Patent application number | Description | Published |
20090214767 | DOPING WITH ALD TECHNOLOGY - Methods for doping a substrate surface or the interface between two thin films by atomic layer deposition process (ALD) are provided. By blocking some of the available binding sites for a dopant precursor with a blocking reactant, the concentration and uniformity of dopant deposited can be controlled. The blocking reactant may be introduced prior to introduction of the dopant precursor in the ALD process, or the blocking reactant and the dopant precursor can be introduced simultaneously. | 08-27-2009 |
20110070380 | SYSTEMS AND METHODS FOR THIN-FILM DEPOSITION OF METAL OXIDES USING EXCITED NITROGEN-OXYGEN SPECIES - Systems and methods are delineated which, among other things, are for depositing a film on a substrate that is within a reaction chamber. In an exemplary method, the method may comprise applying an atomic layer deposition cycle to the substrate, wherein the cycle may comprise exposing the substrate to a precursor gas for a precursor pulse interval and then removing the precursor gas thereafter, and exposing the substrate to an oxidizer comprising an oxidant gas and a nitrogen-containing species gas for an oxidation pulse interval and then removing the oxidizer thereafter. Aspects of the present invention utilize molecular and excited nitrogen-oxygen radical/ionic species in possible further combination with oxidizers such as ozone. Embodiments of the present invention also include electronic components and systems that include devices fabricated with methods consistent with the present invention. | 03-24-2011 |
20110256735 | ALD OF METAL SILICATE FILMS - Methods for forming metal silicate films are provided. The methods comprise contacting a substrate with alternating and sequential vapor phase pulses of a silicon source chemical, metal source chemical, and an oxidizing agent, wherein the metal source chemical is the next reactant provided after the silicon source chemical. Methods according to some embodiments can be used to form silicon-rich hafnium silicate and zirconium silicate films with substantially uniform film coverages on substrate surface. | 10-20-2011 |
20130203267 | MULTIPLE VAPOR SOURCES FOR VAPOR DEPOSITION - A vapor deposition method and apparatus including at least two vessels containing a same first source chemical. A controller is programmed to simultaneously pulse to the reaction space doses or pulses of a gas from the vessels, each of the doses having a substantially consistent concentration of the first source chemical. The apparatus may also include at least two vessels containing a same second source chemical. The controller can be programmed to simultaneously pulse to the reaction space doses or pulses of a gas from the vessels containing the second source chemical, each of the doses having a substantially consistent concentration of the second source chemical. The second source chemical can be pulsed to the reaction space after the reaction space is purged of an excess of the first source chemical. | 08-08-2013 |
Patent application number | Description | Published |
20080224912 | Median and mean coherent filter and method for eliminating noise in touch screen controller - A touch screen system includes a touch screen assembly ( | 09-18-2008 |
20080225009 | Touch-initiated power-saving clock system and method for touch screen controller - A touch screen controller circuit ( | 09-18-2008 |
20080225010 | Wait mode pen-touch detection and method for touch screen controller - A touch screen controller ( | 09-18-2008 |
20130241866 | RESISTIVE MULTI-TOUCH CONTROLLER - An apparatus is provided. The apparatus comprises a touch screen interface and a signal processing circuit. Within the touch screen interface, there are switching circuits, where each switching circuit is configured to be coupled to a column electrode, and there are touch detection circuits, where each touch detection circuit is configured to be coupled to a row electrode. The signal processing circuit is then coupled to each switching circuit and each touch detection circuit so as to be able to selectively activate the plurality of switching circuits and the plurality of touch detection circuits to identify a zone for a touch event. Also, the signal processing circuit is configured to determine first, second, third, and fourth resistances for the zone for the touch event and is configured to determine a set of coordinates and pressure for the touch event from its first, second, third, and fourth resistances. | 09-19-2013 |
20130285944 | PROGRAMMABLE RESISTIVE MULTI-TOUCH DETECTIONS AND REGIONALIZED RESISTIVE MULTI-TOUCH SENSING - An apparatus comprises touch screen interface and signal processing circuit. Within touch screen interface, there are switching circuits configured to be coupled to at least one of a plurality of column electrodes, and there are touch detection circuits configured to be coupled to at least one of a plurality of row electrodes. The signal processing circuit is coupled to each switching circuit and each touch detection circuit so as to be able to selectively activate the plurality of switching circuits and touch detection circuits to identify a zone for a touch event. The signal processing circuit determines first, second, third, and fourth resistances for the zone for the touch event and determines a set of coordinates and pressure for the touch event from its first, second, third, and fourth resistances. A zone controller, wherein the first and second rows are previously enabled, but a third row is not enabled. | 10-31-2013 |
Patent application number | Description | Published |
20090004775 | METHODS FOR FORMING QUAD FLAT NO-LEAD (QFN) PACKAGES - Methods are provided for forming Quad Flat No-Lead (QFN) packages. An embodiment includes disposing an active side of a semiconductor chip on a plurality of leads, coupling a plurality of wire bonds to the active side of the semiconductor chip, coupling the plurality of wire bonds to the plurality of leads in a space between the active side and the plurality of leads, and encasing the semiconductor chip, at least a portion of each of the plurality of leads, and the plurality of wire bonds in a mold material to define a mounting side of the QFN package. The mounting side has a perimeter, the plurality of leads are oriented on and exposed on the mounting side within the perimeter, and the plurality of wire bonds are oriented between the active side and the mounting side within the mold material. | 01-01-2009 |
20090152710 | QUAD FLAT NO-LEAD (QFN) PACKAGES - Quad Flat No-Lead (QFN) packages are provided. An embodiment of a QFN package includes a semiconductor chip including an active surface and an inactive surface, a plurality of leads, a plurality of wire bonds configured to couple the plurality of leads to the semiconductor chip, and a mold material including a mounting side and having a perimeter. The active surface is oriented toward the mounting side, the plurality of wire bonds are disposed between the active surface and the mounting side within the mold material, and the plurality of leads are exposed on the mounting side and are at least partially encapsulated within the perimeter of the mold material. | 06-18-2009 |
Patent application number | Description | Published |
20090065904 | SUBSTRATE HAVING THROUGH-WAFER VIAS AND METHOD OF FORMING - An annular trench region is formed at a semiconductor substrate of an electronic device that defines a conductive plug of the through-wafer via, wherein the conductive plug includes an undisturbed portion of the semiconductor substrate. | 03-12-2009 |
20090152676 | ELECTRONIC DEVICE INCLUDING AN INDUCTOR - An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the shock-absorbing layer overlying the interconnect level. The inductor can include conductive traces and looped wires. The conductive traces can be attached to the conductive traces over the shock-absorbing layer. In another aspect, a process can be used to form the electronic device including the inductor. In still another aspect, an electronic device can a toroidal-shaped inductor that includes linear inductor segments that are connected in series. | 06-18-2009 |
20100015793 | CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR - A semiconductor device has contact between the last interconnect layer and the bond pad that includes a barrier metal between the bond pad and the last interconnect layer. Both a passivation layer and a polyimide layer separate the last interconnect layer and the bond pad. The passivation layer is patterned to form a first opening to contact the last interconnect layer. The polyimide layer is also patterned to leave a second opening that is inside and thus smaller than the first opening through the passivation. The barrier layer is then deposited in contact with the last interconnect layer and bounded by the polyimide layer. The bond pad is then formed in contact with the barrier, and a wire bond is then made to the bond pad. | 01-21-2010 |
20100225434 | STACKED DEVICE ASSEMBLY WITH INTEGRATED COIL AND METHOD OF FORMING SAME - A stacked semiconductor device assembly ( | 09-09-2010 |
20100279489 | Semiconductor bond pad patterns and method of formation - In a semiconductor wafer, the polyimide film underneath a power metal structure is partially etched to create corresponding surface depressions of the conformal top power metal. The depressions at the surface of power metal are visible under optical microscopy. Arrangement of the depressions in a pattern facilitates the alignment of probe needles, set-up of automated wire bonding and microscopic inspection for precise alignment of wire bonds. | 11-04-2010 |
20100301452 | Integrated nano-farad capacitors and method of formation - A high value capacitance per unit area capacitor is fabricated on a substrate | 12-02-2010 |
20120061796 | Programmable anti-fuse wire bond pads - A mechanically programmable anti-fuse is configured in a thick, top metallic layer of a semiconductor. The metallic layer is selected of a material that possesses malleable properties. The metal anti-fuse programming pad is surrounded, either wholly or in part, by a pad segment. An intervening space between the anti-fuse pad and the pad segment is selected from a predetermined value such that capillary pressure, exerted when a ball-bond is placed atop the anti-fuse pad and the pad segment, causes the pads to deform and shorts to the anti-fuse pad to the pad segment. The shorting, created during the wire bonding process, programs the anti-fuse. | 03-15-2012 |
20120320532 | Flexible circuit assembly and method thereof - An embedded device | 12-20-2012 |
20140167618 | Intelligent lighting system - Intelligent lighting system | 06-19-2014 |
20140268594 | METHOD OF EMBEDDING A PRE-ASSEMBLED UNIT INCLUDING A DEVICE INTO A FLEXIBLE PRINTED CIRCUIT AND CORRESPONDING ASSEMBLY - A flexible printed circuit assembly, having a first flexible printed circuit having a first conductive layer and a device that is connected the first conductive layer; and a second flexible printed circuit having a second conductive layer, an insulating center layer, and a third conductive layer, the insulating center layer arranged in-between the second and the third conductive layers, the second conductive layer and the insulating center layer being removed to form an opening to expose an upper surface of the third conductive layer, wherein the first flexible printed circuit is arranged such that the device is accommodated inside the opening, a lower surface of the device being in thermal connection with the third conductive layer, and the first conductive layer is arranged to be in electrical connection with the second conductive layer. | 09-18-2014 |
20140268780 | FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING THE SAME - A flexible circuit assembly for accommodating a plurality of power electronic devices, including an insulating cover layer having first openings for power electronic devices, a flexible conductive layer arranged under the insulating cover layer and attached with a first adhesive to the insulating cover layer, an intermediate insulating layer arranged under the flexible conductive layer and attached with a second adhesive to the flexible conductive layer, the intermediate insulating layer having second openings, a plurality of heat-conductive elements arranged inside the second openings, a first thin heat sink layer, the heat-conductive elements arranged to be in contact with an upper surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material; and a second thin heat sink layer, upper surfaces of the power electronic devices arranged to be in contact with a lower surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material. | 09-18-2014 |
Patent application number | Description | Published |
20120079145 | ROOT HUB VIRTUAL TRANSACTION TRANSLATOR - Systems and methods of operating root hub host controllers provide for determining, at a protocol engine having a dedicated port, a speed of a device in response to a coupling of the device to the dedicated port. Data transfer can occur at a second speed between software interface logic of the host controller and the protocol engine, and at the first speed between the protocol engine and the device via the dedicated port, wherein the second speed is greater than the first speed. In addition, data may be transferred in unicast transactions in which no split tokens are exchanged. | 03-29-2012 |
20120166692 | COMMON PROTOCOL ENGINE INTERFACE FOR A CONTROLLER INTERFACE - A signal transmission system includes a controller interface, a protocol engine to convert data based on at least one protocol, and a common protocol interface coupled between the controller interface and the protocol engine. The controller interface includes or is coupled to a common dispatcher, and the data is to be transmitted between the controller interface and protocol engine through the common protocol interface and common dispatcher. The same protocol engine may convert data into different protocols, with all of the converted data be transmitted to or received from the controller interface through the common dispatcher and common protocol interface. | 06-28-2012 |
20130275640 | AUTOMATIC DOWNSTREAM TO UPSTREAM MODE SWITCHING AT A UNIVERSAL SERIAL BUS PHYSICAL LAYER - Examples are disclosed for automatic downstream to upstream mode switching at a universal serial bus (USB) physical (PHY) layer including activating a switching structure to switch a USB port operating in a downstream mode to an upstream mode based on an attempted attachment by another USB port also operating in a downstream mode. The examples may also include facilitating attachment of the switched USB port now operating in the upstream mode to the other USB port operating in the downstream mode. | 10-17-2013 |
Patent application number | Description | Published |
20110182473 | SYSTEM AND METHOD FOR VIDEO SIGNAL SENSING USING TRAFFIC ENFORCEMENT CAMERAS - A system and method for determining the state of a traffic signal light, such as being red, yellow, or green, by employing a plurality of traffic enforcement cameras to be used in determining if a traffic violation has occurred. The system and method automatically predicts, tacks and captures violation events, such as violating a red traffic signal light, to use the video for any number of reasons, particularly for traffic enforcement purposes. There may be provided a tracking camera, a signal camera and an enforcement camera used to capture the video and other pertinent information relating to the event. The signal camera may be operatively connected to a processing unit that runs a video signal sensing (VSS) software unit to determine the active state of the system. Advantageously, this allows the monitoring of intersection for signal light violations without the need for a connection to the light itself. | 07-28-2011 |
20110267460 | VIDEO SPEED DETECTION SYSTEM - A system and method for measuring vehicle speeds using video sensing. The system comprises a tracking camera that generates accurately time-stamped video sequences of the monitored road at high frame rates and a processing unit that analyzes the video sequences in real time to detect moving vehicles and calculate their speeds using the time-over-distance method. The system automatically detects moving vehicles in each image frame and derives vehicle positions from a projective mapping established from reference markers on the road. Time information is obtained from the date and time stamp associated with each image frame. In one example, the system also allows a user of the system to set a trigger speed, and the system automatically saves a video clip of the vehicle whose speed exceeds the trigger speed, recording the speeding vehicle passing through the monitored traffic zone defined by the reference markers. | 11-03-2011 |
20110267469 | SYSTEM AND METHOD FOR OVERLAYING DATA ONTO IMAGES OF A TRAFFIC ENFORCEMENT CAMERA - A system and method for overlaying data, in the form of a databar, onto image frames that collectively show a video of a traffic violation event. In the system and method, a digital video of the violation event is first captured, where the video is comprised of a plurality of image frames of the violation event. Pertinent data corresponding to the violation event is determined and then this data is overlaid onto each image frame as a databar. In this manner, a single integrated file showing an image frame, having the databar overlaid thereon, may be stored in a database for evidentiary purposes to be reviewed by traffic enforcement personnel. | 11-03-2011 |
20120212617 | SYSTEM AND METHOD FOR DETECTING TRAFFIC VIOLATIONS ON RESTRICTED ROADWAYS - A system and method automatically detect traffic violations on roadways or portions thereof that are restricted for use only by permitted vehicles. The system comprises a controller, a vehicle sensor, and a camera. The vehicle sensor detects vehicle movement on a restricted roadway. Data from the camera and the vehicle sensor are analyzed by the controller to detect a vehicle traveling on the restricted roadway, to gather static vehicle information to determine whether the detected vehicle is permitted to use the restricted roadway, and to determine whether movements of the detected vehicle on the restricted roadway constitute a violation of traffic rules in effect on the roadway. The method captures at least one image of a vehicle on a region of the roadway, detects a vehicle in the region, collects vehicle movement information, and detects a violation of traffic rules in effect using at least the collected vehicle movement information. | 08-23-2012 |
20120229627 | VIDEO SPEED DETECTION SYSTEM - Multiple-object speed tracking apparatuses are disclosed, including a camera configured to capture a set of images of a monitored area (e.g., a roadway). The camera's longitudinal axis may be positioned at any viewing angle relative to a longitudinal axis of a roadway such that at least two moving objects moving on the roadway are included in a set of high or low resolution images. A computer system is configured to analyze the set of images to detect the two moving objects and substantially simultaneously determine a calculated rate of speed of at least one of the two moving objects. The computer system also provides an on-site speed calibration process for transforming locations of an image among the set of images into real-world coordinates by considering both perspective and scale of the image. An apparatus mount for at least one of either the camera or the computer system is also disclosed. | 09-13-2012 |
20140126780 | VIDEO SPEED DETECTION SYSTEM - Multiple-object speed tracking apparatuses are disclosed, including a camera configured to capture a set of images of a monitored area (e.g., a roadway). The camera's longitudinal axis may be positioned at any viewing angle relative to a longitudinal axis of a roadway such that at least two moving objects moving on the roadway are included in a set of high or low resolution images. A computer system is configured to analyze the set of images to detect the two moving objects and substantially simultaneously determine a calculated rate of speed of at least one of the two moving objects. The computer system also provides an on-site speed calibration process for transforming locations of an image among the set of images into real-world coordinates by considering both perspective and scale of the image. An apparatus mount for at least one of either the camera or the computer system is also disclosed. | 05-08-2014 |
Patent application number | Description | Published |
20090320085 | HOUSE AMPLIFIER WITH RETURN PATH GATING - In a traditional HFC plant, the return path signals originating from cable modems, eMTAs, and settop boxes are transmitted in the 5-42 MHz range (other countries use frequencies such as 5-30 MHz, 5-55 MHz, and 5-65 MHz). These signals with entry points at any RF connection point in the home are combined by RF combiners at the side of the house. Furthermore, RF return path signals from multiple homes are combined by RF taps into a coaxial cable TV plant, and transmitted back to a hub or headend either in RF or thru a fiber optic network. | 12-24-2009 |
20100223651 | AMPLIFIER WITH NOISE REDUCTION - The present invention helps eliminate ingress noise addition (i.e., the “noise funneling effect” for an HFC coaxial plant). A system according to various aspects of the present invention comprises a switch that includes: (i) a first state for allowing passage of a signal therethrough; and (ii) a second state for preventing passage of the signal therethrough. The system further includes a detection circuit in communication with the switch. The detection circuit is configured to: (i) detect whether the signal includes an amplitude of at least a predetermined level; (ii) operate the switch to the first state if the amplitude of the signal is at least the predetermined level; and (iii) operate the switch to the second state if the amplitude of the signal is less than the predetermined level, wherein operation of the switch to the second state is delayed by a predetermined period of time. | 09-02-2010 |
20130067525 | SERVICE PROVISIONING DEVICE WITH INTEGRATED CABLE MODEM - A cable service provisioning device includes an integrated cable modem to enable a cable provider to send configuration commands. The device includes an input component that receives an input signal from a cable network and an output component that provides an output signal to a customer premises. The device further includes a cable modem configured to receive configuration commands from a cable head end, radio frequency filters configured to selectively pass a portion of the input signal; and a radio frequency switchboard coupled to the input component, the output component, and the one or more radio frequency filters. A processor is coupled to the cable modem and the radio frequency switchboard and is configured to control the radio frequency switchboard to selectively enable or disable individual radio frequency filters in response to the configuration commands received from the cable head end. | 03-14-2013 |
20130152151 | HOUSE AMPLIFIER WITH RETURN PATH GATING - A house amplifier provides automatic gating to selectively block the return path signal in a cable network. The house amplifier includes ports connected to the cable network and to at least one home coaxial outlet. A forward signal path is coupled to pass a forward signal from the cable network. A reverse signal path is coupled to selectively pass a reverse signal from the home to the cable network. The reverse signal path includes a gate configured to block the reverse signal in response to a control signal. A detector circuit detects when the reverse signal is received and activates or deactivates the gate based on the detection. The detector circuit may include a timing circuit configured to provide a delay before deactivating the gate when the reverse signal is no longer detected. | 06-13-2013 |
20140254441 | AMPLIFIER WITH NOISE REDUCTION - The present invention helps eliminate ingress noise addition (i.e., the “noise funneling effect” for an HFC coaxial plant). A system according to various aspects of the present invention comprises a switch that includes: (i) a first state for allowing passage of a signal therethrough; and (ii) a second state for preventing passage of the signal therethrough. The system further includes a detection circuit in communication with the switch. The detection circuit is configured to: (i) detect whether the signal includes an amplitude of at least a predetermined level; (ii) operate the switch to the first state if the amplitude of the signal is at least the predetermined level; and (iii) operate the switch to the second state if the amplitude of the signal is less than the predetermined level, wherein operation of the switch to the second state is delayed by a predetermined period of time. | 09-11-2014 |
20140375381 | Return Path Noise Reducing Amplifier with Bypass Signal - An amplifier system an amplified path and a bypass path for carrying an RF signal. A switch in the amplified system routes the RF signal through the amplified path in response to a normal condition in the amplifier system, and routes the RF signal through the bypass path in response to an abnormal condition in the amplifier system. The amplified path includes an amplified forward circuit and a return circuit. The amplified forward circuit has an amplifier, and the return circuit has a return amplifier and detection circuitry for providing power to the return amplifier. The detection circuity provides power to the return amplifier in response to a normal condition in the return circuit, and removes power from the return amplifier in response to an abnormal condition in the return circuit. | 12-25-2014 |
Patent application number | Description | Published |
20130334680 | WAFER LEVEL PACKAGES OF HIGH VOLTAGE UNITS FOR IMPLANTABLE MEDICAL DEVICES AND CORRESPONDING FABRICATION METHODS - A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips. | 12-19-2013 |
20130335937 | INTEGRATED CIRCUIT PACKAGING FOR IMPLANTABLE MEDICAL DEVICES - A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances. | 12-19-2013 |
Patent application number | Description | Published |
20140121382 | HYDRATE FORMS OF 1,2,4-TRIAZOLE, PROCESSES FOR MANUFACTURE THEREOF, AND COMPOSITIONS THEREOF - The present invention provides new hydrate forms of triazole, triazole alkaline salt, and alkali doped 1,2,4-triazole. The present invention also discloses processes for manufacturing new hydrate forms of triazole, triazole alkaline salt, and alkali-doped 1,2,4-triazole. The present invention also relates to compositions for different applications of new hydrate forms of triazole, triazole alkaline salt, and alkali doped 1,2,4-triazole. In addition, the present invention provides co-crystal form of triazole with acid, and methods of preparing thereof. | 05-01-2014 |
20140204364 | METHODS FOR MAKING AND COMPOSITIONS OF TWO DIMENSIONAL PARTICLE ARRAYS - A method of preparation of a 2-D array of particles comprising: mixing the particles and a first liquid, the first liquid having the properties of being soluble in water and reducing surface tension of a water surface; adding the mixture to the water surface; and transferring the 2-D array onto a solid surface. A composition comprising: a 2-D array of particles; and a polymer substantially enveloping the 2-D array of particles. | 07-24-2014 |
20150284593 | POLISHING COMPOSITIONS AND METHODS FOR SELECTIVELY POLISHING SILICON NITRIDE OVER SILICON OXIDE FILMS - Stable aqueous polishing compositions that can selectively polish silicon nitride (SiN) films and nearly stop (or polish at very low rates) on silicon oxide films are provided herein. The compositions comprise an anionic abrasive, a nitride removal rate enhancer containing a carboxyl or carboxylate group, water, and optionally, an anionic polymer. The synergistic combination of anionic (negatively charged) abrasives and the nitride removal rate enhancer provide beneficial charge interactions with the dielectric films during CMP, a high SiN rate and selectivity enhancement (over oxide), and stable colloidal dispersed slurries. | 10-08-2015 |
Patent application number | Description | Published |
20100215874 | OPTICAL RECORDING MEDIUM WITH INK RECEPTIVE COATING - The instant disclosure relates to an ink jet printable optical recording medium including a substrate having opposing surfaces, namely a recording surface and a printing surface. The printing surface of the substrate is coated with an adhesion promotion layer which includes polyurethane, a high surface area inorganic pigment having a surface area of at least 100 m | 08-26-2010 |
20100291442 | PRIMER FOR BATTERY ELECTRODE - Primer arrangements that facilitate electrical conduction and adhesive connection between an electroactive material and a current collector are presented. In some embodiments, primer arrangements described herein include first and second primer layers. The first primer layer may be designed to provide good adhesion to a conductive support. In one particular embodiment, the first primer layer comprises a substantially uncrosslinked polymer having hydroxyl functional groups, e.g., polyvinyl alcohol. The materials used to form the second primer layer may be chosen such that the second primer layer adheres well to both the first primer layer and an electroactive layer. In certain embodiments including combinations of first and second primer layers, one or both of the first and second primer layers comprises less than 30% by weight of a crosslinked polymeric material. A primer including only a single layer of polymeric material is also provided. | 11-18-2010 |
20110104408 | PRINT MEDIUM FOR INKJET WEB PRESS PRINTING - A print medium suitable for inkjet web press printing is disclosed herein. The print medium includes a paper substrate and an ink-receiving layer coated onto at least one surface of the paper substrate. The ink-receiving layer includes: two different inorganic pigments with different particle sizes; a binder; a water-soluble metallic salt; and a colorant durability enhancer selected from the group consisting of boric acid, borax, sodium tetraborate, phenyl boronic acid, butyl boronic acid and combinations thereof. | 05-05-2011 |
20120034398 | MEDIA FOR INKJET WEB PRESS PRINTING - A media suitable for inkjet web press printing is disclosed herein. The media includes a paper substrate and an ink receptive layer coated onto at least one surface of the paper substrate. The ink receptive layer includes: inorganic pigments; at least one water-based binder; a water-soluble metallic salt; a colorant durability enhancer selected from the group consisting of boric acid, borax, sodium tetraborate, phenyl boronic acid, butyl boronic acid and combinations thereof; and a coefficient of friction (COF) reducer selected from the group consisting of polyethylene wax, paraffin wax, carnauba wax, polypropylene wax, polytetrafluoroethylene wax, and combinations thereof. | 02-09-2012 |
20130330542 | PHOTOVOLTAIC BACKSHEET - Novel coating formulations and coating processes which have lower costs than TEDLA or KYNAR laminated backsheets, less curl than polyolefin laminated backsheets, excellent adhesion to encapsulant EVA, and better mar resistance on the surface facing the environment. In a preferred embodiment, the backsheet is formed by applying a distinct coating layer to each side of a film substrate. One coating layer is preferably a weather-resistant layer coated on the side of the substrate that will be exposed to the environment, while the other coating layer is a functional layer which provides excellent adhesion both to the substrate and to the EVA encapsulant layer. | 12-12-2013 |
20140072873 | PRIMER FOR BATTERY ELECTRODE - Primer arrangements that facilitate electrical conduction and adhesive connection between an electroactive material and a current collector are presented. In some embodiments, primer arrangements described herein include first and second primer layers. The first primer layer may be designed to provide good adhesion to a conductive support. In one particular embodiment, the first primer layer comprises a substantially uncrosslinked polymer having hydroxyl functional groups, e.g., polyvinyl alcohol. The materials used to form the second primer layer may be chosen such that the second primer layer adheres well to both the first primer layer and an electroactive layer. In certain embodiments including combinations of first and second primer layers, one or both of the first and second primer layers comprises less than 30% by weight of a crosslinked polymeric material. A primer including only a single layer of polymeric material is also provided. | 03-13-2014 |
20140150854 | Patterned Transparent Photovoltaic Backsheet - A multilayer photovoltaic backsheet comprising a transparent substrate with same polymeric coatings on both sides of the substrate or a different polymeric coating on either side of the substrate. The use of coatings instead of laminated layers provides for a manufacturing process that is faster, has fewer steps, and is more cost effective. Coatings can be tailored to provide excellent adhesion, without the problems of delamination seen in prior art laminated backsheets. The coating for the outer side of the substrate can also be tailored to be softened during module lamination. A patterned blanket or other patterned or textured surface can be pressed against the outer side coating layer during lamination. The pattern or texture is thus transferred to the outer side of the backsheet, which will cause light passing through the backsheet to be diffused. Latent cross-linking reaction can further harden the outer side coating layer to increase the outer side coating layer hardness and to improve its durability. | 06-05-2014 |
Patent application number | Description | Published |
20080277779 | Microelectronic package and method of manufacturing same - A microelectronic package comprises a substrate ( | 11-13-2008 |
20140168879 | APPARATUS AND METHOD TO MONITOR DIE EDGE DEFECTS - Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die. | 06-19-2014 |
20150092201 | METROLOGY TOOL FOR ELECTROLESS COPPER THICKNESS MEASUREMENT FOR BBUL PROCESS DEVELOPMENT MONITORING - A method including measuring a first distance to a surface of an integrated circuit substrate or a portion of an integrated circuit package by measuring an angle to it from two known points; introducing a material onto the surface; measuring a second distance to a surface of the film from the two known points; and determining a thickness of the introduced material by subtracting the second distance from the first distance. | 04-02-2015 |
20150276375 | INLINE INSPECTION OF THE CONTACT BETWEEN CONDUCTIVE TRACES AND SUBSTRATE FOR HIDDEN DEFECTS USING WHITE LIGHT INTERFEROMETER WITH TILTED OBJECTIVE LENS - Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing formed on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring. | 10-01-2015 |
20150276480 | Non-Destructive 3-Dimensional Chemical Imaging Of Photo-Resist Material - Embodiments include devices, systems and processes for using a combined confocal Raman microscope for inspecting a photo resist film material layer formed on the top surface of a layer of a substrate package, to detect border defects between regions of light exposed (e.g., cured) and unexposed (e.g., uncured) resist film material. Use of the confocal Raman microscope may provide a 3D photo-resist chemical imaging and characterization technique based on combining (1) Raman spectroscopy to identify the borders between regions of light exposed and unexposed resist along XY planes, with (2) Confocal imaging to select a Z-height of the XY planes scanned. Such detection provides fast, high resolution, non-destructive in-line inspection, and improves technical development of polymerization profiles of the resist film material. | 10-01-2015 |