Patent application number | Description | Published |
20110101408 | LED DIE HAVING HEAT DISSIPATION LAYERS - An LED die includes a multi-layer semiconductor with a first surface, a second surface opposite to the first surface, an inclined plane connecting to the first surface and the second surface, a first electrode and a second electrode respectively positioned on the first surface and the second surface, a first heat dissipation layer made of electrically-insulating and thermally conductive material being coated on the first surface and the inclined plane with a first opening exposing the first electrode, and a second heat dissipation layer made of electrically and thermally conductive material being coated on the first heat dissipation layer and contacting and electrically connecting with the first electrode. | 05-05-2011 |
20110233564 | LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THE SAME - An LED chip includes a transparent substrate and a number of lighting structure units each including a p-type semiconductor and an n-type semiconductor and a recess extending from the p-type semiconductor to the n-type semiconductor. The recess is filled with metal material which covers the surface of the lighting structure units. By filling the recess with metal material, the heat generated by the lighting structure units can rapidly transfer to the metal material. A method for manufacturing the light emitting diode chip is also provided. | 09-29-2011 |
20110266586 | LED PACKAGE AND MANUFACTURING METHOD THEREOF - An LED package includes a base, an LED chip, and an encapsulant. The LED chip is mounted on the base, and is enclosed by the encapsulant. The base includes a substrate and a blocking wall integrally formed with the substrate. The blocking wall divides a surface of the substrate into a first bonding area and a second bonding area. An electrically conductive layer and a solder are formed on the bonding area in sequence. The blocking wall can block the first and second solder to overflow outside the first and second bonding area at soldering respectively. A method for manufacturing the LED package is also provided. | 11-03-2011 |
20110272666 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - A light-emitting diode comprises a light-emitting diode chip having a first semiconductor layer, a first electrode, an active layer formed on the first semiconductor layer, a second semiconductor layer formed on the active layer and a second electrode formed on the second semiconductor layer. The first semiconductor layer, the active layer, the second semiconductor layer and the second electrode sequentially compose a stacked multilayer. A blind hole penetrates the second electrode, the second semiconductor layer, the active layer and inside the first semiconductor layer. The first electrode is disposed on the first semiconductor layer inside the blind hole. A first supporting layer and a second supporting layer are respectively disposed on the first electrode and the second electrode, wherein the first supporting layer and the second supporting layer are separated from each other. A method for manufacturing the light-emitting diode is also provided in the disclosure. | 11-10-2011 |
20110278631 | LIGHT EMITTING DIODE CHIP - A light emitting diode (LED) chip includes a first electrode and a second electrode. Each of the first and second electrodes includes several trunks with at least one branch extending from at least one of the trunk, and at least one conductive pad serially connecting the trunks. A distance between a distal end of the branch of the first electrode and the conductive pad of the second electrode is less than that between any of other portions of the branch of the first electrode and the conductive pad of the second electrode, to thereby avoid crowded electric current formed at the first electrode and the conductive pad of the second electrode to save power accordingly. | 11-17-2011 |
20110291136 | LIGHT-EMITTING ELEMENT AND FABRICATION METHOD THEREOF - A light-emitting element includes a substrate, a light-emitting module and at least two electrodes. The light-emitting module is formed on the substrate. The at least two electrodes are formed on the light-emitting module. Exterior surfaces of the light-emitting module are separated into a first part and a second part. The first part is defined between the at least two electrodes and the light-emitting module. The second part includes exterior surfaces not contacting the at least two electrodes. The first part is smooth. At least a part of the second part is rough. | 12-01-2011 |
20110316024 | LED PACKAGE - An LED package includes a transparent substrate, an LED die, and an encapsulating layer. The transparent substrate has a first surface defining a recess therein, a second surface opposite to the first surface, and a lateral surface interconnecting the first and second surfaces. The LED die is arranged on the bottom of the recess. The encapsulating layer is in the recess and covers the LED die. The LED package further includes a metal layer formed on the second surface and the lateral surface of the substrate. A pair of electrodes is located at the bottom of the recess and extends through the metal layer. An insulated material is filled between the transparent substrate and the electrodes. Light emitted from the LED die is transmitted through the transparent substrate and reflected by the metal layer. | 12-29-2011 |
20120012872 | LED PACKAGE STRUCTURE - An LED package structure includes a transparent substrate having a supporting face and a light-emergent face opposite to the supporting face, a housing disposed on the supporting face, two electrodes disposed on the housing, an LED chip disposed on the supporting face and electrically connected to the two electrodes, a reflecting layer covering the LED chip to reflect light emitted by the LED chip toward the transparent substrate, and a phosphor layer formed on the light-emergent face of the substrate. The phosphor layer includes a plurality of layers each having a specific light wavelength conversion range to generate a light with a predetermined color. | 01-19-2012 |
20120021545 | METHOD OF MANUFACTURING VERTICAL LIGHT EMITTING DIODE - A method of manufacturing a vertical light emitting diode includes: providing a first substrate; forming a lapping stop layer on the first substrate, the lapping stop layer being harder than the first substrate; depositing an epitaxial layer on the lapping stop layer; bonding a second substrate on the epitaxial layer; and removing the first substrate from the lapping stop layer. | 01-26-2012 |
20120056233 | LED PACKAGE - An LED package includes a base, an LED chip and an encapsulation. The LED chip is mounted on the base. The encapsulation encapsulates the LED chip. A heat dissipating plate is sandwiched between the LED chip and the base. The heat dissipating plate includes a first surface and a second surface. The LED chip is mounted on the first surface of the heat dissipating plate and has an interface engaging with the first surface of the heat dissipating plate. The first surface of the heat dissipating plate has an area greater than that of the interface. The second surface of the heat dissipating plate is attached to the base. | 03-08-2012 |
20120077295 | METHOD FOR DICING LED WAFER INTO MULTIPLE LED CHIPS - A method for dicing an LED (light emitting diode) wafer into multiple LED chips includes steps: providing an LED wafer, the LED wafer comprising a substrate, a first semiconductor layer, a light-emitting layer, a second semiconductor layer, and a transparent, electrically conductive film; forming a first channel in the LED wafer extending downwardly through the transparent, electrically conductive film, the second semiconductor layer and the light-emitting layer to the first semiconductor layer, thereby exposing the first semiconductor layer; forming a second channel within the first channel, the second channel extending downwardly through the first semiconductor layer to the substrate, thereby exposing a top face of the substrate; forming a groove in the top face of the substrate within the second channel by means of laser cutting; and dicing the LED wafer along the groove. | 03-29-2012 |
20120080691 | LIGHT EMITTING DIODE AND MAKING METHOD THEREOF - An LED includes a substrate, a first P-type semiconductor layer formed on the substrate and a plurality of LED dies arranged on the first P-type semiconductor layer. The LED dies are electrically connected to each other in series. The present invention also relates to a method for making such an LED. | 04-05-2012 |
20120104407 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer. The first n-type GaN layer is formed on the substrate, the first n-type GaN layer has a first surface facing away from the substrate, and the first surface includes a first area and a second area. The connecting layer, the second n-type GaN layer, the light emitting layer, and the p-type GaN layer are formed on the first area in sequence. The connecting layer is etchable by alkaline solution; a bottom surface of the second n-type GaN layer facing towards the connecting layer has a roughened exposed portion; the GaN on the bottom surface of the second n-type GaN layer is N-face GaN. | 05-03-2012 |
Patent application number | Description | Published |
20120164773 | METHOD FOR FABRICATING SEMICONDUCTOR LIGHTING CHIP - A method for fabricating a semiconductor lighting chip includes steps of: providing a substrate; forming a first etching layer on the substrate; forming a connecting layer on the first etching layer; forming a second etching layer on the connecting layer; forming a lighting structure on the second etching layer; and etching the first etching layer, the connecting layer, the second etching layer and the lighting structure, wherein an etching rate of the first etching layer and the second etching layer is lager than that of the connecting layer and the lighting structure, thereby to form the connecting layer and the lighting structure each with an inverted frustum-shaped structure. | 06-28-2012 |
20120223324 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer. The first n-type GaN layer, the connecting layer, and the second n-type GaN layer are formed on the substrate in sequence. The connecting layer is etchable by alkaline solution, and a bottom surface of the second n-type GaN layer facing towards the connecting layer has a roughed exposed portion. The GaN on the bottom surface of the second n-type GaN layer is N-face GaN. A top surface of the second n-type GaN layer facing away from the connecting layer includes a first area and a second area. The light emitting layer and the p-type GaN layer are formed on the first area of the top surface of the second n-type GaN layer in sequence. | 09-06-2012 |
20120235157 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer formed on the substrate in sequence, the connecting layer being etchable by alkaline solution, a bottom surface of the second n-type GaN layer facing towards the connecting layer having a roughened exposed portion, the GaN on the bottom surface of the second n-type GaN layer having an N-face polarity, a blind hole extending through the p-type GaN layer, the light emitting layer and the second n-type GaN layer to expose the connecting layer, and an annular rough portion formed on the bottom surface of the second n-type GaN layer and surrounding each blind hole. | 09-20-2012 |
20120273757 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode and a light emitting diode (LED) manufacturing method are disclosed. The LED comprises a substrate; a first n-type GaN layer; a second n-type GaN layer; an active layer; and a p-type GaN layer formed on the substrate in sequence; the second n-type GaN layers has a bottom surface interfacing with the first n-type GaN layer, a rim of the bottom surface has a roughened exposed portion, and Ga—N bonds on the bottom surface has an N-face polarity. | 11-01-2012 |
20120292633 | LIGHT EMITTING DIODE ARRAY AND METHOD FOR MANUFACTURING THE SAME - An LED array includes a substrate and a plurality of LEDs formed on the substrate. The LEDs are electrically connected with each other. Each of the LEDs includes a connecting layer, an n-type GaN layer, an active layer, and a p-type GaN layer formed on the substrate in sequence. The connecting layer is etchable by alkaline solution. A bottom surface of the n-type GaN layer which connects the connecting layer has a roughened exposed portion. The bottom surface of the n-type GaN layer has an N-face polarity. A method for manufacturing the LED array is also provided. | 11-22-2012 |
20120326200 | FLIP-CHIP LIGHT EMITTING DIODE AND METHOD FOR MAKING THE SAME - A flip-chip light emitting diode comprising: a substrate; a circuit layer formed on the substrate, the circuit layer comprising a first electrode and a second electrode separated and electrically insulated from the first electrode; an LED chip arranged on the circuit layer, the LED chip comprising a positive electrode and a negative electrode, the positive electrode and the negative electrode which are located at a bottom face of the LED chip being in electrical connection to the first electrode and the second electrode of the circuit layer by solder, respectively; and a blocking structure located between the positive electrode and the negative electrode, the blocking structure being made of elastic and electrically insulating, colloidal material. | 12-27-2012 |
20130032815 | LIGHT EMITTING DIODE ARRAY AND METHOD FOR MANUFACTURING THE SAME - An LED array includes a substrate, protrusions formed on a top surface of the substrate, and LEDs formed on the top surface of the substrate and located at a top of the protrusions. The LEDs are electrically connected with each other. Each LED includes a connecting layer, an n-type GaN layer, an active layer, and a p-type GaN layer formed on a top of the protrusions in sequence. A bottom surface of the n-type GaN layer connecting the connecting layer has a roughened exposed portion. The bottom surface of the n-type GaN layer has an N-face polarity. | 02-07-2013 |
20130032839 | LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF - A manufacturing method for an LED with roughened lateral surfaces comprises following steps: providing an LED wafer with an electrically conductive layer disposed thereon; providing a photoresist layer on the electrically conductive layer; roughening a lateral surface of the electrically conductive layer by wet etching; forming a depression in the LED wafer by dry etching and roughening a sidewall of the LED wafer defining the depression; and disposing two pads respectively in the depression and the conducting layer. The disclosure also provides an LED with roughened lateral surfaces. A roughness of the roughened lateral surfaces is measurable in micrometers. | 02-07-2013 |
20130146837 | LIGHT EMITTING DIODE WITH MULTIPLE TRANSPARENT CONDUCTIVE LAYERS AND METHOD FOR MANUFACTURING THE SAME - An LED includes a first semiconductor layer, a second semiconductor layer, an active layer, a first transparent conductive layer, and a second transparent conductive layer. The first transparent conductive layer is formed on the second semiconductor layer. The second transparent conductive layer is formed on the first transparent conductive layer. The thickness of the first transparent conductive layer is less than that of the second transparent conductive layer. The density of the first transparent conductive layer is larger than that of the second transparent conductive layer. The disclosure further includes a method for manufacturing the LED. | 06-13-2013 |
20130256702 | LIGHT EMITTING DIODE WITH HIGH LIGHT EXTRACTION EFFICIENCY AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode includes a light emitting structure, a transparent conductive layer and a transparent protecting layer formed in sequence. A plurality of holes are defined in the transparent protecting layer to expose the transparent conductive layer out of the transparent protecting layer. A plurality of micro-structures are formed on a top surface of the transparent conductive layer in the holes. The micro-structures refract light emitted from the light emitting structure and travelling through the transparent conductive layer. | 10-03-2013 |
20130292692 | LIGHT EMITTING DIODE - An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer. The first n-type GaN layer, the connecting layer, and the second n-type GaN layer are formed on the substrate in sequence. The connecting layer is etchable by alkaline solution, and a bottom surface of the second n-type GaN layer facing towards the connecting layer has a roughed exposed portion. The GaN on the bottom surface of the second n-type GaN layer is N-face GaN. A top surface of the second n-type GaN layer facing away from the connecting layer includes a first area and a second area. The light emitting layer and the p-type GaN layer are formed on the first area of the top surface of the second n-type GaN layer in sequence. | 11-07-2013 |
20130292693 | LIGHT EMITTING DIODE - An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer formed on the substrate in sequence. The connecting layer is etchable by alkaline solution. A bottom surface of the second n-type GaN layer faces towards the connecting layer and has a roughened exposed portion. The GaN on the bottom surface of the second n-type GaN layer has an N-face polarity. A blind hole extends through the p-type GaN layer, the light emitting layer and the second n-type GaN layer to expose the connecting layer. An annular rough portion is formed on the bottom surface of the second n-type GaN layer and surrounds each blind hole. | 11-07-2013 |
20130320362 | HIGH VOLTAGE LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACUTING THE SAME - A high voltage LED package includes a substrate and LED chips formed on a top surface of the substrate. A periphery of each LED chip is roughened. The LED chips are electrically connected in series. | 12-05-2013 |
20140001494 | LIGHT EMITTING DIODE | 01-02-2014 |
20140001495 | LIGHT EMITTING DIODE LAMP | 01-02-2014 |
20140027806 | SEMICONDUCTOR OPTOELECTRONIC STRUCTURE WITH INCREASED LIGHT EXTRACTION EFFICIENCY - A semiconductor optoelectronic structure with increased light extraction efficiency, includes a substrate; a buffer layer is formed on the substrate and includes a pattern having plural grooves formed adjacent to the substrate; a semiconductor layer is formed on the buffer layer and includes an n-type conductive layer formed on the buffer layer, an active layer formed on the n-type conductive layer, and a p-type conductive layer formed on the active layer; a transparent electrically conductive layer is formed on the semiconductor layer; a p-type electrode is formed on the transparent electrically conductive layer; and an n-type electrode is formed on the n-type conductive layer. | 01-30-2014 |
20140099739 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE CHIP WITH ELECTRODES HAVING SMOOTH SURFACES - A method for manufacturing a light emitting diode chip includes the following steps: providing an epitaxial structure having an epitaxial layer; forming a first electrode and a second electrode on the epitaxial layer; coating an inert layer on the epitaxial structure, the first electrode and the second electrode continuously; annealing the first electrode and the second electrode; and removing the inert layer coated on the first electrode and the second electrode to expose the first electrode and the second electrode. | 04-10-2014 |
20140124808 | LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode (LED) includes a base, an LED die grown on the base, a transparent electrically conductive layer formed on a side of the LED die, a protecting layer covering the transparent electrically conductive layer, and a phosphor layer formed on the protecting layer. Through holes extend through the phosphor layer and the protecting layer to make part of light emitted from the LED die directly traveling out from the through holes to illuminate. A method for manufacturing the LED is also provided. | 05-08-2014 |
20140312299 | LIGHT EMITTING DIODE CHIP - A light emitting diode (LED) includes a substrate, a semiconductor structure formed on the substrate, and two electrodes formed on the semiconductor structure. The semiconductor structure includes a bearing surface via which light generated by the semiconductor structure radiates out of the LED. A plurality of microstructures is formed on the bearing surface. A cross section of each microstructure is rectangular triangular having a vertical side surface. Each microstructure includes a top surface. The top surface is inclined relative to the bearing surface. | 10-23-2014 |
20140319561 | SEMICONDUCTOR LIGHT EMITTING DEVICE WITH LIGHT TRANSMISSIVE ROUGHENED STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A semiconductor light emitting device includes a semiconductor light emitting chip and a transparent conductive layer formed on the semiconductor light emitting chip. The semiconductor light emitting chip includes a substrate, and a first semiconductor layer, an active layer and a second semiconductor layer successively formed on the substrate. The transparent conductive layer is formed on the second semiconductor layer. A first electrode and a second electrode are respectively arranged on the transparent conductive layer and the first semiconductor layer. The transparent conductive layer has a roughened structure. A method of manufacturing a semiconductor light emitting device is also provided. | 10-30-2014 |
20140342099 | METHOD OF PHOTOCURING A COATING FILM - A method of photocuring a coating film includes steps: providing a component, and coating the coating film on the component; then a pulse UV LED light source is used to irradiate the coating film to thereby solidify the coating film. During the on time of the pulse UV light source, it supplies a UV light with an enhanced intensity to the coating film to cause a top surface of the coating film to be cured quickly. Accordingly, a reaction between oxygen and free radicals in the coating film can be effectively avoided. | 11-20-2014 |
20140346540 | LIGHT EMITTING DIODE DIE - A light emitting diode (LED) die includes a first semiconductor layer, a second semiconductor layer, an active layer interposed between the first and second semiconductor layers, a transparent electrically conductive layer formed on the second semiconductor layer, and a passivation layer formed on the transparent electrically conductive layer. A first electrode is electrically connected with the first semiconductor layer, and a second electrode is is electrically connected with the second semiconductor layer. The transparent electrically conductive layer is made of tin doped indium oxide. The passivation layer is made of silicon nitride having a refractive index close to that of the transparent electrically conductive layer. | 11-27-2014 |
20140361245 | LED CHIP AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an LED chip includes: providing a laminated structure with a nanoimprinted material coated thereon; providing an imprinted mold with a patterned structure for pressing and curing the nanoimprinted material, removing the imprinted mold, etching the nanoimprinted material and the laminated structure; and forming electrodes on the etched laminated structure. An LED chip is also provided. | 12-11-2014 |
20150048305 | LED DIE AND METHOD OF MANUFACTURING THE SAME - An LED die includes a substrate, a light emitting structure, electrodes, a first transparent protecting layer, a reflection layer, and a second transparent protecting layer. The light emitting structure includes a first semiconductor layer, an active layer, a second semiconductor layer successively formed on the substrate. A part of first semiconductor layer being exposed. A first electrode is formed the first semiconductor layer. A second electrode is formed on the second semiconductor layer. The first transparent protecting layer, the reflection layer, and the second transparent protecting layer successively formed on the first electrode. The present disclosure also provides a method of manufacturing the LED die. | 02-19-2015 |
20150087099 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE - A method for manufacturing a light emitting diode includes following steps: providing a substrate; forming a buffer layer on the substrate; forming a transitional layer on the buffer layer, the buffer layer being made of InGaN; forming an epitaxial layer on the transitional layer; activating the transitional layer by a way of radiating the transitional layer using laser; and when radiated with a laser, the transitional layer separates from the epitaxial layer. | 03-26-2015 |
20150140701 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing an LED (light emitting diodes) package includes providing a substrate having electrodes; providing an LED chip, the LED chip arranged on the substrate and electrically contacting the electrodes; providing an UV-curing adhesive layer, the UV-curing adhesive layer arranged on the substrate and entirely packaging the LED chip and the electrodes therein, and then the UV-curing adhesive layer being solidified. | 05-21-2015 |
20160064595 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing a light emitting diode (LED) package, the method includes providing an LED chip and forming electrodes on a top surface of the LED chip; forming a first electric insulation layer on the top surface of the LED chip, the first electric insulation layer adapted to enclose the electrodes therein; etching the first electric insulation layer to define a plurality of second through holes; forming a substrate on a top surface of the first electric insulation layer, the substrate adapted to fill in the plurality of second through holes, the substrate directly contacting the electrodes; dividing the substrate into a plurality of spaced heat dissipation parts; and forming a packaging layer on a bottom surface of the substrate, the packaging layer adapted to enclose the LED chip therein. | 03-03-2016 |
20160064614 | LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - A light emitting diode package includes a substrate, a light emitting diode mounted on the substrate by flip chip bonding and a protective layer. The light emitting diode includes an epitaxial layer, a first electrode and a second electrode on the epitaxial layer. The first electrode and the second electrode are spaced apart from each other. The first and second electrodes are embedded in the protective layer. This disclosure also relates to a method for manufacturing the light emitting diode package. | 03-03-2016 |
20160087176 | LIGHT EMITTING DIODE (LED) DIE MODULE, LED ELEMENT WITH THE LED DIE MODULE AND METHOD OF MANUFACTURING THE LED DIE MODULE - A light emitting diode (LED) die module includes an LED die and a guiding layer formed on the LED die. The guiding layer includes a first portion, a second portion and a third portion. The first portion and the second portion are positioned at two edges of the surface of the LED die opposite to each other. The third portion is connected between the first portion and the second portion and divides the surface into a first electrically connecting area and a second electrically connecting area. The first portion, the second portion and the third portion defines a first opening and a second opening. The first opening and the second opening face two opposite directions. The present disclose also provides an LED element with the LED die module and a method of manufacturing the LED die module. | 03-24-2016 |
Patent application number | Description | Published |
20140184873 | OPTICAL IMAGING LENS SET AND ELECTRONIC DEVICE COMPRISING THE SAME - An optical imaging lens set includes: a first lens element with positive refractive power having an image-side surface with a convex part in a vicinity of a circular periphery of the first lens element, a second lens element having an object-side surface with a convex part in a vicinity of a circular periphery of the second lens element, a third lens element having an object-side surface with a concave part in a vicinity of a circular periphery of the third lens element, a fourth lens element having a concave object-side surface, and a plastic fifth lens element having an image-side surface with a concave part in a vicinity of the optical axis. The air gap between the second lens element and the third lens element G | 07-03-2014 |
20140184874 | MOBILE DEVICE AND OPTICAL IMAGING LENS THEREOF - Present embodiments provide for a mobile device and an optical imaging lens thereof. The optical imaging lens comprises five lens elements positioned sequentially from an object side to an image side. Though controlling the convex or concave shape of the surfaces, the refracting power of the lens elements and/or equations between parameters, the optical imaging lens shows better optical characteristics and the total length of the optical imaging lens is shortened. | 07-03-2014 |
20140253796 | Imaging Lens and Electronic Device Having the Same - An imaging lens includes first, second, third, fourth, and fifth lens elements arranged from an object side to an image side in the given order. Through surface designs of the lens elements, the imaging lens has a relatively short overall length while maintaining good optical performance. | 09-11-2014 |
20150036044 | OPTICAL IMAGING LENS AND ELECTRONIC DEVICE COMPRISING THE SAME - An optical imaging lens set includes: a first lens element, an aperture stop, a second lens element, a third lens element, a fourth lens element and a fifth lens element, the first lens element with refractive power having a convex object-side surface and an image-side surface with a concave part in a vicinity of its periphery, the second lens element with refractive power having an object-side surface with a convex part in a vicinity of its periphery, the third lens element with refractive power having an object-side surface with a concave part in a vicinity of its periphery, the fourth lens element with refractive power, the fifth lens element with refractive power having an image-side surface with a concave part in a vicinity of the optical axis. | 02-05-2015 |
20150043091 | OPTICAL IMAGING LENS - An optical imaging lens includes, in order from an object side to an image side, first, second, third, fourth, fifth, sixth, and seventh lens elements arranged along an optical axis. The object-side surface of the first lens element has a convex portion and the image-side surface has a concave portion. The image-side of the third lens element is a concave surface. The object-side surface of the fourth lens element has a concave portion and the image-side surface of the fourth lens element has a convex portion. The image-side surface of the sixth lens element has a convex portion. The object-side surface of the seventh lens element has a convex portion and the image-side surface has a convex portion. The optical imaging lens only has seven lens elements having a refractive power. | 02-12-2015 |
20150177482 | OPTICAL IMAGING SYSTEM AND ELECTRONIC APPARATUS INCLUDING THE SAME - An imaging optical system includes, in order from the object side to the image side, a first lens element, a second lens element, a third lens element, an aperture stop, a fourth lens element, a fifth lens element, and a sixth lens element arranged along an optical axis. The first lens element has a concave image-side surface in the vicinity of the optical axis. The second lens element has a negative refractive power. The third lens element has a convex object-side surface in a vicinity of an optical axis. The fourth lens element has a convex object-side surface in the vicinity of the optical axis. The fifth lens element has a convex image-side surface in the vicinity of the optical axis. The sixth lens element is made of plastic and has a convex image-side surface in a vicinity of an outer circumference. | 06-25-2015 |
20150177484 | OPTICAL IMAGING LENS AND ELETRONIC DEVICE COMPRISING THE SAME - An optical imaging lens includes a first, second, third, fourth, fifth and sixth lens element, the first lens element having an image-side surface with a concave part in a vicinity of its periphery, the second lens element having an object-side surface with a convex part in a vicinity of its periphery, the third lens element having an image-side surface with a convex part in a vicinity of its periphery, the fourth lens with positive refractive power, the fifth lens element having an object-side surface with a concave part in a vicinity of its periphery, the sixth lens element having an image-side surface with a convex part in a vicinity of its periphery, wherein the optical imaging lens set does not include any lens element with refractive power other than said first, second, third, fourth, fifth and sixth lens elements. | 06-25-2015 |
20150177485 | CAMERA DEVICE AND OPTICAL IMAGING LENS THEREOF - The present invention provides a camera device and an optical imaging lens thereof. The optical imaging lens comprises six lens elements positioned in an order from an object side to an image side. Through controlling the convex or concave shape of the surfaces of the lens elements, the view angle of the optical imaging lens is efficiently increased to shows better optical characteristics. | 06-25-2015 |
20150212290 | ELECTRONIC DEVICE AND OPTICAL IMAGING LENS THEREOF - Present invention provides an electronic device and an optical imaging lens thereof. The optical imaging lens comprises a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element positioned in an order from an object side to an image side along an optical axis. The first lens element has negative refractive power, the second lens element has a convex portion formed on the object side surface and a concave portion formed on the image side surface, the third lens element has a convex portion formed on the object side surface and the fifth lens element has a convex portion formed on the image side surface. Through controlling the convex or concave shape of the surfaces, designing parameters satisfying an inequality and/or the refracting power of the lens elements, the field of view is broadened, and the better image performance is maintained. | 07-30-2015 |
20150253540 | OPTICAL IMAGING LENS AND ELECTRONIC DEVICE COMPRISING THE SAME - An optical imaging lens includes: a first, second, third, fourth, fifth and sixth lens element, the first lens element with positive refractive power, the second lens element having an object-side surface with a concave part in a vicinity of its periphery and an image-side surface with a concave part in a vicinity of its periphery, the fourth lens element having an image-side surface with a convex part in a vicinity of the optical axis, the fifth lens element having an object-side surface with a convex part in a vicinity of the optical axis and an image-side surface with a concave part in a vicinity of the optical axis, the sixth lens element having an image-side surface with a convex part in a vicinity of its periphery, and the sixth lens element being made of plastic. | 09-10-2015 |
20150253541 | Imaging Lens, and Electronic Apparatus Including the Same - An imaging lens includes first to sixth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance. | 09-10-2015 |
20150260952 | OPTICAL IMAGING LENS AND ELECTRONIC DEVICE COMPRISING THE SAME - An optical imaging lens includes: a first, second, third, fourth, fifth and sixth lens element, the first lens element has negative refractive power, the second lens element has negative refractive power, the third lens element has refractive power, the fourth lens element having an image-side surface with a convex portion in a vicinity of the optical axis, the fifth lens element having an image-side surface with a convex portion in a vicinity of the optical axis, and the sixth lens element having an image-side surface with a concave portion in a vicinity of its periphery, wherein the optical imaging lens set does not include any lens element with refractive power other than said first, second, third, fourth, fifth and sixth lens elements. | 09-17-2015 |
20150260960 | MOBILE DEVICE AND OPTICAL IMAGING LENS THEREOF - The present invention provides a camera device and an optical imaging lens thereof. The optical imaging lens comprises six lens elements positioned in an order from an object side to an image side and an aperture stop positioned between the third and fourth lens elements. Through controlling the convex or concave shape of the surfaces of the lens elements, the optical imaging lens shows better optical characteristics and the total length of the optical imaging lens is shortened. | 09-17-2015 |
20150338609 | OPTICAL IMAGING LENS AND ELECTRONIC DEVICE COMPRISING THE SAME - An optical imaging lens includes: a first, second, third, fourth, fifth and sixth lens element, the first lens element has an object-side surface with a convex part in a vicinity of the optical axis, and a convex part in a vicinity of its periphery, the second lens element has an image-side surface with a concave part in a vicinity of its periphery, the third lens element has an image-side surface with a convex part in a vicinity of its periphery, the fourth lens has an object-side surface with a concave part in a vicinity of its periphery, the fifth lens element has an object-side surface with a concave part in a vicinity of the optical axis, the sixth lens element has an image-side surface with a concave part in a vicinity of the optical axis, and a convex part in a vicinity of its periphery. | 11-26-2015 |
20150362697 | MOBILE DEVICE AND OPTICAL IMAGING LENS THEREOF - Present embodiments provide for a mobile device and an optical imaging lens thereof. The optical imaging lens comprises six lens elements positioned sequentially from an object side to an image side. Through controlling the convex or concave shape of the surfaces of the lens elements and designing parameters satisfying at least one inequality, the optical imaging lens shows better optical characteristics and the total length of the optical imaging lens is shortened. | 12-17-2015 |
20150362701 | OPTICAL IMAGING LENS AND ELECTRONIC DEVICE COMPRISING THE SAME - An optical imaging lens includes: first through sixth lens elements, the first lens element has a positive refracting power, an object-side surface with a convex part in a vicinity of the optical axis, and a convex part in a vicinity of its periphery, the second lens element has a negative refracting power and an object-side surface with a convex part in a vicinity of its periphery, the third lens element and the fourth lens element each have an image-side surface with a convex part in a vicinity of the optical axis, the fifth lens element has an object-side surface with a convex part in a vicinity of the optical axis, the sixth lens element has an image-side surface with a concave part in a vicinity of the optical axis, and the optical imaging lens set includes no lens element with refractive power other than said first through sixth lens elements. | 12-17-2015 |
20160131868 | Imaging Lens, and Electronic Apparatus Including the Same - An imaging lens includes first to fourth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant optical parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance. | 05-12-2016 |
20160131875 | Imaging Lens and Electronic Apparatus Including the Same - An imaging lens includes first to fifth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance. | 05-12-2016 |
20160139363 | MOBILE DEVICE AND OPTICAL IMAGING LENS THEREOF - Present embodiments provide for a mobile device and an optical imaging lens thereof. The optical imaging lens may comprise four lens elements positioned sequentially from an object side to an image side. Through controlling the convex or concave shape of the surfaces of the lens elements and designing parameters satisfying at least one inequality, the optical imaging lens may exhibit better optical characteristics and the total length of the optical imaging lens may be shortened. | 05-19-2016 |