Patent application number | Description | Published |
20090108423 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles. | 04-30-2009 |
20110101532 | DEVICE FABRICATED USING AN ELECTROPLATING PROCESS - A method for fabricating a device includes providing a substrate including at least one contact and applying a dielectric layer over the substrate. The method includes applying a first seed layer over the dielectric layer, applying an inert layer over the seed layer, and structuring the inert layer, the first seed layer, and the dielectric layer to expose at least a portion of the contact. The method includes applying a second seed layer over exposed portions of the structured dielectric layer and the contact such that the second seed layer makes electrical contact with the structured first seed layer. The method includes electroplating a metal on the second seed layer. | 05-05-2011 |
20120074574 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME - One or more embodiments relate to a method of forming a semiconductor structure, comprising: providing a workpiece; forming a barrier layer over the workpiece; forming a seed layer over the barrier layer; forming an inhibitor layer over the seed layer; removing a portion of said inhibitor layer to expose a portion of the seed layer; and selectively depositing a fill layer on the exposed seed layer. | 03-29-2012 |
20120080791 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME - One or more embodiments relate to a method of forming an electronic device, comprising: providing a workpiece; forming a first barrier layer over the workpiece; forming an intermediate conductive layer over the first barrier layer; forming a second barrier layer over the intermediate conductive layer; forming a seed layer over the second barrier layer; removing a portion of the seed layer to leave a remaining portion of the seed layer and to expose a portion of the second barrier layer; and electroplating a fill layer on the remaining portion of the seed layer. | 04-05-2012 |
20120181710 | Semiconductor Chip and Method for Fabricating the Same - A semiconductor chip includes a first main face and a second main face opposed to the first main face. Side faces connect the first and second main faces. The side faces are at least partially covered with an anti-EBO compound and/or a surface energy reducing compound. | 07-19-2012 |
20130062770 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME - One or more embodiments relate to a semiconductor structure, comprising: a barrier layer overlying a workpiece surface; a seed layer overlying the barrier layer; an inhibitor layer overlying said seed layer, the inhibitor layer having a opening exposing a portion of the seed layer, and a fill layer overlying the exposed portion of the seed layer. | 03-14-2013 |
20130084658 | Separation of Semiconductor Devices from a Wafer Carrier - In accordance with an embodiment of the present invention, a semiconductor device is manufactured by arranging a plurality of semiconductor devices on a frame with an adhesive foil. The plurality of semiconductor devices is attached to the adhesive foil. The plurality of semiconductor devices is removed from the frame with the adhesive foil using a carbon dioxide snow jet and/or a laser process. | 04-04-2013 |
20130084659 | Testing Process for Semiconductor Devices - In accordance with an embodiment of the present invention, a method of manufacturing a semiconductor device includes providing a wafer having a top surface and an opposite bottom surface. The top surface has a plurality of dicing channels. The wafer has a plurality of dies adjacent the top surface. Each die of the plurality of dies is separated by a dicing channel of the plurality of dicing channels from another die of the plurality of dies. Trenches are formed in the wafer from the top surface. The trenches are oriented along the plurality of dicing channels. After forming the trenches, the plurality of dies is tested to identify first dies to be separated from remaining dies of the plurality of dies. After testing the plurality of dies, the wafer is subjected to a grinding process from the back surface. The grinding process separates the wafer into the plurality of dies. | 04-04-2013 |
20130309864 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME - One or more embodiments relate to a method of forming a semiconductor structure, comprising: providing a workpiece; forming a barrier layer over the workpiece; forming a seed layer over the barrier layer; forming an inhibitor layer over the seed layer; removing a portion of said inhibitor layer to expose a portion of the seed layer; and selectively depositing a fill layer on the exposed seed layer. | 11-21-2013 |
20140167272 | Semiconductor Device Having an Identification Mark - A semiconductor device includes a chip, a contact pad arranged over the front side of the chip and an identification mark arranged over the contact pad. The identification mark includes an information about a property of the chip. | 06-19-2014 |
20140319627 | CHIP PACKAGE AND A METHOD OF MANUFACTURING THE SAME - In various embodiments, a chip package is provided. The chip package may include at least one chip having a plurality of pressure sensor regions and encapsulation material encapsulating the chip. | 10-30-2014 |
20140367015 | METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER - An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier. | 12-18-2014 |
20150059454 | Sensor arrangement - A sensor arrangement for sensing an environmental property of an environment of the sensor arrangement, the sensor arrangement comprising:
| 03-05-2015 |
20150061113 | Semiconductor Dies Having Opposing Sides with Different Reflectivity - A method of processing semiconductor dies is provided. Each semiconductor die has a first side with one or more terminals, a second side opposite the first side and sidewalls extending between the first and the second sides. The semiconductor dies are processed by placing the semiconductor dies on a support substrate so that the first side of each semiconductor die faces the support substrate and the second side faces away from the support substrate. A coating is applied to the semiconductor dies placed on the support substrate. The coating has a lower reflectivity than the first side of the semiconductor dies. The coating covers the second side and at least a region of the sidewalls nearest the second side of each semiconductor die. The semiconductor dies are removed from the support substrate after applying the coating for further processing as loose dies such as taping. | 03-05-2015 |
20150090042 | Pressure Sensor Package with Integrated Sealing - A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side of the die. The die is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The package further includes an electrical conductor connecting the terminal to the lead, a molding compound encasing the electrical conductor, the die and part of the lead, a cavity in the molding compound exposing the diaphragm, and a sealing ring disposed on a side of the molding compound with the cavity. The sealing ring surrounds the cavity and has a lower elastic modulus than the molding compound. Alternatively, the sealing ring can be a ridge of the molding compound that protrudes from the side of the molding compound with the cavity and surrounds the cavity. A package manufacturing method is also provided. | 04-02-2015 |
20150132614 | SENSOR ARRANGEMENT, ENERGY SYSTEM AND METHOD - A sensor arrangement according to an embodiment comprises a transmitter to be arranged inside a battery cell and to transmit a signal based on at least one sensed operational parameter of the battery cell wirelessly. | 05-14-2015 |
20150226810 | SENSOR ARRANGEMENT, BATTERY CELL AND ENERGY SYSTEM - A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively. | 08-13-2015 |
Patent application number | Description | Published |
20090217288 | Routing Workloads Based on Relative Queue Lengths of Dispatchers - Mechanisms for distributing workload items to a plurality of dispatchers are provided. Each dispatcher is associated with a different computing system of a plurality of computing systems and workload items comprise workload items of a plurality of different workload types. A capacity value for each combination of workload type and computing system is obtained. For each combination of workload type and computing system, a queue length of a dispatcher associated with the corresponding computing system is obtained. For each combination of workload type and computing system, a dispatcher's relative share of incoming workloads is computed based on the queue length for the dispatcher associated with the computing system. In addition, incoming workload items are routed to a dispatcher, in the plurality of dispatchers, based on the calculated dispatcher's relative share for the dispatcher. | 08-27-2009 |
20120291044 | Routing Workloads Based on Relative Queue Lengths of Dispatchers - Mechanisms for distributing workload items to a plurality of dispatchers are provided. Each dispatcher is associated with a different computing system of a plurality of computing systems and workload items comprise workload items of a plurality of different workload types. A capacity value for each combination of workload type and computing system is obtained. For each combination of workload type and computing system, a queue length of a dispatcher associated with the corresponding computing system is obtained. For each combination of workload type and computing system, a dispatcher's relative share of incoming workloads is computed based on the queue length for the dispatcher associated with the computing system. In addition, incoming workload items are routed to a dispatcher, in the plurality of dispatchers, based on the calculated dispatcher's relative share for the dispatcher. | 11-15-2012 |
20130081025 | Adaptively Determining Response Time Distribution of Transactional Workloads - An adaptive mechanism is provided that learns the response time characteristics of a workload by measuring the response times of end user transactions, classifies response times into buckets, and dynamically adjusts the response time distribution as response time characteristics of the workload change. The adaptive mechanism maintains the actual distribution across changes and, thus, helps the end user to understand changes of workload behavior that take place over a longer period of time. The mechanism is stable enough to suppress spikes and returns a constant view of workload behavior, which is required for long term, performance analysis and capacity planning. The mechanism distinguishes between an initial learning phase of establishing the distribution and one or multiple reaction periods. The reaction periods can be for example a fast reaction period for strong fluctuations of the workload behavior and a slow reaction period for small deviations. | 03-28-2013 |
20130081035 | Adaptively Determining Response Time Distribution of Transactional Workloads - An adaptive mechanism is provided that learns the response time characteristics of a workload by measuring the response times of end user transactions, classifies response times into buckets, and dynamically adjusts the response time distribution as response time characteristics of the workload change. The adaptive mechanism maintains the actual distribution across changes and, thus, helps the end user to understand changes of workload behavior that take place over a longer period of time. The mechanism is stable enough to suppress spikes and returns a constant view of workload behavior, which is required for long term, performance analysis and capacity planning. The mechanism distinguishes between an initial learning phase of establishing the distribution and one or multiple reaction periods. The reaction periods can be for example a fast reaction period for strong fluctuations of the workload behavior and a slow reaction period for small deviations. | 03-28-2013 |
20150040138 | Routing Workloads Based on Relative Queue Lengths of Dispatchers - Mechanisms for distributing workload items to a plurality of dispatchers are provided. Each dispatcher is associated with a different computing system of a plurality of computing systems and workload items comprise workload items of a plurality of different workload types. A capacity value for each combination of workload type and computing system is obtained. For each combination of workload type and computing system, a queue length of a dispatcher associated with the corresponding computing system is obtained. For each combination of workload type and computing system, a dispatcher's relative share of incoming workloads is computed used on the queue length for the dispatcher associated with the computing system. In addition, incoming workload items are routed to a dispatcher, in the plurality of dispatchers, based on the calculated dispatcher's relative share for the dispatcher. | 02-05-2015 |
Patent application number | Description | Published |
20100278079 | APPARATUS AND METHOD FOR DETERMINING A COINCIDENCE OF A POSITION WITH A REFERENCE POSITION - An apparatus for determining a coincidence of a position with a reference position, wherein radio signals from fixedly positioned radio transmitters can be received at the position, having a provider for providing properties of the radio signals of the fixedly positioned radio transmitters at the position, wherein the provided properties of the radio signals include transmitter identifications identifying the radio transmitters, a separator for separating the radio transmitters into a first number of radio transmitters previously recorded transmitter identifications of which at the reference position are identical with transmitter identifications provided at the position, and into a second number of radio transmitters previously recorded transmitter identifications of which at the reference position and transmitter identifications provided at the position are different, and a determiner for determining a measure of matching for the position on the basis of the provided properties of the radio signals, wherein both properties of the first number of radio transmitters and properties of the second number of radio transmitters are taken into account in the determination of a measure of matching, and wherein the properties of the first number of radio transmitters and the properties of the second number of radio transmitters enter the measure of matching differently. | 11-04-2010 |
20130289916 | APPARATUS AND METHOD FOR CALIBRATING A RADIO POSITIONING BASED POSITION FINDING DEVICE - Described is an apparatus for calibrating a position finding device, having a comparer for comparing a received radio signal pattern to a multitude of reference radio signal patterns, a determiner for determining a signal strength difference, and a determiner for determining a calibration value. The comparer for comparing is configured to select a selection subset from the multitude of reference radio signal patterns by means of a measure of matching between the received radio signal pattern and one reference radio signal pattern, respectively. Determination of the calibration value is based on the signal strength difference, and the determiner for determining the calibration value is further configured to provide the calibration value to the position finding device. Also described are a position finding device for radio-based localization, having such an apparatus for calibrating, a method of calibrating a position finding device based on radio-based localization, and a computer program for performing the method are described. | 10-31-2013 |
20130342400 | CONCEPT OF GENERATING EXPERIENCE MESSAGES FOR UPDATING A REFERENCE DATABASE - At a current position, a measurement packet is determined by a mobile terminal device at a measurement time. The measurement packet includes transmitter identifications of radio transmitters receivable at the current position of the mobile terminal device at the measurement time. By means of reference measurement packets provided to the mobile terminal device, the mobile terminal device itself can determine its current position. Additionally, a deviation of the determined transmitter identifications of the measurement packet from reference transmitter identifications of the reference measurement packets is determined. If a deviation of the reference transmitter identifications from the transmitter identifications determined at the current position is detected, experience messages can be generated that can again result in an update measure as, for example, updating the reference database by adding new transmitter identifications to the reference database and/or removing obsolete reference transmitter identifications from the reference database. | 12-26-2013 |
20140133344 | CONCEPT FOR DETERMINING AN ORIENTATION OF A MOBILE DEVICE - Embodiments of the present invention provide a mobile device having a receiver and an orientation determiner. The receiver has a plurality of antennas for receiving a signal from a stationary transmitter. Each antenna of the plurality of antennas is arranged to have a different receiving direction. The receiver is configured to detect a signal strength of the signal received with each antenna in order to obtain a plurality of detected signal strengths. The orientation determiner is configured to determine an orientation of the mobile device relative to the stationary transmitter based on the plurality of detected signal strengths. | 05-15-2014 |