Patent application number | Description | Published |
20100109043 | METHODS AND STRUCTURES FOR ELECTROSTATIC DISCHARGE PROTECTION - A semiconductor device includes a first well region of a first conductivity, a second well region of a second conductivity type, a source region of the second conductivity type within the first well region, and a drain region of the second conductivity type at least partially within the second well region. A well contact to the first well region is coupled to the source. A third doped region of the first conductivity type and a fourth doped region of the second conductivity type are located in the second well region. A first transistor includes the third doped region, the second well region, and the first well region. The first transistor is coupled to a switch device. A second transistor includes the second well region, the first well region, and the source region. The first and the second transistors are configured to provide a current path during an ESD event. | 05-06-2010 |
20100109076 | STRUCTURES FOR ELECTROSTATIC DISCHARGE PROTECTION - A semiconductor device includes a first well region of a first conductivity, a second well region of a second conductivity type, a source region of the second conductivity type within the first well region, and a drain region of the second conductivity type at least partially within the second well region. A well contact to the first well region is coupled to the source. A first doped region of the first conductivity type and a second doped region of the second conductivity type are located in the second well region. A first transistor includes the first doped region, the second well region, and the first well region. The first transistor is coupled to a switch device. A second transistor includes the second well region, the first well region, and the source region. The first and the second transistors are configured to provide a current path during an ESD event. | 05-06-2010 |
20110216454 | ELECTROSTATIC DISCHARGE PROTECTORS HAVING INCREASED RC DELAYS - An RC delay circuit for providing electrostatic discharge (ESD) protection is described. The circuit employs an NMOS transistor and a PMOS transistor to produce a large effective resistance using a relatively small circuit layout area. | 09-08-2011 |
20120286322 | METHODS AND STRUCTURES FOR ELECTROSTATIC DISCHARGE PROTECTION - A semiconductor device includes a first well region of a first conductivity type, a second well region of a second conductive type within the first well region. A first region of the first conductivity type and a second region of the second conductivity type are disposed within the second well region. A third region of the first conductivity type and a fourth region of the second conductivity type are disposed within the first well region, wherein the third region and the fourth region are separated by the second well region. The semiconductor device also includes a switch device coupled to the third region. | 11-15-2012 |
Patent application number | Description | Published |
20100050802 | BALL SCREW MODULE - Provided is a ball screw module including a screw shaft, a nut member, a ball connector, and a circulating device inside the nut member. The screw shaft and the nut member constitute a first load rolling groove. The circulating device, being connected with the first load rolling groove, has a first turning section and a second turning section, and includes a first guiding groove and a second guiding groove. The first guiding groove has a radius of curvature greater than that of the second guiding groove when the ball connector passes the first turning section. The first guiding groove has the radius of curvature smaller than that of the second guiding groove when the ball connector passes the second turning section. | 03-04-2010 |
20120192668 | DEFLECTOR FOR BALL SCREW - A deflector for use in a ball screw is composed of a main body and a junction member connected with the main body to form a channel having a first guide groove and two second guide grooves formed at two opposite sides of the first guide groove. Each of the second guide grooves has two walls extending outward from the first guide groove. Each two of the walls have a conjunction formed therebetween. The vertical section of the channel can define an extending axis passing through centers of the two conjunctions. At least one of the walls of each second guide groove is not parallel to the extending axis. In light of the above features, the roller chain can avoid wear and tear to prolong its service life thereof. Besides, the mold for forming the deflector can be designed to be structurally subject to mold release, such that the production efficiency can be increased. | 08-02-2012 |
20140083224 | EXTERNAL CIRCULATION TYPE BALL SCREW DEVICE - The invention provides an external circulation type ball screw device comprising screw shaft and nut having first and second screw grooves. A circulation member comprises first leg, second leg and connection portion. The first leg comprises a first end surface having first inner and outer points, and the second leg comprises a second end surface having second inner and outer points; first and second entrances formed on the first and second end surfaces of circulation passage; first and second thickness respectively provided between the first entrance and the first inner and outer points thereof; the second thickness being greater than the first; the third and fourth thickness respectively provided between the second entrance and the second inner and outer points thereof; the fourth thickness being greater than the third. The groove wall of the second screw groove occupied and the occurrence of broken teeth of the nut are reduced. | 03-27-2014 |
20140222201 | DIRECTIONAL POSITION CONTROL METHOD - A directional position control method uses an instructor device and a controller to control motion of a robot, and a directional-control starter is used to actuate a directional control function. The directional-control starter controls the controller to drive the robot to move according to the instructor direction reference by converting the coordinate of the robot into the coordinate of the instructor. The directional position control method allows the movement direction reference of the robot to be defined manually or automatically, so that the robot can be moved based on the instructor direction reference of the instructor, allowing the operator to operate the robot by intuition without too much discretion, consequently reducing difficulty and error in operating the robot. Besides, the operator can control the robot by staying at the location where the instructor is located, without standing close to the robot, therefore, improving safety of operating the robot. | 08-07-2014 |
Patent application number | Description | Published |
20090273033 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT - An ESD protection circuit including a substrate of a first conductivity type, an annular well region of a second conductivity type, two first regions of the first conductivity type and at least one transistor of the second conductivity type is provided. The annular well region is disposed in the substrate. The first regions are disposed in the substrate and surrounded by the annular well region. The at least one transistor is disposed on the substrate between the first regions and including a source, a gate, and a drain. The annular well region and the drain are coupled to a first voltage source. The source and one of the first regions are coupled to a second voltage source, and the other of the first regions is coupled to a substrate triggering circuit. | 11-05-2009 |
20120057258 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHOD THEREOF - An electrostatic discharge protection device for protecting an inner circuit, which is operated in a source voltage, is provided and includes a protection unit and a control unit. The protection unit provides a discharge path for transmitting an electrostatic signal from a pad to a ground line. According to a voltage level at a control end, the protection unit adjusts a holding voltage and a triggering voltage determining whether to conduct the discharge path. When the source voltage is supplied, the control unit transmits the input voltage to the control end of the protection unit, so as to raise the holding and the triggering voltages of the discharge path. When the source voltage is not supplied, the control unit switches the control end of the protection unit to a floating condition by the electrostatic signal, so as to lower the holding and the triggering voltages of the discharge path. | 03-08-2012 |
Patent application number | Description | Published |
20110156567 | LAMP AND LAMP HOLDER MODULE THEREOF - A lamp includes a lamp holder module and light-emitting module disposed in the lamp holder module. The lamp holder module includes a body, a pressing mechanism disposed on the body, and an upper cover engaging removably the body. The light-emitting module is placed on the body and is pressed into position through the pressing mechanism. The pressing mechanism is operable to release the light-emitting module, thereby facilitating removal and installation of the light-emitting module. The upper cover serves as a lens of the light-emitting module and covers the light-emitting module. | 06-30-2011 |
20110210346 | LED MODULE - An LED module includes at least two LED package units and at least one connecting unit. Each LED package unit includes at least one first engaging portion, at least one first conductive portion, and at least one LED chip connected electrically to the first engaging portion. The connecting unit includes at least two second engaging portions, and at least one second conductive portion having two opposite end sections extending respectively to the second engaging portions. When the second engaging portions of the connecting unit engaged with the first engaging portions of the LED package units, respectively, the end sections of the second conductive portion contact electrically and respectively the corresponding first conductive portions so as to connect electrically the LED chips of the LED package units. | 09-01-2011 |
20110273076 | LED MODULE AND LED LAMP HAVING THE LED MODULE - An LED module includes a first dielectric layer, and a first patterned conductive layer having first, second, and third die-bonding pads. Each die-bonding pad includes a pad body having a die-bonding area, and an extension extended from the pad body. The extension of the first die-bonding pad extends in proximity to the die-bonding area of the second die-bonding pad. The extension of the second die-bonding pad extends in proximity to the die-bonding area of the third die-bonding pad. A second dielectric layer disposed on the first patterned conductive layer includes three dielectric members corresponding respectively to the die-bonding pads of the first patterned conductive layer. Each dielectric member includes a chip-receiving hole exposing the die-bonding area of a respective die-bonding pad for attachment of an LED chip thereto, and a wire-passage hole spaced apart from the chip-receiving hole to expose partially the first patterned conductive layer for bonding a wire. | 11-10-2011 |
20130032833 | LED MODULE AND LED LAMP HAVING THE LED MODULE - An LED module includes a first dielectric layer, and a first patterned conductive layer having first, second, and third die-bonding pads. Each die-bonding pad includes a pad body having a die-bonding area, and an extension extended from the pad body. The extension of the first die-bonding pad extends in proximity to the die-bonding area of the second die-bonding pad. The extension of the second die-bonding pad extends in proximity to the die-bonding area of the third die-bonding cad. A second dielectric layer disposed on the first patterned conductive layer includes three dielectric members corresponding respectively to the die-bonding pads of the first patterned conductive layer. Each dielectric member includes a chip-receiving hole exposing the die-bonding area of a respective die-bonding pad for attachment of an LED chip thereto, and a wire-passage hole spaced apart from the chip-receiving hole to expose partially the first patterned conductive layer for bonding a wire. | 02-07-2013 |