Patent application number | Description | Published |
20100307929 | SENSOR AND METHOD FOR MEASURING AMOUNT OF ANALYTE IN HUMAN INTERSTITIAL FLUID, FLUID CHANNEL UNIT - Disclosed is a sensor for measuring the amount of an analyte to be detected in human interstitial fluid, comprising a micro-cantilever sensing unit which includes: a first substrate; a micro-cantilever which is substantially in parallel with the first substrate and one end of which is supported onto the first substrate; a gold film formed onto at least one side of the micro-cantilever; a protein layer formed on the gold film, the protein layer being used to adsorb, at a surface thereof, the analyte to be detected in human interstitial fluid; a driving electrode provided on the first substrate; a micro-cantilever electrode which is provided on the first substrate at a position where the micro-cantilever is supported, and which is cooperated with the driving electrode so as to drive the micro-cantilever to produce resonance in a direction perpendicular to the first substrate; and a detecting electrode which is provided on the first substrate and which is cooperated with the micro-cantilever electrode so as to detect resonance frequency of the micro-cantilever. The present invention also relates to a fluid channel unit, a sensor system, and a method for measuring the amount of an analyte to be detected in human interstitial fluid. | 12-09-2010 |
20110131021 | METHOD OF COMPONENT CONCENTRATION DETECTION BASED ON REFERENCE WAVELENGTH - A method of detecting a concentration of a target component by using a reference wavelength comprises: defining a wavelength at which a light intensity is insensitive to the variation of the target component concentration as a reference wavelength for the target component; detecting spectra at both the reference wavelength and a further measuring wavelength; processing the spectrum detected at the further measuring wavelength, with the spectrum detected at the reference wavelength as an inner reference, to obtain a characteristic spectrum including specific information of the target component; building a calibration model between the characteristic spectrum and the concentration of the target component; and determining the concentration of the target component based on the calibration model. | 06-02-2011 |
20150346090 | ABSORPTION AND SCATTERING EFFECTS SEPARATION FROM DIFFUSE SPECTRUM DATA AND MODEL ESTABLISHMENT AND CONCENTRATION PREDICTION BASED THEREON - A method of processing diffuse spectrum data may include: obtaining diffuse spectrum data of a medium to be detected at one or more first radial positions; and determining optical information caused by substantially only a variation in scattering characteristic of the medium to be detected and/or optical information caused by substantially only a variation in absorption characteristic of the medium to be detected at one or more second radial positions from the obtained diffuse spectrum data. | 12-03-2015 |
Patent application number | Description | Published |
20090306259 | METHOD OF PREPARING OIL ABSORBING FIBERS - A method of preparing oil-absorbing fibers by: a) fully dissolving a dispersant and a deionized water in a reaction vessel, adding a methacrylate monomer and an initiator to a reactor and stirring to form a homogenous solution, transferring the homogenous solution into the reaction vessel, charging nitrogen gas, stirring, raising temperature to 70-80° C., allowing to react for 2-6 hours, raising temperature to 90-100° C., allowing to react for 2-4 hours, collecting a resultant product, washing, drying, and obtaining a white resin; b) drying the white resin, mixing with a swelling agent, and sealing the mixture at room temperature for 48-96 hours to yield a homogenous gel; c) grinding the gel completely, spinning by a plunger spinner, and coagulating with a coagulation bath to yield an as-spun oil-absorbing fiber; and d) drawing the as-spun oil-absorbing fiber with a draw ratio of 2-6 to yield oil-absorbing fibers. | 12-10-2009 |
Patent application number | Description | Published |
20100236526 | Common rail electronic control injector - The present invention relates to a common rail electronic control injector, which belongs to the electronic control fuel injection system technology. The injector includes an oil inlet joint, an oil inlet located at outside the oil inlet joint, an electromagnet device, a nozzle body, a needle valve, a valve seat and spray holes, wherein the electromagnet device includes a static core, an armature and a coil, wherein a working gap between the static core and the armature is H, the armature is moveably connected with the needle valve along an axial direction. The present invention further includes a compression spring applying a force to the needle valve, a force mechanism applying a force to the armature, and a block mechanism providing an axial anti-thrust while the armature is reset. The present invention has advantages of lower manufacturing cost, better reliability and smaller driving energy. | 09-23-2010 |
20100236527 | Electronic control common rail DME injection system - A common rail electronic control injection system which uses a DME or a low-viscosity fuel similar with DME to inject into a combustion engine, includes a fuel container, a common rail tube, a high-pressure tube, an electronic control injector, an electronic control unit, a high-pressure pump, a working medium case, a reversing component, and a pressure convertor, wherein the pressure convertor includes at least two working components, each working component is divided into a fuel chamber and a working medium chamber by an dividing element, the dividing element can freely deform or move between the fuel chamber and the working medium chamber by pressure effect. The invention avoids the sealing and abrasion problem in the plunger matching portions which is caused by the low-viscosity fuel so as to greatly improve the lifetime and reliability of system. | 09-23-2010 |
Patent application number | Description | Published |
20080214636 | Glycyrrhetinic Acid-30-Amide Derivatives and Their Use - The present invention relates to the field of a medicine for treating diseases associated with inflammation, immunity or infection, and in particular, to glycyrrhetinic acid-30-amide derivatives of general formula I and their preparation, and a pharmaceutical composition containing the same. Said derivatives and composition exhibit anti-inflammatory, analgesic, anti-allergic, cough-preventing, liver-protecting and anti-viral properties, | 09-04-2008 |
20110218161 | CYCLOASTRAGENOL MONOGLUCOSIDE, PREPARATION, PHARMACEUTICAL COMPOSITION AND APPLICATION THEREOF - This invention provides a method for preparing cycloastragenol monoglucoside CMG (cycloastragenol-6-O-β-D-glucoside), comprising the steps of: a. using astragaloside IV or Astragali extracts prepared by a conventional method as raw materials and adding an appropriate solvent thereinto to form a raw material solution; b. adding hydrolase and allowing for hydrolysis at a constant temperature to obtain a hydrolysate; c. separating the hydrolysate with macroporous adsorption resin; and d. obtaining the product by purification and separation. The present invention further provides cycloastragenol-6-O-β-D-glucoside prepared according to the method of this invention as well as its use in the preparation of a medicament for treating cardiovascular diseases and pharmaceutical compositions comprising the same. | 09-08-2011 |
20110281922 | AMIDE THIAZOLE DERIVATIVE, PREPARATION METHOD AND USES THEREOF - The present invention relates to the field of drugs associated with treating diabetes. Particularly, the present invention relates to a dipeptidyl peptidase-IV inhibitor having the structure shown by formula (I), which contains amide thiazole structure and has an effect on treating diabetes, and a preparation method and a pharmaceutical composition containing it, as well as use thereof in manufacture of the drugs for treating the diabetes, | 11-17-2011 |
20130023486 | PHENYL C-GLUCOSIDE DERIVATIVES, PREPARATION METHODS AND USES THEREOF - The present invention relates to a sodium glucose cotransporter 2 (SGLT2) inhibitor with a phenyl C-glucoside structure, its preparation method, a pharmaceutical composition containing the same, and its use in treating diabetes and preparing an anti-diabetes medicament. The invention provides a compound with the structure of general formula I and a pharmaceutically acceptable salt and prodrug ester thereof, | 01-24-2013 |
20150232527 | GLUCAGON-LIKE PEPTIDE-1 ANALOGUE MONOMER AND DIMER, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF - Provided are a glucagon-like peptide-1 (GLP-1) analogue monomer and dimmer, a preparation method thereof, and an application thereof. The GLP-1 analogue monomer comprises one cysteine; and the dimer is formed by two monomer molecules connected via an intermolecular disulfide bond formed by the cysteine. The GLP-1 monomer comprising cysteine has the following general formula: | 08-20-2015 |
20150274799 | GLP-1 ANALOGUE, ITS PREPARATION METHODS AND USE THEREOF - Provided is a GLP-1 analogue having the structure as shown in the general formula A: | 10-01-2015 |
20160046595 | PHENYL C-GLUCOSIDE DERIVATIVE CONTAINING DEOXYGLUCOSE STRUCTURE, PREPARATION METHOD AND USE THEREOF - The present invention provides a phenyl C-glucoside derivative containing a deoxyglucose structure as represented by formula I, preparation method thereof, a pharmaceutical composition comprising the same, and uses thereof in the preparation of medicaments for treating diabetes, wherein substituents R | 02-18-2016 |
Patent application number | Description | Published |
20080266828 | LEAD FRAME WITH SOLDER FLOW CONTROL - A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding. | 10-30-2008 |
20090236713 | SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF PACKAGING SEMICONDUCTOR INTEGRATED CIRCUIT - In a method of packaging a semiconductor IC, a tape is attached to a back surface of a lead frame array, and the lead frame array is held between an upper mold chase and a lower mold chase of a mold, with the back surface of the lead frame array upward. The upper and lower mold chases form an upper cavity and a lower cavity with respect to the lead frame array respectively. A mold compound is injected into the upper and lower cavities respectively. With respect to clearances between leads, between die pads and/or between the leads and the die pads, the mold compound injected into the upper cavity covers the portion of the tape over the clearances before the mold compound injected into the lower cavity fills the clearances, so that the tape is depressed. After curing the mold compound, removing the mold and de-taping, the mold compound filled in the clearances is recessed inward from the back surface, which increases the solderability in the subsequent surface mount process and decreases the possibility of the occurrence of lead short-circuits. | 09-24-2009 |
20120056311 | LEADFRAME FOR SEMICONDUCTOR DEVICE - A lead frame for a semiconductor device has a die pad with a first major surface for receiving an semiconductor die and a connection bar that encircles the die pad. First lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the first lead fingers lie in a first plane. Second lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the second lead fingers lie in a second plane that is parallel and spaced from the first plane. An isolation frame is disposed between the proximal ends of the first and second lead fingers. The isolation frame separates but supports the proximal ends of the first and second lead fingers. | 03-08-2012 |
20120168884 | PRESSURE SENSOR AND METHOD OF PACKAGING SAME - A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant. | 07-05-2012 |
20120193737 | MRAM DEVICE AND METHOD OF ASSEMBLING SAME - A method of packaging a magnetoresistive random access memory (MRAM) die includes providing a lead frame having a die pad and lead fingers. The MRAM die is attached to the die pad with a first die attach adhesive and bond pads of the MRAM die are electrically connected to the lead fingers of the lead frame with wires using a wire bonding process. A pre-formed composite magnetic shield is attached to a top surface of the MRAM die with a second die attach adhesive. The magnetic shield includes a magnetic permeable filler material dispersed within an organic matrix. An encapsulating material is dispensed onto a top surface of the lead frame, MRAM die and magnetic shield such that the encapsulating material covers the MRAM die and the magnetic shield. The encapsulating material is then cured. | 08-02-2012 |
20120211846 | MRAM DEVICE AND METHOD OF ASSEMBLING SAME - A method of assembling a magnetoresistive random access memory (MRAM) device includes providing a substrate having an opening. A tape is applied to a surface of the substrate and a first magnetic shield is placed onto the tape and within the substrate opening. An adhesive is applied between the first magnetic shield and the substrate to attach the first magnetic shield to the substrate. An MRAM die is attached to the first magnetic shield and bond pads of the MRAM die are connected to pads on the substrate with wires. A second magnetic shield is attached to a top surface of the MRAM die. An encapsulating material is dispensed onto the substrate, the MRAM die, the second magnetic shield and part of the first magnetic shield, cured, and then the tape is removed. Solder balls then may be attached to the substrate. | 08-23-2012 |
20120286406 | SEMICONDUCTOR DEVICE WITH STAGGERED LEADS - A process for assembling a semiconductor device includes providing a lead frame having a native plane and a plurality of leads having a native lead pitch. The process includes trimming and forming a first subset of the plurality of leads to provide a first row of leads. The process includes trimming and forming a second subset of the plurality of leads to provide a second row of leads. At least one subset of leads is formed with an obtuse angle relative to the native plane such that lead pitch associated with the first or second subset of leads is greater than the native lead pitch. | 11-15-2012 |
20130020690 | STACKED DIE SEMICONDUCTOR PACKAGE - A semiconductor package and method of assembling a semiconductor package includes encapsulating a first pre-packaged semiconductor die stacked on top of and interconnected with a second semiconductor die. The first packaged semiconductor die is positioned and fixed relative to a lead frame with a temporary carrier such as tape. The second semiconductor die is attached and interconnected directly to the first packaged semiconductor die and lead frame. The interconnected first packaged die and second semiconductor die, and lead frame are encapsulated to form the semiconductor package. Different types of semiconductor packages such as quad flat no-lead (QFN) and ball grid array (BGA) may be formed, which provide increased input/output (I/O) count and functionality. | 01-24-2013 |
20130037966 | SEMICONDUCTOR DEVICE DIE BONDING - A semiconductor device includes a semiconductor die having first and second opposing faces and an edge surface. The edge surface has an undercut under the first face. The second face of the semiconductor die is bonded to a bonding surface of a die support member, such as a thermally conductive flag of a lead frame, with a die attach material. A fillet of the bonding material is formed within the undercut. | 02-14-2013 |
20130049183 | POWER DEVICE AND METHOD OF PACKAGING SAME - A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers. | 02-28-2013 |
20130264714 | SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME - A semiconductor die has interface electrodes on an interface surface and an electrically conductive layer on a mounting surface that is opposite to the interface surface. The electrically conductive layer extends onto side regions of the semiconductor die. Electrical conductors couple the interface electrodes to external connector pads. A solder alloy joins the semiconductor die to a flag. The solder alloy is disposed between the flag and the electrically conductive layer and provides a joint between the flag and both the mounting surface and the side regions. | 10-10-2013 |
20140191383 | POWER DEVICE AND METHOD OF PACKAGING SAME - A method of packaging a power semiconductor die includes providing a first lead frame of a dual gauge lead frame. The first lead frame includes a thick die pad. A tape is attached to a first side of the thick die pad and the power die is attached to a second side of the thick die pad. A second lead frame of the dual gauge lead frame is provided. The second lead frame has thin lead fingers. One end of the lead fingers is attached to an active surface of the power die such that the lead fingers are electrically connected to bonding pads of the power die. A molding compound is then dispensed onto a top surface of the dual gauge lead frame such that the molding compound covers the power die and the lead fingers. | 07-10-2014 |
20140206124 | PRESSURE SENSOR AND METHOD OF PACKAGING SAME - A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant. | 07-24-2014 |
20160023894 | PACKAGED SEMICONDUCTOR SENSOR DEVICE WITH LID - A method for assembling a packaged semiconductor device includes mounting a pressure-sensing die onto a die paddle of a metal lead frame. A pressure-sensitive gel is dispensed into a recess of a lid, and the lead frame is mated with the lid such that the pressure-sensing die is immersed in the pressure-sensitive gel within the recess of the lid. | 01-28-2016 |
Patent application number | Description | Published |
20130005087 | METHOD AND APPARATUS FOR MOLDING SEMICONDUCTOR DEVICE - An apparatus for molding a semiconductor device includes an upper mold chase and a lower mold chase. The mold chases are capable of being aligned with each other, forming spaced cavities for receiving a lead frame array that includes semiconductor dies for encapsulation. The cavities are aligned in spaced, vertical columns and gates are provided at the opening of each column of cavities. A molding compound is passed through the gates and flows uninterrupted through each cavity and encapsulates the semiconductor dies. | 01-03-2013 |
20150243586 | SEMICONDUCTOR DIE PACKAGE WITH PRE-MOLDED DIE - A semiconductor die is packaged by providing a die assembly that includes a semiconductor die with an active surface and an opposite mounting surface with an attached thermally conductive substrate. The die assembly is mounted on a first surface of a lead frame die flag so that the thermally conductive substrate is sandwiched between the die flag and the semiconductor die. Bonding pads of the die are electrically connected with bond wires to lead frame lead fingers. A mold compound then encapsulates the semiconductor die, bond wires, and thermally conductive substrate. A second surface of the die flag is exposed through the mold compound. | 08-27-2015 |
20150243623 | SEMICONDUCTOR DEVICE GRID ARRAY PACKAGE - A grid array assembly is formed from an electrical insulating material with embedded solder deposits. A first portion of each of the solder deposits is exposed on a first surface of the insulating material and a second portion of each of the solder deposits is exposed on an opposite surface of the insulating material. A semiconductor die is mounted to the first surface of the insulating material and electrodes of the die are connected to the solder deposits with bond wires. The die, bond wires, and the first surface of the insulating material then are covered with a protective encapsulating material. | 08-27-2015 |
20150255443 | EXPOSED DIE POWER SEMICONDUCTOR DEVICE - A semiconductor package has a lead frame and a power die. The lead frame has a first die paddle with a cavity formed entirely therethrough. The power die, which has a lower surface, is mounted on the first die paddle such that a first portion of the lower surface is attached to the first die paddle using a solderless die-attach adhesive, and a second portion of the lower surface, is not attached to the first die paddle and abuts the cavity formed in the first die paddle such that the second portion is exposed. | 09-10-2015 |
20150332985 | PROTECTIVE PACKAGING FOR INTEGRATED CIRCUIT DEVICE - A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure. | 11-19-2015 |