Patent application number | Description | Published |
20090026478 | SEMICONDUCTOR LIGHT EMITTING DEVICE - There is provided a semiconductor light emitting device having excellent light extraction efficiency to efficiently reflect light moving into the device by increasing the total reflectivity of a reflective layer. A semiconductor light emitting device according to an aspect of the invention includes: a substrate, a reflective electrode, a first conductivity semiconductor layer, an active layer, and a second conductivity type semiconductor layer that are sequentially stacked. Here, the reflective electrode includes; a first reflective layer provided on the substrate and including a conductive reflective material reflecting light generated from the active layer; and a second reflective layer provided on the first reflective layer, including one or more dielectric portions reflecting light generated from the active layer, and one or more contact holes filled with a conductive filler to electrically connect the first conductivity type semiconductor layer and the first reflective layer, and having a greater thickness than a wavelength of the generated light. | 01-29-2009 |
20090221110 | VERTICAL LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME - Provided is a vertical LED including an n-electrode; an n-type GaN layer formed under the n-electrode, the n-type GaN layer having a surface coming in contact with the n-electrode, the surface having a Ga | 09-03-2009 |
20100133570 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed is a semiconductor light emitting device, and a method of manufacturing the same. The semiconductor light emitting device includes a first conductivity type semiconductor layer, an active layer disposed on the top of the first conductivity type semiconductor layer, and a second conductivity type semiconductor layer disposed on the top of the active layer and comprising light extraction patterns in the top thereof, the light extraction patterns each having a columnar portion and a hemispherical top portion. | 06-03-2010 |
20110210311 | SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING MULTI-CELL ARRAY AND METHOD FOR MANUFACTURING THE SAME - A semiconductor light emitting device includes: a substrate; a plurality of light emitting cells arranged on the substrate, each of the light emitting cells including a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer disposed therebetween to emit blue light; an interconnection structure electrically connecting at least one of the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer of the light emitting cell to at least one of the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer of another light emitting cell; and a light conversion part formed in at least a portion of a light emitting region defined by the plurality of light emitting cells, the light conversion part including at least one of a red light conversion part having a red light conversion material and a green light conversion part having a green light conversion material. | 09-01-2011 |
20110210351 | SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING MULTI-CELL ARRAY AND METHOD FOR MANUFACTURING THE SAME - A semiconductor light emitting device includes: a substrate; a plurality of light emitting cells arranged on the substrate, each of the light emitting cells including a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer disposed therebetween to emit blue light; an interconnection structure electrically connecting at least one of the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer of the light emitting cell to at least one of the first-conductivity-type semiconductor layer and the second-conductivity-type semiconductor layer of another light emitting cell; and a light conversion part formed in at least a portion of a light emitting region defined by the plurality of light emitting cells, the light conversion part including at least one of a red light conversion part having a red light conversion material and a green light conversion part having a green light conversion material. | 09-01-2011 |
20120080707 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - There is provided a semiconductor light emitting device and method of making the same, having a first conductivity type semiconductor layer; an active layer formed on the first conductivity type semiconductor layer; a second conductivity type semiconductor layer formed on the active layer and including a plurality of holes; and a transparent electrode formed on the second conductivity type semiconductor layer. | 04-05-2012 |
20140070244 | SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING MULTI-CELL ARRAY AND METHOD FOR MANUFACTURING THE SAME - A semiconductor light emitting device includes a substrate and a plurality of light emitting cells arranged on the substrate. Each of the light emitting cells includes a first-conductivity-type semiconductor layer, a second-conductivity-type semiconductor layer, and an active layer disposed therebetween to emit blue light. An interconnection structure electrically connects the first-conductivity-type and the second-conductivity-type semiconductor layers of one light emitting cell to the first-conductivity-type and the second-conductivity-type semiconductor layers of another light emitting cell. A light conversion part is formed in a light emitting region defined by the light emitting cells and includes a red and/or a green light conversion part respectively having a red and/or a green light conversion material. | 03-13-2014 |
Patent application number | Description | Published |
20130135787 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body including dielectric layers; and first and second inner electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body, the first and second inner electrodes being alternately laminated with a difference in printing widths therebetween, wherein a difference ratio between the printing widths of the first and second inner electrodes is 20 to 80%. According to embodiments of the present invention, a multilayer ceramic electronic component having excellent reliability and withstand voltage characteristics may be realized, by reducing the occurrence of cracking through a reduction in the influence of step height while securing high capacitance. | 05-30-2013 |
20140182910 | MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD THEREFOR - There is provided a multilayer ceramic capacitor including: a ceramic body having dielectric layers laminated in a width direction thereof; an active region in which capacitance is formed, by including first and second internal electrodes alternately exposed to end surfaces of the ceramic body while having the dielectric layer interposed therebetween; an upper margin part prepared above the active region; a lower margin part prepared below the active region on the dielectric layer and being thicker than the upper margin part; and first and second external electrodes, wherein, when half of thickness of the ceramic body is denoted by A, thickness of the lower margin part is denoted by B, half of thickness of the active region is denoted by C, and thickness of the upper margin part is denoted by D, | 07-03-2014 |
Patent application number | Description | Published |
20090021325 | FRONT-END MODULE - A front end module is disclosed. The front end module includes a plurality of antennas receiving different frequency band signals, respectively, an impedance matching circuit unit comprising a plurality of tuners respectively connected to the plurality of antennas to control impedance matching, a selection unit selecting one frequency band signal from multiple frequency band signals passing through the impedance matching circuit unit, a measuring unit measuring signal strength of a received signal selected at the selection unit, and a control unit controlling an operation of the selection unit and an impedance of the tuner according to the signal strength of the received signal measured at the measuring unit. | 01-22-2009 |
20090038141 | METHOD FOR MANUFACTURING ANTENNA - Provided is a method for manufacturing an antenna which is minimized and used in a low frequency band. The method includes forming and preparing a radiator for an antenna, mounting the radiator inside a dam molding part including an upper dam molding part and a lower dam molding part, injecting a molding material into the dam molding part through an inlet provided at one side of the dam molding part, the molding material including a composite material with a controlled diameter and content, hardening the injected molding material, and separating the hardened molding material covering the radiator from the dam molding part. Accordingly, a miniaturized antenna can be provided, which can achieve a high integration density, prevent deformation of the radiator caused by external pressure generated in processes, and be used in a low frequency band by covering the radiator with a molding material having a high permittivity and a low-loss characteristic. | 02-12-2009 |
20090128425 | ANTENNA AND MOBILE COMMUNICATION DEVICE USING THE SAME - There is provided a an antenna including: a first radiator having one end connected to a power feeding unit and receiving a signal within a first frequency band; a second radiator having one end connected to a ground surface and receiving a signal within a second frequency band; a first stub extending from the other end of the first radiator and finely adjusting the signal received by the first radiator; a second stub extending from the other end of the second radiator and finely adjusting the signal received by the second radiator; and a short-circuit unit electrically connecting the first radiator to the ground surface. | 05-21-2009 |
20090284419 | ANTENNA - An antenna includes a dielectric substrate, a radiator disposed on one surface of the dielectric substrate, a feeding conductive pattern having one end connected with the radiator and the other end connected with an external feed line, a first slot disposed in the feeding conductive pattern, a ground plane disposed on the other surface of the dielectric substrate, and a second slot disposed on the ground plane. | 11-19-2009 |
20100031548 | ELECTRONIC SHELF LABEL - An electronic shelf label has a simple structure to be easily installed or removed and is attached and detached only through a predetermined-shaped key so as to prevent unauthorized personnel from removing the electronic shelf label, thereby protecting the electronic shelf label from theft. | 02-11-2010 |
20100108764 | Bar code made of electronic paper - There is provided a bar code made of electronic paper. A bar code made of electronic paper according to an aspect of the invention may include: one or more e-paper stacks having a plurality of pieces of e-paper each having an entire surface displaying black, white or being transparent, wherein an upper level of e-paper of the e-paper stack is narrower than a lower level of e-paper thereof, the outermost layer of e-paper of the e-paper stack has the same width as the narrowest constituting a bar code, and part of the lower level of e-paper exposed by the upper level of e-paper adjacent to the lower level of e-paper has the same width as the narrowest constituent bar of the bar code. | 05-06-2010 |
Patent application number | Description | Published |
20130100460 | APPARATUS FOR MEASURING WARPAGE CHARACTERISTIC OF SPECIMEN - There is provided an apparatus for measuring a warpage characteristic of a specimen, the apparatus including: a light irradiating unit irradiating light toward the specimen; alight transmitting member transmitting the light irradiated by the light irradiating unit therethrough and including a reference lattice pattern to allow a shadow to be formed on the specimen; a sensing unit sensing the shadow formed on the specimen by the reference lattice pattern; and a heating plate disposed under the light transmitting member and heating the specimen mounted thereon, wherein the reference lattice pattern formed on the light transmitting member is formed of a conductive material and is connected to a power supplying unit to thereby generate heat when power is supplied. | 04-25-2013 |
20140061891 | SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - Disclosed herein are a semiconductor chip package and a manufacturing method thereof. The manufacturing method of the semiconductor chip package includes: a) mounting a semiconductor chip on a printed circuit board (PCB); b) inserting a warpage suppressing reinforcement member into an inner ceiling of a mold manufactured in order to package the PCB having the semiconductor chip mounted thereon; c) combining the mold having the warpage suppressing reinforcement member inserted into the ceiling thereof with the upper surface of the PCB so as to surround the PCB having the semiconductor chip mounted thereon; d) injection-molding and filling a molding material in the mold, and hardening the molding material by applying heat, and e) hardening the molding material and then removing the mold to complete the semiconductor chip package. | 03-06-2014 |
20140145322 | ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an electronic component package and a method of manufacturing the same. The electronic component package includes: a substrate; a connection member provided on at least one surface of the substrate; an active element coupled to the substrate by the connection member; and a molding part covering an exposed surface of the active element, wherein the molding part is formed of a first material having a coefficient of thermal expansion of 8 to 15 ppm/° C. and thermal conductivity of 1 to 5 W/m° C. Therefore, warpage may be significantly decreased and heat radiation performance of the active element may be improved, as compared with the case of implementing the molding part using an EMC according to the related art. | 05-29-2014 |
20140146498 | ELECTRONIC COMPONENT PACKAGE - Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art. | 05-29-2014 |
20150014034 | PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity. | 01-15-2015 |