Patent application number | Description | Published |
20100035373 | Method for manufacturing a sensor device with a stress relief layer - A method for packaging a sensor device having a sensitive structure integrated on a semiconductor chip is provided. When molding the device package, an inward extending section of the mold maintains an access opening to the sensor. A buffer layer is arranged on the chip between the inward extending section and the sensitive structure. The buffer layer protects the sensitive structure from damage by the inward extending section and acts as a seal while casting the housing. The buffer layer also covers at least part of the semiconductor electronic components of the circuitry integrated onto the chip. By covering these components, mechanical stress, as it is e.g. caused by different thermal expansion coefficients of the packaging and the chip, can be reduced. | 02-11-2010 |
20100117185 | Temperature sensor with buffer layer - A temperature sensor with a bandgap circuit is provided. The bandgap circuit is covered by a buffer layer of photoresist. The device is packaged in a housing. By providing the buffer layer, mechanical stress in the bandgap circuit, as it is e.g. caused by different thermal expansion coefficients of the packaging and the chip, can be reduced. This improves the accuracy of the device. | 05-13-2010 |
20100212433 | Sensor in a moulded package and a method for manufacturing the same - The flow sensor or other type of sensor comprises a package having a cylindrical section arranged between an anchor section and a head section. The diameter of the anchor section is typically larger than the diameter of the cylindrical section, which in turn is typically larger than the diameter of the head section. A sensor chip is embedded partially into the package, with a sensitive area being exposed to the surroundings. The sensor can e.g. be inserted into a bore having a diameter matching the one of the cylindrical section. | 08-26-2010 |
20120217593 | SENSOR MOUNTED IN FLIP-CHIP TECHNOLOGY AT A SUBSTRATE EDGE - The sensor assembly comprises a substrate ( | 08-30-2012 |
20120267731 | SENSOR MOUNTED IN FLIP-CHIP TECHNOLOGY ON A SUBSTRATE - The sensor assembly comprises a substrate ( | 10-25-2012 |
20140028340 | SENSOR DEVICE - In a method for manufacturing a sensor chip a spacer ( | 01-30-2014 |
20150143874 | SENSOR DEVICE - A sensor device comprises a sensitive element ( | 05-28-2015 |
20150325492 | SEMICONDUCTOR PACKAGE - A semiconductor package comprises an integrated device, a front side of a material A and a back side of a material B opposite to the front side. Side walls link the front side and the back side. Each side wall is coated with a coating material to at least 80% of its area, wherein the coating material is different from the material A and different from the material B. | 11-12-2015 |