| Patent application number | Description | Published |
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| 20120231184 | POLYSILOXANE-MODIFIED POLYHYDROXY POLYURETHANE RESIN, METHOD FOR PRODUCING SAME, HEAT-SENSITIVE RECORDING MATERIAL USING THE RESIN, IMITATION LEATHER, THERMOPLASTIC POLYOLEFIN RESIN SKIN MATERIAL, MATERIAL FOR WEATHER STRIP, AND WEATHER STRIP - Disclosed are a polysiloxane-modified polyhydroxy polyurethane resin characterized by being derived from a reaction between a 5-membered cyclic carbonate polysiloxane compound represented by the below-described formula (1) and an amine compound, and its production process; and a resin composition, thermal recording medium, imitation leather, thermoplastic polyolefin resin skin material, weather strip material, and weather strip, all of which make use of the resin. | 09-13-2012 |
| 20120232289 | FIVE-MEMBERED CYCLOCARBONATE POLYSILOXANE COMPOUND AND PROCESS FOR PREPARATION OF SAME - A 5-membered cyclic carbonate polysiloxane compound is represented by the below-described formula (1), and is produced by a process that reacts an epoxy-modified polysiloxane compound with carbon dioxide. | 09-13-2012 |
| 20120237701 | POLYSILOXANE-MODIFIED POLYHYDROXY POLYURETHANE RESIN, METHOD FOR PRODUCING SAME, HEAT-SENSITIVE RECORDING MATERIAL USING THE RESIN, IMITATION LEATHER, THERMOPLASTIC POLYOLEFIN RESIN SKIN MATERIAL, MATERIAL FOR WEATHER STRIP, AND WEATHER STRIP - Disclosed are a polysiloxane-modified polyhydroxy polyurethane resin derived from a reaction between a 5-membered cyclic carbonate compound and an amine-modified polysiloxane compound, and its production process; and a resin composition, thermal recording medium, imitation leather, thermoplastic polyolefin resin skin material, weather strip material, and weather strip, all of which make use of the resin. | 09-20-2012 |
| 20130095715 | SELF-CROSSLINKABLE POLYHYDROXY POLYURETHANE RESIN, RESINACEOUS MATERIAL THAT CONTAINS THE RESIN, PROCESS FOR PRODUCTION OF THE RESIN, AND IMITATION LEATHER, SURFACING MATERIAL AND WEATHERSTRIP MATERIAL, USING THE RESIN - Provided are a self-crosslinking polyhydroxy polyurethane resin derived from a reaction of a 5-membered cyclic carbonate compound and an amine compound and having masked isocyanate groups in its structure; a process for producing the resin; an imitation leather composed of a base fabric and a resin composition composed of the resin as its principal component and impregnated in or laminated on the base fabric; as kin material made of a thermoplastic polyolefin resin, said skin material including a thermoplastic polyolefin resin sheet and a top coat layer formed directly or via a primer layer on the sheet, wherein the top coat layer has been formed with a resin composition composed of the resin as its principal component; and a weather strip material composed, as its principal components, of the resin and a specific diorganopolysiloxane and/or a silicone oil. | 04-18-2013 |
| 20130171896 | SELF-CROSSLINKING POLYSILOXANE-MODIFIED POLYHYDROXY POLYURETHANE RESIN, RESIN MATERIAL CONTAINING SAME, METHOD FOR PRODUCING SAME, ARTIFICIAL LEATHER COMPRISING SAME, AND THERMOPLASTIC POLYOLEFIN SKIN MATERIAL COMPRISING SAME - Provided are a self-crosslinking polysiloxane-modified polyhydroxy polyurethane resin derived from a reaction of a 5-membered cyclic carbonate polysiloxane compound represented by the following formula (1) and an amine compound and having polysiloxane segments and masked isocyanate groups in its structure: | 07-04-2013 |
| 20130323491 | COATING COMPOSITION FOR FORMING GAS BARRIER LAYER, GAS BARRIER FILM, AND METHOD FOR PRODUCING GAS BARRIER FILM - Provided are a coating composition for forming a gas barrier layer as configured such that a specific compound having two or more 5-membered cyclic carbonate groups and a compound having two or more amino groups are reactable at an equivalent ratio of functional groups of 0.8 to 1.25 to form the gas barrier layer with a polyhydroxyurethane resin as a principal component; a gas barrier film formed of a single layer or multiple layers, at least one of the layer or layers that forms or form the film is a layer that exhibits gas barrier properties, and the layer is formed of a polyhydroxyurethane resin having a specific chemical structure; and a production method of a film having gas barrier properties. Owing to the use of the specific polyhydroxyurethane resin, the coating composition, gas barrier film and production method readily enable to reduce moisture-dependent variations in gas barrier properties, to avoid the production of noxious fumes upon incineration disposal, to provide excellent processability, and to lower the pollutant load on the environment. | 12-05-2013 |
| 20140024274 | SELF-CROSSLINKABLE POLYSILOXANE-MODIFIED POLYHYDROXY POLYURETHANE RESIN, PROCESS FOR PRODUCING SAID RESIN, RESIN MATERIAL COMPRISING SAID RESIN, AND ARTIFICIAL LEATHER PRODUCED UTILIZING SAID RESIN - A problem is to provide, in the field of polyhydroxy polyurethane resins the development of applications of which has not moved ahead by conventional technologies, a self-crosslinking polyhydroxy polyurethane resin, which enables to provide products, such as imitation leathers, excellent in abrasion resistance, chemical resistance, heat resistance and the like, and moreover, which is useful from the view point of a reduction in greenhouse gas, contains carbon dioxide incorporated and fixed therein, and is responsive to environmental conservation. Provided are a self-crosslinking, polysiloxane-modified, polyhydroxy polyurethane resin having masked isocyanate groups in a structure of a polysiloxane-modified, polyhydroxy polyurethane resin derived from a reaction of a | 01-23-2014 |
| 20140030526 | POLYHYDROXYURETHANE MICROPARTICLES, AND PROCESS FOR PRODUCING SAME - A problem is to provide polyhydroxyurethane microparticles, which have a narrow particle size distribution and are applicable to a wide range of use. Provided are polyhydroxyurethane microparticles which are spherical polymer microparticles having particle sizes of 0.1 μm to 300 μm. A polymer that makes up the polymer microparticles has in a structure thereof chemical structure units represented by the following formula (1) and/or chemical structure units represented by the following formula (2). In the chemical structure units (1) and (2), —O—CO— bonds have been derived from carbon dioxide. | 01-30-2014 |
| 20140235916 | METHOD FOR REMOVING RADIOACTIVE CESIUM, HYDROPHILIC RESIN COMPOSITION FOR REMOVAL OF RADIOACTIVE CESIUM, METHOD FOR REMOVING RADIOACTIVE IODINE AND RADIOACTIVE CESIUM, AND HYDROPHILIC RESIN COMPOSITION FOR REMOVAL OF RADIOACTIVE IODINE AND RADIOACTIVE CESIUM - A method for removing radioactive cesium and/or iodine from a radioactive substance in liquid and/or a solid matter using a hydrophilic resin composition comprising a hydrophilic resin and a metal ferrocyanide compound, wherein the hydrophilic resin includes at least one hydrophilic resin selected from the group consisting of a hydrophilic polyurethane resin, a hydrophilic polyurea resin, and a hydrophilic polyurethane-polyurea resin each having at least a hydrophilic segment, and a metal ferrocyanide compound is dispersed in the hydrophilic resin composition in a ratio of at least 1 to 200 mass parts relative to 100 mass parts of the hydrophilic resin. | 08-21-2014 |
| 20140288346 | METHOD FOR REMOVING RADIOACTIVE CESIUM, HYDROPHILIC RESIN COMPOSITION FOR REMOVING RADIOACTIVE CESIUM, METHOD FOR REMOVING RADIOACTIVE IODINE AND RADIOACTIVE CESIUM, AND HYDROPHILIC RESIN COMPOSITION FOR REMOVING RADIOACTIVE IODINE AND RADIOACTIVE CESIUM - The present invention intends to provide a method for removing radioactive cesium, or radioactive iodine and radioactive cesium that is simple and low-cost, further does not require an energy source such as electricity, moreover can take in and stably immobilize the removed radioactive substances within a solid, and can reduce the volume of radioactive waste as necessary, and to provide a hydrophilic resin composition using for the method for removing radioactive cesium, or radioactive iodine and radioactive cesium, and the object of the present invention is achieved by using a hydrophilic resin composition containing: at least one hydrophilic resin selected from the group consisting of a hydrophilic polyurethane resin, a hydrophilic polyurea resin, and a hydrophilic polyurethane-polyurea resin each having at least a hydrophilic segment; and a zeolite dispersed therein in a ratio of at least 1 to 200 mass parts relative to 100 mass parts of the hydrophilic resin. | 09-25-2014 |
| 20140364027 | POLYSILOXANE-MODIFIED POLYHYDROXY POLYURETHANE RESIN, METHOD FOR PRODUCING SAME, HEAT-SENSITIVE RECORDING MATERIAL USING THE RESIN, IMITATION LEATHER, THERMOPLASTIC POLYOLEFIN RESIN SKIN MATERIAL, MATERIAL FOR WEATHER STRIP, AND WEATHER STRIP - Disclosed are a polysiloxane-modified polyhydroxy polyurethane resin characterized by being derived from a reaction between a 5-membered cyclic carbonate polysiloxane compound represented by the below-described formula (1) and an amine compound, and its production process; and a resin composition, thermal recording medium, imitation leather, thermoplastic polyolefin resin skin material, weather strip material, and weather strip, all of which make use of the resin. | 12-11-2014 |
| 20150318064 | METHOD FOR REMOVING RADIOACTIVE CESIUM, HYDROPHILIC RESIN COMPOSITION FOR REMOVAL OF RADIOACTIVE CESIUM, METHOD FOR REMOVING RADIOACTIVE IODINE AND RADIOACTIVE CESIUM, AND HYDROPHILIC RESIN COMPOSITION FOR REMOVAL OF RADIOACTIVE IODINE AND RADIOACTIVE CESIUM - The present invention intends to provide a method for removing radioactive cesium, or radioactive iodine and radioactive cesium that is simple and low-cost, further does not require an energy source such as electricity, moreover can take in and stably immobilize the removed radioactive substances within a solid, and can reduce the volume of radioactive waste as necessary, and to provide a hydrophilic resin composition using for the method for removing radioactive cesium, or radioactive iodine and radioactive cesium, and the object of the present invention is achieved by using a hydrophilic resin composition containing: at least one hydrophilic resin selected from the group consisting of a hydrophilic polyurethane resin, a hydrophilic polyurea resin, and a hydrophilic polyurethane-polyurea resin each having at least a hydrophilic segment; and a clay mineral dispersed therein in a ratio of at least 1 to 180 mass parts relative to 100 mass parts of the hydrophilic resin. | 11-05-2015 |
| Patent application number | Description | Published |
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| 20130040093 | ADHESIVE FILM - The adhesive film includes a film-like adhesive layer, a light release separator and a heavy release separator that are laminated on either side of the adhesive layer, and a carrier film further laminated on the heavy release separator. The outer edges of the light release separator and the carrier film forming the outer layer extend outward beyond the outer edge of the adhesive layer and the heavy release separator forming the inner layer. The outer edge sections of the adhesive layer are thereby protected. The outer edge section of the carrier film is gripped and released first, after which the outer edge section of the light release separator is gripped and released, and finally the heavy release separator is released, thereby allowing each separator and the carrier film to be reliably and easily released in the prescribed order. | 02-14-2013 |
| 20130048921 | CONDUCTIVE MATERIAL - A conductive material used for connecting electrodes of a solar battery cell and wiring members, the conductive material comprising a resin binder; and a conductive particle dispersed in the resin binder, wherein the conductive particle comprises a phosphorous-containing copper alloy having a phosphorus content of 0.01% by mass or more and 8% by mass or less. | 02-28-2013 |
| 20130071596 | ADHESIVE FILM AND METHOD FOR PRODUCING THE SAME - An adhesive film includes a film-like adhesive layer and a pair of separators sandwiching the adhesive layer. The outer edges of both separators extend outward beyond the outer edge of the adhesive layer, and a blade is used to form a notch on the adhesive layer side of the heavy release separator, along the outer edge of the adhesive layer. The thickness of the heavy release separator is between 50 μm and 200 μm, the average notch depth is between 5 μm and 45 μm and the standard deviation for the notch depth is no greater than 15 μm. Specifying the notch depth allows complete cutting of the adhesive layer with the blade, while also limiting release problems between the heavy release separator and the adhesive layer. | 03-21-2013 |
| 20150239220 | ADHESIVE FILM - The adhesive film includes a film-like adhesive layer, a light release separator and a heavy release separator that are laminated on either side of the adhesive layer, and a carrier film further laminated on the heavy release separator. The outer edges of the light release separator and the carrier film forming the outer layer extend outward beyond the outer edge of the adhesive layer and the heavy release separator forming the inner layer. The outer edge sections of the adhesive layer are thereby protected. The outer edge section of the carrier film is gripped and released first, after which the outer edge section of the light release separator is gripped and released, and finally the heavy release separator is released, thereby allowing each separator and the carrier film to be reliably and easily released in the prescribed order. | 08-27-2015 |
| Patent application number | Description | Published |
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| 20080286594 | Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device - The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges. | 11-20-2008 |
| 20080305583 | Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device - The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges. | 12-11-2008 |
| 20090186216 | Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device - The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges. | 07-23-2009 |
| 20120068312 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 03-22-2012 |
| 20120073743 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 03-29-2012 |
| 20120135176 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 05-31-2012 |
| 20130045585 | ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE - The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges. | 02-21-2013 |
| 20130224932 | ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE - The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges. | 08-29-2013 |
| 20130295314 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 11-07-2013 |
| 20130302570 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 11-14-2013 |
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| 20090026993 | LOAD DRIVE CONTROL CIRCUIT - A load drive control circuit includes a drive circuit for driving a load. A control circuit, connected to the drive circuit by diagnostic lines, provides the drive circuit with a control command that specifies an operation state. The drive circuit drives the load in the operation state specified by the control command, generates a diagnostic output including diagnostic notification signals each having an H level or an L level, and provides the diagnostic notification signals of the diagnostic output to the control circuit. A signal output unit outputs first and second diagnostic outputs respectively in response to the first and second control command from the control circuit. A diagnostic line failure determination unit checks whether the first and second diagnostic outputs are both normal to determine whether the diagnostic lines includes a failure or not. | 01-29-2009 |
| 20100097737 | LOAD DRIVING DEVICE - A load driving device including a semiconductor switch arranged in a current path extending from a power supply to a load. A control circuit controls activation and deactivation of the semiconductor switch. The control circuit deactivates the semiconductor switch when it is determined that overcurrent is flowing through the current path. A current detector detects current that is flowing through the current path. The control circuit determines that overcurrent is flowing when the current detector continuously detects current that is greater than a threshold value over a predetermined detection time. The detection time is set to be shorter than the time from when the current in the current path exceeds the threshold value to when an increase in resistance value of the semiconductor switch resulting from heat generated by the current lowers the current to the threshold value. | 04-22-2010 |
| 20100102880 | LOAD DRIVE DEVICE - A load drive device has a load drive unit including an input system electrically connectable to a control power supply and an output system electrically connectable to a load drive power supply. The load drive unit supplies the electrical load with load drive voltage from the load drive power supply via the output system when the control power supply applies control voltage to the input system. A potential difference detection unit detects a potential difference between the control voltage and the load drive voltage. A potential fixing unit fixes a potential at a control system electrical route, connecting the control power supply and the input system of the load drive unit, to a prohibition level that prohibits the output system of the load drive unit from driving the electrical load when the potential difference detected by the potential difference detection unit exceeds a predetermined threshold value. | 04-29-2010 |
| 20120176040 | INDICATOR DRIVE CIRCUIT - An indicator drive circuit includes a current mirror circuit including a first transistor located at a control side and a second transistor located at a controlled side, a current through the current mirror circuit being switched by an external control signal, a current source adapted to feed a control current to the first transistor of the current mirror circuit, and a switching element adapted to be driven by a current through the second transistor of the current mirror circuit and to switch on or off an indicator light source. The current source includes two transistors cascode-connected. | 07-12-2012 |
