Uh, KR
Bong Yong Uh, Cheongju-Si KR
Patent application number | Description | Published |
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20090207042 | WIRELESS REMOTE METER READING APPARATUS AND DRIVING METHOD THEREOF - A wireless remote meter reading apparatus and driving method thereof are used to reduce the cost of detecting the amount of energy consumption and to enhance the detection efficiency, so as to facilitate the detection of the energy consumption amount of tap water, gas, electricity, calorie or the like. Each of a set of short-range wireless networks includes meter reading units. Regenerative repeating units and a data centralizing unit configure a cell unit. A base station controller collects meter-reading data from the short-range wireless networks configured by the cell unit via a base station. A meter reading server supplies a control signal to the meter reading units, the regenerative repeating units and the data centralizing unit using a long-range network, such as GSM, GPRS, CDMA, SMSC via a mobile switch or an internet network. The meter reading server is supplied with the meter reading data via the long-range network. | 08-20-2009 |
Dong-Seon Uh, Uiwang-Si KR
Patent application number | Description | Published |
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20090140216 | Anisotropic conductive film composition, anisotropic conductive film including the same, and associated methods - An anisotropic conductive film composition includes a polymer resin, a first epoxy resin including at least one of a bisphenol epoxy resin, a novolac epoxy resin, a glycidyl epoxy resin, an aliphatic epoxy resin, and an alicyclic epoxy resin, a second epoxy resin including an acetal epoxy resin, an epoxy resin curing agent, and conductive particles. | 06-04-2009 |
20090146105 | Liquid Crystal Photo-Alignment Agent and Liquid Crystal Photo-Alignment Film and Liquid Crystal Display Including the Same - One embodiment of the present invention provides a liquid crystal photo-alignment agent that includes a polyamic acid copolymer including a repeating unit having the following Formula 1 and a repeating unit having the following Formula 2; a polyimide copolymer including a repeating unit having the following Formula 3 and a repeating unit having the following Formula 4; or a combination thereof: | 06-11-2009 |
20100136264 | Liquid Crystal Alignment Agent, and Liquid Crystal Alignment Film and Liquid Crystal Display Including Same - Disclosed are a liquid crystal alignment agent, and a liquid crystal alignment film and a liquid crystal display (LCD) including the same. The liquid crystal alignment agent includes a polymer of polyamic acid, a polyimide, or a combination thereof, and an epoxy compound represented by the following Chemical Formula 1. | 06-03-2010 |
20100155661 | Epoxy Compound for Liquid Crystal Photo-Alignment Agent, Liquid Crystal Photo-Alignment Agent, and Liquid Crystal Photo-Alignment Film - Disclosed is an epoxy compound for a liquid crystal photo-alignment agent, a liquid crystal photo-alignment agent, and a liquid crystal photo-alignment film. The epoxy compound is represented by the following Chemical Formula 1. | 06-24-2010 |
20100163811 | Organic Layer Photosensitive Resin Composition and Organic Layer Fabricated Using Same - Disclosed is an organic layer photosensitive resin composition and an organic layer fabricated using the same. The organic layer photosensitive resin composition includes (A) an organic binder resin, (B) a reactive unsaturated compound, (C) a polymerization initiator, (D) a black pigment including a lactam-based black pigment, and (E) a solvent. | 07-01-2010 |
20110155430 | ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITE AND FILM, AND CIRCUIT CONNECTING STRUCTURE INCLUDING THE SAME - An anisotropic conductive adhesive composite and film includes a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle. | 06-30-2011 |
20110230606 | Liquid Crystal Photo-Alignment Agent and Liquid Crystal Photo-Alignment Film Manufactured Using the Same - Disclosed is a liquid crystal photo-alignment agent and a liquid crystal photo-alignment film manufactured using the same. The liquid crystal photo-alignment agent includes an epoxy compound represented by Chemical Formula 1, and a polymer including a polyamic acid, a polyimide, or a mixture thereof. | 09-22-2011 |
20120141786 | ADHESIVE FILM FOR SEMICONDUCTOR DEVICE - An adhesive film for semiconductor devices, the adhesive film including a base film having a coefficient of linear expansion of about 50 to about 150 μm/m·° C. at 0 to 5° C. | 06-07-2012 |
20120141802 | OPTICAL MEMBER COMPRISING ANISOTROPIC CONDUCTIVE FILM - An optical member includes an anisotropic conductive film that has a multilayer structure having a bonding layer containing an epoxy resin as a curing part and a bonding layer containing a (meth)acrylate resin as a curing part. | 06-07-2012 |
20120168213 | ANISOTROPIC CONDUCTIVE FILM AND APPARATUS INCLUDING THE SAME - An apparatus includes a first member including a plurality of first electrodes on a first substrate, a second member including a plurality of second electrodes on a second substrate, the second electrodes facing the first electrodes of the first member, and an anisotropic conductive film (ACF) between the first member and the second member, the ACF having a double-layered structure and electrically connecting the first member and the second member, the ACF including an epoxy resin with a polycyclic aromatic ring and exhibiting a minimum melt viscosity of about 3,000 Pa·s to about 10,000 Pa·s at about 30° C. to about 200° C. | 07-05-2012 |
20120168683 | ANISOTROPIC CONDUCTIVE FILM, COMPOSITION FOR THE SAME, AND APPARATUS INCLUDING THE SAME - An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, the binder part having an ion content of more than 0 ppm to about 100 ppm. | 07-05-2012 |
20130113119 | SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILM OR ANISOTROPIC CONDUCTIVE ADHESIVE FILM - A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less. | 05-09-2013 |
20130126788 | Electronic device using anisotropic conductive composition and film - An electronic device includes a connection material formed from an adhesive composition that includes: a polymer resin; a cationic polymerization catalyst represented by Formula 1; and an organic base, | 05-23-2013 |
20130127038 | SEMICONDUCTOR DEVICE BONDED BY AN ANISOTROPIC CONDUCTIVE FILM - A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer. | 05-23-2013 |
20130154093 | ANISOTROPIC CONDUCTIVE FILM COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, AND SEMICONDUCTOR DEVICE BONDED BY THE SAME - An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: | 06-20-2013 |
20130154095 | SEMICONDUCTOR DEVICES CONNECTED BY ANISOTROPIC CONDUCTIVE FILM COMPRISING CONDUCTIVE MICROSPHERES - A semiconductor device includes an anisotropic conductive film for connecting the semiconductor device. The anisotropic conductive film includes a first conductive layer that has first conductive particles. The first conductive particles include cores containing silica or a silica composite, and have a 20% K-value ranging from about 7,000 N/mm | 06-20-2013 |
20130154129 | ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE BONDED BY THE SAME - A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst. | 06-20-2013 |
20130161566 | SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILM OR ANISOTROPIC CONDUCTIVE ADHESIVE FILM - An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1: | 06-27-2013 |
20130161838 | ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE - A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate. | 06-27-2013 |
20130168847 | ANISOTROPIC CONDUCTIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME - An electronic device includes an anisotropic conductive film as a connection material, the anisotropic conductive film being formed from an anisotropic conductive film-forming composition. The anisotropic conductive film-forming composition includes a polycyclic aromatic ring-containing epoxy resin, a fluorene epoxy resin, nano silica and conductive particles. | 07-04-2013 |
20130196129 | ANISOTROPIC CONDUCTIVE FILM AND APPARATUS INCLUDING THE SAME - An anisotropic conductive film includes a first insulating adhesive layer, a conductive adhesive layer, and a second insulating adhesive layer which are sequentially stacked on a base film, wherein an adhesive strength ratio of the second insulating adhesive layer to the first insulating adhesive layer is about 1.1 to about 20. | 08-01-2013 |
20130213691 | ELECTRONIC DEVICE - An anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing conductive particles, wherein after glass substrates are positioned to face each other on the upper and lower surface of the anisotropic conductive film and are pressed against the anisotropic conductive film at 3 MPa (based on the sample area) and 160° C. (based on the detection temperature of the anisotropic conductive film) for 5 sec, a ratio of the area of the insulating layer to that of the conductive layer is from about 1.3:1 to about 3.0:1. | 08-22-2013 |
20130273355 | DICING DIE BONDING FILM - A pressure sensitive dicing die bonding film includes a base film, a pressure sensitive adhesive layer formed on the base film, and a bonding layer formed on the pressure sensitive adhesive layer. An adhesive strength between the pressure sensitive adhesive layer and the bonding layer and an adhesive strength between the pressure sensitive adhesive layer and a ring frame may satisfy the following relation: | 10-17-2013 |
20130281559 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME - An adhesive composition for a semiconductor has two exothermic peaks between 65° C. and 350° C. and has an area ratio of voids of less than 10%, measured after curing at 150° C. for 10 minutes and then at 150° C. for 30 minutes, and then molding at 175° C. for 60 seconds. A first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C. | 10-24-2013 |
20140034882 | ANISOTROPIC CONDUCTIVE FILM, COMPOSITION FOR THE SAME, AND APPARATUS INCLUDING THE SAME - An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, wherein the anisotropic conductive film has an electrical conductivity of more than 0 μS/cm to about 100 μS/cm. | 02-06-2014 |
20140042374 | ANISOTROPIC CONDUCTIVE FILM, COMPOSITION FOR THE SAME, AND APPARATUS INCLUDING THE SAME - An anisotropic conductive film includes a binder part, a curing part, an initiator, and conductive particles, wherein the binder part includes at least one of a nitrile butadiene rubber (NBR) resin and a urethane resin, the anisotropic conductive film has a halogen ion content of more than 0 ppm to about 100 ppm. | 02-13-2014 |
Hong-Sun Uh, Seoul KR
Patent application number | Description | Published |
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20090104669 | Method for Preparing (S)-3-Hydroxy-Gamma-Butyrolactone Using Hydrolase - The present invention relates to a method for preparing S-HGB ((S)-3-hydroxy-γ-butyrolactone) using hydrolase, and more particularly to a method for preparing S-HGB in a high purity by hydrolyzing S-BBL ((S)-β-benzoyloxy-γ-butyrolactone) in the presence of hydrolase. According to the present invention, the S-HGB having an optical purity can be obtained in a high yield under simple process conditions without requiring reaction conditions of high pressure and high temperature or complex operating conditions by hydrolyzing S-BBL with hydrolase. | 04-23-2009 |
Hwa Il Uh, Suwon-Si KR
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20100068616 | Secondary battery - A secondary battery including an electrode assembly; a can having an opening at an upper portion thereof and housing the electrode assembly; a cap assembly sealing the opening of the can; and an insulation case disposed between the electrode assembly and the cap assembly, the insulation case having an impact absorber configured to deform and absorb an external impact. | 03-18-2010 |
Jiheum Uh, Seoul KR
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20090199694 | Flat display panel cutting apparatus and cutting method using the same - A flat display panel cutting apparatus includes: a conveyor for feeding a loaded flat display panel to a cutting area and a spraying area; a cutting means positioned in the cutting area, and for forming primary cracks on the flat display panel, the primary cracks including two or more first cracks spaced apart from each other in the X-axis direction and two or more second cracks spaced apart from each other in the Y-axis direction; and a spraying means positioned in the spraying area, and for growing secondary cracks by spraying a high temperature steam onto the first cracks or second cracks of the primary cracks formed on the flat display panel. | 08-13-2009 |
Ji-Heum Uh, Seoul KR
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20100258605 | APPARATUS FOR CUTTING LIQUID CRYSTAL DISPLAY PANEL - An apparatus for cutting liquid crystal display panels is disclosed in the present invention. The apparatus includes at least one table receiving bonded mother substrates having a plurality of unit liquid crystal display panels, at least one cutting wheel forming a scribing line on a surface of the bonded mother substrates, and a suction unit coupled to the at least one cutting wheel and sucking in glass debris on the surface of the bonded mother substrates. | 10-14-2010 |
Ji Ho Uh, Songpa-Gu KR
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20110286118 | Lens Module And Wafer Level Lens Module Manufacturing Apparatus - Example embodiments are directed to a lens module manufactured from a wafer and a wafer level lens module manufacturing apparatus. The wafer level lens module manufacturing apparatus to mold lenses on a wafer provided with lens holes includes a first master substrate and a second master substrate disposed such that the wafer is between the first master substrate and the second master substrate. The wafer level lens module manufacturing apparatus also includes lens molding parts that enter the lens holes and are on at least one of the first master substrate and the second master substrate. The lens is molded to have a thickness less than that of the wafer using the first lens molding parts and second lens molding parts, and both surfaces of the lens are inside the lens hole. Therefore, even if wafers provided with lenses are stacked on each other, the lens does not contact the surfaces of the neighboring wafers or the lenses molded on the neighboring wafers. | 11-24-2011 |
Ji-Ho Uh, Seongnam-Si KR
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20160115583 | DEVICE AND METHOD FOR VACUUM EVAPORATING - A device for vacuum evaporating includes a thermal evaporation module that generates vapor in a vacuum chamber through a circular opening by heating a vapor evaporation material accommodated therein. A moving stage is positioned in an atmospheric area separated from the vacuum chamber and adjusts a position of the thermal evaporation module under the thermal evaporation module. A sealing part is combined with the thermal evaporation module to isolate the vacuum chamber and the atmospheric area from each other and maintain a vacuum state of the vacuum chamber while surrounding the thermal evaporation module and permitting movement of the thermal evaporation module. | 04-28-2016 |
Ji-Ho Uh, Seoul KR
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20130255766 | CONDUCTIVE PASTE COMPOSITIONS AND SOLAR CELLS USING THE SAME - The present inventive concepts provide a conductive paste composition including conductive particles, a thickening agent, a dispersing agent, a thixotropic agent, an organic solvent, and glass frit, wherein the conductive paste composition has a thixotropic index of about 2 to 7 and a viscosity of about 50,000 to 300,000 cps at a temperature of 25° C. | 10-03-2013 |
20140242753 | FLIP CHIP PACKAGING METHOD, AND FLUX HEAD MANUFACTURING METHOD APPLIED TO THE SAME - Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided. | 08-28-2014 |
Kee-Han Uh, Yongin-City KR
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20110221098 | METHODS OF MANUFACTURING ALIGNMENT SUBSTRATE AND LIQUID CRYSTAL DISPLAY DEVICE HAVING THE ALIGNMENT SUBSTRATE - A method of manufacturing an alignment substrate includes preparing a first substrate on which an alignment film aligned in a first alignment direction is formed; forming a plurality of fluoro-polymer patterns on the first substrate; changing the alignment direction of regions of the alignment film on which the fluoro-polymer patterns are not formed; and removing the fluoro-polymer patterns by using a fluoro-solvent. | 09-15-2011 |
20120162586 | APPARATUS AND METHOD FOR MANUFACTURING ENCAPSULATED LIQUID CRYSTALS AND LIQUID CRYSTAL DISPLAY INCLUDING THE ENCAPSULATED LIQUID CRYSTALS - An apparatus for manufacturing encapsulated liquid crystals including at least one first flow duct configured to have liquid crystals flow therethrough, at least one second flow duct configured to have encapsulation film materials flow therethrough, a third flow duct configured to have an inflow portion connected to an outflow portion of the first flow duct and an outflow portion of the second flow duct and to have liquid crystal droplets in which the liquid crystals and the encapsulation film materials are mixed flow therethrough, and a curing machine configured to manufacture the encapsulated liquid crystals by curing the liquid crystal droplets. | 06-28-2012 |
20150179710 | METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY APPARATUS - A method of manufacturing an organic light emitting display apparatus by utilizing a deposition apparatus for forming an organic layer on a substrate includes: fixing the substrate to a mask assembly for forming a common layer or a mask assembly for forming a pattern layer in a loading unit; when the one or more deposition assemblies are separated from the substrate, forming an intermediate layer by depositing a deposition material discharged from the one or more deposition assemblies in a deposition unit of the deposition apparatus onto the substrate while the substrate is moved relative to the one or more deposition assemblies by a first conveyer unit; and separating the substrate on which the deposition is finished from the mask assembly for forming the common layer or the mask assembly for forming the pattern layer in an unloading unit. | 06-25-2015 |
Kee-Han Uh Uh, Yongin-City KR
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20130286462 | FLEXIBLE DISPLAY DEVICE - Provided is a flexible display device including a display body having flexibility; an actuator for changing and driving the display body; and an initial shape forming substrate for maintaining an initial state of the display body before the display body is changed and driven. The flexible display device allows a user to exactly control a change state of the flexible display device by driving the actuator and to decrease power consumption for changing and driving the flexible display device. Thus, by using the flexible display device, user convenience can be improved and the flexible display device can be driven with low power consumption. | 10-31-2013 |
Rae Jin Uh, Seoul KR
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20090233552 | OPERATION METHOD AND DEVICE FOR INTEGRATED MODEM HAVING PLURALITY OF MODEMS - An operation method and device for an integrated modem having a plurality of modems is provided. The method includes connecting the integrated modem to a mobile terminal, supplying, by the mobile terminal, power to each modem of the integrated modem, performing booting each modem to maintain a ready-on state, and controlling to operate a modem selected according to an input signal from an input unit while terminating supplying of power to the non-selected modem or maintaining the booting completion state. | 09-17-2009 |
20090291712 | OPERATING DEVICE AND METHOD FOR UNIVERSAL IC CARD - A device and method for operating a Universal Integrated Circuit Card (UICC) are provided. The method includes selecting a first data type based application by a mobile terminal, and transceiving data by converting data transceived between the first data type based application and a first application module into data of a second data type set in the UICC, while the mobile terminal communicates with the UICC storing the first application module for supporting the first data type based. | 11-26-2009 |
Sung-Sun Uh, Gyeonggi-Do KR
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20100319447 | CUTTING INSERT - Provided is a tire pressure sensor valve that can be easily installed to a 2-piece or 3-piece inch-up wheel and protect a tire pressure sensor when removing a tire. The tire pressure sensor valve includes a sensor housing including a mounting space for receiving a PCB to which circuit parts including an air pressure sensor are mounted, and a coupling recess for coupling, a valve body including a head and an inner air inlet hole having an opening-closing member, the head being inserted into the coupling recess of the sensor housing and fixed to the sensor housing through a screw, and a valve adapter including a threaded end such that the end is covered with a valve cap. | 12-23-2010 |
20110132081 | Tire Monitoring Device and System - A tire monitoring device may be used in conjunction with a tire monitoring system for a vehicle. The tire monitoring device includes a tire monitoring sensor unit having a state monitoring sensor monitoring a tire state, such as a tire pressure, and a first acceleration sensor and a second acceleration sensor respectively measuring accelerations in first and second directions on a plane perpendicular to a wheel axis, and a controller. The controller is configured to determine whether a wheel is on the left or right side of the vehicle on the basis of a relationship between alternating signals of the first acceleration sensor and the second acceleration sensor and determining whether or not a tire event has occurred with reference to a calculated value based on the accelerations measured by the first acceleration sensor and the second acceleration sensor. The tire monitoring device performs minimum operation required for automatic tire location recognition, thereby minimizing battery consumption and reducing the calculation load of the tire monitoring device itself and a central control unit. | 06-09-2011 |
20120017672 | Tire pressure monitoring system and tire pressure sensor thereof - Provided is a tire pressure sensor (TPS) of a tire pressure monitoring system (TPMS). The TPS includes a detachable and angle-adjustable tire valve coupled to the front side of a tire pressure sensor housing. A holder bracket having a tire valve insertion hole is at the front side, and an insertion head inserted into the valve insertion hole is at an end of the tire valve. Accordingly, the angle of the tire valve is freely controlled, allowing compatible use regardless of the shape or size of wheels of cars and commercial vehicles. Thus, manufacturing costs can be greatly reduced, thereby obtaining superior competitiveness over competitors' products. Furthermore, air leakage through a wheel valve hole can be effectively prevented against high speed rotation and inertia motion caused by the high speed rotation during the driving of a vehicle. | 01-26-2012 |