes a barrier layer and a conductor, and penetrates the silicon substrate and the passivation layer. A first end of the through via is exposed to the surface of the passivation layer, and a second end of the through via connects the electrical device. When a redistribution layer is formed on the surface of the passivation layer, the redistribution layer will not contact the silicon substrate, thus avoiding a short circuit. | 02-07-2013 |
Hung-Duen Yang, Kaohsiung TW
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20110253996 | COMPOSITE DIELECTRIC MATERIAL DOPED WITH RARE EARTH METAL OXIDE AND MANUFACTURING METHOD THEREOF - A composite dielectric material doped with rare earth metal oxide and a manufacturing method thereof are provided. The composite dielectric material is doped with nano-crystalline rare metal oxide which is embedded in silicon dioxide glass matrix, and the composite dielectric material of the nano-crystalline rare metal oxide and the silicon dioxide glass matrix is synthesized by the manufacturing method using sol-gel route. The dielectric value of the glass composite dielectric material is greater than that of pure rare metal oxide or that of silicon dioxide. In presence of magnetic field, the dielectric value of the composite dielectric material is substantially enhanced compared with that of the composite dielectric material at zero field. | 10-20-2011 |
I-Ping Yang, Kaohsiung TW
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20120329853 | MICRORNA-BASED METHOD FOR ANTI-COLORECTAL CANCER EFFECTS AND PROGNOSIS OF COLORECTAL CANCER - The present invention discloses a method of providing anti-oncogenic effects in a subject suffered from colorectal cancer. The present invention also discloses a method for screening an anti-colorectal cancer agent. The present invention further discloses a method of determining the prognosis of a subject with colorectal cancer. | 12-27-2012 |
20130137597 | Microrna-based method for anti-colorectal cancer effects and prognosis of colorectal cancer - The present invention discloses a method of providing anti-oncogenic effects in a subject suffered from colorectal cancer. The present invention also discloses a method for screening an anti-colorectal cancer agent. The present invention further discloses a method of determining the prognosis of a subject with colorectal cancer. | 05-30-2013 |
Jing-Iong Yang, Kaohsiung TW
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20120189652 | FREE RADICAL-INDUCED INTRACELLULAR DNA DAMAGE REDUCING REAGENT, MEDICAMENT OR HEALTH FOOD AND SKIN CARE PRODUCT OR COSMETIC, AND METHODS FOR PREPARING THE SAME - The invention provides a free radical-induced intracellular DNA damage reducing reagent, including: an effective amount of a | 07-26-2012 |
Jiunn-Jye Yang, Kaohsiung TW
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20080219035 | Active Power Filter - An active power filter comprises an energy storage capacitor, an inverter, a filtering circuit and a controller. The inverter is controlled to act as a virtual resister at a fundamental frequency for compensating for the power loss of the active power filter, act as a virtual capacitor at a fundamental frequency for compensating for a fundamental reactive power of the load, and/or generate a harmonic current for suppressing the harmonic currents of specific orders of the load. | 09-11-2008 |
Jun-Young Yang, Kaohsiung TW
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20150035127 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present disclosure relates to a semiconductor package and a method of fabricating the same. The semiconductor package includes a substrate, a grounding layer, a chip, a package body, and a shielding layer. The substrate includes a lateral surface and a bottom surface. The grounding layer is buried in the substrate and extends horizontally in the substrate. The chip is arranged on the substrate. The package body envelops the chip and includes a lateral surface. The shielding layer covers the lateral surface of the package body and the lateral surface of the substrate, and is electrically connected to the grounding layer, where a bottom surface of the shielding layer is separated from a bottom surface of the substrate. | 02-05-2015 |
Jwu-Jiun Yang, Kaohsiung TW
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20130147942 | ALIGNMENT METHOD FOR ASSEMBLING SUBSTRATES IN DIFFERENT SPACES WITHOUT FIDUCIAL MARK AND ITS SYSTEM - An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard character regions of two substrates; capturing at least two partially actual images of two substrates in different waiting spaces, respectively; comparing to obtain at least two partially actual character regions of the two substrates, respectively; building actual coordinate systems of the two substrates, respectively; comparing the actual coordinate systems of the two substrates with each other to obtain a set of offset values; moving the two substrates from the different waiting spaces to an alignment-and-installation space based on the set of offset values and a predetermined movement value, respectively; and stacking the two substrates with each other to finish the alignment and installation in the alignment-and-installation space. | 06-13-2013 |
20130148878 | ALIGNMENT METHOD FOR ASSEMBLING SUBSTRATES WITHOUT FIDUCIAL MARK - An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment. | 06-13-2013 |
Kai-Chun Yang, Kaohsiung TW
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20140177274 | LIGHT GUIDE ELEMENT AND LIGHT SOURCE DEVICE USING THE LIGHT GUIDE ELEMENT - A light guide element and a light source device using the same are provided. The light guide element has a main body. The side surface is located between the bottom surface and the light-emitting surface. The bottom surface is opposite to the light-emitting surface. The main body has a hollow portion with a cone shape. The cone-shaped hollow portion has a bottom portion and a top portion. The bottom portion is located on the bottom surface of the main body, and has a first hollow cross section area. The top portion is opposite to the bottom surface, and has a second cross section area smaller than the first cross section area. The light source device includes the light guide element and a light emitting diode (LED). The LED is used to emit light into the cone-shape hollow portion through the bottom portion. | 06-26-2014 |
20150117057 | LIGHT GUIDE ELEMENT AND LIGHT SOURCE DEVICE USING THE LIGHT GUIDE ELEMENT - A light guide element and a light source device using the same are provided. The light guide element has a main body. The main body has a hollow portion with a cone shape and a microstructure pattern formed on the main body. The cone-shaped hollow portion has a bottom portion and a top portion. The bottom portion is located on the bottom surface of the main body, and has a first hollow cross section area. The top portion is opposite to the bottom surface, and has a second cross section area smaller than the first cross section area. The microstructure pattern includes high-density areas and low-density areas to improve a light distribution caused by the cone-shaped hollow portion. The light source device includes the light guide element and a ht emitting diode (LED). The LED is used to emit light into the cone-shape hollow portion through the bottom portion. | 04-30-2015 |
Kao-Lung Yang, Kaohsiung TW
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20110159235 | COMPOSITE FIBER HAVING ELASTOMER AND METHOD FOR MAKING THE SAME, AND A SUBSTRATE HAVING THE COMPOSITE FIBER AND METHOD FOR MAKING THE SAME - A composite fiber having elastomer and method for making the same, and a substrate having the composite fiber and method for making the same are provided. The composite fiber includes a first composition and a second composition. The first composition is thermoplastic non-elastomer, and the second composition is thermoplastic elastomer (TPE). The second composition is in an amount of 5 to 70 weight % of the composite fiber. The first composition and the second composition are alternately distributed in a circumference of a cross-section of the composite fiber, and the length of the second composition is less than 50% of the total length of the circumference. The TPE can be dispersed uniformly and increase the adhesion between fibers, and the segmented fiber cross-section thereof further prevents the TPE from becoming too adhesive and affecting the processing during the fabrication of fibers and non-woven fabric substrates. Therefore, the non-woven fabric substrate or artificial leather made from the composite fiber has excellent textile feeling and physical properties. | 06-30-2011 |
20110177305 | POLISHING PAD AND METHOD FOR MAKING THE SAME - The present invention relates to a polishing pad and method for making the same. The polishing pad includes a fabric substrate and a second high polymeric elastomer resin. The fabric substrate is formed by a plurality of cross composite fibers. Each composite fiber has a plurality of fine fibers and a first high polymeric elastomer resin, and the first high polymeric elastomer resin discontinuously encloses the fine fibers. The second high polymeric elastomer resin encloses the composite fibers, and the first high polymeric elastomer resin and the second high polymeric elastomer resin have the same functional group. By adjusting the degree of saturation of the first high polymeric elastomer resin and the second high polymeric elastomer resin, the fine fibers will have smaller size and will not be easily entangled. Therefore, a workpiece to be polished will not be scratched and will have excellent surface quality. | 07-21-2011 |
Kuen-Shiuh Yang, Kaohsiung TW
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20100141384 | BOTTLE CAP HAVING ANTI-COUNTERFEIT FUNCTION AND BOTTLE USING THE SAME - A bottle cap having anti-counterfeit function comprises a cap body and an RFID tag. The cap body has a cap portion, a ring neck portion and at least one joint portion, there is an interval between the cap portion and the ring neck portion, and the joint portion crosses through the interval and couples the cap portion and the ring neck portion. The RFID tag is disposed at the cap body and has an antenna and a chip electrically connected with the antenna. The antenna has a first antenna portion, a second antenna portion and a third antenna portion, the first antenna portion and the chip are disposed at the cap portion of the cap body, the second antenna portion is disposed at the ring neck portion of the cap body, and the third antenna portion crosses through the interval and bridge connects the first antenna portion and the second antenna portion. | 06-10-2010 |
Kuo-Pin Yang, Kaohsiung TW
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20100187681 | Silicon Substrate Having Through Vias and Package Having the Same - The present invention relates to a silicon substrate having through vias and a package having the same. The silicon substrate includes a substrate body, a plurality of through vias and at least one heat dissipating area. The substrate body has a surface, and the material of the substrate body is silicon. The through vias penetrate the substrate body, and each of the through vias has a conductive material therein. The heat dissipating area is disposed on the surface of the substrate body and covers at least two through vias. The heat dissipating area is made of metal, and the through vias inside the heat dissipating area have same electrical potential. Thus, the heat in the through vias is transmitted to the heat dissipating area, and since the area of the heat dissipating area is large, the silicon substrate has good heat dissipation efficiency. | 07-29-2010 |
20100244244 | Chip Having a Bump and Package Having the Same - The present invention relates to a chip having a bump and a package having the same. The chip includes a chip body, at least one via, a passivation layer, an under ball metal layer and at least one bump. The via penetrates the chip body, and is exposed to a surface of the chip body. The passivation layer is disposed on the surface of the chip body, and the passivation layer has at least one opening. The opening exposes the via. The under ball metal layer is disposed in the opening of the passivation layer, and is connected to the via. The bump is disposed on the under ball metal layer, and includes a first metal layer, a second metal layer and a third metal layer. The first metal layer is disposed on the under ball metal layer. The second metal layer is disposed on the first metal layer. The third metal layer is disposed on the second metal layer. As the bumps can connect two chips, the chip is stackable, and so the density of the product is increased while the size of the product is reduced. | 09-30-2010 |
20110048788 | Method for forming a via in a substrate and substrate with a via - The present invention relates to a method for forming a via in a substrate and a substrate with a via. The method includes the following steps: (a) providing a substrate having a first surface and a second surface; (b) forming a groove that has a side wall and a bottom wall on the first surface of the substrate; (c) forming a conductive metal on the side wall and the bottom wall of the groove so as to form a central groove; (d) forming an annular groove that surrounds the conductive metal on the first surface of the substrate; (e) forming an insulating material in the central groove and the annular groove; and (f) removing part of the second surface of the substrate to expose the conductive metal and the insulating material. | 03-03-2011 |
Lian-Chwan Yang, Kaohsiung TW
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20150297647 | ENTEROCOCCUS FAECIUM EF08 STRAIN, A USE, A FEED ADDITIVE AND A FEED THEREOF | 10-22-2015 |
Lung-Chi Yang, Kaohsiung TW
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20100085784 | Ripple Voltage Suppression Method for DC/DC Converter and Apparatus Thereof - A ripple voltage suppression apparatus includes a DC/DC converter and a control circuit. The DC/DC converter has a power electronic switch. The control circuit has a voltage detector detecting a DC output voltage of the DC/DC converter, a ripple voltage suppression circuit receiving the detected DC output voltage to generate an AC control signal for controlling an AC component of a duty ratio of the power electronic switch, an output voltage regulation circuit receiving the detected DC output voltage to generate a DC control signal for controlling an DC component of a duty ratio, an adder adding the AC and DC control signals to form a combined control signal, and a PWM circuit converting the combined control signal into a PWM signal to control the power electronic switch. Only the DC output voltage of the DC/DC converter has to be detected for the control circuit. | 04-08-2010 |
Pang-Piao Yang, Kaohsiung TW
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20090040056 | RECEPTACLE CAPABLE OF WARNING OVERLOADING - A receptacle capable of warning overloading includes a receptacle main body and a protect device. The receptacle main body transmits a power source to an electric product while a plug of said electric product being inserted to the receptacle main body. The protect device is attached to the receptacle main body. It is characterized in that the protect device further comprises a detect circuit for detecting an amperage, and a warning component for receiving a signal coming from said detect circuit and converting the signal to a warning sound, a warning flash light or a numerical value. Thus, when the output end of the receptacle has an abnormal current overload, the user is notified to be aware of the problem of overloading. | 02-12-2009 |
Phile Yang, Kaohsiung TW
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20090047007 | Instantaneous water heater with a heating tube - An instantaneous water heater includes a heating tube, a heating device over a lower end of the heating tube, a spiral pipe held in the heating tube, water inlet and outlet pipes connected to two ends of the spiral pipe, a water-discharge switch installed on the other end of the water outlet pipe; the heating tube is made of metal, and emptied of air, and it contains heat media, which will vaporize into gas rapidly when heated by means of the heating device; the heating device isn't powered usually, yet it will be activated to heat the heat media in the heating tube, which in turn transform into gas to heat water in the spiral pipe, as soon as the water-discharge switch is turned on to discharge hot water through the water outlet pipe. | 02-19-2009 |
Po-Chun Yang, Kaohsiung TW
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20120068142 | RESISTANCE RANDOM ACCESS MEMORY ELEMENT AND METHOD FOR MAKING THE SAME - A resistance random access memory element includes a first electrode, an insulating layer, a diffusing metal layer, and a second electrode superimposed in sequence. The insulating layer includes a plurality of pointed electrodes. A method for making a resistance random access memory element includes growing and forming an insulating layer on a surface of a first electrode. A diffusing metal layer is formed on a surface of the insulating layer. A second electrode is mounted on a surface of the diffusing metal layer. A negative pole and a positive pole of a driving voltage are connected with the first and second electrodes, respectively. The diffusing metal in the diffusing metal layer is oxidized into metal ions by the driving voltage. The metal ions are driven into the insulating layer and form a plurality of pointed electrodes after reduction. | 03-22-2012 |
Rei-Cheng Yang, Kaohsiung TW
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20120184869 | ELECTROENCEPHALOGRAM SIGNAL PROCESSING METHOD - An electroencephalogram signal processing method includes a recording step, a retrieving step, a removing step and a synthesizing step. The recording step retrieves EEG signal components of a testee via a plurality of electrodes, wherein the EEG signal components serve as an input signal. The retrieving step filters the input signal to obtain a predetermined frequency band signal, and subtracts the predetermined frequency band signal from the input signal to obtain a difference signal. The removing step performs an independent component analysis operation between the difference signal and a separating matrix to obtain an analysis signal, generates a separating pseudo inverse and an independent analysis signal, and performs a matrix operation between the separating pseudo inverse and the independent analysis signal to obtain a corrected signal. The synthesizing step adds the corrected signal and the predetermined frequency band signal together to obtain an output signal. | 07-19-2012 |
Sheng-Chung Yang, Kaohsiung TW
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20090114290 | CO2 SUPPLY SYSTEM - The present invention relates to a CO | 05-07-2009 |
Shu-Hui Yang, Kaohsiung TW
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20080293670 | Edible tremella polysaccharide for prevention and/or improvement of intestinal disorder - It has been found that the polysaccharide isolated from a hot water extract of a Tremella mushroom without adding a chemical reagent has a novel effect of preventing and/or treating of intestinal disorder. The Tremella polysaccharide has excellent stability, water absorbing and holding ability, and swelling capacity, so it can be used to raise fecal water content and increase fecal volume, so as to improve intestinal disorder characterized by constipation and symptom caused by constipation. | 11-27-2008 |
Su-Hua Yang, Kaohsiung TW
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20150129804 | Phosphor Material and Manufacturing Method Thereof - A phosphor material manufacturing method includes: prefabricating a LaPO | 05-14-2015 |
Su-Tai Yang, Kaohsiung TW
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20080303128 | LEADFRAME WITH DIE PAD AND LEADS CORRESPONDING THERETO - A leadframe includes a die pad and a plurality of leads corresponding to the die pad. The die pad for supporting a die is formed with a plurality of sides, each of the sides having at least one recess portion and at least one protrusion portion. The leads are substantially coplanar to the die pad. The leads include a plurality of first leads and a plurality of second leads. The first leads extend into the recess portions respectively, and the second leads are aligned with the protrusion portions. The length of the first leads is greater than that of the second leads. The length of wires electrically connecting the die to the leads or the die pad can be adjusted by the sides of the leadframe with the recess portion and the protrusion portion having a dimension corresponding to the leads, so as to save the manufacture cost of the leadframe. | 12-11-2008 |
Tsung-Yu Yang, Kaohsiung TW
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20140159048 | High Electron Mobility Transistor and Manufacturing Method Thereof - The present invention discloses a high electron mobility transistor (HEMT) and a manufacturing method thereof. The HEMT device includes: a substrate, a first gallium nitride (GaN) layer; a P-type GaN layer, a second GaN layer, a barrier layer, a gate, a source, and a drain. The first GaN layer is formed on the substrate, and has a stepped contour from a cross-section view. The P-type GaN layer is formed on an upper step surface of the stepped contour, and has a vertical sidewall. The second GaN layer is formed on the P-type GaN layer. The barrier layer is formed on the second GaN layer. two dimensional electron gas regions are formed at junctions between the barrier layer and the first and second GaN layers. The gate is formed on an outer side of the vertical sidewall. | 06-12-2014 |
20140187003 | High Electron Mobility Transistor and Manufacturing Method Thereof - The present invention discloses a high electron mobility transistor (HEMT) and a manufacturing method thereof. The HEMT includes a semiconductor layer, a barrier layer on the semiconductor layer, a piezoelectric layer on the barrier layer, a gate on the piezoelectric layer, and a source and a drain at two sides of the gate respectively, wherein each bandgap of the semiconductor layer, the barrier layer, and the piezoelectric layer partially but not entirely overlaps the other two bandgaps. The gate is formed for receiving a gate voltage. A two dimensional electron gas (2DEG) is formed in a portion of a junction between the semiconductor layer and the barrier layer but not below at least a portion of the piezoelectric layer, wherein the 2DEG is electrically connected to the source and the drain. | 07-03-2014 |
20150021615 | JUNCTION BARRIER SCHOTTKY DIODE AND MANUFACTURING METHOD THEREOF - The present invention discloses a junction barrier Schottky (JBS) diode and a manufacturing method thereof. The JBS diode includes: an N-type gallium nitride (GaN) substrate; an aluminum gallium nitride (AlGaN) barrier layer, which is formed on the N-type GaN substrate; a P-type gallium nitride (GaN) layer, which is formed on or above the N-type GaN substrate; an anode conductive layer, which is formed at least partially on the AlGaN barrier layer, wherein a Schottky contact is formed between part of the anode conductive layer and the AlGaN barrier layer; and a cathode conductive layer, which is formed on the N-type GaN substrate, wherein an ohmic contact is formed between the cathode conductive layer and the N-type GaN substrate, and the cathode conductive layer is not directly connected to the anode conductive layer. | 01-22-2015 |
20150084060 | INSULATED GATE BIPOLAR TRANSISTOR AND MANUFACTURING METHOD THEREOF - The present invention discloses an insulated gate bipolar transistor (IGBT) and a manufacturing method thereof. The IGBT includes: a gallium nitride (GaN) substrate, a first GaN layer with a first conductive type, a second GaN layer with a first conductive type, a third GaN layer with a second conductive type or an intrinsic conductive type, and a gate formed on the GaN substrate. The first GaN layer is formed on the GaN substrate and has a side wall vertical to the GaN substrate. The second GaN layer is formed on the GaN substrate and is separated from the first GaN layer by the gate. The third GaN layer is formed on the first GaN layer and is separated from the GaN substrate by the first GaN layer. The gate has a side plate adjacent to the side wall in a lateral direction to control a channel. | 03-26-2015 |
Tsung-Yu Yang, Kaohsiung US
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20150130067 | OHMIC CONTACT STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME - This invention provides an ohmic contact structure including: a semiconductor substrate having a top surface which includes a plurality of micro-structures; and a conductive layer, which is formed on the micro-structures. An ohmic contact is formed by the conductive layer and the semiconductor substrate. The present invention also provides a semiconductor device having the ohmic contact structure. | 05-14-2015 |
Tung-Chieh Yang, Kaohsiung TW
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20140188047 | THERMOTHERAPY NEEDLING INSTRUMENT WITH TISSUE INJECTION - The disclosure provides a thermotherapy needling instrument with tissue injection, including: a casing, an outer needle, an inner needle and a working needle. The casing has an inlet, an outlet and an inner channel. The outer needle is connected to the casing, and is in communication with the inner channel. The inner needle is disposed in the inner channel of the casing and the outer needle, and the inner needle has at least one opening The at least one opening is in communication with the inner channel so that the cooling agent flows in circulation. The working needle is connected to the outer needle so as to receive the injectant for injection and tissue ablation. By using the thermotherapy needling instrument, when sampling or injection is required during thermotherapy, the injection efficacy can be achieved by withdrawing the inner needle only. Therefore, efficacy of tissue injection and ablation thermotherapy can be achieved. | 07-03-2014 |
Tze-Ching Yang, Kaohsiung TW
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20100118909 | MINIATURE HIGH-POWER LASER DIODE DEVICE - The present invention provides a miniature high-power laser diode device, which includes a base, a laser chip, an optical fiber guider, and an optical fiber. The base has a groove and a disposing area, and the groove connects to the disposing area. The laser chip is disposed on the disposing area, and the optical fiber guider is disposed at the groove. The optical fiber is disposed in and through the optical fiber guider. The optical fiber has a first end connected to the laser chip. As a result of the cooperation between the optical fiber guider and the groove, the orientation of the optical fiber is simple and precise. The conventional thermal deformation and residual welding stress can be reduced, and the soldering flux applied in a conventional soldering and packaging process of the optical fiber can be omitted, so that the coupling efficiency, the yield, the stability of high power laser output, and the lifetime of the laser diode device of the present invention can be improved. | 05-13-2010 |
Wan Hsi Yang, Kaohsiung TW
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20140231861 | CURABLE COMPOSITION AND METHOD FOR MANUFACTURING THE SAME - A curable composition comprises the following: (A) a branched polymer having an average unit formula (I′): | 08-21-2014 |
20140231862 | CURABLE COMPOSITION AND METHOD FOR MANUFACTURING THE SAME - A curable composition comprises the following: (A) a polymer having at least two silicon-bonded alkenyl groups and having an average unit formula (I′): | 08-21-2014 |
Wen-Kuang Yang, Kaohsiung TW
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20110319353 | TREATMENT FOR SPINAL MUSCULAR ATROPHY - A method of treating spinal muscular atrophy. The method includes administering an effective amount of composition including a sodium-proton exchanger inhibitor and a pharmaceutically acceptable carrier or salt, to a subject with spinal muscular atrophy to ameliorate a symptom of spinal muscular atrophy. | 12-29-2011 |
Yan-Mei Yang, Kaohsiung TW
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20090315853 | MULTI-INDUCED TOUCHPAD - A multi-induced touchpad sequentially includes a protect layer, a first axis locus, an insulation layer, a multi-induced layer, a space dot layer, a conductive film and a substrate. The first axis locus layer has the first axis locus and the multi-induced layer has the second axis locus and a conductive circuit is provided at the first axis locus layer and the multi-induced layer respectively. The respective axis locus is intersected to each other and the conductive circuit is connected to the axis locus respectively for transmitting the conductive inducing signal to a subsequent signal processing component. The second axis locus has an electrical node at an end thereof and the conductive film has an electrical node thereon for connecting with a voltage source and a resistance calculation circuit such that the induced signal at the presses spot can be created and figured out. | 12-24-2009 |
Yuan-Cheng Yang, Kaohsiung TW
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20110189859 | Method of Etching Oxide Layer and Nitride Layer - An exemplary method of etching an oxide layer and a nitride layer is provided. In particular, a substrate is provided. A surface of the substrate has an isolating structure projecting therefrom. A first oxide layer, a nitride layer and a second oxide layer are sequentially provided on the surface of the substrate, wherein the first oxide layer is uncovered on the isolating structure, the nitride layer is formed overlying the first oxide layer, and the second oxide layer is formed overlying the nitride layer. An isotropic etching process is performed by using an etching mask unmasking the isolating structure, and thereby removing the unmasked portion of the second oxide layer and the unmasked portion of the nitride layer and further exposing sidewalls of the isolating structure. The unmasked portion of the first oxide layer generally is partially removed due to over-etching. | 08-04-2011 |
Yuan-Hsiu Yang, Kaohsiung TW
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20100214443 | GPS DEVICE WITH A DISPLAY FUNCTION AND METHOD FOR USING THE SAME - A GPS device with a display function includes a GPS recorder and a display screen. The GPS recorder has a GPS casing that encloses one part of the display screen and only a display area of the display screen is exposed. The display screen is electrically disposed on the GPS recorder, and the display screen displays pattern in order to show time information and the position information that have been captured by the GPS recorder. In addition, the GPS recorder has a memory disposed therein for storing the time information and the position information. | 08-26-2010 |