Patent application number | Description | Published |
20080241764 | Lithographic Method - The present invention provides a method of lithographic patterning in order to the strength of the patterned photoresist. The method comprises: applying to a surface to be patterned a photoresist ( | 10-02-2008 |
20090130611 | Lithographic Method - The present invention provides a method of lithographic patterning. The method comprisese: applying to a surface to be patterned a photoresist ( | 05-21-2009 |
20090311623 | PHOTOLITHOGRAPHY - The invention relates to a method of photolithography comprising the steps of: providing a substrate and forming a layer of a photoresist ( | 12-17-2009 |
20100028809 | DOUBLE PATTERNING FOR LITHOGRAPHY TO INCREASE FEATURE SPATIAL DENSITY - A method of forming a pattern in at least one device layer in or on a substrate comprises: coating the device layer with a first photoresist layer; exposing the first photoresist using a first mask; developing the first photoresist layer to form a first pattern on the substrate; coating the substrate with a protection layer; treating the protection layer to cause a change therein where it is in contact with the first photoresist, to render the changed protection layer substantially immune to a subsequent exposure and/or developing step; coating the substrate with a second photoresist layer; exposing the second photoresist layer using a second mask; and developing the second photoresist layer to form a second pattern on the substrate without significantly affecting the first pattern in the first photoresist layer, wherein the first and second patterns together define interspersed features having a spartial frequency greater than that of the features defined in each of the first and second patterns separately. The process has particular utility in defining source, drain and fin features of finFET devices with a smaller feature size than otherwise achievable with the prevailing lithography tools. | 02-04-2010 |
20100308833 | LIGHTING UNIT WITH COMPENSATION FOR OUTPUT FREQUENCY, AND METHOD FOR DETERMINING OUTPUT FREQUENCY - A method of determining the dominant output wavelength of an LED, comprises determining an electrical characteristic of the LED which is dependent on the voltage-capacitance characteristics, and analysing the characteristic to determine the dominant output wavelength. | 12-09-2010 |
20110031903 | SYSTEM AND METHOD FOR ESTIMATING THE JUNCTION TEMPERATURE OF A LIGHT EMITTING DIODE - A method of estimating the junction temperature of a light emitting diode comprises driving a forward bias current through the diode, the current comprising a square wave which toggles between high and low current values (I | 02-10-2011 |
20110109897 | MEASURING APPARATUS - An apparatus comprising at least one measuring cell ( | 05-12-2011 |
20110121705 | APPARATUS FOR REGULATING THE TEMPERATURE OF A LIGHT EMITTING DIODE - Apparatus for regulating the temperature of a light emitting diode (LED). The apparatus includes a heat sink, an LED mount, and an LED mounted on the LED mount. The LED mount is configured to change shape in response to a change in temperature. The change in shape alters the position of the LED relative to the heat sink, for adjusting heat transfer between the LED and the heat sink. The LED mount may include a laminated portion such as a bi-metallic strip. | 05-26-2011 |
20110133214 | LIGHT SENSOR DEVICE AND MANUFACTURING METHOD - A light sensor device comprises a substrate ( | 06-09-2011 |
20110150028 | SELF-CALIBRATION CIRCUIT AND METHOD FOR JUNCTION TEMPERATURE ESTIMATION - The present invention relates to a calibration circuit, computer program product, and method of calibrating a junction temperature measurement of a semiconductor element, wherein respective forward voltages at junctions of the semiconductor element and a reference temperature sensor are measured, and an absolute ambient temperature is determined by using the reference temperature sensor, and the junction temperature of the semiconductor element is predicted based on the absolute ambient temperature and the measured forward voltages. | 06-23-2011 |
20110269646 | SENSING DEVICE AND MANUFACTURING METHOD THEREOF - The present invention relates to a sensing device with a surface having at least one individual sensing region, wherein each sensing region includes a plurality of binding elements anchored on the surface for binding different specific analytes of interest, at least one of the analyte of interest and its matching binding element having a label for detecting said binding. The present invention further relates to a method of manufacturing such a sensing device. | 11-03-2011 |
20120105311 | Display Device - A display device comprises a substrate which carries an array of pixels. Each pixel comprises an array of apertures in the substrate, each aperture of the array having a maximum opening dimension less than the wavelength of the light to be transmitted through the aperture. The effective dielectric constant of the aperture and/or the dielectric constant of the substrate is varied, thereby to vary the light transmission characteristics of the pixel between transmission of at least one frequency in the visible spectrum and transmission of substantially no frequency in the visible spectrum. | 05-03-2012 |
20130053268 | ANALYTE DETECTION METHOD AND ANALYTE DETECTION INTEGRATED CIRCUIT - A method for providing an integrated circuit such that first and second sensing electrodes respectively have at their surfaces first and second receptor molecules for selectively binding to first and second analytes of interest; exposing the integrated circuit to a sample potentially comprising at least one of the first and second analytes, providing a first bead having a first electrical signature attached to a first molecule having a conformation/affinity for binding to the first sensing electrode dependent on the presence of the first analyte; providing a second bead having a second electrical signature attached to a second molecule having a conformation/affinity for binding to the second sensing electrode dependent on the presence of the second analyte; and determining the presence of the electrical signature of the first and/or second bead(s) on the first and second sensing electrodes respectively. An IC for implementing this method. | 02-28-2013 |
20130102085 | METHOD OF SENSING A MOLECULE, AN APPARATUS AND A SEMICONDUCTOR CHIP THEREFOR - A semiconductor chip, apparatus, and associated method wherein the semiconductor chip, having at least one electrode and configured as a sensor such as a biosensor, is removably attachable to a tip of a dipstick. The dipstick tip, with the attached semiconductor chip, is arranged to be dipped into a well containing an analyte. The well may be part of a micro-titre plate. The chip electrically senses the presence of a target molecule in the analyte. The sensing may be by detecting a change in capacitance associated with the electrode which occurs in the presence of the target molecule. The apparatus may include plural dipsticks and associated semiconductor chips which are sensitive for different target molecules. Alternatively or in addition, a single semiconductor chip may have a plurality of electrodes, which may be sensitive to different target molecules. | 04-25-2013 |
20130207206 | SEMICONDUCTOR DEVICE HAVING AU-CU ELECTRODES, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a biosensor semiconductor device in which copper electrodes at a major surface of the device are modified to form Au—Cu alloy electrodes. Such modification is effected by depositing a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold and the electrode copper. Alloyed gold-copper is removed from the surface of the device, leaving the exposed electrodes. The electrodes are better compatible with further processing into a biosensor device than is the case with conventional copper electrodes, and the process windows are wider than for gold capped copper electrodes. A biosensor semiconductor device having Au—Cu alloy electrodes is also disclosed. | 08-15-2013 |
20140159173 | SEMICONDUCTOR DEVICE HAVING AU-CU ELECTRODES, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a biosensor semiconductor device in which copper electrodes at a major surface of the device are modified to form Au—Cu alloy electrodes. Such modification is effected by depositing a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold and the electrode copper. Alloyed gold-copper is removed from the surface of the device, leaving the exposed electrodes. The electrodes are better compatible with further processing into a biosensor device than is the case with conventional copper electrodes, and the process windows are wider than for gold capped copper electrodes. A biosensor semiconductor device having Au—Cu alloy electrodes is also disclosed. | 06-12-2014 |
20140170762 | INTEGRATED CIRCUIT ARRANGEMENT, DEVICE AND GAS DETECTION METHOD - An integrated circuit arrangement ( | 06-19-2014 |
Patent application number | Description | Published |
20080200359 | Benefit agent delivery compositions - Benefit agent delivery compositions, compositions, packaged products and displays comprising such benefit agent delivery compositions, and processes for making and using such benefit agent delivery compositions, compositions, packaged products and displays. Such compositions have improved deposition and retention properties that may impart improved benefit characteristics to a composition and/or situs. | 08-21-2008 |
20090048351 | Benefit agent delivery compositions - Benefit agent delivery compositions, compositions, packaged products and displays comprising such benefit agent delivery compositions, and processes for making and using such benefit agent delivery compositions, compositions, packaged products and displays. Such compositions have improved deposition and retention properties that may impart improved benefit characteristics to a composition and/or situs. | 02-19-2009 |
20100331190 | BENEFIT AGENT DELIVERY COMPOSITIONS - Benefit agent delivery compositions, compositions, packaged products and displays comprising such benefit agent delivery compositions, and processes for making and using such benefit agent delivery compositions, compositions, packaged products and displays. Such compositions have improved deposition and retention properties that may impart improved benefit characteristics to a composition and/or situs. | 12-30-2010 |