Wen-Chung
Wen-Chung Chang, Taipei TW
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20130085387 | RADIOTHERAPY SYSTEM ADAPTED TO MONITOR A TARGET LOCATION IN REAL TIME - The present invention provides a radiotherapy system that can monitor a target location in real time. The radiotherapy system includes a remote control system operable to actuate a real-time image capturing device to acquire images in real time for monitoring the target location. The system also includes an image registration system that can register the acquired image with an image previously captured for the treatment plan, whereby it can be determined whether the patient's tumor is in the beam's eye view of the treatment plan. By confirming that the tumor is in the range of the beam's eye view, the accuracy of the treatment can be improved, and the irradiated area can be reduced, which makes the radiation treatment safer. | 04-04-2013 |
Wen-Chung Chang, Taipei City TW
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20090314318 | FLOOR WASHING ROBOT - A floor washing robot is disclosed. The robot includes: a control unit for controlling a power source to drive at least three omnidirectional wheels and at least one washing disc to rotate to wash a floor; a water spray device for spraying water; and a vacuum device for vacuuming waste water or dirt. The floor washing robot can be moved freely in any direction to improve the cleaning effect. | 12-24-2009 |
Wen-Chung Chang, Hsinchu City TW
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20090157947 | Memory Apparatus and Method of Evenly Using the Blocks of a Flash Memory - A memory apparatus and a method of evenly using the blocks of a flash memory are provided. The memory apparatus comprises a flash memory and a controller. The flash memory comprises a data region with a plurality of data blocks and a spare region with a plurality of spare blocks. The controller is configured to receive data corresponding to the first data block, select a spare block, program data into the spare block when the erase count corresponding to the spare block is less than the predetermined value or to select a second data block and program data stored in the second data block into the spare block when the erased count corresponding to the spare block reaches the predetermined value. As a result, the blocks of the flash memory are used evenly. | 06-18-2009 |
20140092689 | METHOD FOR PROGRAMMING NON-VOLATILE MEMORY CELL, NON-VOLATILE MEMORY ARRAY AND NON-VOLATILE MEMORY APPARATUS - A method for programming a non-volatile memory cell is described. The memory cell includes a substrate, a gate over the substrate, a charge-trapping structure at least between the substrate and the gate, and first and second S/D regions in the substrate beside the gate. The method includes performing a channel-initiated secondary electron (CHISEL) injection process to inject electrons to the charge-trapping structure. | 04-03-2014 |
20140175531 | NON-VOLATILE MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF - A method for manufacturing a non-volatile memory structure includes providing a substrate having a gate structure, performing a first oxidation process to form a first SiO layer at least covering a bottom corner of the conductive layer, performing a first etching process to remove the first SiO layer and a portion of the dielectric layer to form a cavity, performing a second oxidation process to form a second SiO layer covering sidewalls of the cavity and a third SiO layer covering a surface of the substrate, forming a first SiN layer filling in the cavity and covering the gate structure on the substrate, and removing a portion of the first SiN layer to form a SiN structure including a foot portion filling in the cavity and an erection portion upwardly extended from the foot portion, and the erection portion covering sidewalls of the gate structure. | 06-26-2014 |
20140197472 | NON-VOLATILE MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF - A method for manufacturing a non-volatile memory structure includes providing a substrate having a memory region and a logic region defined thereon, masking the logic region while forming at least a first gate in the memory region, forming an oxide-nitride-oxide (ONO) structure under the first gate, forming an oxide structure covering the ONO structure on the substrate, masking the memory region while forming a second gate in the logic region, and forming a first spacer on sidewalls of the first gate and a second spacer on sidewalls of the second gate simultaneously. | 07-17-2014 |
20140198574 | NONVOLATILE MEMORY AND MANIPULATING METHOD THEREOF - A manipulating method of a nonvolatile memory is provided and comprises following steps. The nonvolatile memory having a plurality of memory cell is provided. Two adjacent memory cells correspond to one bit and comprise a substrate, a first and another first doping regions, a second doping region, a charge trapping layer, a control gate, a first bit line, a source line and a second bit line different from the first bit line. A first and a second channel are formed. The charge trapping layer is disposed on the first and the second channels. The two adjacent memory cells are programmed by following steps. A first positive and negative voltages are applied to the control gate between the first and the second doping regions and the control gate between the second and the another first doping regions, respectively. A first voltage is applied to the source line. | 07-17-2014 |
20150056775 | NON-VOLATILE MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF - A method for manufacturing a non-volatile memory structure includes providing a substrate having a gate structure, performing a first oxidation process to form a first SiO layer at least covering a bottom corner of the conductive layer, performing a first etching process to remove the first SiO layer and a portion of the dielectric layer to form a cavity, performing a second oxidation process to form a second SiO layer covering sidewalls of the cavity and a third SiO layer covering a surface of the substrate, forming a first SiN layer filling in the cavity and covering the gate structure on the substrate, and removing a portion of the first SiN layer to form a SiN structure including a foot portion filling in the cavity and an erection portion upwardly extended from the foot portion, and the erection portion covering sidewalls of the gate structure. | 02-26-2015 |
Wen-Chung Chen, Taoyuan County TW
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20080285799 | APPARATUS AND METHOD FOR DETECTING OBSTACLE THROUGH STEREOVISION - According to an apparatus and method for detecting an obstacle through stereovision, an image capturing module comprises a plurality of cameras and is used for capturing a plurality of images; an image processing module edge-detecting the image to generate a plurality of edge objects and object information corresponding to each edge object; an object detection module matches a focus and a horizontal spacing interval of the camera according to the object information to generate a relative object distance corresponding to each edge object; a group module compares the relative object distance with a threshold distance and groups the edge objects with the relative object distance smaller than the threshold distance to be an obstacle and obtains a relative obstacle distance corresponding to the obstacle. | 11-20-2008 |
Wen-Chung Chen, Taipei County TW
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20110066417 | ELECTRONIC LOAD FOR SIMULATING CHARACTERISTICS OF AN LED AND METHOD FOR OPERATING THE SAME - An electronic load simulates an LED is to output a simulation signal after receiving an input signal. The simulation signal has a voltage value and a current value approximating to a characteristic curve of a real LED. The electronic load comprises a processor, an amplifier, and a control unit. The processor receives a control command to set up the LED. The control command includes a forward voltage parameter and an equivalent impedance parameter. The control unit generates an adjustment command according to the foregoing parameters and the voltage of the power source. The amplifier receives and further adjusts the adjustment command so as to output the simulation signal. | 03-17-2011 |
Wen-Chung Cheng, New Taipei City TW
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20150366506 | ELECTRODE PATCH AND PHYSIOLOGICAL SIGNAL DEVICE - An electrode patch and physiological signal device are disclosed. The physiological signal device includes an electrode patch and a physiological signal unit. The physiological signal unit has a conductive pad, and the electrode patch includes a flexible sheet having a first surface and a second surface opposite from each other, a conductive pad is disposed on the first surface, a conductive gel covers a portion of the conductive pad and a conductive area is exposed; the conductive gel penetrates through the flexible sheet and is exposed on the second surface; the second surface of the electrode patch contacts with the physiological signal unit, and the conductive gel is electrically connected to the conductive pad. The physiological signal unit is electrically connected to a charging device via the conductive area of the electrode patch. Thereby, the physiological signal unit can be placed on the charging device directly for charging. | 12-24-2015 |
Wen-Chung Chiang, Lujhu Township TW
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20100230156 | PACKAGING DEVICE FOR AN ELECTRONIC ELEMENT AND METHOD FOR MAKING THE SAME - A method for making a packaging device for an electronic element includes: preparing a ceramic frame body defined with a hollow space for receiving the electronic element therein; preparing a ceramic substrate having a copper layer formed thereon; etching the copper layer to form a predetermined copper pattern on an upper surface of the ceramic substrate; placing the ceramic frame body onto the upper surface of the ceramic substrate and in contact with the copper pattern ; and heating the ceramic frame body and the ceramic substrate such that the copper pattern bonds the ceramic frame body to the ceramic substrate. A packaging device for an electronic element is also disclosed. | 09-16-2010 |
20100236819 | PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME - A method for making a printed circuit board includes: (a) preparing a laminate having a ceramic substrate, first and second metal foils disposed on two opposite surfaces of the ceramic substrate, and a through hole extending through the ceramic substrate and the first and second metal foils; (b) filling the through hole with a metal paste such that the metal paste is in contact with the first and second metal foils; and (c) sintering the metal paste and the laminate such that the metal paste is connected electrically to the first and second metal foils. A printed circuit board made according to the method is also disclosed. | 09-23-2010 |
20100258838 | PACKAGING SUBSTRATE DEVICE, METHOD FOR MAKING THE PACKAGING SUBSTRATE DEVICE, AND PACKAGED LIGHT EMITTING DEVICE - A packaging substrate device includes: a first laminate including a first ceramic substrate and a first copper pattern disposed on an upper surface of the first ceramic substrate; and a second laminate disposed over the first copper pattern and including a second ceramic substrate, a second copper pattern that is disposed on an upper surface of the second ceramic substrate, and a through hole extending through the second ceramic substrate and the second copper pattern to expose a copper portion of the first copper pattern. A light emitting semiconductor die can be mounted on the copper portion within the through hole. Efficient heat dissipation can be achieved through the first laminate. | 10-14-2010 |
20100288536 | Ceramic circuit board and method of making the same - A ceramic circuit board for use in packaging an electronic element includes a ceramic-copper plate, and a heat-dissipating unit that is adapted for dissipating heat from the electronic element. The ceramic-copper plate includes a ceramic substrate that has opposite first and second surfaces, and a through-hole formed through the first and second surfaces, a top copper pattern that overlies the first surface of the ceramic substrate and that has at least two conducting portions spaced apart from each other, and a bottom copper layer that underlies the second surface of the ceramic substrate. The heat-dissipating unit includes a heat-dissipating layer that is disposed in the through-hole of the ceramic substrate above the bottom copper layer and that has a thermal conductivity larger than that of the ceramic substrate. A method of making the ceramic circuit board is also disclosed. | 11-18-2010 |
20100288537 | Circuit board module and method of making the same - A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed. | 11-18-2010 |
20100307730 | Liquid-cooled heat dissipating device and method of making the same - A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed. | 12-09-2010 |
20130228273 | CERAMIC CIRCUIT BOARD AND METHOD OF MAKING THE SAME - A ceramic circuit board for use in packaging an electronic element includes a ceramic-copper plate, and a heat-dissipating unit that is adapted for dissipating heat from the electronic element. The ceramic-copperplate includes a ceramic substrate that has opposite first and second surfaces, and a through-hole formed through the first and second surfaces, a top copper pattern that overlies the first surface of the ceramic substrate and that has at least two conducting portions spaced apart from each other, and a bottom copper layer that underlies the second surface of the ceramic substrate. The heat-dissipating unit includes a heat-dissipating layer that is disposed in the through-hole of the ceramic substrate above the bottom copper layer and that has a thermal conductivity larger than that of the ceramic substrate. A method of making the ceramic circuit board is also disclosed. | 09-05-2013 |
20140000106 | CIRCUIT BOARD MODULE AND METHOD OF MAKING THE SAME | 01-02-2014 |
20140090825 | LIQUID-COOLED HEAT DISSIPATING DEVICE AND METHOD OF MAKING THE SAME - A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed. | 04-03-2014 |
Wen-Chung Chiang, Tanzih Township TW
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20160005633 | HIGH EFFICIENCY BUFFER STOCKER - A high-efficiency buffer stocker is disclosed. The buffer stocker includes an overhead transport track for supporting overhead transport vehicles carrying wafer containers and at least one conveyor system or conveyor belt provided beneath the overhead transport track for receiving the wafer containers from the overhead transport vehicles on the overhead transport track. The buffer stocker is capable of absorbing the excessive flow of wafer containers between a processing tool and a stocker, for example, to facilitate the orderly and efficient flow of wafers between sequential process tools in a semiconductor fabrication facility, for example. | 01-07-2016 |
Wen-Chung Chiang, Banciao City TW
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20090152237 | Ceramic-Copper Foil Bonding Method - A ceramic-copper foil bonding method includes wet-oxidizing a copper foil such that a surface of the copper foil is oxidized to a copper oxide layer, contacting the copper oxide layer with a surface of a ceramic substrate, and bonding the copper oxide layer of the copper foil to the surface of the ceramic substrate by heat treatment. Preferably, a protective layer is provided on an opposite surface of the copper foil so that the opposite surface is not oxidized during wet-oxidizing the copper foil. | 06-18-2009 |
Wen-Chung Chiang, Tanzih Towship TW
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20130032450 | HIGH EFFICIENCY BUFFER STOCKER - A high-efficiency buffer stocker is disclosed. The buffer stocker includes an overhead transport track for supporting overhead transport vehicles carrying wafer containers and at least one conveyor system or conveyor belt provided beneath the overhead transport track for receiving the wafer containers from the overhead transport vehicles on the overhead transport track. The buffer stocker is capable of absorbing the excessive flow of wafer containers between a processing tool and a stocker, for example, to facilitate the orderly and efficient flow of wafers between sequential process tools in a semiconductor fabrication facility, for example. | 02-07-2013 |
Wen-Chung Ho, Taoyuan City TW
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20160070095 | PROJECTOR - A projector includes a color wheel module and an optical engine. The color wheel module includes a rotation device, a mount, a color wheel, and an optical sensor. The color wheel is fixed on a rotary part of the rotation device. The rotation device and the optical sensor are fixed on the mount. The mount has an anti-dust structure includes a curved surface that is opposite to a rotary surface of the rotary part and extends in a rotation direction of the rotary part. The curved surface and the optical sensor are arranged sequentially in the rotation direction. Either by shortening a distance between the curved surface and the rotary surface or by a guiding slot that is disposed beside or lower than the curved surface, dust deposited on the optical sensor can be reduced effectively. | 03-10-2016 |
Wen-Chung Kuo, Taipei TW
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20090001730 | VERTICAL AXIS WINDMILL WITH WINGLETTED AIR-TILTABLE BLADES - A vertical axis windmill includes a generator, a shaft mounted to the generator; and a plurality of blade sets. The blade set includes a blade rod rotatably connected to the shaft and carrying blades arranged on opposite sides of the shaft. Each blade is divided into first and second moment-inducing sections located on opposite sides of the blade rod. The first moment-inducing section is greater in area than the second moment-inducing section. Each blade is provided, at a predetermined location thereof, with a winglet. Stops for limiting swiveling of the blade are arranged on the blade set. When the blade set is moved so that the blades thereof are located in a windward position and a leeward position respectively, the blades are automatically and easily set at an optimum pressure-receiving condition and a least wind-resistance condition respectively, for receiving wind energy from variable directions. | 01-01-2009 |
20090035134 | VERTICAL AXIS WIND TURBINE WITH WINGLETTED CAM-TILTABLE BLADES - A vertical axis wind turbine with wingletted cam-tiltable blades is provided, including: a generator, a shaft interconnected with the generator, and a plurality of blade sets coupled to the shaft. Cam members are provided inside the shaft and have guide sections of predetermined shapes. The blade set includes blades that are coupled to crank arms in contact with the guide sections. Thus, when the blades are located in a windward position and a leeward position respectively, the blades are caused by the guide sections to automatically and easily set at an optimum pressure-receiving condition and a least wind-resistance condition respectively, for receiving wind energy from variable directions so that the shaft can be rotated in low wind speed conditions to drive the generator for power generation. | 02-05-2009 |
Wen-Chung Kuo, Yonghe TW
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20080292460 | Fluid Turbine With Fluid-Tiltable Blades - A fluid-driven turbine includes a main driving shaft defining a shaft axis and a plurality of blade sets symmetrically disposed about the main driving shaft. Each of the plurality of blade sets includes a rod extending radially from the main driving shaft in a direction transverse to the shaft axis. The rod defines a rod axis. Each blade set also includes a fluid-tiltable blade connected to the rod and extending along the direction of the rod axis. It has an airfoil shape in cross-section with a leading edge, a trailing edge, and a maximum thickness. The blade is divided into first and second moment-inducing sections located on opposite sides of the rod with the first moment-inducing section being greater in area than the second moment-inducing section. Also, it is rotatable about the rod axis between an optimum pressure-receiving position and a least fluid-resistance position for receiving fluid energy from variable directions. The blade sets also include a stopper system limiting rotation of the blade about the rod axis to a rotation range between the optimum pressure-receiving position and a least fluid-resistance position. | 11-27-2008 |
Wen-Chung Liu, Tao Yuan Xien TW
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20140187095 | Female Socket for Power Cord - A female socket for power cord, including a plug terminal and an integrally formed jack body, the jack body comprises of an interconnecting piece of terminal hole, the matrix extended from the interconnecting piece and a side cover connected to the lateral margin of the matrix and buckled with the matrix. There is a scab on the matrix, there is a trip on said scab, there is a blocking part matching the trip on the inner wall of the side cover, there is a tenon on the side cover, and there is a tenon hole matching the tenon on the lateral margin of the matrix. | 07-03-2014 |
Wen-Chung Shih, Taiping City TW
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20100025704 | HIGH EFFICIENCY LIGHTING DEVICE - A method for fabricating a high efficiency lighting device and the structure thereof are disclosed. The method includes the following steps: providing a light emitting diode structure; attaching a distributed-Bragg reflecting layer (DBR) to the light emitting diode structure by vapor deposition; and connecting the light emitting diode structure to a eutectic layer through the distributed-Bragg reflecting layer to form the high efficiency lighting device. | 02-04-2010 |
20100025705 | HIGH EFFICIENCY LIGHTING DEVICE AND MANUFACTURING METHOD THEREOF - A high efficiency luminous device and a manufacturing method thereof are disclosed. The high efficiency luminous device includes a LED structure, a first metal electrode, and a second metal electrode. The LED structure is for emitting light. The first metal electrode is formed on the LED structure, and the first metal electrode has a plurality of first openings therein. The second metal electrode is formed on the LED structure, and the second metal electrode has a plurality of second openings therein. The plurality of first openings and the plurality of second openings allow the light emitted from the LED structure to pass therethrough. | 02-04-2010 |
Wen-Chung Shih, Tai-Ping City TW
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20080258163 | Semiconductor light-emitting device with high light-extraction efficiency - The invention discloses a semiconductor light-emitting device and a fabricating method thereof. The semiconductor light-emitting device according to the invention includes a substrate, a multi-layer structure, a top-most layer, and at least one electrode. The multi-layer structure is formed on the substrate and includes a light-emitting region. The top-most layer is formed on the multi-layer structure, and the lower part of the sidewall of the top-most layer exhibits a first surface morphology relative to a first pattern. In addition, the upper part of the sidewall of the top-most layer exhibits a second surface morphology relative to a second pattern. The at least one electrode is formed on the top-most layer. Therefore, the sidewall of the semiconductor light-emitting device according to the invention exhibits a surface morphology, which increases the light-extraction area of the sidewall, and consequently enhances the light-extraction efficiency of the semiconductor light-emitting device. | 10-23-2008 |
Wen-Chung Wang, Taichung City TW
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20130222314 | TOUCH-SENSITIVE DEVICE AND TOUCH-SENSITIVE DISPLAY DEVICE - A touch-sensitive device includes a transparent substrate, a touch-sensing structure, a decorative layer, a metal trace layer, a first insulation layer and a second insulation layer. The touch-sensing structure is disposed on the transparent substrate and located in a touch-sensitive region of the touch-sensitive device. The decorative layer is disposed on a non-touch-sensitive region of the touch-sensitive device, and the metal trace layer is disposed on the non-touch-sensitive region. The first insulation layer is disposed on the transparent substrate and covers the touch-sensing structure and the metal trace layer. The second insulation layer is disposed on the transparent substrate and distributed only in the non-touch-sensitive region to provide a distribution area substantially overlapping the metal trace layer. | 08-29-2013 |
Wen-Chung Wu, Taipei TW
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20120101163 | COMPOSITION FOR INHIBITING CANCER METASTASIS - The invention provides a composition for inhibiting cancer metastasis, including: an effective amount of an amino acid hydroxamic acid derivative having a formula as shown as formula (I), formula (II) or formula (III): | 04-26-2012 |
Wen-Chung Yeh, Hsinchu TW
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20150214850 | Synchronous Rectification Controller and Relevant Control Method - A timing controller provides adaptive timings to control a synchronous rectifier with a body diode. The timing controller has a ramp generator providing a ramp signal at a first capacitor. The ramp signal corresponds to a discharge time when the body diode is forward biased. A second capacitor records an estimated duration signal. An update circuit is connected between the first and second capacitors, for shorting the first and second capacitor to update the estimated duration signal by charge sharing. A comparator with two inputs coupled to the ramp signal and the estimated duration signal respectively compares the ramp signal and the estimated duration signal to control the synchronous rectifier. | 07-30-2015 |
Wen-Chung Yeh, Taipei City TW
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20130033211 | SWITCHING-MODE POWER SUPPLIES AND CONTROL METHODS THEREOF - Disclosed include switching-mode power supplies and control methods thereof. A disclosed switching-mode power supply is coupled to an input power node and a ground node, comprising a controller, a first inductor, and a bootstrap circuit. The controller is for controlling a power switch coupled to the input power node and a connection node. The controller is powered by the connection node and an operation power node. The first inductor is coupled between the connection node and a discharge node. The bootstrap circuit is coupled between the discharge node, the operation power node and the connection node, to make an operation voltage at the operation power node substantially not less than a discharge voltage at the discharge node. The discharge node is coupled to power an output load. | 02-07-2013 |