Patent application number | Description | Published |
20100223756 | TWO-STAGE TYPE TORSION PIVOT HINGE - A two-stage type torsion pivot hinge mainly comprising: an axle which is connected with a base and has a shaft; the shaft is mounted thereon with a bush for a spring tube, the bush forms a first and a second protrusion sheet respectively extending out of its two ends; the spring tube is fixedly connected with a supporting member and is provided with two torsion sleeves respectively on the two ends of the bush; each torsion sleeve has an axial cut and has two contact sheets extending respectively toward the two ends of the bush; the contact sheets respectively interfere with the first and the second protrusion sheets. By the function between the torsion sleeve and the bush, the pivot hinge can provide different torsion forces for the stroke of rotating the screen from its closed position to a vertical angular position and for the stroke from the vertical position to its maximum opening angular position. | 09-09-2010 |
20110173775 | PIVOT HINGE WITH MUTUALLY REVERSELY ALLOCATED SPRING TUBES - A pivot hinge includes: a fixing seat having therein a round hole from which two grooves forming an inversed “V” shape are extended downwards, the grooves include two bevel groove segments extending laterally and obliquely form the central bottom of the round hole to two different directions at the opening of the round hole, and include two vertical groove segments formed on the ends of the bevel groove segments respectively; a shaft of a rotation axle extends into the round hole; and includes: at least two mutually reversely allocated “9” shaped spring tubes each having a slipping over portion over the shaft surface, the portion is formed on its periphery a slit, a lower area of each slipping over portion has a positioning sheet extending downwards obliquely but not radially, each positioning sheet has a bottom vertical portion; the positioning sheets and the vertical portions are slipped respectively in the bevel and the vertical groove segments, an area at an upper area of each positioning sheet contacting with an upper area of a corresponding bevel groove segment forms a surface contacting fulcrum. | 07-21-2011 |
20110252601 | 360o BI-DIRECTIONAL ROTARY HINGE - A 360° bi-directional rotary hinge formed of a fixed bracket, a rotary bracket, a limiter plate, a stop plate, a positioning plate, a spring ring and a fastening member for use in a folding electronic device is disclosed. Subject to matching between bottom blocks of the limiter plate and arched sliding grooves of the stop plate, movement of the stop plate is constrained by the fixed bracket, and therefore rotation of the rotary bracket of the 360° bi-directional rotary hinge is limited to a forward and backward 360° angle. Further, the stop plate carries an index block corresponding to a −180° angle indication hole and a 180° angle indication hole on the base member of the folding electronic device for giving an indication when the rotary bracket is rotated to +180° or −180° angle relative to the fixed bracket. | 10-20-2011 |
Patent application number | Description | Published |
20130224890 | Feedback Control Using Detection Of Clearance And Adjustment For Uniform Topography - A method of controlling polishing includes storing a desired ratio representing a ratio for a clearance time of a first zone of a substrate to a clearance time of a second zone of the substrate. During polishing of a first substrate, an overlying layer is monitored, a sequence of measurements is generated, and the measurements are sorted a first group associated with the first zone of the substrate and a second group associated with the second zone on the substrate. A first time and a second time at which the overlying layer is cleared is determined based on the measurements from the first group and the second group, respectively. At least one adjusted polishing pressure is calculated for the first zone based on a first pressure applied in the first zone during polishing the first substrate, the first time, the second time, and the desired ratio. | 08-29-2013 |
20140127971 | IN-SITU MONITORING SYSTEM WITH MONITORING OF ELONGATED REGION - A method of chemical mechanical polishing a substrate includes polishing a layer on the substrate at a polishing station, monitoring the layer during polishing at the polishing station with an in-situ monitoring system, the in-situ monitoring system monitoring an elongated region and generating a measured signal, computing an angle between a primary axis of the elongated region and a tangent to an edge of the substrate, modifying the measured signal based on the angle to generate a modified signal, and at least one of detecting a polishing endpoint or modifying a polishing parameter based on the modified signal. | 05-08-2014 |
20150118765 | DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR - In one aspect, a method of controlling polishing includes receiving a measurement of an initial thickness of a conductive film on a first substrate prior to polishing the first substrate from an in-line or stand-alone monitoring system, polishing one or more substrates in a polishing system, the one or more substrates including the first substrate, during polishing of the one or more substrates, monitoring the one or more substrates with an eddy current monitoring system to generate a first signal, determining a starting value of the first signal for a start of polishing of the first substrate, determining a gain based on the starting value and the measurement of the initial thickness, for at least a portion of the first signal collected during polishing of at least one substrate of the one or more substrates, and calculating a second signal based on the first signal and the gain. | 04-30-2015 |
20150118766 | DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR - A method of controlling polishing includes polishing a substrate at a first polishing station, monitoring the substrate with a first eddy current monitoring system to generate a first signal, determining an ending value of the first signal for an end of polishing of the substrate at the first polishing station, determining a first temperature at the first polishing station, polishing the substrate at a second polishing station, monitoring the substrate with a second eddy current monitoring system to generate a second signal, determining a starting value of the second signal for a start of polishing of the substrate at the second polishing station, determining a gain for the second polishing station based on the ending value, the starting value and the first temperature, and calculating a third signal based on the second signal and the gain. | 04-30-2015 |
20150224623 | ADJUSTING EDDY CURRENT MEASUREMENTS - Among other things, a method of controlling polishing during a polishing process is described. The method includes receiving a measurement of a thickness, thick(t), of a conductive layer of a substrate undergoing polishing from an in-situ monitoring system at a time t; receiving a measured temperature, T(t), associated with the conductive layer at the time t; calculating resistivity ρ | 08-13-2015 |
Patent application number | Description | Published |
20110060441 | Clustering for Prediction Models in Process Control and for Optimal Dispatching - A first embodiment is a method for semiconductor process control comprising clustering processing tools of a processing stage into a tool cluster based on processing data and forming a prediction model for processing a semiconductor wafer based on the tool cluster. A second embodiment is a method for semiconductor process control comprising providing cluster routes between first stage tool clusters and second stage tool clusters, assigning a comparative optimization ranking to each cluster route, and scheduling processing of wafers. The comparative optimization ranking identifies comparatively which cluster routes provide for high wafer processing uniformity. Further, wafers that require high wafer processing uniformity are scheduled to be processed along one cluster route that has a high comparative optimization ranking that identifies the one cluster route to have a highest wafer processing uniformity, and wafers that do not require high wafer processing uniformity are scheduled to be processed along another cluster route. | 03-10-2011 |
20110186987 | STRESS BUFFER STRUCTURES IN A MOUNTING STRUCTURE OF A SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THE SAME - A mounting structure for a semiconductor device includes a stepwise stress buffer layer under a likewise stepwise UBM structure. | 08-04-2011 |
20110241201 | Radiate Under-Bump Metallization Structure for Semiconductor Devices - An under-bump metallization (UBM) structure for a semiconductor device is provided. The UBM structure has a center portion and extensions extending out from the center portion. The extensions may have any suitable shape, including a quadrangle, a triangle, a circle, a fan, a fan with extensions, or a modified quadrangle having a curved surface. Adjacent UBM structures may have the respective extensions aligned or rotated relative to each other. Flux may be applied to a portion of the extensions to allow an overlying conductive bump to adhere to a part of the extensions. | 10-06-2011 |
20120305916 | Interposer Test Structures and Methods - An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and at least a portion of the test structure is in a first redistribution element. The first redistribution element is on a first surface of a substrate of the interposer. The test structure is intermediate and electrically coupled to at least two probe pads. | 12-06-2012 |
20130092935 | Probe Pad Design for 3DIC Package Yield Analysis - An interposer includes a first surface on a first side of the interposer and a second surface on a second side of the interposer, wherein the first and the second sides are opposite sides. A first probe pad is disposed at the first surface. An electrical connector is disposed at the first surface, wherein the electrical connector is configured to be used for bonding. A through-via is disposed in the interposer. Front-side connections are disposed on the first side of the interposer, wherein the front-side connections electrically couple the through-via to the probe pad. | 04-18-2013 |
20130109169 | METHODS OF MANUFACTURING STRESS BUFFER STRUCTURES IN A MOUNTING STRUCTURE OF A SEMICONDUCTOR DEVICE | 05-02-2013 |
20130113070 | Interposers for Semiconductor Devices and Methods of Manufacture Thereof - Interposers for semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, an interposer includes a substrate, a contact pad disposed on the substrate, and a first through-via in the substrate coupled to the contact pad. A first fuse is coupled to the first through-via. A second through-via in the substrate is coupled to the contact pad, and a second fuse is coupled to the second through-via. | 05-09-2013 |
20140027900 | Bump Structure for Yield Improvement - A bump structure for electrically coupling semiconductor components is provided. The bump structure includes a first bump on a first semiconductor component and a second bump on a second semiconductor component. The first bump has a first non-flat portion (e.g., a convex projection) and the second bump has a second non-flat portion (e.g., a concave recess). The bump structure also includes a solder joint formed between the first and second non-flat portions to electrically couple the semiconductor components. | 01-30-2014 |
20140088747 | Near Non-Adaptive Virtual Metrology and Chamber Control - Embodiments of the present invention relate to a method for a near non-adaptive virtual metrology for wafer processing control. In accordance with an embodiment of the present invention, a method for processing control comprises diagnosing a chamber of a processing tool that processes a wafer to identify a key chamber parameter, and controlling the chamber based on the key chamber parameter if the key chamber parameter can be controlled, or compensating a prediction model by changing to a secondary prediction model if the key chamber parameter cannot be sufficiently controlled. | 03-27-2014 |
20140106536 | Cylindrical Embedded Capacitors - A device includes a substrate having a front surface and a back surface opposite the front surface. A capacitor is formed in the substrate and includes a first capacitor plate; a first insulation layer encircling the first capacitor plate; and a second capacitor plate encircling the first insulation layer. Each of the first capacitor plate, the first insulation layer, and the second capacitor plate extends from the front surface to the back surface of the substrate. | 04-17-2014 |
20150102487 | STRESS BUFFER STRUCTURES IN A MOUNTING STRUCTURE OF A SEMICONDUCTOR DEVICE - A semiconductor device includes a bonding pad on a substrate. The semiconductor device further includes a passivation layer covering a peripheral portion of the bonding pad while exposing a middle portion of the bonding pad. Additionally, the semiconductor device includes a stress buffer layer over the passivation layer where the stress buffer layer exposes a portion of the bonding pad, and where a wall of the stress buffer layer extends, in steps, upwardly from the exposed portion of the bonding pad. Furthermore, the semiconductor device includes an under-bump metallurgy (UBM) layer over the stress buffer layer, where the UBM layer contacts a portion of the bonding pad. | 04-16-2015 |
20150143324 | Semiconductor Device Design Methods and Conductive Bump Pattern Enhancement Methods - Semiconductor device design methods and conductive bump pattern enhancement methods are disclosed. In some embodiments, a method of designing a semiconductor device includes designing a conductive bump pattern design, and implementing a conductive bump pattern enhancement algorithm on the conductive bump pattern design to create an enhanced conductive bump pattern design. A routing pattern is designed based on the enhanced conductive bump pattern design. A design rule checking (DRC) procedure is performed on the routing pattern. | 05-21-2015 |
20150241876 | Clustering for Prediction Models in Process Control and for Optimal Dispatching - A first embodiment is a method for semiconductor process control comprising clustering processing tools of a processing stage into a tool cluster based on processing data and forming a prediction model for processing a semiconductor wafer based on the tool cluster. A second embodiment is a method for semiconductor process control comprising providing cluster routes between first stage tool clusters and second stage tool clusters, assigning a comparative optimization ranking to each cluster route, and scheduling processing of wafers. The comparative optimization ranking identifies comparatively which cluster routes provide for high wafer processing uniformity. Further, wafers that require high wafer processing uniformity are scheduled to be processed along one cluster route that has a high comparative optimization ranking that identifies the one cluster route to have a highest wafer processing uniformity, and wafers that do not require high wafer processing uniformity are scheduled to be processed along another cluster route. | 08-27-2015 |
20150380324 | Interposer Test Structures and Methods - An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and at least a portion of the test structure is in a first redistribution element. The first redistribution element is on a first surface of a substrate of the interposer. The test structure is intermediate and electrically coupled to at least two probe pads. | 12-31-2015 |
Patent application number | Description | Published |
20140217961 | PORTABLE POWER SUPPLY HAVING LOWER CHARGING VOLTAGE THAN DISCHARGING VOLTAGE - The portable power supply contains at least a first battery, at least a second battery, at least a first switch element, at least a second switch element, a plurality of charging and regulating circuits, an input interface element, and an output interface element. Each second battery is electrically connected in series with a first battery through a first switch element. Each second switch element is electrically connected in-series between ground and a first battery or a second battery. Each charging and regulating circuit is electrically connected to a first battery or a second battery The input interface element has an end electrically connected to an external power source, and another end electrically connected to all charging and regulating circuits. The output interface element has an end electrically connected to an external electronic device, and another end electrically connected to a first battery or a second battery. | 08-07-2014 |
20140285020 | PORTABLE POWER SUPPLY - The portable power supply contains a circuit unit and a rechargeable battery. The circuit unit contains a conversion circuit, an AC output port, a DC input/output port, and a coupling port. The rechargeable battery is coupled to the coupling port. The DC electricity stored in the rechargeable battery is delivered to the circuit unit through the coupling port, and then to a first branch and a second branch. Following the first branch, the DC electricity is transformed a pre-determined AC voltage by the conversion circuit, and the AC voltage is delivered to an external electronic device through the AC output port. Following the second branch, the DC electricity is directly delivered to another external electronic device through the DC input/output port. Without connecting the external electronic device, the DC input/output port is capable of connecting to an external DC power source for charging the rechargeable battery. | 09-25-2014 |
20150349514 | MULTIFUNCTIONAL ELECTRICAL POWER OUTPUT PROTECTION DEVICE - A multifunctional electrical power output protection device includes a protection device having a circuit board. The circuit board is mounted in a receiving space of the protection device and includes an input port, an output port, a switching element, a detection element, and a manually-operating overriding device. The manually-operating overriding device is electrically connected to an end of the detection element. The switching element has an end electrically connected to the input port and an opposite end electrically connected to the output port. The detection element has an end electrically connected to the input port and an opposite end electrically connected to the output port. The switching element and the detection element that are connectable to an external power supply respectively provide an effect of preventing backward charging induced by a reverse electrical current and effects of over-loading interruption and current-limiting protection. | 12-03-2015 |