Patent application number | Description | Published |
20080258165 | Light emitting diode chip - A substrate-free LED chip has a multilayer semiconductor structure at least 10 microns thick provided on a growth substrate. One or more arrays of parallel streets are etched into the multilayer semiconductor structure using a first pulsed laser beam. By scanning a second pulsed laser beam through the growth substrate to the multilayer semiconductor structure, the LED chips are detached from the growth substrate while simultaneously forming surface features on the chips. | 10-23-2008 |
20080261341 | Method for fabricating a light emitting diode chip - A method for fabricating substrate-free LED chips has a multilayer semiconductor structure at least 10 microns thick provided on a growth substrate. One or more arrays of parallel streets are etched into the multilayer semiconductor structure using a first pulsed laser beam. By scanning a second pulsed laser beam through the growth substrate to the multilayer semiconductor structure, the LED chips are detached from the growth substrate while simultaneously forming surface features on the chips. | 10-23-2008 |
20090059586 | LED light recycling cavity with integrated optics - A light emitting diode light source with mirrored surfaces is formed on a planar substrate which, when folded, forms both a light recycling cavity and an optical taper at the end of the light recycling cavity. | 03-05-2009 |
20090085047 | Integrated multi-colored LED light source with heatsink and collimator - A LED light source is integrated with a heatsink and a collimator. Four isolated heatsinks form an optical taper in which a single color LED is mounted. The LEDs are arranged to form a reflective light recycling cavity. Up to four different colors can be combined inside the light recycling cavity to form a uniform and homogenous mixing of the colors at the exit aperture of the light recycling cavity and/or the exit aperture of the collimator/heatsink. | 04-02-2009 |
20090140272 | Solid-state light source - A solid-state light source includes at least one stack of light emitting elements. The elements are an inorganic light emitting diode chip and at least one wavelength conversion chip or the elements are a plurality of light emitting diode chips and one or more optional wavelength conversion chips. The wavelength conversion chip may include an electrical interconnection means. The light emitting diode chip may include at least one GaN-based semiconductor layer that is at least ten microns thick and that is fabricated by hydride vapor phase epitaxy. A method is described for fabricating the solid-state light source. | 06-04-2009 |
20090140279 | Substrate-free light emitting diode chip - A light emitting diode (LED) chip has a multilayer semiconductor structure that is at least 10 microns thick and does not require an attached growth substrate or transfer substrate for structural rigidity or support. The multilayer semiconductor structure includes a first doped layer, a second doped layer and an active region interposed between the first doped layer and the second doped layer. Optionally, the multilayer semiconductor structure includes an undoped layer. At least one of the layers of the multilayer semiconductor structure is at least 5 microns thick and is preferably deposited by hydride vapor phase epitaxy. | 06-04-2009 |
20090173954 | Semiconducting sheet - A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements. | 07-09-2009 |
20090217970 | Fixtures for large area directional and isotropic solid state lighting panels - Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source. | 09-03-2009 |
20090218589 | Semiconductor die with reduced thermal boundary resistance - Thermal boundary resistances within nitride semiconductor LEDs are reduced or eliminated by forming a thick nitride epitaxial layer, which can be separated from a growth substrate, and by reducing the number of thermal boundary layers during laser lift-off. The thermal boundary resistances within nitride semiconductor LEDs can also be reduced or eliminated by forming a plurality of thin nitride epitaxial layers. | 09-03-2009 |
20090221106 | Article and method for color and intensity balanced solid state light sources - Subtractive and/or additive techniques can adjust both color and/or intensity in solid wavelength conversion materials. | 09-03-2009 |
20090316406 | Foldable LED light recycling cavity - LEDs are mounted onto a flat, thermally conductive, substrate, which is folded to form a light recycling cavity. A planar substrate is first coated with a metal layer, which is patterned to electrically connect the LEDs and to form bonding pads for wirebonds to connect the LEDs to external circuitry. The LEDs are mounted on the substrate. The substrate is then scribed on the backside to form the folds. The LED dies are then attached onto the metal islands (pads) defined on the substrate and wirebonds are used to connect the top side of the LED to adjacent patterned metal islands (pads) on the substrate. The substrate is then folded into a light recycling cavity where the LEDs are facing the inside of the cavity. | 12-24-2009 |
20100032682 | Large area thin freestanding nitride layers and their use as circuit layers - Thin flat crack-free freestanding nitride layers are fabricated by laser patterning of the interface and/or opposing surface of the nitride layer. The nitride layer is substantially flat once removed from the non-native substrate. The thin flat crack free nitride layers are between 3 and 250 microns thick and can have areas greater than 1 cm | 02-11-2010 |
20100060143 | Color stabilized light source having a thermally conductive luminescent element and a light emitting diode - A color stabilized light source has a thermally conductive luminescent element in conjunction with a light emitting diode. A thermal pathway through the LED allows the thermally conductive luminescent element to maintain its output level even at high flux levels. | 03-11-2010 |
20100060553 | LED display utilizing freestanding epitaxial LEDs - High resolution light emitting diode (LED) displays can be formed from freestanding small epitaxial LED chips or small LED arrays. The addressing elements for the LED display can be active matrix backplane. The LED display may use isotropic and directional luminescent elements. The LED displays can be flat screen, fixed image, projection or low resolution or high resolution direct view. A macro freestanding epitaxial LED chip with multiple addressable pixels is described which forms a complete microdisplay. | 03-11-2010 |
20100200837 | Dual sided processing and devices based on freestanding nitride and zinc oxide films - Thin freestanding nitride films are used as a growth substrate to enhance the optical, electrical, mechanical and mobility of nitride based devices and to enable the use of thick transparent conductive oxides. Optoelectronic devices such as LEDs, laser diodes, solar cells, biomedical devices, thermoelectrics, and other optoelectronic devices may be fabricated on the freestanding nitride films. The refractive index of the freestanding nitride films can be controlled via alloy composition. Light guiding or light extraction optical elements may be formed based on freestanding nitride films with or without layers. Dual sided processing is enabled by use of these freestanding nitride films. This enables more efficient output for light emitting devices and more efficient energy conversion for solar cells. | 08-12-2010 |
20100248499 | Enhanced efficiency growth processes based on rapid thermal processing of gallium nitride films - Rapid thermal processing of freestanding gallium nitride wafers is used to form semiconductor devices. This high speed process is enabled by the low thermal inertia of the growth substrate and the use of a low thermal inertia susceptor. The use of a low thermal inertia susceptor consisting of, but not limited to, silicon carbide, silicon carbide coated graphite, and/or other platen materials. Infrared (IR) heating is a preferred approach for increasing the temperature of the freestanding gallium nitride films via the susceptor but Radio Frequency (RF) and other methods are also approaches. | 09-30-2010 |
20100264452 | Methods for high temperature processing of epitaxial chips - High temperature semiconducting materials in a freestanding epitaxial chip enables the use of high temperature interconnect and bonding materials. Process materials can be used which cure, fire, braze, or melt at temperatures greater than 400 degrees C. These include, but are not limited to, brazing alloys, laser welding, high-temperature ceramics and glasses. High temperature interconnect and bonding materials can additionally exhibit an index of refraction intermediate to that of the freestanding epitaxial chip and its surrounding matrix. High index, low melting point glasses provide a hermetic seal of the semiconductor device and also index match the freestanding epitaxial chip thereby increasing extraction efficiency. In this manner, a variety of organic free semiconducting devices, such as solid-sate lighting sources, can be created which exhibit superior life, efficiency, and environmental stability. | 10-21-2010 |
20100308361 | Wavelength conversion chip for use with light emitting diodes and method for making same - A wavelength conversion chip is formed by depositing a wavelength conversion material on a substrate to form a layer, removing the resulting wavelength conversion layer from the substrate and then segmenting the wavelength conversion layer into a plurality of wavelength conversion chips. The wavelength conversion material can be annealed by thermal annealing or radiation annealing to increase the wavelength conversion efficiency of the chips or to sinter the wavelength conversion material to form a ceramic material. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips. | 12-09-2010 |
20110018011 | Solid-state light source - A solid-state light source includes at least one stack of light emitting elements. The elements are an inorganic light emitting diode chip and at least one wavelength conversion chip or the elements are a plurality of light emitting diode chips and one or more optional wavelength conversion chips. The wavelength conversion chip may include an electrical interconnection means. The light emitting diode chip may include at least one GaN-based semiconductor layer that is at least ten microns thick and that is fabricated by hydride vapor phase epitaxy. A method is described for fabricating the solid-state light source. | 01-27-2011 |
20110024775 | Methods for and devices made using multiple stage growths - Surface modification of individual nitride semiconductor layers occurs between growth stages to enhance the performance of the resulting multiple layer semiconductor structure device formed from multiple growth stages. Surface modifications may include, but are not limited, to laser patterning, lithographic patterning (with the scale ranging from 10 microns to a few angstroms), actinic radiation modifications, implantation, diffusional doping and combinations of these methods. The semiconductor structure device has enhanced crystal quality, reduced phonon reflections, improved light extraction, and an increased emission area. The ability to create these modifications is enabled by the thickness of the HVPE growth of the GaN semiconductor layer. | 02-03-2011 |
20110203767 | Recycling thermal sources - The invention is a thermal recycling system for converting lower quality thermal sources into higher quality thermal sources. In one embodiment, at least one photonic crystal radiator is combined with at least one substantially different radiator within a low loss thermal recycling cavity. Thermal recycling is based on the use of spectrum, polarization and temporal restrictions. These systems can be used in cooling, heating, and energy production. | 08-25-2011 |
20110284066 | Dual sided processing and devices based on freestanding nitride and zinc oxide films - Thin freestanding nitride films are used as a growth substrate to enhance the optical, electrical, mechanical and mobility of nitride based devices and to enable the use of thick transparent conductive oxides. Optoelectronic devices such as LEDs, laser diodes, solar cells, biomedical devices, thermoelectrics, and other optoelectronic devices may be fabricated on the freestanding nitride films. The refractive index of the freestanding nitride films can be controlled via alloy composition. Light guiding or light extraction optical elements may be formed based on freestanding nitride films with or without layers. Dual sided processing is enabled by use of these freestanding nitride films. This enables more efficient output for light emitting devices and more efficient energy conversion for solar cells. | 11-24-2011 |
20120063137 | Foldable LED light recycling cavity - LEDs are mounted onto a flat, thermally conductive, substrate, which is folded to form a light recycling cavity. A planar substrate is first coated with a metal layer, which is patterned to electrically connect the LEDs and to form bonding pads for wirebonds to connect the LEDs to external circuitry. The LEDs are mounted on the substrate. The substrate is then scribed on the backside to form the folds. The LED dies are then attached onto the metal islands (pads) defined on the substrate and wirebonds are used to connect the top side of the LED to adjacent patterned metal islands (pads) on the substrate. The substrate is then folded into a light recycling cavity where the LEDs are facing the inside of the cavity. | 03-15-2012 |
20120086028 | Wavelength conversion chip for use with light emitting diodes and method for making same - A wavelength conversion chip is formed by depositing a wavelength conversion material on a substrate to form a layer, removing the resulting wavelength conversion layer from the substrate and then segmenting the wavelength conversion layer into a plurality of wavelength conversion chips. The wavelength conversion material can be annealed by thermal annealing or radiation annealing to increase the wavelength conversion efficiency of the chips or to sinter the wavelength conversion material to form a ceramic material. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips. | 04-12-2012 |
20120205682 | Semiconducting sheet - A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements. | 08-16-2012 |
20120205683 | Semiconducting sheet - A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements. | 08-16-2012 |
20120261703 | Self-cooling solid-state emitters - A self-cooling emitter is a light emitting element embedded within a thermally conductive luminescent element which functions as a thermal cooling means and wavelength conversion of the light emitting element. The thermally conductive luminescent element exhibits a bulk thermal conductivity greater than | 10-18-2012 |
20120280264 | Wavelength conversion chip for use with light emitting diodes and method for making same - A solid-state light source has a wavelength conversion chip affixed to a light emitting diode. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips. | 11-08-2012 |
20130019927 | USE OF FREESTANDING NITRIDE VENEERS IN SEMICONDUCTOR DEVICES - Thin freestanding nitride veneers can be used for the fabrication of semiconductor devices. These veneers are typically less than 100 microns thick. The use of thin veneers also eliminates the need for subsequent wafer thinning for improved thermal performance and 3D packaging. | 01-24-2013 |
20130020582 | RAPID FABRICATION METHODS FOR FORMING NITRIDE BASED SEMICONDUCTORS BASED ON FREESTANDING NITRIDE GROWTH SUBSTRATES - High temperature bonding and interconnect methods can be used for LED and other optoelectronic devices based on freestanding nitride devices. Inorganic glasses, especially those which exhibit a CTE, which substantially matches the CTE of the freestanding nitride devices, can provide hermetic sealing of the freestanding nitride devices or the contact regions of the freestanding nitride devices. The freestanding nitride devices are typically freestanding nitride veneers. | 01-24-2013 |
20130021793 | RECYCLING LIGHT CAVITY WITH ENHANCED REFLECTIVITY - The reflectivity of mixed color LEDs, for example, red, green, and blue LEDs, and the resulting efficiency of a mixed color recycling light cavity can be increased by over-coating each LED with a multi-layer thin film coating comprising a dichroic filter. The thin film, dichroic filter coatings transmit the light emitted by the LED and reflect the light emanating from the other colors within the cavity. By utilizing high efficiency dichroic coatings, the reflectivity of the LEDs to the alternate wavelengths of the light emitted by other LEDs in the cavity can be raised to over 90%. By increasing the reflectivity of the LEDs for other colors, the optical radiation absorbed by the LEDs is decreased, thereby lowering the operation temperature and junction temperature of the LEDS. Lowering the operation temperature and junction temperature of the LEDS contributes to more efficient operation of the LEDs improving Lumen/Watt performance. | 01-24-2013 |
20130023307 | MICROPROJECTION ELEMENTS FOR PORTABLE DEVICES - Additional power and cooling can be provided for microprojectors by supplemental rechargeable power sources that can be integrated into memory sticks or by expansion cards that can plug into cellphones, PDAs and other portable devices. A docking station for portable devices using microprojectors contains supplemental power, cooling means, addition data/audio/video interfaces, touch screen/optical interface, projection optics, contrast enhancing screens and/or addition optics for video conferencing. Optics can be adapted to the microprojector for better imaging, secured communications, enhanced light sources, low versus high power operation ratios, and contrast enhancing screens. | 01-24-2013 |
20130099264 | SOLID STATE LIGHT SOURCES BASED ON THERMALLY CONDUCTIVE LUMINESCENT ELEMENTS CONTAINING INTERCONNECTS - Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device. | 04-25-2013 |
20140036493 | FIXTURES FOR LARGE AREA DIRECTIONAL AND ISOTROPIC SOLID STATE LIGHTING PANELS - Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source. | 02-06-2014 |
20140061707 | SOLID STATE LIGHT SOURCES BASED ON THERMALLY CONDUCTIVE LUMINESCENT ELEMENTS CONTAINING INTERCONNECTS - Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device. | 03-06-2014 |
20140146527 | FIXTURES FOR LARGE AREA DIRECTIONAL AND ISOTROPIC SOLID STATE LIGHTING PANELS - Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source. | 05-29-2014 |
20140147993 | LARGE AREA THIN FREESTANDING NITRIDE LAYERS AND THEIR USE AS CIRCUIT LAYERS - Thin flat crack-free freestanding nitride layers are fabricated by laser patterning of the interface and/or opposing surface of the nitride layer. The nitride layer is substantially flat once removed from the non-native substrate. The thin flat crack free nitride layers are between 3 and 250 microns thick and can have areas greater than 1 cm | 05-29-2014 |
20140153227 | FIXTURES FOR LARGE AREA DIRECTIONAL AND ISOTROPIC SOLID STATE LIGHTING PANELS - Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source. | 06-05-2014 |
20140264359 | Lightweight self-cooling light sources - A solid-state light source has light emitting diodes embedded in a thermally conductive translucent luminescent element. The thermally conductive translucent luminescent element has optically translucent thermal filler and at least one luminescent element in a matrix material. A leadframe is electrically connected to the light emitting diodes. The leadframe distributes heat from the light emitting diodes to the thermally conductive translucent luminescent element. The thermally conductive translucent luminescent element distributes heat from light emitting diodes and the thermally conductive translucent luminescent element. | 09-18-2014 |
20140265810 | Solid-state light source using passive phase change cooling - A solid-state light source with light emitting diodes embedded in thermally conductive luminescent elements is cooled by immersion cooling via a phase change material (liquid or pool boiling). The thermally conductive translucent luminescent elements are arranged to confine the boiling to an inner tube with the condensed liquid on the output faces so as to provide a flicker free 360 degree output light source. At least one face of each LED is exposed directly to the fluid and the LED is unconstrained so as to provide optical emission with little to no wavelength shift as a function of drive current. | 09-18-2014 |
20140268698 | Self cooling, magnetically connected fixtures for large area directional and isotropic solid state lighting panels - Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid-state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source. Magnetic elements make electrical connection between the fixture contacts and the light source contacts on the panel light source for a light fixture. | 09-18-2014 |
20140299902 | Articles and methods for rapid manufacturing of solid state light sources - Rapid manufacturing processes and designs based on solid luminescent elements form solid state light sources. Direct attach, as well as other LED types, are embedded or affixed to the solid luminescent elements to form low cost solid state light sources. | 10-09-2014 |
20140319533 | FLEXIBLE SEMICONDUCTOR DEVICES BASED ON FLEXIBLE FREESTANDING EPITAXIAL ELEMENTS - Flexible semiconductor devices based on flexible freestanding epitaxial elements are disclosed. The flexible freestanding epitaxial elements provide a virgin as grown epitaxy ready surface for additional growth layers. These flexible semiconductor devices have reduced stress due to the ability to flex with a radius of curvature less than 100 meters. Low radius of curvature flexing enables higher quality epitaxial growth and enables 3D device structures. Uniformity of layer formation is maintained by direct absorption of actinic radiation by the flexible freestanding epitaxial element within a reactor. In addition, standard post processing steps like lithography are enabled by the ability of the devices and elements to be flattened using a secondary support element or vacuum. Finished flexible semiconductor devices can be flexed to a radius of curvature of less than 100 meters. Nitrides, Zinc Oxides, and their alloys are preferred materials for the flexible freestanding epitaxial elements. | 10-30-2014 |
20140339573 | LED light source with thermally conductive luminescent matrix - A wavelength conversion chip is formed by depositing a wavelength conversion material on a substrate to form a layer, removing the resulting wavelength conversion layer from the substrate and then segmenting the wavelength conversion layer into a plurality of wavelength conversion chips. The wavelength conversion material can be annealed by thermal annealing or radiation annealing to increase the wavelength conversion efficiency of the chips or to sinter the wavelength conversion material to form a ceramic material. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips. | 11-20-2014 |
20140362563 | Fixtures for large area directional and isotropic solid state lighting panels - Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source. | 12-11-2014 |
20140367703 | SOLID STATE LIGHT SOURCES BASED ON THERMALLY CONDUCTIVE LUMINESCENT ELEMENTS CONTAINING INTERCONNECTS - Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device. | 12-18-2014 |
20140369030 | SOLID STATE LIGHT SOURCES WITH COMMON LUMINESCENT AND HEAT DISSIPATING SURFACES - A solid-state light source with LEDs contained in a light recycling cavity emits both light and heat from heat extracting light emitting elements which form the light recycling cavity. Eliminating appended heat sinks makes these light sources ultra lightweight. The light sources can be attached and supported by suspended ceilings without affecting the seismic properties of the ceiling. The heat extracting light emitting elements are combined with a reflector to make directional light sources, which can be attached to ceilings with small magnets. Because the heat extracting light emitting elements transfer the heat from the light source to the illuminated area there is no requirement for disturbing or penetrating the ceiling barrier to a heat sink on the plenum side of the ceiling. This enables a contiguous acoustic ceiling. Further, the light sources are made from non flammable materials and therefore do not affect the fire rating of the ceiling. | 12-18-2014 |
20140369031 | SOLID STATE LIGHT SOURCES WITH COMMON LUMINESCENT AND HEAT DISSIPATING SURFACES - A solid-state light source with LEDs contained in a light recycling cavity emits both light and heat from heat extracting light emitting elements which form the light recycling cavity. Eliminating appended heat sinks makes these light sources ultra lightweight. The light sources can be attached and supported by suspended ceilings without affecting the seismic properties of the ceiling. The heat extracting light emitting elements are combined with a reflector to make directional light sources, which can be attached to ceilings with small magnets. Because the heat extracting light emitting elements transfer the heat from the light source to the illuminated area there is no requirement for disturbing or penetrating the ceiling barrier to a heat sink on the plenum side of the ceiling. This enables a contiguous acoustic ceiling. Further, the light sources are made from non flammable materials and therefore do not affect the fire rating of the ceiling. | 12-18-2014 |
20150023023 | LIGHTING SYSTEMS WITH HEAT EXTRACTING LIGHT EMITTING ELEMENTS - Lighting systems with heat extracting light emitting elements are disclosed based on the light emitting surface also functioning as the heat cooling surface. Lighting systems which have only their light emitting surfaces exposed to ambient are disclosed. A thermally conductive mostly reflective light transmitting element provides light diffusion, interconnect, and forms a light recycling cavity providing very low profile and lightweight solid state light sources. These properties make these light sources very useful in applications such as aircraft, rescue, temporary illumination, and automotive where weight directly impacts cost and utility. The integration of drivers and other electrical functions onto the heat extracting light emitting elements is also disclosed. | 01-22-2015 |