Patent application number | Description | Published |
20080297261 | Circuits and Methods for Implementing Transformer-Coupled Amplifiers at Millimeter Wave Frequencies - Circuits and methods are provided for building integrated transformer-coupled amplifiers with on-chip transformers that are designed to resonate or otherwise tune parasitic capacitances to achieve frequency tuning of amplifiers at millimeter wave operating frequencies. | 12-04-2008 |
20090195464 | APPARATUS AND METHODS FOR PACKAGING INTEGRATED CIRCUIT CHIPS WITH ANTENNAS FORMED FROM PACKAGE LEAD WIRES - Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications. | 08-06-2009 |
20100013459 | CIRCUITS AND METHODS FOR HIGH-EFFICIENCY ON-CHIP POWER DETECTION - Power detector integrally formed within a printed transmission line to capacitively couple a portion of signal power propagating on the printed transmission line and a power detector circuit that receives coupled power output from the power detector to detect a power level of the signal power. The power detector is designed such that capacitance of the coupling capacitor is absorbed into a distributed capacitance of the transmission line to maintain continuity of a characteristic impedance of the transmission line. | 01-21-2010 |
20110156730 | CHIP-BASED PROBER FOR HIGH FREQUENCY MEASUREMENTS AND METHODS OF MEASURING - A chip-based prober for measuring a device-under-test is provided. The prober includes a probe tip, a voltage and control connector, a chip carrier, and a programmable termination chip. The probe tip is configured to contact the device-under-test. The voltage and control connector is in electrical communication with the probe tip. The programmable termination chip has a plurality of terminations interconnected with the voltage and control connector and the chip carrier through controlled collapsed chip connections. | 06-30-2011 |
20120060135 | Integrated Circuit Transformer Devices for On-Chip Millimeter-Wave Applications - Methods are provided for building integrated circuit transformer devices having compact and optimized architectures for use in MMW (millimeter-wave) applications. The integrated circuit transformer devices have universal and scalable architectures that can be used as templates or building blocks for constructing various types of on-chip devices for millimeter-wave applications. | 03-08-2012 |
20120176281 | Apparatus and Methods for Packaging Integrated Circuit Chips with Antennas Formed From Package Lead Wires - Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications. | 07-12-2012 |
20120235759 | VOLTAGE CONTROLLED OSCILLATOR CIRCUITS AND METHODS USING VARIABLE CAPACITANCE DEGENERATION FOR INCREASED TUNING RANGE - Voltage controlled oscillator circuits are provided in which variable capacitance degeneration is employed to provide increased tuning ranges and output amplitudes for VCO circuits for millimeter wave applications. | 09-20-2012 |
20130016023 | APPARATUS AND METHODS FOR PACKAGING ANTENNAS WITH INTEGRATED CIRCUIT CHIPS FOR MILLIMETER WAVE APPLICATIONS - Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication, and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip. | 01-17-2013 |