Patent application number | Description | Published |
20130059416 | FLIP-CHIP BGA ASSEMBLY PROCESS - A method for assembling a flip chip ball grid array package includes mounting solder spheres to a ball grid array substrate, applying flux to a plurality of flip chip solder bumps provided on a diced wafer, aligning the ball grid array substrate over a chip on the diced wafer, picking and separating the chip from the diced wafer by urging the chip upwards towards the ball grid array substrate until the flip chip solder bumps on the chip come in contact with the ball grid array substrate, whereby the chip attaches to the ball grid array substrate in an upside-down orientation, and subjecting the chip and the ball grid array substrate to a thermal process whereby the solder spheres reflow and form solder balls and the flip chip solder bumps reflow and form solder joints between the chip and the ball grid array. | 03-07-2013 |
20130062752 | RING STRUCTURE FOR CHIP PACKAGING - A ring structure for chip packaging comprises a frame portion adaptable to bond to a substrate and at least one corner portion. The frame portion surrounds a semiconductor chip and defines an inside opening, and the inside opening exposes a portion of a surface of the substrate. The at least one corner portion extends from a corner of the frame portion toward the chip, and the corner portion is free of a sharp corner. | 03-14-2013 |
20130093094 | Method and Apparatus for Die Assembly - Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having connector terminals extending from the active surface, the trench extending into, but not through, the semiconductor substrate; forming a protective layer overlying the active surface of the semiconductor substrate and the trench, and covering the lower portion of the connector terminals; opening a pre-dicing opening in the protective layer and within the trench; applying a tape over the active surface of the semiconductor wafer, the protective layer and the connector terminals; and performing an operation on a backside of the semiconductor substrate to remove material until the pre-dicing opening is exposed on the backside of the semiconductor wafer. An apparatus includes a semiconductor substrate with integrated circuits and a protective layer surrounding connector terminals of integrated circuits. | 04-18-2013 |
20130095607 | Methods and Apparatus For Alignment In Flip Chip Bonding - Methods and apparatus for alignment in a flip chip bonding. A method includes attaching an integrated circuit having connector terminals to a bonding arm, the bonding arm having a chuck for attaching the integrated circuit at the backside surface, the bonding arm having a plurality of CCD imagers mounted thereon; receiving a substrate having pads corresponding to the connector terminals; using the bonding arm, positioning the integrated circuit proximal to the substrate; aligning the integrated circuit connector terminals with the pads on the substrate using the CCD imagers on the bonding arm; positioning the connector terminals in contact with the pads on the substrate; and performing a solder reflow to attach the integrated circuit to the substrate. An apparatus includes a bonding arm with a chuck for carrying a component and CCD imagers mounted on the arm for alignment. | 04-18-2013 |
20130119565 | Rotating Curing - A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like. | 05-16-2013 |
20130189467 | ADHESIVE COMPOSITION AND ADHESIVE COMPRISING THE SAME - Adhesives with a specific viscose component to provide good thermal conductivity, insulation and flame retardant and high temperature resistant is provided. The adhesive composition form may be single-sided or double-sided with a substrate or not. The substrate may be metal foil, glass fiber, thermal pad or organic polymers. Adhesive composition includes polymerized siloxane, metal hydroxides, and metal oxides. Nitrides, aluminum powder or coupling agent may be added. The coupling agent is specially used in non-silica resin substrate, which enhances the adhesion to substrate surface. Optionally, the adhesive may include a release film. | 07-25-2013 |
20130260511 | LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR PACKAGES - A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies. | 10-03-2013 |
20140119039 | VEHICLE LIGHT DEVICE WITH LIGHT GUIDE COVER - A vehicle light device includes a light source board and a light guide cover. The light source board include a plurality of light emitting diodes (LEDs) mounted thereon to emit a light. The light guide cover is disposed on the light source board and covering the LEDs to make the emitted light uniformly illuminated. The vehicle light device has a simple structure, which the LED lamp holder and the reflecting element are eliminated. Therefore, the structure of the vehicle light device is thin and reduced-volume, that is easy to mass-produce with cost down. | 05-01-2014 |
20150059159 | APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - An apparatus for manufacturing a semiconductor device includes a holder for holding a carrier and a supporting base for receiving the holder comprising a recess for accommodating a plurality of balls mounted on a surface of the carrier. Furthermore, a method of manufacturing a semiconductor device includes providing a carrier, providing an apparatus comprising a supporting base including a recess, holding the carrier on the supporting base and accommodating a plurality of balls mounted on a surface of the carrier in the recess. | 03-05-2015 |
20150069089 | LID ATTACH PROCESS AND APPARATUS FOR FABRICATION OF SEMICONDUCTOR PACKAGES - An adhesive dispenser comprises a dispensing head. The dispensing head comprises an adhesive material applicator portion on a first level of the dispensing head. The adhesive material applicator portion corresponds to a periphery of a package. The dispensing head also comprises a thermal interface material (TIM) applicator portion on a second level of the dispensing head different from the first level. The TIM applicator portion corresponds to a die of the package. The dispensing head further comprises an adhesive material conduit configured to supply the adhesive material applicator portion with an adhesive material. The dispensing head additionally comprises a TIM conduit configured to supply the TIM applicator portion with a TIM. | 03-12-2015 |