Patent application number | Description | Published |
20100164289 | METHOD AND SYSTEM FOR VOLTAGE INDEPENDENT POWER SUPPLY LOAD SHARING - An apparatus and method for load sharing among N current supplies, where N>1. N current supply paths are coupled to corresponding N independent power sources, respectively. A system load is coupled to the outputs of the N current supply paths to receive N current supplies. There is a common current share bus configured to connect to the N current supply paths to provide a common current share signal, used to indicate the current contribution needed from each of the N current supply paths. In this configuration, each of the N current supply paths adjusts an adjustable voltage drop between its power source and the current supply it provides to the system load in accordance with the common current share signal so that the current supplied from each current supply path is consistent with the common current share signal. | 07-01-2010 |
20100225294 | INRUSH CURRENT CONTROL SYSTEM WITH SOFT START CIRCUIT AND METHOD - A method of and system for controlling the inrush current generated in a MOSFET of an inrush current control system, wherein the MOSFET includes a source, gate and drain. The dV/dt at the drain of the MOSFET is controlled so as to set the inrush current level as a function of dV/dt, independent of current limit without requiring a separate capacitor connected between the gate and drain of the MOSFET so that the MOSFET can turn on and off more quickly. | 09-09-2010 |
20150015300 | DETECTING FAULTS IN HOT-SWAP APPLICATIONS - Circuitry for detecting faults in a system for supplying power from an input node to an output node and having at least one switch coupled between the input node and the output node. The fault detecting circuitry is configured for indicating a fault condition of the switch when the switch is commanded to turn on and at least one of the following conditions is detected: a voltage across the switch exceeds a predetermined value or a value of the switch control signal is insufficient to turn the switch on. The fault condition is indicated only if the detected condition is present for a predetermined period of time. | 01-15-2015 |
20150016005 | INRUSH CONTROL WITH MULTIPLE SWITCHES - A novel system is offered for supplying power from an input node to a load coupled to an output node. The system may have multiple switches coupled between the input node and the output node. One or more limiting circuits may be configured for controlling the switches so as to limit outputs of the switches. For example, the limiting circuits may limit current through the respective switches. One or more timers may set a delay period for indicating a fault condition after the limiting is initiated. | 01-15-2015 |
Patent application number | Description | Published |
20130021232 | APPARATUS, SYSTEM, AND METHOD FOR PROVIDING FEEDBACK SENSATIONS OF TEMPERATURE, TEXTURE, AND HARDNESS-SOFTNESS TO A CONTROLLER - Described herein are hand-held controller, system, and method for providing real-time programmable sensations of texture, hardness-softness, and temperature (thermal) to the hand-held controller. The hand-held controller comprises a first region configured to be touched by a user and to provide a real-time programmable hardness-softness sensation to the user in response to a first trigger signal generated by an interactive program; a second region to be touched by the user and to provide real-time programmable hardness-softness sensations to the user in response to a second trigger signal generated by the interactive program; and a third region to be touched by the user and to provide real-time programmable thermal sensations to the user in response to a third trigger signal generated by the interactive program. | 01-24-2013 |
20130021233 | APPARATUS, SYSTEM, AND METHOD FOR PROVIDING FEEDBACK SENSATIONS OF TEMPERATURE AND HARDNESS-SOFTNESS TO A CONTROLLER - Described herein are hand-held controller, system, and method for providing real-time sensations of temperature and/or hardness-softness to the hand-held controller. The hand-held controller comprises a first region configured to be touched by a user and to provide a real-time computer programmable hardness-softness sensation to the user in response to a first trigger signal generated by an interactive program; and a first mechanism, coupled to the first region, to cause the first region to harden relative to a first state, and to cause the first region to soften relative to a second state. | 01-24-2013 |
20130021234 | APPARATUS, SYSTEM, AND METHOD FOR PROVIDING FEEDBACK SENSATIONS OF TEMPERATURE AND TEXTURE TO A CONTROLLER - Described herein are hand-held controller, system, and method for providing real-time sensations of temperature and texture to a user of the hand-held controller. The hand-held controller comprises a first region to be touched by a user and to provide a real-time computer programmable texture sensation to a user in response to a first trigger signal generated by an interactive program; and a first mechanism, coupled to the first region, to cause the first region to roughen relative to a first state, and to cause the first region to smooth relative to a second state. | 01-24-2013 |
20130021235 | APPARATUS, SYSTEM, AND METHOD FOR PROVIDING FEEDBACK SENSATIONS OF TEXTURE AND HARDNESS-SOFTNESS TO A CONTROLLER - Described herein are hand-held controller, system, and method for providing real-time sensations of texture and hardness-softness to a user of the hand-held controller. The hand-held controller comprises a first region to be touched by a user and to provide real-time computer programmable texture sensations to the user in response to a first trigger signal generated by an interactive program; and a second region to be touched by the user and to provide real-time computer programmable hardness-softness sensations to the user in response to a second trigger signal generated by the interactive program. | 01-24-2013 |
20150092965 | METHOD OF IMPROVING EXTERNALIZATION OF VIRTUAL SURROUND SOUND - Aspects of the present disclosure relate to techniques for processing a source audio signal in order to localize sounds. In particular, aspects of the present disclosure relate to sound localization techniques which externalize sounds for headphone audio, such as a virtual surround sound headphone system. In various implementations, room reverberations and other acoustic effects of the environment may be more accurately modeled using improved room reverberation models. For example, in some implementations, the underlying source signal may be filtered with a filter representing a room impulse response that is a combination of a stereo room impulse response and a mono room impulse response. By way of further example, in some implementations the source signal may be filtered with a combined impulse response filter that is derived from binaural recordings of simulated impulses recorded in a desired reverberant environment. | 04-02-2015 |
Patent application number | Description | Published |
20140070376 | Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements - A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole in the carrier includes: selectively removing carrier material, thereby forming a cavity in the carrier, forming passivation material over one or more cavity walls exposed by the selective removal of the carrier material; selectively removing a portion of the passivation material and further carrier material exposed by the selective removal of the passivation material, wherein a further portion of the passivation material remains over at least one cavity side wall; the method further including subsequently forming a layer over the further portion of passivation material remaining over the at least one cavity side wall. | 03-13-2014 |
20140338827 | Substrate Removal from a Carrier - Methods and apparatuses are provided where a parting agent is applied to at least one portion of a substrate. The at least one portion of the substrate is removed from a carrier. | 11-20-2014 |
20150115417 | METHODS FOR MANUFACTURING A CHIP ARRANGEMENT, METHODS FOR MANUFACTURING A CHIP PACKAGE, A CHIP PACKAGE AND CHIP ARRANGEMENTS - A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole in the carrier includes: selectively removing carrier material, thereby forming a cavity in the carrier, forming passivation material over one or more cavity walls exposed by the selective removal of the carrier material; selectively removing a portion of the passivation material and further carrier material exposed by the selective removal of the passivation material, wherein a further portion of the passivation material remains over at least one cavity side wall; the method further including subsequently forming a layer over the further portion of passivation material remaining over the at least one cavity side wall. | 04-30-2015 |