Patent application number | Description | Published |
20090032692 | Apparatus of generating an optical tweezers with momentum and method thereof and photo-image for guiding particles - An apparatus of generating an optical tweezers with momentum and method thereof and an optical tweezers photo-image for guiding particles are provided. The apparatus generates at least one optical tweezers on an examined object that carries at least one particle. The apparatus includes a laser source, a diffractive optical element and a convergent lens. The laser beam from the laser source passes through the diffractive optical element to produce a diffractive pattern. The laser beam is then received by the convergent lens and then to be focused on a plane of the examined object. The optic axis of the convergent lens is substantially not perpendicular to the plane of the examined object, so that the laser beam is projected onto the plane of the examined object in a skewed manner for providing a lateral momentum to move the particle. | 02-05-2009 |
20090052038 | Apparatus and method for changing optical tweezers - An apparatus and a method for changing optical tweezers are provided. The apparatus includes a diffractive optical element (DOE), a mask unit and an objective lens. The DOE includes a plurality of phase delay patterns. The mask unit includes a plurality of mask patterns that correspond to the phase delay patterns, respectively, wherein at least a portion of the mask patterns are complementary. A laser beam passing through each phase diffractive pattern correspondingly passes through each mask pattern to generate a compound diffractive pattern. The objective lens receives the compound diffractive pattern and focuses it on an examining object to form an optical tweezers. | 02-26-2009 |
20090097119 | DIFFRACTION MICRO FLOW STRUCTURE AND OPTICAL TWEEZERS USING THE SAME - A diffraction micro flow structure and optical tweezers using the same are provided. The diffraction micro flow structure comprises a substrate and a diffraction part. The substrate comprises at least a flow path. The diffraction part is disposed on the substrate. The diffraction part comprises a diffraction optical element. After light passes through the diffraction optical element, the light is focused in the flow path and forms an optical field. | 04-16-2009 |
20090272180 | CONTINUOUS TESTING DEVICE AND CONTINUOUS TESTING SYSTEM - A continuous testing device for testing the concentration of a target object in a fluid is provided. The continuous testing device includes a first chip, a signal source and a second chip. The first chip includes a separating unit and a reacting unit. The separating unit separates the target object from a non-target object in the fluid. The reacting unit enables the fluid having separated out the non-target object to react with a reagent. The signal source provides a signal passing through the fluid having reacted with the reagent. The second chip disposed at one side of the first chip includes a signal transducing element and a processing unit. The signal transducing element receives the signal passing through the fluid and outputs an electronic signal corresponding to the input signal. The processing unit acquires the concentration of the target object according to the electronic signal. | 11-05-2009 |
20090273831 | LIGHT MODULE, OPTICAL TWEEZERS GENERATOR AND DARK FIELD MICROSCOPE - A light module is provided. The light module applied to a dark field microscope is used for illuminating an object. The light module includes a light beam, a reflection component and a condensing component. The light beam has several lights. The reflection component is used for converting the lights radiating along a beginning direction to a circular beam substantially radiating along the beginning direction. The circular beam passes through the condensing component and is focused on the object. A part of the circular beam passing through the condensing component is scattered by the object. | 11-05-2009 |
20100129963 | INTEGRATED CIRCUIT PACKAGE AND FABRICATING METHOD THEREOF - The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided. | 05-27-2010 |