Patent application number | Description | Published |
20090153210 | Maintaining output I/O signals within an integrated circuit with multiple power domains - An integrated circuit is provided with a power domain PD | 06-18-2009 |
20090288056 | Method, system and computer program product for determining routing of data paths in interconnect circuitry - A system, method and computer program product are provided for determining routing of data paths in interconnect circuitry for an integrated circuit. The interconnect circuitry on a first side provides a narrow interface for connection to a first device, and on a second side provides a wide interface for connection to a distributed plurality of further devices. Each data path is associated with one of the further devices and provides a connection through the interconnect circuitry between that associated further device and the first device. The method comprises the steps of defining a plurality of cells to be provided along the wide interface, each of the further devices being associated with at least one of the cells, and defining the interconnect circuitry as an array of blocks formed in rows and columns, with each cell abutting one of the columns. Further, the method includes the steps of providing a predetermined set of tiles, each tile providing a predetermined wiring layout, and for each block, applying predetermined rules to determine one of the tiles to be used to implement that block. The predetermined rules take into account the location of the block in the array and the association between the plurality of further devices and the plurality of cells, ensuring that each data path provided by the interconnect circuitry has the same propagation delay. By such an approach, a structured routing method is provided that uses predetermined tiles enabling a layout design for the interconnect circuitry to be readily produced whilst ensuring that the propagation delays are matched for each of the data paths within the interconnect circuitry. | 11-19-2009 |
20120179893 | Area efficient arrangement of interface devices within an integrated circuit - An integrated circuit is disclosed that comprises: a core comprising logic circuitry: a plurality of interface devices for transmitting signals to and from the processing core, the plurality of interface devices comprising two types of interface devices: one type being a power interface device for delivering power to the core; and a second type being a signal interface device for transmitting data signals between the core and devices external to the integrated circuit; wherein the plurality of interface devices are arranged in two rows, an outer row towards an outer edge of the core and an inner row within the outer row closer to a centre of the core the inner row comprising one of the two types of interface devices and the outer row comprising an other of the two types of interface devices. | 07-12-2012 |
20140043071 | SELF-INITIALIZING ON-CHIP DATA PROCESSING APPARATUS AND METHOD OF SELF-INITIALIZING AN ON-CHIP DATA PROCESSING APPARATUS - An on-chip data processing apparatus has an operating supply voltage selected from a range of supply voltages and has voltage level detection circuitry configured to determine the level of the operating supply voltage. The voltage level detection circuitry comprises adaptive circuitry responsive to a variation in the reference voltage. Phase lock loop circuitry is configured to generate a source clock signal from the operating supply voltage, to receive the voltage level selection signal, to select a target frequency for the source clock signal in dependence on the voltage level selection signal, and to phase lock the source clock signal on the target frequency. Initialization circuitry is configured to initialize the on-chip data processing apparatus for data processing in dependence on the level of said operating supply voltage after the phase lock loop circuitry has phase locked the source clock signal on the target frequency. | 02-13-2014 |
Patent application number | Description | Published |
20100131432 | Methods and compositions of molecular profiling for disease diagnostics - The present invention relates to compositions, kits, and methods for molecular profiling and cancer diagnostics, including but not limited to gene expression product markers, alternative exon usage markers, and DNA polymorphisms associated with cancer. In particular, the present invention provides molecular profiles associated with thyroid cancer, methods of determining molecular profiles, and methods of analyzing results to provide a diagnosis. | 05-27-2010 |
20120220474 | METHODS AND COMPOSITIONS FOR DIAGNOSIS OF THYROID CONDITIONS - The present invention relates to compositions, kits, and methods for molecular profiling and cancer diagnostics, including but not limited to genomic DNA markers associated with cancer. In particular, the present invention provides molecular profiles associated with thyroid cancer, methods of determining molecular profiles, and methods of analyzing results to provide a diagnosis. | 08-30-2012 |
20130225662 | METHODS AND COMPOSITIONS OF MOLECULAR PROFILING FOR DISEASE DIAGNOSTICS - The present invention relates to compositions, kits, and methods for molecular profiling and cancer diagnostics, including but not limited to gene expression product markers, alternative exon usage markers, and DNA polymorphisms associated with cancer. In particular, the present invention provides molecular profiles associated with thyroid cancer, methods of determining molecular profiles, and methods of analyzing results to provide a diagnosis. | 08-29-2013 |
20140349864 | METHODS AND COMPOSITIONS OF MOLECULAR PROFILING FOR DISEASE DIAGNOSTICS - The present invention relates to compositions, kits, and methods for molecular profiling and cancer diagnostics, including but not limited to gene expression product markers, alternative exon usage markers, and DNA polymorphisms associated with cancer. In particular, the present invention provides molecular profiles associated with thyroid cancer, methods of determining molecular profiles, and methods of analyzing results to provide a diagnosis. | 11-27-2014 |
Patent application number | Description | Published |
20150364431 | SILICON SHIELD FOR PACKAGE STRESS SENSITIVE DEVICES - A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly. | 12-17-2015 |
20150380627 | LID ASSEMBLY FOR THERMOPILE TEMPERATURE SENSING DEVICE IN THERMAL GRADIENT ENVIRONMENT - A temperature sensing device and method for fabrication of the temperature sensing device are described that include a second temperature sensor disposed on and/or in the lid assembly. In an implementation, the temperature sensing device includes a substrate, a ceramic structure disposed on the substrate, a thermopile disposed on the substrate, a first temperature sensor disposed on the substrate, and a lid assembly disposed on the ceramic structure, where the lid assembly includes a base layer, a first filter layer disposed on a first side of the base layer, a first metal layer disposed on a second side of the base layer, a passivation layer disposed on the first metal layer, where the passivation layer includes at least one of a second metal layer, a via, a metal plate, or an epoxy ring, and a second temperature sensor disposed on and/or in the passivation layer. | 12-31-2015 |
Patent application number | Description | Published |
20100208500 | Detecting Light Load Conditions and Improving Light Load Efficiency in a Switching Power Converter - A switching power converter detects low load conditions based on the ratio of a first peak current value for peak current switching in constant voltage regulation mode to a second peak current value for peak current switching in constant current regulation mode. The power supply load is considered to have a low load if the ratio is lower than a predetermined threshold. Once a low load condition is detected, the switching frequency of the switching power converter is reduced to a level that minimizes switching loss in the power converter. In addition, the switching power converter also adjusts the switching frequency according to the sensed input line voltage. An offset is added to the switching period to reduce the switching frequency of the switching power converter, as the input line voltage is increased. | 08-19-2010 |
20100225293 | ADAPTIVE CONTROL FOR TRANSITION BETWEEN MULTIPLE MODULATION MODES IN A SWITCHING POWER CONVERTER - In a switching power converter, PWM mode and PFM mode are separated into two independent control sections with the control voltage range in each control section determined independently. Each of the PWM and PFM modulation modes cannot operate continuously beyond its boundaries, thereby forming a control gap between the two control sections within which no continuous operation is allowed. In order to supply a load condition within the control gap, the power supply operates at the two boundaries of the control gap. Transition between PWM and PFM modes occurs fast, with low output voltage ripple. No limitation needs to be imposed on the control voltage range in each of the PWM and PFM control sections, because the control parameters in the PWM and PFM control sections need not be matched to one another, due to separation of the PWM and PFM modes by the control gap. | 09-09-2010 |
20110062872 | Adaptive Switch Mode LED Driver - An adaptive switch mode LED driver provides an intelligent approach to driving multiple strings of LEDs. The LED driver determines an optimal current level for each LED channel from a limited set of allowed currents. The LDO driver then determines a PWM duty cycle for driving the LEDs in each LED channel to provide precise brightness control over the LED channels. Beneficially, the LED driver minimizes the power dissipation in the LDO circuits driving each LED string, while also ensuring that the currents in each LED string are maintained within a limited range. A sample and hold LDO allows PWM control over extreme duty cycles with very fast dynamic response. Furthermore, fault protection circuitry ensures fault-free startup and operation of the LED driver. | 03-17-2011 |
20110286248 | Adaptive Control for Transition Between Multiple Modulation Modes in a Switching Power Converter - In a switching power converter, PWM mode and PFM mode are separated into two independent control sections with the control voltage range in each control section determined independently. Each of the PWM and PFM modulation modes cannot operate continuously beyond its boundaries, thereby forming a control gap between the two control sections within which no continuous operation is allowed. In order to supply a load condition within the control gap, the power supply operates at the two boundaries of the control gap. Transition between PWM and PFM modes occurs fast, with low output voltage ripple. No limitation needs to be imposed on the control voltage range in each of the PWM and PFM control sections, because the control parameters in the PWM and PFM control sections need not be matched to one another, due to separation of the PWM and PFM modes by the control gap. | 11-24-2011 |
20120223648 | Adaptive Switch Mode LED System - A system that provides an intelligent approach to driving multiple strings of LEDs. A processing device determines an optimal current level for each LED string from a limited set of allowed currents. The processing device also determines a PWM duty cycle for driving the LEDs in each LED string to provide precise brightness control over the LED string. The settings for the current level and duty cycle are transmitted to an LED driver for regulating the current and on-off times of the LED strings. Beneficially, the system reduces the size of the LED driver while leveraging existing resources available in the processing device to operate the LEDs in a power efficient manner. | 09-06-2012 |
20130127344 | Adaptive Switch Mode LED Driver - An adaptive switch mode LED driver provides an intelligent approach to driving multiple strings of LEDs. The LED driver determines an optimal current level for each LED channel from a limited set of allowed currents. The LDO driver then determines a PWM duty cycle for driving the LEDs in each LED channel to provide precise brightness control over the LED channels. Beneficially, the LED driver minimizes the power dissipation in the LDO circuits driving each LED string, while also ensuring that the currents in each LED string are maintained within a limited range. A sample and hold LDO allows PWM control over extreme duty cycles with very fast dynamic response. Furthermore, fault protection circuitry ensures fault-free startup and operation of the LED driver. | 05-23-2013 |
20130169172 | Predictive Control of Power Converter for LED Driver - A system controls a switching power converter to power LED strings using a predictive feedforward control mechanism. An LED controller determines programmed current levels and duty cycles for driving LED strings. The LED controller determines a predicted load for a subsequent cycle of a switching power converter driving the LED strings based on the programmed current levels and duty cycles. A power conversion controller uses the predicted load information to control switching of the switching power converter. This improves the dynamic response of the switching converter to changing load conditions, thereby improving overall power efficiency and performance of the system. | 07-04-2013 |
20130235621 | REGULATION FOR POWER SUPPLY MODE TRANSITION TO LOW-LOAD OPERATION - A switching power converter includes a controller configured to transition from a first operating mode to a second operating mode by determining the operating conditions at the transition point between the operation modes. The controller uses a point where a switch included in the power converter would have been turned on if operating under the first operating mode as a reference point to determine when to turn on the switch under the second operating mode. Using the reference point, the switching power converter determines a control period for regulating the switching period of the switch in a second operating mode. | 09-12-2013 |
20130249437 | ADAPTIVE FILTER FOR LED DIMMER - A dimming controller for an LED lamp controls dimming using an adaptive filter to reduce or eliminate perceivable flickering and to provide smooth transitions during active dimming. During stable conditions, the adaptive filter operates with a relatively narrow bandwidth to filter noise that may lead to perceivable flickering. During active or startup conditions, the adaptive mapping filter operates with a high bandwidth to provide a quick response to the dimmer switch. | 09-26-2013 |
20140153292 | PRIMARY SIDE SENSE OUTPUT CURRENT REGULATION - The embodiments disclosed herein describe a method of a controller to maintain a substantially constant average output current at the output of a switching power converter. In one embodiment, the controller uses a regulation voltage that corresponds to the primary peak current regulation level to regulate the average output current. | 06-05-2014 |
20140159616 | ADAPTIVE HOLDING CURRENT CONTROL FOR LED DIMMER - A TRIAC dimmer controller for an LED lamp dynamically adjusts the amount of additional current supplied to the TRIAC dimmer based on the TRIAC dimmer operating mode. A TRIAC dimmer current controller continually senses the TRIAC dimmer current loading and determines a TRIAC dimmer operating mode based on the detected current. The TRIAC dimmer controller compares the detected current with a threshold current value called a TRIAC holding current, and adjusts the amount of bleeder current based on the difference between the detected current and the threshold current value. By continually sensing the TRIAC dimmer current loading, the LED controller regulates the amount of bleeder current supplied to the TRIAC dimmer using a single sink current path to satisfy the TRIAC dimmer current demands of multiple TRIAC dimmer operating modes. | 06-12-2014 |
20140233269 | AVERAGE INPUT CURRENT ESTIMATION BASED ON PRIMARY SIDE CURRENT SENSE - The embodiments herein describe a power converter including a controller that estimates input current of the power converter. The controller estimates the input current without explicitly sensing the input current. The estimated input current can be used in various applications such as regulating power factor and total harmonic distortion as well as estimating current required to maintain proper operation of a dimmer switch in light emitting diode lamp systems. | 08-21-2014 |
20140239840 | OUTPUT CURRENT COMPENSATION FOR JITTER IN INPUT VOLTAGE FOR DIMMABLE LED LAMPS - An LED controller reduces jitter of an LED lamp. In one embodiment, the LED controller includes a jitter detection circuit adapted to determine an amount of jitter in an input voltage signal. The input voltage signal includes a plurality of cycles and indicates an amount of dimming for the LED lamp. The LED controller further includes a jitter compensation circuit, which generates a control signal to control regulated in the LED lamp such that an output light intensity of the LED lamp substantially corresponds to the amount of dimming for the LED lamp. The control signal controls current delivery to the LED lamp to compensate for the determined amount of jitter in the input voltage signal. | 08-28-2014 |
20150237693 | High Voltage Converter without Auxiliary Winding - The present document relates to driver circuits and/or power converters, e.g. for Solid State Lighting (SSL) devices, such as Light Emitting Diodes (LEDs). A controller for a driver circuit which is configured to provide a drive voltage to a load subject to an input voltage is described. The driver circuit comprises a power converter network and a power transistor. The controller comprises a control transistor which is configured to couple or to decouple a low voltage terminal of the power transistor to or from a low voltage potential, to put the power transistor to a conduction-state or an off-state, respectively. Furthermore, the controller comprises a charging transistor, arranged in parallel to the control transistor, and configured to couple or to decouple the low voltage terminal of the power transistor to a supply voltage capacitor, to put the power transistor to the conduction-state or off-state, respectively. | 08-20-2015 |
20160077165 | Time Based AC Line Detection - A power supply detection system and method for determining the AC mains voltage range when a device (e.g., LED based bulbs) is indirectly connected to the AC mains and the device does not receive the complete sinusoidal AC mains signal. | 03-17-2016 |
20160081149 | Solid State Lamp Control - Intelligent control of a solid state lamp when coupled to a trailing edge phase cut dimmer switch is provided. On and off cycles of the lamp's power stage switch are enabled during a period when the energy in the bulk capacitor is at its highest levels. During this period a bleeder circuit does not have to be enabled, which results in a greater operational efficiency as compared with normal switching schemes for trailing edge dimmers. | 03-17-2016 |
20160081151 | Dynamic Bleeder Current Control for LED Dimmers - LED lamp systems as described herein include a dimmer switch and a bleeder circuit. The bleeder circuit provides a bleeder current to management voltage and to prevent the dimmer switch from turning off prematurely. The bleeder circuit may monitor the AC input voltage outputted by the dimmer switch. When the AC input voltage is less than a first threshold, the bleeder circuit provides a bleeder current. When the AC input voltage is greater than a second threshold, the bleeder circuit adjusts the bleeder current to less than a predetermined level. | 03-17-2016 |
Patent application number | Description | Published |
20100084554 | METHOD OF CONTROLLING PARTICLE ABSORPTION ON A WAFER SAMPLE BEING INSPECTED BY A CHARGED PARTICLE BEAM IMAGING SYSTEM - A method of controlling particle absorption on a wafer sample being inspected by a charged particle beam imaging system prevents particle absorption by grounding the wafer sample and kept electrically neutral during the transfer-in and transfer-out process. | 04-08-2010 |
20100090107 | METHOD AND HANDLING APPARATUS FOR PLACING PATTERNING DEVICE ON SUPPORT MEMBER FOR CHARGED PARTICLE BEAM IMAGING - A patterning device handling apparatus for use in charged particle beam imaging is disclosed. The disclosed patterning device handling apparatus comprises a first gripping member and a second gripping member. The first gripping member is equipped with a plurality of first positioning projections, and the second gripping member is equipped with a plurality of second positioning projections. When the patterning device is held at one angle, the first positioning projections abut against one edge of the patterning device and the second positioning projections abut against the opposite edge of the patterning device. When the patterning device is held at another angle, the first positioning projections abut against two neighboring edges of the patterning device, and the second positioning projections abut against the other two neighboring edges of the patterning device. Therefore, the disclosed patterning device handling apparatus can hold the pattering device at different angles. | 04-15-2010 |
20100102226 | PATTERNING DEVICE HOLDING APPARATUS AND APPLICATION THEREOF - A patterning device holding apparatus includes a support platform unit with a plurality of first positioning projections and a gripper unit. The gripper unit includes a head portion and a plurality of second positioning projections disposed on the head portion, and a rolling member set at a base portion. The grapping and releasing of the patterning device is achieved by the rotation of the gripper unit about a pivot substantially parallel with the center axis of the rolling member. The first and second positioning projections corporately abut against the edges of a patterning device to fix the patterning device in place. | 04-29-2010 |
20100165346 | APPARATUS FOR DETECTING A SAMPLE - An apparatus for effectively detecting and calibrating a sample of examination system. The apparatus has an optics-electricity assembly for detecting the sample by a light and an elastically supporting assembly for providing motion freedoms to adjust the relative geometric conditions between the optics-electricity assembly and the sample. The elastically supporting assembly has a planer structure and a cubic structure, and provides both motion freedoms on a plane and motion freedoms vertical to the plane. The optics electricity assembly could analyze the received reflected light to get geometric information of the sample, and could adjust the light used to detect the sample. | 07-01-2010 |
20100270467 | METHOD FOR VENTING GAS INTO CLOSED SPACE AND GAS SUPPLY ASSEMBLY THEREOF - A method for venting a gas into a closed space is disclosed. At the beginning of the venting process the flow rate of the venting gas starts from zero and then increases at a substantially differential incremental rate for at least a certain period of time. When a predefined saturation pressure inside the closed space is reached, the flow rate of the venting gas is maintained or increased to speed up the venting process. | 10-28-2010 |
20100288923 | DISCHAGING METHOD FOR CHARGED PARTICLE BEAM IMAGING - A layer of conductive or semi-conductive material is formed on a surface of a sample and then the sample, when being charged particle beam imaged, is electrically coupled with an object having a large charge-receiving or charge-storage capacity (e.g., capacitance). Hence, the charging on the sample surface is removed and released quickly by the layer. The layer is then removed by reacting it with a predefined agent. The reaction forms a gaseous product which does not form a physical or chemical bond to the sample surface. | 11-18-2010 |
20110101222 | Z-STAGE CONFIGURATION AND APPLICATION THEREOF - A stage configuration is provided, wherein a ceramic plate is used as the z-stage body to decrease the use of the metal plates in the conventional configuration, so that the compact structure of the z-stage may decrease the vibrational movements of the z-stage. Further, two Laser interferometer are used to detect a movement of different points along a vertical line of the z-stage sidewall to calculate a movement of the specimen surface, so that a horizontal movement of the specimen surface can be detected more accurately | 05-05-2011 |
20120006984 | METHOD OF CONTROLLING PARTICLE ABSORPTION ON A WAFER SAMPLE BEING INSPECTED BY A CHARGED PARTICLE BEAM IMAGING SYSTEM - A method of controlling particle absorption on a wafer sample and charged particle beam imaging system thereof prevents particle absorption by grounding the wafer sample and kept electrically neutral during the transfer-in and transfer-out process. | 01-12-2012 |
20120032076 | METHOD FOR INSPECTING EUV RETICLE AND APPARATUS THEREOF - A method of inspecting an EUV reticle is proposed, which uses an electron beam (EB) with low density and high energy to scan the surface of an EUV reticle for inspecting the EUV reticle. A step of conditioning surface charge is followed by a step of inspecting surface of the EUV reticle. The step of conditioning surface can neutralize the surface charge and the step of inspecting can obtain an image of the EUV reticle. The present invention uses a scanning electron microscope (SEM) to provide a primary electron beam for conditioning the surface charge and a focused primary electron beam for scanning the surface. | 02-09-2012 |
20120228494 | METHOD FOR INSPECTING EUV RETICLE AND APPARATUS THEREOF - A method of inspecting an EUV reticle is proposed, which uses an original design layout information to align the plurality of patterns on an image, which is got by scanning the surface of an EUV reticle, such that the defect can be identified and classified according to the aligned patterns. In the scanning process, a step of conditioning surface charge is followed by a step of inspecting surface of the EUV reticle wherein the step of conditioning surface can neutralize the surface charge and the step of inspecting can obtain an image of the EUV reticle. The method of inspecting an EUV reticle also tuning a retarding electrode to attract more secondary electrons such that the greylevels of different patterns may be shown and the defect can be identified and classified. | 09-13-2012 |
20120292509 | STRUCTURE FOR DISCHARGING EXTREME ULTRAVIOLET MASK - A structure for discharging an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for discharging an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and bottom. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUU mask is grounded. | 11-22-2012 |
20140027634 | STRUCTURE FOR DISCHARGING EXTREME ULTRAVIOLET MASK - A structure for discharging an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for discharging an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and bottom. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUU mask is grounded. | 01-30-2014 |
20150305131 | STRUCTURE ELECTRON BEAM INSPECTION SYSTEM FOR INSPECTING EXTREME ULTRAVIOLET MASK AND STRUCTURE FOR DISCHARGING EXTREME ULTRAVIOLET MASK - A structure for discharging an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for discharging an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and bottom. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUU mask is grounded. | 10-22-2015 |
Patent application number | Description | Published |
20100243427 | FABRICATION OF LOW DEFECTIVITY ELECTROCHROMIC DEVICES - Prior electrochromic devices frequently suffer from high levels of defectivity. The defects may be manifest as pin holes or spots where the electrochromic transition is impaired. This is unacceptable for many applications such as electrochromic architectural glass. Improved electrochromic devices with low defectivity can be fabricated by depositing certain layered components of the electrochromic device in a single integrated deposition system. While these layers are being deposited and/or treated on a substrate, for example a glass window, the substrate never leaves a controlled ambient environment, for example a low pressure controlled atmosphere having very low levels of particles. These layers may be deposited using physical vapor deposition. | 09-30-2010 |
20100245973 | ELECTROCHROMIC DEVICES - Prior electrochromic devices frequently suffer from poor reliability and poor performance. Some of the difficulties result from inappropriate design and construction of the devices. In order to improve device reliability two layers of an electrochromic device, the counter electrode layer and the electrochromic layer, can each be fabricated to include defined amounts of lithium. Further, the electrochromic device may be subjected to a multistep thermochemical conditioning operation to improve performance. Additionally, careful choice of the materials and morphology of some components of the electrochromic device provides improvements in performance and reliability. In some devices, all layers of the device are entirely solid and inorganic. | 09-30-2010 |
20110211247 | FABRICATION OF LOW DEFECTIVITY ELECTROCHROMIC DEVICES - Prior electrochromic devices frequently suffer from high levels of defectivity. The defects may be manifest as pin holes or spots where the electrochromic transition is impaired. This is unacceptable for many applications such as electrochromic architectural glass. Improved electrochromic devices with low defectivity can be fabricated by depositing certain layered components of the electrochromic device in a single integrated deposition system. While these layers are being deposited and/or treated on a substrate, for example a glass window, the substrate never leaves a controlled ambient environment, for example a low pressure controlled atmosphere having very low levels of particles. These layers may be deposited using physical vapor deposition. | 09-01-2011 |
20110249314 | ELECTROCHROMIC DEVICES - Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. | 10-13-2011 |
20110266137 | ELECTROCHROMIC DEVICES - Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically-insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically-insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. | 11-03-2011 |
20110266138 | ELECTROCHROMIC DEVICES - Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically-insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically-insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. | 11-03-2011 |
20110267674 | ELECTROCHROMIC DEVICES - Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. | 11-03-2011 |
20110267675 | ELECTROCHROMIC DEVICES - Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. | 11-03-2011 |
20130003157 | ELECTROCHROMIC DEVICES - Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. | 01-03-2013 |
20130270105 | ELECTROCHROMIC DEVICES - Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. | 10-17-2013 |
20140177027 | ELECTROCHROMIC DEVICES - Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. | 06-26-2014 |
20140313561 | ELECTROCHROMIC DEVICES - Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer, which are in direct contact with one another. The interfacial region contains an ion conducting electronically insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. In addition to the improved electrochromic devices and methods for fabrication, integrated deposition systems for forming such improved devices are also disclosed. | 10-23-2014 |
20150060264 | FABRICATION OF LOW DEFECTIVITY ELECTROCHROMIC DEVICES - Prior electrochromic devices frequently suffer from high levels of defectivity. The defects may be manifest as pin holes or spots where the electrochromic transition is impaired. This is unacceptable for many applications such as electrochromic architectural glass. Improved electrochromic devices with low defectivity can be fabricated by depositing certain layered components of the electrochromic device in a single integrated deposition system. While these layers are being deposited and/or treated on a substrate, for example a glass window, the substrate never leaves a controlled ambient environment, for example a low pressure controlled atmosphere having very low levels of particles. These layers may be deposited using physical vapor deposition. | 03-05-2015 |
20150370139 | ELECTROCHROMIC DEVICES - Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer, which are in direct contact with one another. The interfacial region contains an ion conducting electronically insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. In addition to the improved electrochromic devices and methods for fabrication, integrated deposition systems for forming such improved devices are also disclosed. | 12-24-2015 |
20160103379 | FABRICATION OF LOW DEFECTIVITY ELECTROCHROMIC DEVICES - Prior electrochromic devices frequently suffer from high levels of defectivity. The defects may be manifest as pin holes or spots where the electrochromic transition is impaired. This is unacceptable for many applications such as electrochromic architectural glass. Improved electrochromic devices with low defectivity can be fabricated by depositing certain layered components of the electrochromic device in a single integrated deposition system. While these layers are being deposited and/or treated on a substrate, for example a glass window, the substrate never leaves a controlled ambient environment, for example a low pressure controlled atmosphere having very low levels of particles. These layers may be deposited using physical vapor deposition. | 04-14-2016 |