Patent application number | Description | Published |
20120018830 | Packaging device of image sensor - A packaging device of an image sensor includes a supporting seat and the image sensor. The supporting seat is a hollow frame having a predetermined thickness, a first surface, a second surface, and an inner edge receding from the second surface toward the first surface to form a recessed step. Plural contacts in the recessed step and in the outer periphery of the supporting seat are electrically connected by plural electrical connection structures. The image sensor has an active surface set on the recessed step by a flip-chip packaging technique. The image sensor also has plural conductive ends electrically connected to the contacts in the recessed step. An insulating material covers an inactive surface of the image sensor and fills the gap between the recessed step of the supporting seat and the image sensor to provide dust-proofness, shock resistance, and prevention against static electricity and leakage of light. | 01-26-2012 |
20140092265 | Integrated Substrate for Anti-Shake Apparatus - An integrated substrate for an anti-shake apparatus defined with an optical axis includes: a substrate, a lens module, an anti-shake apparatus and an image-sensing module. The substrate includes a frame having a predetermined thickness. The frame includes a first surface, a second surface, a first circuit layout, and a second circuit layout. The lens module is located above the substrate on the optical axis. The anti-shake apparatus is furnished between the lens module and the substrate. The image-sensing module has an active side and an inactive side, and the inactive side is furnished onto the second surface. The active side is located on the optical axis in a manner of facing the lens module. The anti-shake apparatus is coupled to the first circuit layout, while the image-sensing module is coupled to the second circuit layout. The first and second circuit layouts comprise a plurality of first and second metal leads, respectively. | 04-03-2014 |
20140327965 | Tri-Axis Close Loop Feedback Controlling Module for Electromagnetic Lens Driving Device - The tri-axis close-loop feedback controlling module for electromagnetic lens driving device comprises a 6-pin Hall element. Two pins of the Hall element are coupled to an auto-focus module for providing a current to drive the auto-focus module to conduct auto-focusing operations along the Z-axis; while other four pins of the Hall element are coupled to a control unit. The control unit detects the X-Y axial positions of the auto-focus module relative to an OIS module and generates a control signal which is then sent to the Hall element. Therefore, the Hall element not only can provide its own feedback controlling function according to the Z-axial position of lens, but also can drive the auto-focus module based on the control signal corresponding to the X-Y axial positions of the auto-focus module, so as to achieve the goal of tri-axis close-loop feedback controlling for the electromagnetic lens driving device. | 11-06-2014 |
20150201115 | Integrated Substrate for Anti-Shake Apparatus - An integrated substrate for an anti-shake apparatus defined with an optical axis includes: a substrate, a lens module, an anti-shake apparatus and an image-sensing module. The substrate includes a frame having a predetermined thickness. The frame includes a first surface, a second surface, a first circuit layout, and a second circuit layout. The lens module is located above the substrate on the optical axis. The anti-shake apparatus is furnished between the lens module and the substrate. The image-sensing module has an active side and an inactive side, and the inactive side is furnished onto the second surface. The active side is located on the optical axis in a manner of facing the lens module. The anti-shake apparatus is coupled to the first circuit layout, while the image-sensing module is coupled to the second circuit layout. The first and second circuit layouts comprise a plurality of first and second metal leads, respectively. | 07-16-2015 |
Patent application number | Description | Published |
20140013542 | Shoulder Hanging Type And Backpack Type Grass Trimmer Folding Device - A shoulder hanging type and backpack type grass trimmer handle folding device includes a joint installed at the middle of a main body for positioning a handle, and the joint includes a lower casing; a fixed base having an upper casing at a lower end of the fixed base and corresponding to the lower casing for fixing the main body, and the upper end has a containing slot for axially connecting the handle; a positioning element for unfolding the handle to transversally position at the fixed base, folding the handle to longitudinally attach to and position at both sides of the main body, so as to achieve the effects of folding and unfolding the device easily, reducing the volume of the device, and facilitating the storage and transportation of the device. | 01-16-2014 |
20140263937 | Frame For Power Machinery - Disclosed is a frame for a power machinery such as a pump, a motor, a generator, etc, and the frame comprises a machine frame formed by connecting a plurality of tubes; two roofs installed at upper ends of the tubes and having a plurality of latch bases disposed on inner sides of the two roofs respectively; and a plurality of side plates installed on outer sides of the side plates and having a plurality of elastic latch rods installed on inner sides of the side plates, and a tube clamp. The elastic latch rod is latched to the latch base, and the tube clamp is latched to the tubes, so that the roofs and the side plates are fixed at a top end of the machine frame to form a rain shelter. | 09-18-2014 |
20150313079 | Grass Trimmer - A shoulder hanging type and backpack type grass trimmer handle includes a joint installed at the middle of a main body for positioning a handle. The joint includes a lower casing; a fixed base having an upper casing at a lower end of the fixed base and corresponding to the lower casing for fixing the main body, and the upper end has a containing slot for axially connecting the handle; and a positioning element for unfolding the handle to transversally position at the fixed base, folding the handle to longitudinally attach to and position at both sides of the main body, to achieve the effects of folding and unfolding the device easily, reducing the volume of the device, and facilitating the storage and transportation of the device. | 11-05-2015 |
Patent application number | Description | Published |
20110006505 | Roller Apparatus For Generator, Pump and The Like - A roller apparatus for generator, pump and the like is disclosed, where the generator, pump or the like is lodged in a frame, and the roller apparatus is set up at the bottom of the frame, comprising: a plurality of rollers, for rolling along the ground; and a plurality of link units, for linking each roller to the frame, where each link unit is provided with: a brace, obliquely set up at each bottom corner of the frame with a screw hole; a wheel carrier, having its bottom portion join fixedly to the roller and its top portion fixed by a fastener with a shaft portion, for oscillating up and down, and having a screw hole at its middle; and a fixing article, joining the wheel carrier. Through joining the wheel carrier with the frame together by the fixing article, the rollers is ready to unfold for rolling on the ground, or through joining the wheel carrier with the brace together by the fixing article, the rollers is ready to fold aside from the ground, to achieve simplicity in structure and handiness in manipulation. | 01-13-2011 |
Patent application number | Description | Published |
20150129940 | MECHANISM FOR FORMING GATE - Embodiments of mechanisms for forming a semiconductor device are provided. The semiconductor device includes a semiconductor substrate. The semiconductor device also includes an isolation structure in the semiconductor substrate and surrounding an active region of the semiconductor substrate. The semiconductor device includes a gate over the semiconductor substrate. The gate has an intermediate portion over the active region and two end portions connected to the intermediate portion. Each of the end portions has a first gate length longer than a second gate length of the intermediate portion and is located over the isolation structure. | 05-14-2015 |
20150129987 | MECHANISM FOR FORMING SEMICONDUCTOR DEVICE WITH GATE - Embodiments of mechanisms for forming a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and an isolation structure in the semiconductor substrate and surrounding an active region of the semiconductor substrate. The semiconductor device also includes a gate over the semiconductor substrate, and the gate has an intermediate portion over the active region and two end portions connected to the intermediate portion, and the end portions are over the isolation structure. The semiconductor device further includes a support film over the isolation structure and covering the isolation structure and at least one of the end portions of the gate. The support film exposes the active region and the intermediate portion of the gate. | 05-14-2015 |
20150137247 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a p-type metal oxide semiconductor device (PMOS) and an n-type metal oxide semiconductor device (NMOS) disposed over a substrate. The PMOS has a first gate structure located on the substrate, a carbon doped n-type well disposed under the first gate structure, a first channel region disposed in the carbon doped n-type well, and activated first source/drain regions disposed on opposite sides of the first channel region. The NMOS has a second gate structure located on the substrate, a carbon doped p-type well disposed under the second gate structure, a second channel region disposed in the carbon doped p-type well, and activated second source/drain regions disposed on opposite sides of the second channel region. | 05-21-2015 |
20150200299 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF - A semiconductor device and a method of fabricating the semiconductor device are provided. The semiconductor device includes a substrate; a source/drain region having a first dopant in the substrate; a barrier layer having a second dopant formed around the source/drain region in the substrate. When a semiconductor device is scaled down, the doped profile in source/drain regions might affect the threshold voltage uniformity, the provided semiconductor device may improve the threshold voltage uniformity by the barrier layer to control the doped profile. | 07-16-2015 |
20150206945 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a metal oxide semiconductor device disposed over a substrate and an interconnect plug. The metal oxide semiconductor device includes a gate structure located on the substrate and a raised source/drain region disposed adjacent to the gate structure. The raised source/drain region includes a top surface above a surface of the substrate by a distance. The interconnect plug connects to the raised source/drain region. The interconnect plug includes a doped region contacting the top surface of the raised source/drain region, a metal silicide region located on the doped region, and a metal region located on the metal silicide region. | 07-23-2015 |
Patent application number | Description | Published |
20110051311 | TUNABLE CAPACITIVE DEVICE WITH LINEARIZATION TECHNIQUE EMPLOYED THEREIN - One exemplary tunable capacitive device includes a first tunable capacitive element, a first coupling capacitive element, a first coupling resistive element, and a first specific capacitive element. The first tunable capacitive element has a first node coupled to a first input voltage, and a second node. The first coupling capacitive element has a first node coupled to the second node of the first tunable capacitive element, and a second node coupled to a first connection terminal of the tunable capacitive device. The first coupling resistive element has a first node coupled to the second node of the first tunable capacitive element, and a second node coupled to a second input voltage, where the first input voltage and the second input voltage include a control voltage and a reference voltage. The first specific capacitive element is coupled between the first node and the second node of the first tunable capacitive element. | 03-03-2011 |
20110133308 | SEMICONDUCTOR DEVICE WITH OXIDE DEFINE PATTERN - A semiconductor device includes a substrate; an inductor wiring pattern overlying the substrate, wherein the inductor wiring pattern is formed in an inductor-forming region; a plurality of shielding patterns between the inductor wiring pattern and the substrate within the inductor-forming region; and at least one first oxide define (OD) pattern disposed in the substrate or between the inductor wiring pattern and the substrate. | 06-09-2011 |
20120154073 | TUNABLE INDUCTOR - A tunable inductor includes a main wiring and at least one tuning module. The main wiring is arranged to encircle an inductor area of the tunable inductor. In addition, the tuning module is arranged to couple associated nodes of the main wiring. For example, each tuning module of the at least one tuning module includes a first switch positioned within the inductor area, and further includes at least one auxiliary wiring. When the first switch is turned on, the tuning module couples two nodes of the main wiring, where the at least one auxiliary wiring is arranged to couple the two nodes when the first switch is turned on. In particular, a patterned ground plane is arranged to decrease the energy loss of the tunable inductor, and more particularly, to prevent the tunable inductor from suffering energy loss. The patterned ground plane includes some conductive sections forming a W-like shape. | 06-21-2012 |
20120249195 | CLOCK GENERATING APPARATUS AND FREQUENCY CALIBRATING METHOD OF THE CLOCK GENERATING APPARATUS - A clock generating apparatus includes: a time-to-digital converter (TDC) arranged to convert a timing difference between a reference clock and a variable clock to generate a digital value; a calibrating device arranged to generate a control signal according to the digital value and the reference clock; a controllable oscillator arranged to generate an oscillating signal according to the control signal and the digital value; and a feedback device arranged to generate the variable clock to the TDC according to the oscillating signal, and the calibrating device calibrates the controllable oscillator to make the oscillating signal have a target oscillating frequency. | 10-04-2012 |
20130043958 | DIGITALLY CONTROLLED OSCILLATOR - A digitally controlled oscillator is provided. The digitally controlled oscillator includes a pair of transistors cross-coupled to each other, a switched capacitor array coupled to the pair of transistors and a plurality of frequency tracking units coupled to the pair of transistors. The pair of transistors provides an output signal. The switched capacitor array tunes a frequency of the output signal. The frequency tracking units tune the frequency of the output signal to a target frequency. At least one of the frequency tracking units is capable of selectively providing a first capacitance and a second capacitance. A tuning resolution of the frequency tracking unit is determined by a difference between the first and second capacitances. | 02-21-2013 |
20130234800 | CALIBRATION DEVICE FOR OSCILLATOR AND METHOD THEREOF - A calibration device arranged for calibrating an oscillating frequency of an oscillator includes: a phase locking device arranged to track a first reference clock generated by the oscillator until a feedback clock is phase-aligned with the first reference clock, and then arranged to track a second reference clock generated by the oscillator until a phase difference between the second reference clock and the feedback clock is a static phase difference, wherein the feedback clock is generated by dividing an output oscillating signal of the phase locking device by a divisor; an adjusting circuit arranged to adjust the divisor into an updated divisor to reduce the static phase difference between the second reference clock and the feedback clock; and a calibrating circuit arranged to calibrate the oscillating frequency of the oscillator according to the updated divisor, wherein the second reference clock is generated by varying a control signal of the oscillator. | 09-12-2013 |
20130265114 | METHOD AND APPARATUS FOR MEASURING/COMPENSATING MISMATCHES IN DIGITALLY-CONTROLLED OSCILLATOR - A method for measuring mismatches in a digitally-controlled oscillator (DCO) includes: in a first settling phase, controlling a first capacitor array of the DCO to have a first capacitive value consistently, and controlling a second capacitor array of the DCO in a closed loop to make a frequency of the DCO locked to a target value; in a second settling phase, controlling the first capacitor array to consistently have a second capacitive value different from the first capacitive value, and controlling the second capacitor array in the closed loop to make the frequency of the DCO locked to the target value; and deriving an estimation from a difference value between a first characteristic value and a second characteristic value, wherein the first and second characteristic values are derived from the digital control word; and estimating the mismatches according to at least the estimation value. | 10-10-2013 |
Patent application number | Description | Published |
20110291424 | SYSTEM FOR GENERATING ELECTRICITY - A system for generating electricity includes a housing body defining an accommodating space, an oxyhydrogen generating unit, a combustion unit, a turbine unit disposed above the combustion unit, and an electrical generator. The housing body is formed with a top exhaust vent and at least one air entrance both in flow communication with the accommodating space. The air entrance allows air to flow into the accommodating space. The oxyhydrogen generating unit is used for electrolytically converting an electrolyte into oxyhydrogen gas. The combustion unit is operable to burn the oxyhydrogen gas from the oxyhydrogen generating unit for heating air in the accommodating space so as to generate an upward airflow. The turbine unit is to be driven by the upward airflow to rotate. The electrical generator is driven by the turbine unit so as to generate electrical power. | 12-01-2011 |
20120247522 | DECARBONIZATION DEVICE - A decarbonization device for engine decarbonization includes an oxyhydrogen supplying unit, an oxyhydrogen conduit unit connected to the oxyhydrogen supplying unit, a sensor unit disposed at the oxyhydrogen conduit unit for detecting inner gas pressure within the oxyhydrogen conduit unit, and a control unit coupled to the sensor unit and the oxyhydrogen supplying unit. The oxyhydrogen conduit unit is configured to be connected to an engine to be supplied with oxyhydrogen gas from the oxyhydrogen supplying unit. The sensor unit generates a notifying signal upon detecting the inner gas pressure greater than a predetermined value, and the control unit controls supply of the oxyhydrogen gas upon receipt of the notifying signal from the sensor unit. | 10-04-2012 |
20130168234 | SYSTEM CAPABLE OF OXYHYDROGEN ION AIR CLEANING AND HUMIDIFYING - A system is capable of oxyhydrogen ion air cleaning and humidifying, and includes a water supplying device, a humidifying device and an oxyhydrogen ion generating device. The humidifying device is coupled to the water supplying device and includes a moist air output unit and a water passage unit permitting supply of water from the water supplying device to the moist air output unit, which can operate to form water into moist air. The oxyhydrogen ion generating device is coupled to the water supplying device and includes a container receiving water from the water supplying device, electrode plates disposed in the container, and an output conduit. The electrode plates are operable to electrolytically convert water to form oxyhydrogen-ion-containing gas that is released via the output conduit. | 07-04-2013 |
20130168235 | SYSTEM CAPABLE OF AIR CLEANING AND DEHUMIDIFYING - A system is capable of air cleaning and dehumidifying, and includes a condenser device, a water supplying device and an oxyhydrogen ion generating device. The condenser device is operable to form water vapor in ambient air into water droplets. The water supplying device collects the water droplets from the condenser device. The oxyhydrogen ion generating device is coupled to the water supplying device and includes a container receiving water from the water supplying device, electrode plates disposed in the container, and an output conduit. The electrode plates are operable to electrolytically convert water to form oxyhydrogen-ion-containing gas that is released via the output conduit. | 07-04-2013 |
20130206586 | APPARATUS FOR SUPPLYING OXYHYDROGEN GAS - An apparatus that can supply oxyhydrogen gas includes an electrolysis device, a filter device, and a control device. The electrolysis device includes a voltage controller that applies voltages to positive and negative electrode plates to convert water electrolytically in an electrolysis chamber to form oxyhydrogen gas, which is outputted via a first output conduit. An output end of the first output conduit is extended below water level in a container of the filter device. A second output conduit permits the oxyhydrogen gas that flows through the first output conduit and through the water in the container to flow therethrough. The control device includes a ratio adjusting interface for controlling a difference in the voltages provided by the voltage controller so as to adjust a ratio of hydrogen to oxygen in the oxyhydrogen gas formed in the electrolysis chamber. | 08-15-2013 |
20140250868 | CARBON BUILDUP REMOVAL DEVICE WITH PROTECTION FUNCTION OF VIBRATION DETECTION - A carbon buildup removal device with protection function of vibration detection is provided for electrically connecting to an engine from which carbon buildup is to be removed. The carbon buildup removal device includes a gas output unit and a vibration detection unit. The gas output unit outputs a gas that is supplied to the engine. The vibration detection unit includes a vibration detector that detects vibration of the automobile and a controller that is electrically connected to the vibration detector and the gas output unit. By using the vibration detector in combination with the controller, when the engine stops operating or is operating abnormally, power supplied to the gas output unit is cut off so as to prevent excessive accumulation of gas and thus back fire or excessive pressure to thereby improve stability and safety of carbon buildup removal operation of the engine. | 09-11-2014 |
Patent application number | Description | Published |
20140141541 | LOADING PORT, SYSTEM FOR ETCHING AND CLEANING WAFERS AND METHOD OF USE - A loading port includes a housing and a plurality of stations defined in the housing configured to receive a front opening universal pod (FOUP). The loading port further includes a connector configured to receive an inert gas. At least one of the plurality of stations is configured to deliver the inert gas to the FOUP to purge an interior of the FOUP of moisture. A system including the loading port and a method of using the system are also described. | 05-22-2014 |
20140242804 | Integrated Platform for Improved Wafer Manufacturing Quality - The present disclosure relates to a method and apparatus for performing a dry plasma procedure, while mitigating internal contamination of a semiconductor substrate. In some embodiments, the apparatus includes a semiconductor processing tool having a dry process stage with one or more dry process elements that perform a dry plasma procedure on a semiconductor substrate received from an input port. A wafer transport system transports the semiconductor substrates from the dry process stage to a wet cleaning stage located downstream of the dry process stage. The wet cleaning stage has one or more wet cleaning elements that perform a wet cleaning procedure to remove contaminants from a surface of the semiconductor substrates before the semiconductor substrate is provided to an output port. The wet cleaning procedure prior removes internal contaminants of the dry process procedure from the semiconductor substrate and thereby improves wafer manufacturing quality. | 08-28-2014 |
20150064928 | PHOTORESIST REMOVAL - Among other things, one or more systems and techniques for removing a photoresist from a semiconductor wafer are provided. The photoresist is formed over the semiconductor wafer for patterning or material deposition. Once completed, the photoresist is removed in a manner that mitigates damage to the semiconductor wafer or structures formed thereon. In an embodiment, trioxygen liquid is supplied to the photoresist. The trioxygen liquid is activated using an activator, such as an ultraviolet activator or a hydrogen peroxide activator, to create activated trioxygen liquid used to remove the photoresist. In an embodiment, the activation of the trioxygen liquid results in free radicals that aid in removing the photoresist. In an embodiment, an initial photoresist strip, such as using a sulfuric acid hydrogen peroxide mixture, is performed to remove a first portion of the photoresist, and the activated trioxygen liquid is used to remove a second portion of the photoresist. | 03-05-2015 |
20150144159 | MECHANISMS FOR WAFER CLEANING - Embodiments that relate to mechanisms for cleaning wafers is provided. A method for wafer cleaning includes cleaning wafers by a wet-bench cleaning operation. The method also includes thereafter cleaning each of the wafers by a single-wafer cleaning operation. In addition, a cleaning apparatus for enhancing the performance of the above method is also provided. | 05-28-2015 |
20150255270 | INTEGRATED PLATFORM FOR IMPROVED WAFER MANUFACTURING QUALITY - The present disclosure relates to a method and apparatus for performing a dry plasma procedure, while mitigating internal contamination of a semiconductor substrate. In some embodiments, the apparatus includes a semiconductor processing tool having a dry process stage with one or more dry process elements that perform a dry plasma procedure on a semiconductor substrate received from an input port. A wafer transport system transports the semiconductor substrates from the dry process stage to a wet cleaning stage located downstream of the dry process stage. The wet cleaning stage has one or more wet cleaning elements that perform a wet cleaning procedure to remove contaminants from a surface of the semiconductor substrates before the semiconductor substrate is provided to an output port, thereby improving wafer manufacturing quality. | 09-10-2015 |
20150357198 | METHOD OF ETCHING AND CLEANING WAFERS - A method of operating a wafer processing system includes etching a batch of wafers. The method also includes transferring at least a portion of the batch of wafers to a first front opening universal pod (FOUP). The method further includes purging an interior of the first FOUP with an inert gas. The method additionally includes transporting the first FOUP from a first loading port to a second loading port. The method also includes monitoring an elapsed time from the purging. The method further includes performing a second purging of the interior of the first FOUP if the elapsed time exceeds a threshold time. The method additionally includes cleaning the batch of wafers. | 12-10-2015 |