Tzu-Yang
Tzu-Yang Chen, Hsinchu County TW
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20150377926 | POSITIONER OF PROBE CARD AND PROBE HEAD OF PROBE CARD - A positioner and a probe head of a probe card are provided. The positioner has a main opening, a first sub-opening, a second sub-opening, a third sub-opening, a fourth sub-opening, a first positioning portion, a second positioning portion, a first elastic portion and a second elastic portion. The first sub-opening, the second sub-opening, the third sub-opening, and the fourth sub-opening are sequentially arranged at the periphery of the main opening and are communicated to the main opening. A stiffness of the first positioning portion and a stiffness of the second positioning portion are higher than a stiffness of the first elastic portion and a stiffness of the second elastic portion. | 12-31-2015 |
Tzu-Yang Chung, Hsin-Chu City TW
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20140158155 | WAFER CLEANING - One or more techniques or systems for cleaning wafers during semiconductor fabrication or an associated brush are provided herein. In some embodiments, the brush includes a brush body and one or more inner hole supports within the brush body. For example, a first inner hole support and a second inner hole support define a first inner hole associated with a first size. For another example, a third inner hole support and a fourth inner hole support define a second inner hole associated with a second size different than the first size. In some embodiments, a cleaning solution is applied to a wafer based on a first flow rate at a first brush position and based on a second flow rate at a second brush position. In this manner, a flow field associated with wafer cleaning is provided, thus enhancing cleaning efficiency, for example. | 06-12-2014 |
20150027489 | MECHANISMS FOR CLEANING WAFER AND SCRUBBER - Embodiments of mechanisms for cleaning a wafer are provided. A method for cleaning a wafer includes cleaning a wafer by using a wafer scrubber and cleaning the wafer scrubber in a scrubber cleaning module. An agitated cleaning liquid is applied on the wafer scrubber to clean the wafer scrubber. The method also includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning liquid. | 01-29-2015 |
Tzu-Yang Lin, Taipei City TW
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20120013486 | Optical Three-Dimensional Coordinate Sensor System and Method Thereof - The present invention relates an optical three-dimensional coordinate sensor system and method thereof. A plurality of light-emitting modules produce a plurality of light signals, and then a plurality of reflected light signals reflected by an object are received by a plurality of photodetectors. After receiving the reflected light signals, the photodetectors generate a plurality of photocurrents. A plurality of active pixel circuits receive the photocurrents and transform the photocurrents to a plurality of reflective optical voltages. A plurality of differential amplifier circuits (DAC) compare the reflective optical voltages and the background voltages, and then output a plurality of DAC output voltages of the reflected light signals. Afterward, a processing module detects the DAC output voltages and uses an algorithm to calculate the top three of the DAC output voltages to determine the three-dimensional coordinate of the object. | 01-19-2012 |
Tzu-Yang Lin, Tainan City TW
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20130134464 | LIGHT EMITTING DIODE DEVICE AND FLIP-CHIP PACKAGED LIGHT EMITTING DIODE DEVICE - The present invention relates to a light emitting diode (LED) and a flip-chip packaged LED device. The present invention provides an LED device. The LED device is flipped on and connected electrically with a packaging substrate and thus forming the flip-chip packaged LED device. The LED device mainly has an Ohmic-contact layer and a planarized buffer layer between a second-type doping layer and a reflection layer. The Ohmic-contact layer improves the Ohmic-contact characteristics between the second-type doping layer and the reflection layer without affecting the light emitting efficiency of the LED device and the flip-chip packaged LED device. The planarized buffer layer id disposed between the Ohmic-contact layer and the reflection layer for smoothening the Ohmic-contact layer and hence enabling the reflection layer to adhere to the planarized buffer layer smoothly. Thereby, the reflection layer can have the effect of mirror reflection and the scattering phenomenon on the reflected light can be reduced as well. | 05-30-2013 |
20150380618 | FLIP CHIP PACKAGE STRUCTURE AND WAFER LEVEL PACKAGE STRUCTURE - A flip chip package structure includes a package base and a LED chip. The package base includes a first substrate, a first and a second electrodes disposed on the first substrate and a bonding layer disposed on the first substrate. The LED chip is flipped on the package base and includes an epitaxy layer, a third and a fourth electrodes disposed on the epitaxy layer and contacting the first and the second electrodes, a second insulating layer disposed between the third and the fourth electrodes, and a plurality of bonding pillars disposed on the second insulating layer and contacting the bonding layer. A minimum interval between the bonding layer, the first and the second electrodes and a minimum interval between the bonding pillars, the second and the third electrodes are larger than a width of each bonding pillar. | 12-31-2015 |
Tzu-Yang Lin, Kaohsiung City TW
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20160043281 | METHOD OF FABRICATING A LIGHT EMITTING DIODE DEVICE - The present invention relates to a light emitting diode (LED) and a flip-chip packaged LED device. The present invention provides an LED device. The LED device is flipped on and connected electrically with a packaging substrate and thus forming the flip-chip packaged LED device. The LED device mainly has an Ohmic-contact layer and a planarized buffer layer between a second-type doping layer and a reflection layer. The Ohmic-contact layer improves the Ohmic-contact characteristics between the second-type doping layer and the reflection layer without affecting the light emitting efficiency of the LED device and the flip-chip packaged LED device. The planarized buffer layer id disposed between the Ohmic-contact layer and the reflection layer for smoothening the Ohmic-contact layer and hence enabling the reflection layer to adhere to the planarized buffer layer smoothly. Thereby, the reflection layer can have the effect of mirror reflection and the scattering phenomenon on the reflected light can be reduced as well. | 02-11-2016 |
Tzu-Yang Tsai, New Taipei City TW
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20140146228 | VIDEO CAMERA DRIVING CIRCUIT AND METHOD THEREOF - A video camera driving circuit and a method thereof are provided, where the video camera driving circuit includes a connector, a determination unit and a control chip. The connector outputs an identification signal specifying either a first lens or a second lens which the connector connects to. The determination unit outputs a determination signal according to the identification signal and a reference voltage. The control chip outputs a control signal according to the determination signal. | 05-29-2014 |