Patent application number | Description | Published |
20120252218 | BIPHENYL DERIVATIVE, RESIST BOTTOM LAYER MATERIAL, BOTTOM LAYER FORMING METHOD, AND PATTERNING PROCESS - A biphenyl derivative having formula (1) is provided wherein Ar1 and Ar2 denote a benzene or naphthalene ring, and x and z each are 0 or 1. A material comprising the biphenyl derivative or a polymer comprising recurring units of the biphenyl derivative is spin coated and heat treated to form a resist bottom layer having improved properties, optimum values of n and k, step coverage, etch resistance, heat resistance, solvent resistance, and minimized outgassing. | 10-04-2012 |
20130149645 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM - A chemically amplified negative resist composition is provided comprising (A) a resin having a crosslinking group, (B) a crosslinker, (C) a photoacid generator capable of generating an acid upon exposure to light of wavelength 190-500 nm, (D) a solvent, and (E) an isocyanuric acid. The resist composition overcomes the stripping problem that the film is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates. | 06-13-2013 |
20130196114 | SILICONE STRUCTURE-BEARING POLYMER, RESIN COMPOSITION, AND PHOTO-CURABLE DRY FILM - A silicone structure-bearing polymer having a crosslinking group within the molecule, containing an isocyanurate structure bonded within the molecule, and having a Mw of 3,000-500,000 is provided. The polymer overcomes the stripping problem that a coating is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates. | 08-01-2013 |
20150293447 | SILICONE STRUCTURE-BEARING POLYMER, RESIN COMPOSITION, AND PHOTO-CURABLE DRY FILM - A silicone structure-bearing polymer having a crosslinking group within the molecule, containing an isocyanurate structure bonded within the molecule, and having a Mw of 3,000-500,000 is provided. The polymer overcomes the stripping problem that a coating is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates. | 10-15-2015 |
20160033865 | SILICONE STRUCTURE-BEARING POLYMER, NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, AND ELECTRIC/ELECTRONIC PART-PROTECTING FILM - A silicone structure-bearing polymer comprising recurring units derived from a bis(4-hydroxy-3-allylphenyl) derivative and having a Mw of 3,000-500,000 is provided. A chemically amplified negative resist composition comprising the polymer overcomes the stripping problem that a coating is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates. | 02-04-2016 |
Patent application number | Description | Published |
20140205951 | THERMAL CROSSLINKING ACCELERATOR, POLYSILOXANE-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING SAME, AND PATTERNING PROCESS USING SAME - A thermal crosslinking accelerator of a polysiloxane compound is shown by the following general formula (A-1), | 07-24-2014 |
20150056545 | POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND PRODUCTION METHOD THEREOF, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE - A polymer compound has a carboxyl group and a siloxane chain and is obtained in the presence of an acid catalyst by condensation of at least; (I) a siloxane compound having phenol groups at both terminals, as shown by formula (1), (II) phenols shown by formula (2) and/or phenols shown by formula (3), and (III) one or more kinds of aldehydes and ketones shown by the following general formula (4). A polymer compound can be used suitably as a base resin of a chemically amplified negative resist composition with which the problem of delamination generated on metal wires, an electrode, and a substrate, can be improved, and with which a fine pattern can be formed without generating a scum and a footing profile in the pattern bottom and on the substrate, using a widely used aqueous 2.38% TMAH solution as a developer. | 02-26-2015 |
20150198883 | NEGATIVE RESIST COMPOSITION AND PATTERNING PROCESS USING SAME - A negative resist composition containing as base resin a novolak resin having repeating unit “a”, | 07-16-2015 |
20150370166 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE - A positive photosensitive resin composition containing a polymer compound obtained in the presence of an acid catalyst by condensation of at least a siloxane compound shown by formula (1), a phenol compounds shown by formula (2) and/or formula (3), and aldehydes and ketones shown by formula (4), a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, a crosslinker, and a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination generated on metal wiring, electrode, and substrate such as Cu and Al, especially on substrate SiN, and can form fine pattern having forward tapered shape without generating scum and footing profile in the pattern bottom and on the substrate when the widely used 2.38% TMAH aqueous solution is used as a developer. | 12-24-2015 |
20160097973 | SILICONE SKELETON-CONTAINING POLYMER COMPOUND AND METHOD FOR PRODUCING SAME, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, PATTERNING PROCESS, LAYERED PRODUCT, AND SUBSTRATE - The present invention provides a silicone skeleton-containing polymer compound containing a repeating unit shown by the general formula (1) and having a weight average molecular weight of 3,000 to 500,000. There can be provided a silicone skeleton-containing polymer compound suitable used as a base resin of a chemically amplified negative resist composition that can remedy the problem of delamination generated on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern without generating a scum and a footing profile in the pattern bottom and on the substrate when the widely used 2.38% TMAH aqueous solution is used as a developer. | 04-07-2016 |
Patent application number | Description | Published |
20130323574 | ELECTRIC CELLS AND ASSEMBLED BATTERY - An electric cell comprises: a power generating element including electrodes; a cell container including a cell case for housing the power generating element and a cell cover for sealing an opening of the cell case; two external terminals disposed on the cell cover; and two collector electrodes for connecting the electrodes of the power generating element to the external terminals; wherein each of the external terminals includes: a connector connected to one of the collector electrodes within the cell container; a flat section located right above the connector and exposed to the outside of the cell container; and a bolting section located adjacent to the flat section and having an insertion hole, and wherein the connector, the flat section, and the bolting section are integrally formed. The electric cell allows connection of external terminals to busbars either by bolting or welding. | 12-05-2013 |
20140141293 | PRISMATIC STORAGE BATTERY - A safety valve is integrally formed in a battery lid together with a peripheral wall portion by press and the like. The safety valve is formed in contact with the peripheral wall portion, at the bottom portion of the depressed portion depressed from the upper surface of the base portion of the battery lid. The upper surface of the safety valve is located below the lower surface of the base portion. When pressing force parallel to the upper surface of the battery lid is exerted on the inner peripheral surface of the peripheral wall portion while the connection tube and the like is connected, the pressing force can be supported by the entire thickness (plate thickness) of the base portion. | 05-22-2014 |
20140377607 | SECONDARY BATTERY - A secondary battery includes improved insulation properties between an electrode group and a battery container against an external force can be improved without lowering the battery capacity. The secondary battery of the present invention has: a wound electrode group formed by winding electrodes in which mixture layers are formed on metal foils; a battery container for housing the wound electrode group; and an insulator interposed between the wound electrode group and the battery container. The insulator has a section interposed between the battery container and a mixture layer laminated region formed at the center of the wound electrode group in the winding axis direction, and a section interposed between the battery container and a pair of metal foil exposed portions formed on both sides of the wound electrode group in the winding axis direction, wherein the latter region is thicker than the former region. | 12-25-2014 |
20150194651 | SQUARE SECONDARY BATTERY - A square secondary battery suppresses welding failure from occurring by temporarily retaining and securing a sealing cover and enabling detection by a leakage test even when welding failure occurs. The square secondary battery has a case surface portion with an injection opening for injecting an electrolyte, a sealing cover disposed at a position opposite to the case surface portion and sealing the injection opening and having an outer edge welded to the case surface portion to seal the injection opening, and a pressure sensitive adhesive member interposed between the sealing cover and the case surface portion for securing the sealing cover to the case surface portion. A gas passage is provided between the case surface portion and the sealing cover for communicating a gap formed at a position outer to the pressure sensitive adhesive member with respect to a battery case and the injection opening in a ventilation manner. | 07-09-2015 |
20150207128 | SQUARE SECONDARY BATTERY - A square secondary battery includes a generating element having an electrode; a battery can holding the generating element; a battery lid that seals an opening of the battery can; an external terminal arranged on the battery lid; and a current collector connecting the electrode of the generating element to the external terminal. The external terminal has a bus bar joint to which a bus bar is connected and a current collector joint to which the current collector is connected, the bus bar joint and the current collector joint being integrally juxtaposed on the battery lid. The current collector joint has a cylindrical insertion part to be inserted into a through hole in the battery lid and also has a sealing part arranged at an outer periphery of the insertion part, the sealing part pressing down a sealing member. | 07-23-2015 |
20150243961 | RECTANGULAR SECONDARY BATTERY - A rectangular secondary battery includes a current breaking mechanism with improved rigidity against vibration and impact. The current breaking mechanism is interposed in the middle of a current path electrically connected between an external terminal and a wound electrode group to break the current path by the rise of battery internal pressure. The current breaking mechanism includes a connection electrode arranged inside a battery lid and electrically connected to the external terminal, and a conductive plate bonded to the connection electrode and deformed by the rise of the battery internal pressure. The connection electrode includes a tabular member having a through hole in communication with the outside of the battery opening on a planar portion. The conductive plate includes a dome-shaped diaphragm portion gradually reducing its diameter as shifting in an axial direction and a flange portion extending radially outward from an outer peripheral portion of the diaphragm portion. | 08-27-2015 |
20150380712 | Electrical Storage Element - An electrical storage element includes a power generation element that includes an electrode, a can in which the power generation element is stored, a lid that seals an opening of the can, an external terminal that is disposed on the lid, and a current collector that connects the electrode of the power generation element, and the external terminal. The external terminal includes a bus bar welding portion having a bus bar welding surface to which a bus bar is welded, and a current collector connection portion having a caulking-jig abutting surface, the current collector connection portion includes an insertion portion which is inserted into a through-hole of the lid and has a tip end which is fixed to the current collector by caulking, the bus bar welding portion and the current collector connection portion are integrally provided in parallel on the lid, and the jig abutting surface is extended from the bus bar welding surface in the same plane as the bus bar welding surface. | 12-31-2015 |
Patent application number | Description | Published |
20140062320 | LIGHTING CONTROL CIRCUIT, LAMP, AND LIGHTING CONTROL METHOD USING THE LIGHTING CONTROL CIRCUIT - A lighting control circuit includes a rectifier connected to an electric ballast to which a commercial AC power is supplied, and configured to convert an AC to a DC, a series light emitter a plurality of solid-state light-emitting elements is connected in series, a smoothing capacitor provided in parallel with the series light emitter in a current supply line between the rectifier and the series light emitter, and configured to eliminate an AC component included in the DC from an output side of the rectifier, and a switching control circuit configured to generate an output voltage equal to an output voltage from the electric ballast when a fluorescent lamp starts up upon the connection of the fluorescent lamp to the electric ballast as a startup voltage in the startup of the series light emitter. | 03-06-2014 |
20160119991 | ILLUMINATION LAMP AND ILLUMINATION DEVICE - An illumination lamp includes: an input portion connectable to any one of power supply portions for two or more starting methods including a rapid-start method; a voltage detection circuit configured to detect a voltage applied from a power supply portion; and a control portion including at least one first voltage supply portion configured to supply a voltage suitably for the rapid-start method to a semiconductor light-emitting device, and at least one second voltage supply portion configured to supply a voltage suitably for the other fluorescent-lamp starting method to the semiconductor light-emitting device. The control portion causes, if the voltage is detected by the voltage detection circuit, the first voltage supply portion to supply a voltage to the semiconductor light-emitting device, but causing, if the voltage is not detected by the voltage detection circuit, the second voltage supply portion to supply a voltage to the semiconductor light-emitting device. | 04-28-2016 |
Patent application number | Description | Published |
20120141012 | APPARATUS AND METHOD FOR INSPECTING DEFECT - A defect inspection apparatus includes an illumination optical system which irradiates an inspection subject under a predetermined optical condition, a detection optical system which obtains image data by detecting a scattered light from the inspection subject irradiated by the illumination optical system, and an image processing unit provided with a defect candidate detection unit which detects defect candidates with respect to plural image data obtained by the detection optical system under different conditions, and a post-inspection processing unit which executes a defect determination by integrating the defect candidates with respect to the plural image data. | 06-07-2012 |
20120229618 | DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD - Disclosed is a defect inspection device that has an illumination optical system; a detection optical system; and a processing unit which includes a defect feature quantity calculation unit that calculates the feature quantities of each defect candidate, a defect candidate grouping unit that groups the aforementioned defect candidates on the basis of the feature quantities, a defect classification evaluation value calculation unit that calculates defect classification evaluation values for the aforementioned defect candidates, a defect classification evaluation value updating unit that, on the basis of instructions, updates the evaluation values, a defect classification threshold determination unit that, on the basis of evaluation valued updated by the aforementioned defect classification evaluation value updating unit, determines a classification boundary that is a threshold for classifying defect types of the aforementioned defect candidates, and a defect detection unit that detects defects using the thresholds. | 09-13-2012 |
20120293795 | DEFECT INSPECTION DEVICE AND METHOD OF INSPECTING DEFECT - Disclosed is a defect inspection device comprising: an illumination optical portion which illuminates an object to be inspected with illuminating light; a detection optical portion system illuminated by the illumination optical portion and provided with a plurality of detectors which respectively detects components of scattering light which scatter from the inspected object each in a different direction of azimuthal angle or in a different direction of angle of elevation with respect to a surface of the inspected object; and a signal processing portion which makes gain adjustments and defect decisions in parallel on plural signals based on the components of the scattering light from the inspected object detected by the detectors, respectively, the defect decisions being based on a threshold value decision, and which extracts defects based on results of the gain adjustments and of the defect decisions. | 11-22-2012 |
20130202188 | DEFECT INSPECTION METHOD, DEFECT INSPECTION APPARATUS, PROGRAM PRODUCT AND OUTPUT UNIT - A defect inspection method has the following steps. An irradiation step of irradiating illumination light on an object. A detection step of detecting scattered light from the object. A defect detection step having the following steps. A first pixel-value information acquisition step of dividing an image based on the scattered light into multiple areas and obtaining first pixel value information, information of the pixel value about each of the multiple areas. A second pixel-value information acquisition step of acquiring second pixel value information, information of the pixel value about all the areas by processing the first pixel value information obtained. A similarity calculation step of calculating the similarity between each image of the multiple areas and the image of all the areas by comparing the first and the second pixel value information. A defect extraction step of extracting a defect of the object using the calculated similarity. | 08-08-2013 |
20130294677 | DEFECT INSPECTION METHOD AND DEFECT INSPECTION DEVICE - There is provided a defect inspection method including the steps of: acquiring image data sets of a sample under a plurality of imaging conditions; storing a plurality of image data sets acquired under the plurality of imaging conditions in an image storage unit; acquiring a defect candidate from each of the plurality of image data sets; cutting out, from the image data sets acquired under at least two imaging conditions and stored in the image storage unit, a partial images each including a position of the defect candidate detected in any of the plurality of image data sets and the periphery of the defect candidate position; and integrating the partial images acquired under at least two imaging conditions corresponding to the defect candidates, thereby classifying the defect candidates. | 11-07-2013 |
Patent application number | Description | Published |
20120287602 | LIGHTING APPARATUS - A lighting apparatus comprising: an elongated-shaped LED unit provided with a plurality of lighting units on one surface in the thickness direction thereof, each of said lighting units having a LED chip; a reflective plate held by a main body; a lighting device for lighting the LED unit; and a heat radiation block to which said LED unit being replaceably attached, configured to dissipate the heat generated in the LED unit, and arranged at the other surface side in the thickness direction of the LED unit. The reflective plate has an installation portion for installing the LED unit. The heat radiation block is held by the reflective plate. The LED unit has a flat portion at light extracting surface from the lighting unit. The flat portion has the same plane with a surrounding area of the installation portion in a reflective surface of the reflective plate. | 11-15-2012 |
20130070452 | LEAD FRAME, WIRING BOARD, LIGHT EMITTING UNIT, AND ILLUMINATING APPARATUS - Provided is lead frame in which a wiring pattern supported by a support piece inside of a one-pitch outer frame section comprises a plurality of base units, each of which comprises a die pad on which a solid-state light emitting element is mounted, a heat sink extending from die pad so as to surround die pad electrically connected to one electrode of the element, and a lead electrically connected to the other electrode of the element. Lead of one base unit among adjacent base units and heat sink of the other base unit are coupled and electrically connected in series. Increase in temperature of the element is inhibited, light output is increased, and cost of a light emitting unit in which a plurality of solid-state light emitting elements connected in series are used is reduced. Also provided are wiring board, light emitting unit, and illuminating apparatus. | 03-21-2013 |
20150048402 | LIGHT-EMITTING DEVICE - A light-emitting device in accordance with the present invention includes a mounting substrate; an LED chip bonded to a surface of the mounting substrate with a bond; and an encapsulating portion covering the LED chip. The bond transmits light from the LED chip. The mounting substrate includes: a light-transmissive member having a planar size larger than that of the LED chip; and first and second penetrating wirings which penetrate the light-transmissive member in the thickness direction thereof and are electrically connected to first and second electrodes of the LED chip via first and second wires, respectively. The light-transmissive member includes at least two light-transmissive layers with different optical properties which are stacked in the thickness direction. A light-transmissive layer of the light-transmissive layers which is farther from the LED chip is higher in reflectance to the light. | 02-19-2015 |
20150077982 | LED MODULE, LIGHTING DEVICE, AND LAMP - An LED module includes: an opaque substrate on which a wiring circuit is provided; a submount bonded to a surface of the opaque substrate with a first bond; an LED chip bonded with a second bond to an opposite side of the submount from the opaque substrate; and wires electrically connecting the LED chip to patterned wiring circuit. In the LED module, the first bond and the second bond each allow light emitted from the LED chip to pass therethrough. The submount is a light-transmissive member. A lighting device includes a device main body and the LED module. The lamp includes the LED module. | 03-19-2015 |
20150108510 | LED MODULE - The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate. | 04-23-2015 |
20150137149 | LED MODULE AND METHOD OF PREPARING THE LED MODULE, LIGHTING DEVICE - An LED module includes a submount having a face in a thickness direction thereof, an LED chip bonded to the face of the submount with a first bond, and a patterned wiring circuit electrically connected to the LED chip. The first bond transmits light emitted from the LED chip. The submount is a light-transmissive member having light diffusing properties, and a planar size larger than a planar size of the LED chip. The patterned wiring circuit is provided on the face of the submount so as not to overlap the LED chip. The submount is constituted by a plurality of light-transmissive layers which are stacked in the thickness direction and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip. | 05-21-2015 |