Patent application number | Description | Published |
20130286800 | FLEX CIRCUIT WITH DUAL SIDED INTERCONNECT STRUCTURE - A flex circuit including a dual sided interconnect structure to connect electrical components on a head or suspension assembly to head circuitry is described. The dual sided interconnect structure described has application for providing an electrical connection to one or more transducer elements on a slider and one or more elements of a heat assisted magnetic recording HAMR unit. In an illustrated embodiment, a flexible structure or insulating base layer includes one or more slider and heat assisted magnetic recording traces coupled to one or more slider or HAMR bond pads on an interconnect portion. As disclosed, the slider bond pads are on the obverse side of the flexible structure and the HAMR bond pads include a reverse side bonding surface to form reverse side bond pads to connect to one or more electrical or heating elements on the HAMR unit. | 10-31-2013 |
20130286801 | FLEX CIRCUIT HAVING A MULTIPLE LAYERED STRUCTURE AND INTERCONNECT - A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer. In one embodiment, the gimbal portion of the flex circuit includes the first layer and not the second layer of the multiple layer structure and in another embodiment a bending portion of the flex circuit includes the first base layer and not the second layer of the multiple layered structure to provide a reduced thickness to facilitate bending, for example in a micro-actuation region of the load beam. | 10-31-2013 |
20150201493 | FLEX CIRCUIT HAVING A MULTIPLE LAYERED STRUCTURE AND INTERCONNECT - A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer. In one embodiment, the gimbal portion of the flex circuit includes the first layer and not the second layer of the multiple layer structure and in another embodiment a bending portion of the flex circuit includes the first base layer and not the second layer of the multiple layered structure to provide a reduced thickness to facilitate bending, for example in a micro-actuation region of the load beam. | 07-16-2015 |
Patent application number | Description | Published |
20100097726 | COST REDUCED MICROACTUATOR SUSPENSION - An improved microactuator suspension is provided for use with high density storage media. The number of microactuator elements is reduced to one and placed perpendicularly to the longitudinal axis of the suspension arm to maximize the windage and resonance performance and minimize the microactuator's contribution to bending stiffness and the off track bending component. An improved electrical connection eliminates the requirement for a jumper. These improvements reduce cost by reducing part count and assembly complexity. | 04-22-2010 |
20100128394 | TOP BOND PAD BIAS AND VARIATION CONTROL - An assembly includes a slider and a suspension assembly. The slider includes an air bearing surface and a slider mounting surface opposite the air bearing surface. There are a plurality of slider pads on the slider mounting surface. The suspension assembly includes a plurality of suspension pads on a suspension mounting surface. Each of the suspension pads is connected to one of the slider pads with a solder joint so that the slider mounting surface has at least one of a pitch, roll, or yaw angle with respect to the suspension mounting. | 05-27-2010 |
20110075302 | BASEPLATE RESONANT AXIS OPTIMIZATION - In one implementation, the presently disclosed technology teaches an apparatus with a head attached to an end of a baseplate. The baseplate includes a tilted section that causes a torsion axis of the baseplate to pass near the head. In another implementation, the presently disclosed technology teaches an apparatus with a load beam attached to a baseplate. The apparatus also includes a head attached to an opposite end of the load beam from the baseplate. The baseplate includes a mass-shifted section that causes a torsion axis of the apparatus to pass through the head. In yet another implementation, the presently disclosed technology teaches a method for reducing baseplate resonance amplitude. The method includes shifting a baseplate mass on a suspension toward an adjacent disc surface to move a baseplate torsion axis to pass near a head. | 03-31-2011 |
20120314548 | Head Gimbal Assembly With Heat Assist Laser - An apparatus and associated method for a head gimbal assembly for data transduction in a data storage device with a heat assist laser. Various embodiments of the present invention are generally directed to a slider supporting at least a transducing element on an air bearing surface (ABS) and a laser assembly directly attached to a top side of the slider opposite the ABS. The laser assembly is positioned on the top side with no portion of the laser assembly extending past a longitudinal centerline of the slider. | 12-13-2012 |
20150085400 | BASEPLATE RESONANT AXIS OPTIMIZATION - In one implementation, the presently disclosed technology teaches an apparatus with a head attached to an end of a baseplate. The baseplate includes a tilted section that causes a torsion axis of the baseplate to pass near the head. In another implementation, the presently disclosed technology teaches an apparatus with a load beam attached to a baseplate. The apparatus also includes a head attached to an opposite end of the load beam from the baseplate. The baseplate includes a mass-shifted section that causes a torsion axis of the apparatus to pass through the head. In yet another implementation, the presently disclosed technology teaches a method for reducing baseplate resonance amplitude. The method includes shifting a baseplate mass on a suspension toward an adjacent disc surface to move a baseplate torsion axis to pass near a head. | 03-26-2015 |