Van Riet
Egbert Jan Van Riet, Gs Rijswijk NL
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20120298379 | METHOD AND SYSTEM FOR LINING A SECTION OF A WELLBORE WITH AN EXPANDABLE TUBULAR ELEMENT - A system and method for lining a section of a wellbore with an expandable tubular element. The system comprises an elongate drill string having a force multiplier near a lower end thereof, which is housed within the expandable tubular element. An expander for expanding the tubular element is arranged at a lower end of the force multiplier. Anchoring means are provided at the exterior of the tubular element for anchoring the tubular element in the wellbore. Pulling the expander through the expandable tubular using the force multiplier may be combined with pulling the drill string upwards. A sudden drop of the hydraulic pressure in the force multiplier drops will confirm fixation of the anchoring means in the wellbore wall. | 11-29-2012 |
Egbert Jan Van Riet, Rijswijk NL
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20150014989 | CONNECTOR ASSEMBLY - The invention provides a connector assembly for interconnecting tubular elements. The connector assembly comprises at least one pin member, at least one box member, and for each box member a respective coating layer. Each pin member has a threaded outer surface and each box member has a threaded inner surface allowing the pin member and the box member to be screwed together. Herein the respective coating layer is positioned between the threaded surfaces of the pin member and the box member. Each coating layer is of a softer material than said threaded surfaces. The connector assembly further comprises means for removing excess coating material during make up of the pin member and the box member. | 01-15-2015 |
20150035274 | CONNECTOR ASSEMBLY - The invention provides a connector assembly for interconnecting tubular elements. The connector assembly comprises at least one pin member, at least one box member, and for each box member a respective coating layer. Each pin member has a threaded outer surface and each box member has a threaded inner surface allowing the pin member and the box member to be screwed together. Herein the respective coating layer is positioned between the threaded surfaces of the pin member and the box member. Each coating layer is of a softer material than said threaded surfaces. The connector assembly further comprises means for removing excess coating material during make up of the pin member and the box member. | 02-05-2015 |
Martinus Johannes Maria Van Riet, Arnhem NL
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20110140522 | ELECTRICITY DISTRIBUTION SYSTEM, END USER RESIDENCE, AND METHOD - An electricity distribution system, arranged to provide low voltage to end users (for instance, transport means) and located at end user locations includes a first medium voltage line for providing medium voltage and several end user electricity providers associated with respective several end user locations. Each end user electricity provider is couplable to an end user located at the respective end user location, and is arranged to provide low voltage to the end user. The first medium voltage line is provided with a number of branches and the end user electricity providers are each couplable to a respective branch of the medium voltage line via a respective second medium voltage line to receive medium voltage, and are arranged to convert the medium voltage to the low voltage to be provided to an end user. | 06-16-2011 |
20120022813 | END USER ELECTRICITY NETWORK, USE, METHOD AND ASSEMBLY - An end user electricity network, connected to an electricity transmission cable via a main circuit breaker includes a primary part having a calibrated electrical meter that measures an amount of electricity consumed in the network, and a secondary part connected to the primary part that includes network parts connected electrically in parallel to each other in the network. The primary part further is provided with at least one first current sensor which is arranged to measure a total current running through the primary part. | 01-26-2012 |
Michael Van Riet, Sunnyvale, CA US
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20130137193 | SYSTEMS AND METHODS FOR PREPARATION OF SAMPLES FOR SUB-SURFACE DEFECT REVIEW - One embodiment relates to a method of preparation of a sample of a substrate for sub-surface review using a scanning electron microscope apparatus. A defect at a location indicated in a first results file is re-detected, and the location of the defect is marked with at least one discrete marking point having predetermined positioning relative to the location of the defect. The location of the defect may be determined relative to the design for the device, and a cut location and a cut angle may be determined in at least a partly-automated manner using that information. Another embodiment relates to a system for preparing a sample for sub-surface review. Another embodiment relates to a method for marking a defect for review on a target substrate. Other embodiments, aspects and feature are also disclosed. | 05-30-2013 |
Michael J. Van Riet, Sunnyvale, CA US
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20110320149 | Selecting One or More Parameters for Inspection of a Wafer - Computer-implemented methods, computer-readable media, and systems for selecting one or more parameters for inspection of a wafer are provided. | 12-29-2011 |
20120298862 | CONTOUR-BASED DEFECT DETECTION USING AN INSPECTION APPARATUS - One embodiment relates to a method of inspecting a site location on a target substrate. Contours are obtained, the contours having been generated from a reference image using a design clip. A target image of the site location is acquired. The contours are aligned to the target image, and contrast values are computed for pixels on the contours. A threshold is applied to the contrast values to determine contour-based defect blobs. Another embodiment relates to a method of generating contours for use in inspecting a site location for defects. Other embodiments, aspects and features are also disclosed. | 11-29-2012 |
20130064442 | Determining Design Coordinates for Wafer Defects - Methods and systems for determining design coordinates for defects detected on a wafer are provided. One method includes aligning a design for a wafer to defect review tool images for defects detected in multiple swaths on the wafer by an inspection tool, determining a position of each of the defects in design coordinates based on results of the aligning, separately determining a defect position offset for each of the multiple swaths based on the swath in which each of the defects was detected (swath correction factor), the design coordinates for each of the defects, and a position for each of the defects determined by the inspection tool, and determining design coordinates for the other defects detected in the multiple swaths by the inspection tool by applying the appropriate swath correction factor to those defects. | 03-14-2013 |
20140072203 | Selecting Parameters for Defect Detection Methods - Computer-implemented methods, computer-readable media, and systems for selecting one or more parameters for a defect detection method are provided. One method includes selecting one or more parameters of a defect detection method using an optimization function and information for a set of classified defects, which includes defects of interest and nuisance defects, such that the one or more parameters satisfy an objective for the defect detection method. | 03-13-2014 |
20140212024 | CONTOUR-BASED ARRAY INSPECTION OF PATTERNED DEFECTS - One embodiment relates to a method of inspecting an array of cells on a substrate. A reference image is generated using a cell image that was previously determined to be defect free. A reference contour image which includes contours of the reference image is also generated. The reference contour image is used to detect defects in the array of cells on the substrate. Another embodiment relates to a system for detecting defects in an array on a substrate. Other embodiments, aspects and features are also disclosed. | 07-31-2014 |
Michael J. Van Riet, Morgan Hill, CA US
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20090299681 | METHODS AND SYSTEMS FOR GENERATING INFORMATION TO BE USED FOR SELECTING VALUES FOR ONE OR MORE PARAMETERS OF A DETECTION ALGORITHM - Methods and systems for generating information to be used for selecting values for parameter(s) of a detection algorithm are provided. One method includes without user intervention performing a scan of an area of a wafer using an inspection system and default values for parameter(s) of a detection algorithm to detect defects on the wafer. The method also includes selecting a portion of the defects from results of the scan based on a predetermined maximum number of total defects to be used for selecting values for the parameter(s) of the detection algorithm. The method further includes storing information, which includes values for the parameter(s) of the detection algorithm determined for the defects in the portion. The information can be used to select the values for the parameter(s) of the detection algorithm to be used for the inspection recipe without performing an additional scan of the wafer subsequent to the scan. | 12-03-2009 |
Michael John Van Riet, Sunnyvale, CA US
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20110172804 | Scanner Performance Comparison And Matching Using Design And Defect Data - A system and method of matching multiple scanners using design and defect data are described. A golden wafer is processed using a golden tool. A second wafer is processed using a second tool. Both tools provide focus/exposure modulation. Wafer-level spatial signatures of critical structures for both wafers can be compared to evaluate the behavior of the scanners. Critical structures can be identified by binning defects on the golden wafer having similar patterns. In one embodiment, the signatures must match within a certain percentage or the second tool is characterized as a “no match”. Reticles can be compared in a similar manner, wherein the golden and second wafers are processed using a golden reticle and a second reticle, respectively. | 07-14-2011 |