Patent application number | Description | Published |
20090001390 | Matrix material including an embedded dispersion of beads for a light-emitting device - A light-emitting device has a light source disposed on a support. A matrix material including a dispersion of beads is disposed over the light source. The refractive index of the beads is different from the refractive index of the matrix material. The light source may include an LED. The matrix material may include a lens. | 01-01-2009 |
20100091491 | TOTAL INTERNAL REFLECTION LENS FOR COLOR MIXING - A total-internal-reflection (TIR) lens for color mixing includes a body member having an outer surface and an interior open channel extending longitudinally through the body member. The body member and the interior open channel are substantially symmetric with respect to an optical axis, and the outer surface is shaped to provide total internal reflection. The body member has a first end surface region at a first end of the open channel for accommodating a light source and a second end surface region opposite the first end region. The second end surface region includes a plurality of refractive surface regions positioned around the second end region of the open channel. The lens is configured to provide projected light substantially centered with respect to the optical axis when the light source is positioned off the optical axis. In a specific embodiment, a lighting apparatus for providing centered white light includes such a lens and a plurality of light sources. | 04-15-2010 |
20100259930 | PACKAGE FOR MULTIPLE LIGHT EMITTING DIODES - Substrates and packages for LED-based light devices can significantly improve thermal performance and provide separate electrical and thermal paths through the substrate. One substrate includes multiple electrically insulating base layers. On a top one of these layers are disposed top-side electrical contacts, including light device pads to accommodate a plurality of light devices. External electrical contacts are disposed on an exterior surface of the substrate. Electrical paths connect the top-side electrical contacts to the external electrical contacts. At least portions of some of the electrical paths are disposed between the electrically insulating base layers. The electrical paths can be arranged such that different subsets of the light device pads are addressable independently of each other. A heat dissipation plate can be formed on the bottom surface of a bottom one of the base layers. | 10-14-2010 |
20120286669 | TUNING OF EMITTER WITH MULTIPLE LEDS TO A SINGLE COLOR BIN - The color of an LED-based lamp can be tuned to a desired color or color temperature. The lamp can include two or more independently addressable groups of LEDs associated with different colors or color temperatures and a total-internal-reflection (TIR) color-mixing lens to produce light of a uniform color by mixing the light from the different groups of LEDs. The color of the output light is tuned by controllably dividing an input current among the groups of LEDs. Tuning can be performed once, e.g., during manufacture, and the lamp does not require active feedback components for maintaining color temperature. | 11-15-2012 |
20120286699 | APPARATUS FOR TUNING OF EMITTER WITH MULTIPLE LEDS TO A SINGLE COLOR BIN - An apparatus is used to tune the color produced by an LED-based lamp to a desired color or color temperature. To support tuning, the lamp can include two or more independently addressable groups of LEDs. Color or color temperature is tuned by controllably dividing an input current among the groups of LEDs. The apparatus determines an optimal division of the input current based on a linear interpolation between measured values of color or color temperature produced by at least two different divisions of the input current. | 11-15-2012 |
20130075769 | SELECTION OF PHOSPHORS AND LEDS IN A MULTI-CHIP EMITTER FOR A SINGLE WHITE COLOR BIN - An emitter for an LED-based lighting device has multiple groups of LEDs that are independently addressable, allowing the emitter to be tuned to a desired color bin (e.g., a specific white color) by adjusting the relative current supplied to different groups. The LED dies for the groups and a phosphor chip for each LED die are individually selected such that each LED-die/phosphor-chip combination produces light in a desired source region associated with the group to which the LED belongs. Robotic pick-and-place systems can be used to automate assembly of the emitters by selecting LED dies from a bin based on based on spectral characteristics and phosphor chips from a number of distinct phosphor chip types. | 03-28-2013 |
20130087813 | GROOVED PLATE FOR IMPROVED SOLDER BONDING - A metal plate on a multi-die LED emitter substrate or a metal plate on a metal-core printed circuit board (MCPCB) that attaches to the emitter substrate (or both plates) can be fabricated with a number of generally radial grooves, at least some of which extend to the peripheral edge of the plate. These grooves can provide channels that allow air to escape during solder-bonding processes, reducing the size and/or total area of solder voids and thereby improving thermal transfer between the emitter and the MCPCB. | 04-11-2013 |
20130120985 | SPOT TIR LENS SYSTEM FOR SMALL HIGH-POWER EMITTER - A lamp includes a single emitter structure having a substrate with 25 or more light emitting diodes (LEDs) arranged thereon and a power rating of 80 Watts or more, a total internal reflection (TIR) lens with a plurality of refractive surface regions disposed on the step-shaped upper surface of the optical body, and a holder having a plurality of tabs disposed along an inside rim of the holder and configured for radial compression fit with a flange of the lens, and three or more support members configured for centering the optical body member with respect to the single emitter structure. A low weight ratio of hardener over base resin below 6 is used, for example, between 1.5:1 to 2.5:1. | 05-16-2013 |
20130168703 | DEPOSITION OF PHOSPHOR ON DIE TOP BY STENCIL PRINTING - A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a plurality of LED dies in one of the plurality of openings of the template. The method also includes disposing a stencil over the template and the plurality of LED dies. The stencil has a plurality of openings configured to expose a top surface of each of the LED dies. Next, a phosphor-containing material is disposed on the exposed top surface of each the LED dies. The method further includes removing the stencil and the template. | 07-04-2013 |
20130228804 | METHOD AND SYSTEM FOR FORMING LED LIGHT EMITTERS - A method for forming a flexible sheet of LED light emitters includes forming a micro lens sheet having a plurality of micro lenses, forming a phosphor sheet including a wave-length converting material, forming a flexible circuit sheet, forming a ceramic substrate sheet including a plurality of LED light emitters, and forming a support substrate including a thermally conductive material. The method also includes attaching the above sheets to form a stack including, from top to bottom, the micro lens sheet, the phosphor sheet, the flexible circuit sheet, the ceramic substrate sheet, and the support substrate. | 09-05-2013 |
20130229125 | TUNABLE MULTI-LED EMITTER MODULE - A light-emitting diode (LED) emitter module includes a substrate having a plurality of base layers of an electrically insulating material, a plurality of electrical contacts disposed on a top one of the base layer, and a plurality of electrical paths coupled to the electrical contacts, wherein at least a portion of the plurality of electrical paths is disposed between the base layers. The emitter module also includes two or more groups of light-emitting diodes (LEDs), each group having one or more LEDs, and each of the LEDs is coupled to an electrical contact. The electrical paths are configured for feeding separate electrical currents to the groups of LEDs. The emitter module also includes a memory device containing information associating a plurality of output light colors with a corresponding plurality of combinations of electrical currents, each combination specifying an electric current for each of the two or more groups of LEDs. | 09-05-2013 |
20130258654 | LED-BASED MR16 REPLACEMENT LAMP - An LED-based lamp can be made to have a form factor compatible with fixtures designed for MR16 lamps. Such a lamp can have a housing that provides an external electrical connection. Inside the housing is disposed a single emitter structure having a substrate with multiple light-emitting diodes (LEDs) arranged thereon. Different LEDs produce light of different colors (or color temperatures). For example, at least one LED can produce a warm white light, while at least one other LED produces a cool white light and at least one other LED produces a red light. A total-internal-reflection (TIR) lens is positioned to collect light emitted from the single emitter structure and adapted to mix the light from the LEDs to produce a uniform white light. A diffusive coating is applied to a front face of the TIR lens for further color mixing. | 10-03-2013 |
20130270585 | SYSTEM AND METHODS FOR WARM WHITE LED LIGHT SOURCE - An LED light emitter includes a single emitter structure having a substrate with a plurality of light emitting diodes (LEDs) arranged thereon, wherein the plurality of LEDs includes at least one first LED die that produces a first color light, and at least one second LED die that produces a second color light. The LED light emitter also includes a total internal reflection (TIR) lens positioned to collect light emitted from the single emitter structure and adapted to mix the light from the plurality of LEDs to produce a uniform light. The plurality of LEDs are selected such that the light output by the LED light emitter has a desired color temperature when an equal current is supplied to all of the plurality of LEDs. | 10-17-2013 |
20140049958 | PACKAGE FOR MULTIPLE LIGHT EMITTING DIODES - Substrates and packages for LED-based light devices can significantly improve thermal performance and provide separate electrical and thermal paths through the substrate. One substrate includes multiple electrically insulating base layers. On a top one of these layers are disposed top-side electrical contacts, including light device pads to accommodate a plurality of light devices. External electrical contacts are disposed on an exterior surface of the substrate. Electrical paths connect the top-side electrical contacts to the external electrical contacts. At least portions of some of the electrical paths are disposed between the electrically insulating base layers. The electrical paths can be arranged such that different subsets of the light device pads are addressable independently of each other. A heat dissipation plate can be formed on the bottom surface of a bottom one of the base layers. | 02-20-2014 |
20140084796 | TUNING OF EMITTER WITH MULTIPLE LEDS TO A SINGLE COLOR BIN - The color of an LED-based lamp can be tuned to a desired color or color temperature. The lamp can include two or more independently addressable groups of LEDs associated with different colors or color temperatures and a total-internal-reflection (TIR) color-mixing lens to produce light of a uniform color by mixing the light from the different groups of LEDs. The color of the output light is tuned by controllably dividing an input current among the groups of LEDs. Tuning can be performed once, e.g., during manufacture, and the lamp does not require active feedback components for maintaining color temperature. | 03-27-2014 |
20140124822 | GRAPHITE-CONTAINING SUBSTRATES FOR LED PACKAGES - Substrates and packages for LED based light devices can incorporate a material with high thermal conductivity in at least the lateral direction (e.g., graphite or graphene) to spread heat across the surface of the substrate. A substrate or layer in a multi-layer substrate can have a graphite core disposed between ceramic sublayers that provide electrical insulation and thermal conductivity in the transverse direction. Another substrate or layer in a multi-layer substrate can be fabricated using a composite of graphite and ceramic materials. | 05-08-2014 |
20140167075 | PHOSPHOR CAP FOR LED DIE TOP AND LATERAL SURFACES - A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a plurality of LED dies in one of the plurality of openings of the template. The method also includes forming a patterned dry film photoresist layer over the template and the plurality of LED dies. The photoresist layer has a plurality of openings configured to expose a top surface and side surfaces of each of the LED dies. Next, a phosphor-containing material is disposed on the exposed top surface of each the LED dies. The method further includes removing the photoresist layer and the template. | 06-19-2014 |
20140209939 | CERAMIC LED PACKAGE - A package for multiple LED's and for attachment to a substrate includes a body, which includes a top body layer, a cavity disposed through the top body layer and having a floor for bonding to the multiple LED's, and a thermal conduction layer bonded to the top body layer and having a top surface forming the floor of the cavity and a bottom surface. The thermal conduction layer includes a thermally conducting ceramic material disposed between the floor and the bottom surface. The package also includes a plurality of LED bonding pads in direct contact with the floor and configured to bond to the multiple LED's and a plurality of electrical bonding pads in direct contact with the floor, proximate to the LED bonding pads, and in electrical communication with a plurality of electrical contacts disposed on a surface of the body. | 07-31-2014 |
20140268153 | MANUFACTURING METHOD FOR LED EMITTER WITH HIGH COLOR CONSISTENCY - A method is provided for forming multiple-LED (light-emitting-diode) light emitters from a plurality of LEDs, wherein the number of LEDs in each emitter is an integer M. The method includes providing a plurality of LEDs, each of the LEDs characterized by a first parameter and a second parameter, which are related to color coordinates CIEx and CIEy in a chromaticity diagram. The method also includes determining first and second parameter X | 09-18-2014 |
20140300283 | COLOR TUNABLE LIGHT SOURCE MODULE WITH BRIGHTNESS CONTROL - LED-based light source modules can incorporate color tunability and brightness control, allowing a user to select a desired color temperature and/or brightness and to change either or both dynamically. An emitter can include multiple independently addressable groups of LEDs, each emitting light of a different color. By controlling the relative operating current provided to each group, a desired color temperature can be achieved, and by controlling the absolute operating currents, the brightness of the output light can be controlled. Pulse width modulation (PWM) can be used to control the relative and absolute operating currents. Smooth, gradual transitions between brightness and/or color temperature settings in response to changes can be provided. | 10-09-2014 |
20140300284 | COLOR TUNABLE LIGHT SOURCE MODULE WITH BRIGHTNESS AND DIMMING CONTROL - LED-based light source modules can incorporate color tunability and brightness control, allowing a user to select a desired color temperature and/or brightness and to change either or both dynamically. An emitter can include multiple independently addressable groups of LEDs, each emitting light of a different color. By controlling the relative operating current provided to each group, a desired color temperature can be achieved, and by controlling the absolute operating currents, the brightness of the output light can be controlled. Pulse width modulation (PWM) can be used to control the relative and absolute operating currents. Smooth, gradual transitions between brightness and/or color temperature settings in response to changes can be provided. | 10-09-2014 |
20140335636 | METHOD OF MANUFACTURING CERAMIC LED PACKAGES - Methods of fabricating a light-emitting device are provided. A light-emitting device can be formed from bonding a lens including a plug and a cap to an LED package including a socket configured to receive the plug. The lens can be fabricated using an injection mold formed from a well secured to the LED package and injecting a material into the injection mold to cure into a shape of the lens. The lens can also be fabricated using a blank about the shape of the lens and machining the blank to produce the plug and the cap of the lens. The lens can be bonded to the LED package using a convex bead of adhesive deposited on the surface of the LED package and spreading the adhesive between the lens and the LED package. | 11-13-2014 |
20140360766 | PACKAGE FOR MULTIPLE LIGHT EMITTING DIODES - Substrates and packages for LED-based light devices can significantly improve thermal performance and provide separate electrical and thermal paths through the substrate. One substrate includes multiple electrically insulating base layers. On a top one of these layers are disposed top-side electrical contacts, including light device pads to accommodate a plurality of light devices. External electrical contacts are disposed on an exterior surface of the substrate. Electrical paths connect the top-side electrical contacts to the external electrical contacts. At least portions of some of the electrical paths are disposed between the electrically insulating base layers. The electrical paths can be arranged such that different subsets of the light device pads are addressable independently of each other. A heat dissipation plate can be formed on the bottom surface of a bottom one of the base layers. | 12-11-2014 |
20140369051 | SPOT TIR LENS SYSTEM FOR SMALL HIGH-POWER EMITTER - A lamp includes a single emitter structure having a substrate with 25 or more light emitting diodes (LEDs) arranged thereon and a power rating of 80 Watts or more, a total internal reflection (TIR) lens with a plurality of refractive surface regions disposed on the step-shaped upper surface of the optical body, and a holder having a plurality of tabs disposed along an inside rim of the holder and configured for radial compression fit with a flange of the lens, and three or more support members configured for centering the optical body member with respect to the single emitter structure. | 12-18-2014 |
20150039114 | SELECTION OF PHOSPHORS AND LEDS IN A MULTI-CHIP EMITTER FOR A SINGLE WHITE COLOR BIN - An emitter for an LED-based lighting device has multiple groups of LEDs that are independently addressable, allowing the emitter to be tuned to a desired color bin (e.g., a specific white color) by adjusting the relative current supplied to different groups. The LED dies for the groups and a phosphor chip for each LED die are individually selected such that each LED-die/phosphor-chip combination produces light in a desired source region associated with the group to which the LED belongs. Robotic pick-and-place systems can be used to automate assembly of the emitters by selecting LED dies from a bin based on based on spectral characteristics and phosphor chips from a number of distinct phosphor chip types. | 02-05-2015 |
20150061508 | TUNING OF EMITTER WITH MULTIPLE LEDS TO A SINGLE COLOR BIN - The color of an LED-based lamp can be tuned to a desired color or color temperature. The lamp can include two or more independently addressable groups of LEDs associated with different colors or color temperatures and a total-internal-reflection (TIR) color-mixing lens to produce light of a uniform color by mixing the light from the different groups of LEDs. The color of the output light is tuned by controllably dividing an input current among the groups of LEDs. Tuning can be performed once, e.g., during manufacture, and the lamp does not require active feedback components for maintaining color temperature. | 03-05-2015 |
20150070872 | METHOD AND SYSTEM FOR FORMING LED LIGHT EMITTERS - A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has a ceramic substrate sheet overlying support substrate, and the ceramic substrate sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the ceramic substrate sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses. | 03-12-2015 |