Wen-Bing
Wen-Bing Hsu, New Taipei City 24243 TW
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20150303595 | SHIFT WIRE-CONNECTION TERMINAL BLOCK STRUCTURE - A switch wire-connection terminal block structure includes a casing and at least one contact terminal. The contact terminal has a locking hole in direct communication with a receiving hole. The receiving hole communicates with a wire socket. A locking member is disposed in the receiving hole and lockable in the locking hole. A gasket member is fitted on the locking member. A guide channel is formed on inner wall of the receiving hole and extends in a locking direction of the locking member. The gasket member has a guide section extending in a direction reverse to the locking direction of the locking member. The guide section is slidably disposed in the guide channel. The receiving hole provides a larger locking travel for the locking member so that the terminal block is applicable to closed wire terminal. | 10-22-2015 |
Wen-Bing Hsu, Nwe Taipei City TW
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20150303658 | SHIFT ASSEMBLY STRUCTURE OF SWITCH DEVICE - A shift assembly structure of switch device includes a connection seat formed with an assembling hole for rotatably connecting with a main body. A latch section is disposed on the bottom of the connection seat for latching and assembling with a wire-connection module. The connection seat has an arm protruding from the connection seat and an (elastic) restriction section formed on the arm. A shift body is assembled in the connection seat. The shift body is formed with a ridge section and a push/press section. When the shift body is moved from a first position to a second position, the ridge section is permitted to directly pass through the restriction section into a locked state. After the push/press section pushes the restriction section, the main body is unlocked from the connection seat, whereby the assembly of the main body and the connection seat is controllable. | 10-22-2015 |
Wen-Bing Wang, Songjiang Epz Shanghai CN
Patent application number | Description | Published |
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20110024173 | Ball grid array printed circuit board, package structure, and fabricating method thereof - A BGA (ball grid array) printed circuit board is disclosed, which includes a substrate having a dielectric layer, a BGA pad and a solder mask formed on the dielectric layer, and an adhesive glue filled in a gap between the BGA pad and the solder mask. A BGA printed circuit board package structure and a method for fabricating the BGA printed circuit board are also disclosed. | 02-03-2011 |
20120316264 | METHOD OF MANUFACTURING ORGANIC MONTMORILLONITE - A method of manufacturing an organic montmorillonite is disclosed. The manufacturing method includes the steps hereinafter. A montmorillonite solution and an intercalation agent solution are prepared respectively. The montmorillonite solution and the intercalation agent solution are mixed at high temperature to form an organic montmorillonite solution. The organic montmorillonite is purified to obtain an organic montmorillonite solution. | 12-13-2012 |
Wen-Bing Wang, Shanghai CN
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20140200289 | ORGANIC MONTMORILLONITE ENHANCED EPOXY RESIN AND PREPARATION METHOD THEREOF - An organic montmorillonite enhanced epoxy resin and a preparation method thereof are provided. The preparation method of the organic montmorillonite enhanced epoxy resin includes adding an organic montmorillonite exfolicated by an organic solvent and a coupling agent to increase the thermal stability and reliability of the epoxy resin. | 07-17-2014 |