Umbach
Brian Umbach, Millstone, NJ US
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20150022080 | Cathode Assembly For Use In A Radiation Generator - A cathode assembly is for use in a radiation generator and includes an ohmically heated cathode, and a support having formed therein a hole and a recess at least partially surrounding the hole. In addition, there is a mount coupled to the support. The mount includes a larger outer frame positioned within the recess, a smaller inner frame carrying the ohmically heated cathode and spaced apart from the larger outer frame, and a plurality of members coupling the smaller inner frame to the larger outer frame. | 01-22-2015 |
Brian Umbach, North Caldwell, NY US
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20100318130 | FLEXIBLE ROD ASSEMBLY FOR SPINAL FIXATION - A flexible spinal fixation rod assembly that provides relatively stiff bending compliance provided by a core rod or tube that is connected to surrounding spring and associated couplings in such a way that when the core rod is bent, the spring extends and the associated couplings move away from each other, with the core rod generating a force tending to return the core rod to its unbent configuration thereof and the spring generating a force tending to return the couplings to there unextended configuration thereof. Couplings connect each end of the rod or tube to corresponding pedicle screws for attachment to corresponding vertebrae. As the spine bends, this arrangement allows the spine to bend against limited resistance, exhibiting the necessary axial and compressive strength, and applies force to return the spine to its original configuration. | 12-16-2010 |
Brian Umbach, North Coldwell, NJ US
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20110266178 | Autoclavable Medical Instrument Case For Reduced Instrument Corrosion - A case for storing medical instruments contains a rotating bracket for holding the instruments. The bracket is connected to the tray and hinged lid of the case via a movable frame, and the bracket movement is controlled by opening and closing of the lid. When the lid is closed, the bracket points the tips of the instruments downward to minimize water collection; and when the lid is opened, the instrument holding bracket rotates so that the instruments it holds are moved to a vertical position, facilitating instrument selection. | 11-03-2011 |
Dan Umbach, Brighton, MI US
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20140109075 | MODULE UPDATING DEVICE - An automobile, vehicle, vessel or other device may include a plurality of modules, software applications, computer program products, controllers or other logically executing entities to facilitate controlling, implementing or otherwise enabling various operations according to computer-readable instructions, code or other information stored within a memory, such as within a file or other memory construct. A controller having capabilities sufficient to facilitate updating, modifying, creating or otherwise manipulating such stored files and/or corresponding instructions is contemplated. | 04-17-2014 |
20140351803 | MODULE UPDATING DEVICE - An automobile, vehicle, vessel or other device may include a plurality of modules, software applications, computer program products, controllers or other logically executing entities to facilitate controlling, implementing or otherwise enabling various operations according to computer-readable instructions, code or other information stored within a memory, such as within a file or other memory construct. A controller having capabilities sufficient to facilitate updating, modifying, creating or otherwise manipulating such stored files and/or corresponding instructions is contemplated. | 11-27-2014 |
Frank Umbach, Munich DE
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20150115391 | Semiconductor Device Having a Locally Reinforced Metallization Structure and Method for Manufacturing Thereof - A method for forming a semiconductor device includes providing a semiconductor substrate having a first area and a second area. A first metal layer structure is formed which includes at least a first metal portion in the first area and a second metal portion in the second area. A plating mask is formed on the first metal layer structure to cover the second metal portion, and a second metal layer structure is plated on and in ohmic contact with the first metal portion of the first metal layer structure. | 04-30-2015 |
Frank Umbach, Munchen DE
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20090267200 | METHOD FOR MANUFACTURING A SEMICONDUCTOR SUBSTRATE INCLUDING LASER ANNEALING - A method for manufacturing a semiconductor device by laser annealing. One embodiment provides a semiconductor substrate having a first surface and a second surface. The second surface is arranged opposite to the first surface. A first dopant is introduced into the semiconductor substrate at the second surface such that its peak doping concentration in the semiconductor substrate is located at a first depth with respect to the second surface. A second dopant is introduced into the semiconductor surface at the second surface such that its peak doping concentration in the semiconductor substrate is located at a second depth with respect to the second surface, wherein the first depth is larger than the second depth. At least a first laser anneal is performed by directing at least one laser beam pulse onto the second surface to melt the semiconductor substrate, at least in sections, at the second surface. | 10-29-2009 |
Frank Umbach, Muenchen DE
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20140077376 | SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP AND METHOD FOR SOLDERING A SEMICONDUCTOR CHIP TO A CARRIER - A semiconductor chip includes a semiconductor body and a chip metallization applied on the semiconductor body. The chip metallization has an underside facing away from the semiconductor body. The chip further includes a layer stack applied to the underside of the chip metallization and having a number N1≧1 or N1≧2 of first partial layers and a number N2≧2 of second partial layers. The first partial layers and the second partial layers are arranged alternately and successively such that at least one of the second partial layers is arranged between the first partial layers of each first pair of the first partial layers and such that at least one of the first partial layers is arranged between the second partial layers of each second pair of the second partial layers. | 03-20-2014 |
Frank Umbach, Hagen DE
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20130244507 | INSERTION CONTACT FOR ARRANGEMENT AT A CONTACT SUPPORT - The invention relates to an insertion contact for arrangement at a contact support including an opposite contact, the insertion contact including a contact arm which contacts a first contact surface of an opposite contact in an electrically conductive manner which opposite contact is arranged on a top side of a contact support; a support arm which contacts a bottom side of the contact support; and a connection arm which arranges the contact arm at the support arm, wherein the contact arm and/or the support arm is deflectable in a spring elastic manner, wherein the insertion contact includes a connection member for connecting a conductor, wherein the insertion contact is configured as a stamped component. It is an object of the invention to provide insertion contacts which facilitate reducing grid pitches of plug connectors, in particular according to Rast 2.5 standard, while maintaining predetermined technical specifications. | 09-19-2013 |
Gert Umbach, Gundelfingen DE
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20090252210 | CIRCUIT ARRANGEMENT, APPARATUS AND PROCESS FOR THE SERIAL SENDING OF DATA VIA A CONNECTION CONTACT - The invention relates to an integrated circuit arrangement with connection contacts for the serial exchange of data and/or signals with external components and apparatuses and with a control apparatus and/or a serial interface for the clocked receiving of data by means of a signal voltage on such a connection contact, which voltage is modulated between at least one low, one middle and one high voltage state. The control apparatus and/or the interface are designed in such a manner that data is sent in a sending mode via the connection contact in that the switching apparatus, after having received a slope changing in particular from the middle voltage state into in particular the higher or the lower voltage state, pulls the voltage state into the in particular opposite lower or higher voltage state. Furthermore, the invention relates to an apparatus and a process for operating such a circuit arrangement. | 10-08-2009 |
Jeffrey A. Umbach, Palm Beach Garden, FL US
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20130223672 | METHOD OF DETECTING MATERIAL IN A PART - A method includes the steps of producing a first digital x-ray image of a part utilizing a full energy spectrum, producing a second digital x-ray image of the part with a hardened beam correlating to a higher energy portion of the full energy spectrum, subtracting the second x-ray image from the first x-ray image, and using a remainder of the subtracting step to locate the matter. | 08-29-2013 |
Jeffrey A. Umbach, Palm Beach Gardens, FL US
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20130160553 | ENERGY ABSORBENTULTRASONIC INSPECTION SYSTEM WITH LASER POINTER - A system is provided for inspecting a workpiece that includes a workpiece defect and a workpiece surface. The system includes a laser pointer connected to an ultrasonic inspection system. The ultrasonic inspection system includes an ultrasonic transducer that directs sound waves to the workpiece defect, where the sound waves contact the workpiece surface at a workpiece surface location. The laser pointer directs a laser beam against the workpiece surface to visually annunciate the workpiece surface location. | 06-27-2013 |
20130191042 | COMPONENT INSPECTION USING A CURVED TRANSDUCER ARRAY - An example component inspection method includes directing a wave from a curved array of transducer elements toward a component. The method forms the wave using focal law calculator software. | 07-25-2013 |