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Umesh C. Desai, Wexford US

Umesh C. Desai, Wexford, PA US

Patent application numberDescriptionPublished
20100003506COATED ARTICLES DEMONSTRATING HEAT REDUCTION AND NOISE REDUCTION PROPERTIES - Coated articles are provided comprising: 01-07-2010
20100004353WATERBORNE FILM-FORMING COMPOSITIONS HAVING HEAT REFLECTIVE PROPERTIES - Curable compositions are provided comprising: 01-07-2010
20100004369LOW DENSITY VISCOELASTIC COMPOSITION HAVING DAMPING PROPERTIES - Curable compositions are provided comprising: 01-07-2010
20100258371WATERBORNE FILM-FORMING COMPOSITIONS HAVING HEAT REFLECTIVE PROPERTIES - A heat reflective system in which a curable composition is deposited and cured onto a substrate, wherein the curable composition comprises: (a) a resinous binder comprising a polyamideimide, a polyepoxide and/or a polysiloxane; and (b) a metallic reflective pigment. After application to a surface of a substrate and after curing, when the coated surface is exposed to a heat source having a temperature up to 390° C. at a distance of at least ½ inch (1.27 cm), the reverse side of the substrate is at least 20 Celsius degrees lower than the temperature of the reverse side of a similar substrate without the curable film-forming composition.10-14-2010
20110037013COATINGS COMPRISING ITACONATE LATEX PARTICLES AND METHODS FOR USING THE SAME - Coatings comprising a latex particle comprising the reaction product of itaconic acid/anhydride and a monoalcohol, a monoepoxide, a monoamine or mixtures thereof are disclosed. Methods for using such coatings, particularly for inhibiting sound and/or vibration transmission through a substrate, are also disclosed.02-17-2011
20120128499STRUCTURAL ADHESIVE COMPOSITIONS - Disclosed herein are 2K structural adhesive compositions comprising (a) a first component comprising (i) an epoxy-adduct formed as a reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid; and (ii) a second epoxy compound; and (b) a second component that reacts with the first component. In one embodiment, the second component is an amine compound. These adhesives may be used to bond together substrate materials such as two half shells of wind turbine blades.05-24-2012
20120129980STRUCTURAL ADHESIVE COMPOSITIONS - Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct.05-24-2012
20120211160ADHESIVE COMPOSITIONS CONTAINING GRAPHENIC CARBON PARTICLES - Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having a compressed density of 0.9 or less. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.08-23-2012
20140150970STRUCTURAL ADHESIVE COMPOSITIONS - Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.06-05-2014
20140299270ADHESIVE COMPOSITIONS CONTAINING GRAPHENIC CARBON PARTICLES - Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having an oxygen content of no more than 2 atomic weight percent. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.10-09-2014

Patent applications by Umesh C. Desai, Wexford, PA US

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