Tummala
Arjunkumar Tummala, Visakhapatnam IN
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20140235895 | PREPARATION OF FINGOLIMOD AND ITS SALTS - The present application provide processes for the preparation of fingolimod and its pharmaceutically acceptable salts, process for the purification of fingolimod hydrochloride and process for the preparation of amorphous fingolimod hydrochloride. | 08-21-2014 |
Arjunkumar Tummala, Guntur IN
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20110028518 | DEXLANSOPRAZOLE PROCESS AND POLYMORPHS - Processes for the preparation of dexlansoprazole, an amorphous form of dexlansoprazole, a solid dispersion of amorphous dexlansoprazole and a pharmaceutically acceptable carrier, and processes for their preparation. Also provided are crystalline compounds 2-[(R)-[(4-chloro-3-methyl-2-pyridinyl)methyl]sulfinyl]-1H-benzimidazole and 2-[(R)-[(4-nitro-3-methyl-2-pyridinyl)methyl]sulfinyl]-1H-benzimidazole, and methods for their preparation. | 02-03-2011 |
Arjun Kumar Tummala, Visakhapatnam IN
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20100298564 | PREPARATION OF AMORPHOUS VALGANCICLOVIR HYDROCHLORIDE - The present application relates to processes for the preparation amorphous valganciclovir hydrochloride, comprising combining a solution of valganciclovir with an anti-solvent. | 11-25-2010 |
20110213159 | PROCESS FOR PREPARATION OF CELECOXIB CRYSTALLINE FORM - Celecoxib crystalline Form Ill substantially free of celecoxib crystalline Forms I and II and a process for its preparation. | 09-01-2011 |
20110250454 | PREPARATION OF NEBIVOLOL - Processes for the synthesis of pharmacologically active 2,2-iminobisethanol derivatives, e.g., 2H-1-benzopyran-2 methanol-α,α′-iminobis(methylene)]bis-[6-fluoro-3,4-dihydro-[2R*[R*[R*(S*)]]]], and their pharmaceutically acceptable salts. | 10-13-2011 |
20140187538 | LORCASERIN HYDROCHLORIDE - The present invention relates to amorphous lorcaserin hydrochloride; amorphous solid dispersion comprising lorcaserin hydrochloride and one or more pharmaceutically acceptable carries; processes for preparation thereof; pharmaceutical compositions comprising amorphous lorcaserin hydrochloride and one or more pharmaceutically acceptable carries. | 07-03-2014 |
Arjun Kumar Tummala, Guntur IN
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20090062538 | AMORPHOUS VALGANCICLOVIR HYDROCHLORIDE - The present application relates to amorphous forms of valganciclovir salts such as the hydrochloride and processes for their preparation. | 03-05-2009 |
20100081809 | AMORPHOUS VALGANCICLOVIR HYDROCHLORIDE - The present application relates to amorphous forms of valganciclovir salts such as the hydrochloride and processes for their preparation. | 04-01-2010 |
20100137358 | SOLIFENACIN COMPOSITIONS - Compositions and/or formulations comprising solifenacin or a salt thereof and processes for preparing the same. Certain compositions and formulations contain a stable amorphous form of solifenacin succinate. | 06-03-2010 |
Ashok Kumar Tummala, Austin, TX US
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20150012713 | DATA PROCESSING APPARATUS HAVING FIRST AND SECOND PROTOCOL DOMAINS, AND METHOD FOR THE DATA PROCESSING APPARATUS - A data processing apparatus ( | 01-08-2015 |
Harsha Tummala, Kolding DK
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20150174835 | METHOD AND MOULDING SYSTEM FOR MANUFACTURING A FIBRE-REINFORCED POLYMER OBJECT VIA A FEEDBACK SYSTEM FOR CONTROLLING RESIN FLOW RATE - A method of manufacturing a fibre-reinforced polymer object by means of vacuum-assisted resin transfer moulding (VARTM), wherein fibre material is impregnated with liquid resin in a mould cavity comprising a rigid mould part having a mould surface defining an outer surface of the object, is described. One or more pressure sensors are connected to resin inlets of the VARTM system. A control unit is used for controlling a polymer supply unit based on measured resin pressure and is adapted to adjusting a resin flow rate, if pressure measured by the pressure sensors is below a lower threshold level or above a higher threshold level. | 06-25-2015 |
Hemachand Tummala, Brookings, SD US
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20130195930 | Inulin and Inulin Acetate Formulations - The disclosure provides compositions that include microparticles or nanoparticles of beta inulin or inulin acetate and an active agent, where the active agent is contained within individual microparticles or nanoparticles. The active agent can be, for example, a vaccinating antigen, an antigenic peptide sequence, or an immunoglobulin. The compositions can be incorporated into various formulations for administration to a subject such as a human or animal. The invention further provides methods of using the compositions and formulations, including methods of stimulating an immune response in a subject, or enhancing an immune response in a subject, for the purpose of treating, preventing, or inhibiting an infectious disease, autoimmune disease, immunodeficiency disorder, neoplastic disease, degenerative disease, an aging disease, or a combination thereof. | 08-01-2013 |
20140271530 | CURCUMINOID COMPLEXES WITH ENHANCED STABILITY, SOLUBILITY AND/OR BIOAVAILABILITY - Methods and materials relating to a medicament preparation comprising a curcuminoid component and a eudragit component provided as a curcuminoid-eudragit complex, which enhance the bioavailability of the curcumin component and are useful for the treatment of various diseases including cancer, neurodegeneration, inflammation, and immunodeficiency. In some aspects, the curcuminoid component comprises curcumin to prepare a curcumin-eudragit complex and a medicament comprising curcumin-eudragit complexes. | 09-18-2014 |
Manoj Tummala, Troy, MI US
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20090145903 | FLUID FILL SYSTEM FOR AN AUTOMOTIVE VEHICLE - A fluid port for an automotive vehicle includes a neck, cap and tether. The cap is connected with the neck via the tether. The tether rotates with the cap as the cap is twisted relative to the neck. The cap may include a recessed portion to receive the tether. The cap may include a passageway for the tether to permit the cap to move relative to the tether. | 06-11-2009 |
20120145130 | Temperature Based Fuel Management in a Vehicle Fuel System - A vehicle fuel system for use in a vehicle having an engine. The system includes a fuel tank having a fuel pump module area and a bulk area, and a fuel pump mounted in the fuel pump module area, having an inlet and an outlet. A thermostatic valve has a fuel inlet connected to a return fuel line from the engine, a first outlet and a second outlet, with the valve directing fuel through the first outlet when the temperature is below a threshold and directing fuel through the second outlet when the temperature is above the threshold. A cold fuel line connects to the first outlet of the valve and directs fuel to the fuel pump inlet, and a warm fuel line connects to the second outlet of the valve and directs fuel into the bulk area of the fuel tank away from the fuel pump. | 06-14-2012 |
Praveen Tummala, Rock Hil, SC US
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20110285061 | Apparatus and Method for Cooling Part Cake in Laser Sintering - A part cake defining a build produced by laser sintering and the surrounding unfused powder is contained in an enclosure, and the enclosure includes displaceable wall portions for compressing the part cake to support the build against distortion during rapid cooling from a cooling fluid. The enclosure enables the part cake to be quickly and reliably cooled either within the laser sintering system or outside the laser sintering system. A source of cooling fluid connects to the enclosure and a lid holds the part cake in place as cooling fluid is forced through the pore volume of the cake. An inert gas blanket apparatus is also provided to reduce or prevent oxidation of the part cake and/or to cool the part cake. Once the part cake is cooled, the build produced by laser sintering may be removed from the part cake. | 11-24-2011 |
Praveen Tummala, Rock Hill, SC US
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20100155985 | Apparatus and Method for Cooling Part Cake in Laser Sintering - A part cake defining a build produced by laser sintering and the surrounding unfused powder is contained in an enclosure, aid the enclosure includes displaceable wall portions for compressing the part cake to support the build against distortion during rapid cooling from a cooling fluid. The enclosure enables the part cake to be quickly and reliably cooled either within the laser sintering system or outside the laser sintering system. A source of cooling fluid connects to the enclosure and a lid holds the part cake in place as cooling fluid is forced through the pore volume of the cake. An inert gas blanket apparatus is also provided to reduce or prevent oxidation of the part cake and/or to cool the part cake. Once the part cake is cooled, the build produced by laser sintering may be removed from the part cake. | 06-24-2010 |
20130310507 | Adhesive for 3D Printing - In one aspect, adhesives for use with a 3D printer are described herein. In some embodiments, an adhesive for use with a 3D printer comprises a first polymeric component comprising a poly(vinyl alcohol) and a second polymeric component. The poly(vinyl alcohol), in some embodiments, comprises amorphous poly(vinyl alcohol). In some embodiments, the second polymeric component comprises a water-soluble polymer. Further, in some embodiments, an adhesive described herein further comprises a solvent, a surfactant, and/or a preservative. | 11-21-2013 |
20150126670 | ADHESIVE FOR 3D PRINTING - In one aspect, adhesives for use with a 3D printer are described herein. In some embodiments, an adhesive for use with a 3D printer comprises a first polymeric component comprising a poly(vinyl alcohol) and a second polymeric component. The poly(vinyl alcohol), in some embodiments, comprises amorphous poly(vinyl alcohol). In some embodiments, the second polymeric component comprises a water-soluble polymer. Further, in some embodiments, an adhesive described herein further comprises a solvent, a surfactant, and/or a preservative. | 05-07-2015 |
20160059445 | ADHESIVE FOR 3D PRINTING - In one aspect, adhesives for use with a 3D printer are described herein. In some embodiments, an adhesive for use with a 3D printer comprises a first polymeric component comprising a poly(vinyl alcohol) and a second polymeric component. The poly(vinyl alcohol), in some embodiments, comprises amorphous poly(vinyl alcohol). In some embodiments, the second polymeric component comprises a water-soluble polymer. Further, in some embodiments, an adhesive described herein further comprises a solvent, a surfactant, and/or a preservative. | 03-03-2016 |
Rama Krishna Tummala, Fremont, CA US
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20150222505 | BUSINESS TRANSACTION RESOURCE USAGE TRACKING - A system associates resource usage with a particular business transaction. A business transaction may include a PHP request and occur over a distributed system. The distributed application may be monitored. The resource usage by the requests that form the business transaction may be compiled together to determine the resource usage of the business transaction. The resources may include resources used by PHP requests, such as for example memory pool usage, files used, CPU usage, and other resources. | 08-06-2015 |
20150319221 | TRACING BUSINESS TRANSACTIONS BASED ON APPLICATION FRAMEWORKS - A distributed transaction is traced to determine how it is handled by applications which process the distributed transaction at least in part without threads. To trace the transaction, the business transaction may be named based on the application framework that handles the transaction. The tracing occurs in application frameworks which do not include multiple threads for handling transactions, such as for example a PHP application framework. The present technology may detect the framework and framework calls, and then generate a name for a business transaction based on the detected information. The business transaction may then be named based on the loaded application framework. | 11-05-2015 |
Rao Tummala, Greensboro, GA US
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20100283122 | SYSTEMS AND METHODS FOR PROVIDING HIGH-DENSITY CAPACITORS - The present invention describes systems and methods for providing high-density capacitors. An exemplary embodiment of the present invention provides a high-density capacitor system comprising a substrate and a porous conductive layer formed on the substrate, wherein the porous conductive layer is formed in accordance with a predetermined pattern. Furthermore, the high-density capacitor system includes a dielectric material formed on the porous conductive layer and a second conductive layer formed on the dielectric material. Additionally, the high-density capacitor system includes a plurality of conductive pads configured in communication with the second conductive layer. | 11-11-2010 |
20100284123 | SYSTEMS AND METHODS FOR FABRICATING HIGH-DENSITY CAPACITORS - The present invention describes systems and methods for fabricating high-density capacitors. An exemplary embodiment of the present invention provides a method for fabricating a high-density capacitor system including the steps of providing a substrate and depositing a nanoelectrode particulate paste layer onto the substrate. The method for fabricating a high-density capacitor system further includes sintering the nanoelectrode particulate paste layer to form a bottom electrode. Additionally, the method for fabricating a high-density capacitor system includes depositing a dielectric material onto the bottom electrode with an atomic layer deposition process. Furthermore, the method for fabricating a high-density capacitor system includes depositing a conductive material on the dielectric material to form a top electrode. | 11-11-2010 |
20120228754 | CHIP-LAST EMBEDDED INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME - The various embodiments of the present invention provide a novel chip-last embedded structure, wherein an IC is embedded within a one to two metal layer substrate. The various embodiments of the present invention are comparable to other two-dimensional and three-dimensional WLFO packages of the prior art as the embodiments have similar package thicknesses and X-Y form factors, short interconnect lengths, fine-pitch interconnects to chip I/Os, a reduced layer count for re-distribution of chip I/O pads to ball grid arrays (BGA) or land grid arrays (LGA), and improved thermal management options. | 09-13-2012 |
20140145328 | INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME - The various embodiments of the present invention provide fine pitch, chip-to-substrate hybrid interconnect assemblies, as well as methods of making and using the assemblies. The hybrid assemblies generally include a semiconductor having a die pad disposed thereon, a substrate having a substrate pad disposed thereon, and a polymer layer disposed between the surface of the die pad and the surface of the substrate pad. In addition, at least a portion of the surface of the die pad is metallically bonded to at least a portion of the surface of the substrate pad and at least a portion of the surface of the die pad is chemically bonded to at least a portion of the surface of the substrate pad. | 05-29-2014 |
Rao Tummala, Stone Mountain, GA US
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20100103639 | Ferroelectrics and ferromagnetics for noise isolation in integrated circuits, packaging, and system architectures - Disclosed are ferroelectric and ferromagnetic noise isolation structures that reduce electromagnetic interference and noise in integrated circuit devices and system architectures. Representative structures comprise two or more devices that are vertically disposed relative to one another, and a thin ferroelectric or ferromagnetic film layer disposed between the respective devices that isolates electromagnetic energy coupling from one device to another. | 04-29-2010 |
Rao R. Tummala, Greenboro, GA US
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20160109653 | OPTICAL INTERCONNECTS AND METHODS OF FABRICATING SAME - An embodiment provides an optical interconnect comprising first and second planar metallization layers, a glass substrate disposed between at least portions of the first and second metallization layers, an aperture in the second metallization layer having a first and second ends, and a polymer waveguide having a first end adjacent the first end of the aperture. The first end of the waveguide can have a first edge defining a first acute angle with respect to a top surface of the waveguide. The first end of the optical waveguide can be configured to receive an optical signal traversing through the glass substrate from a source proximate a first position on a top surface of the glass substrate and direct the optical signal with the first edge in a direction parallel to the glass substrate towards a second end of the waveguide. | 04-21-2016 |
Rao R. Tummala, Greensboro, GA US
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20120104603 | INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME - The various embodiments of the present invention provide fine pitch, chip-to-substrate interconnect assemblies, as well as methods of making and using the assemblies. The assemblies generally include a semiconductor having a die pad and a bump disposed thereon and a substrate having a substrate pad disposed thereon. The bump is configured to electrically interconnect at least a portion of the semiconductor with at least a portion of the substrate when the bump is contacted with the substrate pad. In addition, when the bump is contacted to the substrate pad, at least a portion of the bump and at least a portion of the substrate pad are deformed so as to create a non-metallurgical bond therebetween. | 05-03-2012 |
20120106117 | ULTRA-THIN INTERPOSER ASSEMBLIES WITH THROUGH VIAS - A 3D interconnect structure comprising an ultra-thin interposer having a plurality of ultra-high density of through-via interconnections defined therein. The 3D interposer electrically connects first and second electronic devices in vertical dimension and has the same or similar through-via density as the first or second electronic devices it connects. The various embodiments of the interconnect structure allows 3D ICs to be stacked with or without TSVs and increases bandwidth between the two electronic devices as compared to other interconnect structures of the prior art. Further, the interconnect structure of the present invention is scalable, testable, thermal manageable, and can be manufactured at relatively low costs. Such a 3D structure can be used for a wide variety of applications that require a variety of heterogeneous ICs, such as logic, memory, graphics, power, wireless and sensors that cannot be integrated into single ICs. | 05-03-2012 |
20120261805 | THROUGH PACKAGE VIA STRUCTURES IN PANEL-BASED SILICON SUBSTRATES AND METHODS OF MAKING THE SAME - The various embodiments of the present invention provide a low cost, low electrical loss, and low stress panel-based silicon interposer with TPVs. The interposer of the present invention has a thickness of about 100 microns to 200 microns and such thickness is achieved without utilizing a carrier and further wherein no grinding, bonding, or debonding methods are utilized, therefore distinguishing the interposer of the present invention from prior art embodiments. | 10-18-2012 |
20130107485 | INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME | 05-02-2013 |
20130119555 | Through-Package-Via (TPV) Structures On Inorganic Interposer And Methods For Fabricating Same - The present invention generally relates to the use of glass as the interposer material with the surface of the interposer and/or the walls of through vias in being coated by a stress relief barrier that provides thermal expansion and contraction stress relief and better metallization capabilities. The present invention discloses ways in that a stress relief barrier can be used to reduce the effects of stress caused by the different CTEs while also, in some applications, acting as an adhesion promoter between the metallization and the interposer. The stress relief barrier acts to absorb some of the stress caused by the different CTEs and promotes better adhesion for the conductive metal layer, thus helping to increase reliability while also providing for smaller designs. | 05-16-2013 |
20130270695 | Second Level Interconnect Structures and Methods of Making the Same - The various embodiments of the present invention provide a stress-relieving, second-level interconnect structure that is low-cost and accommodates TCE mismatch between low-TCE packages and PCBs. The various embodiments of the interconnect structure are reworkable and can be scaled to pitches from about 1 millimeter (mm) to about 150 micrometers (μm). The interconnect structure comprises at least a first pad, a supporting pillar, and a solder bump, wherein the first pad and supporting pillar are operative to absorb substantially all plastic strain, therefore enhancing compliance between the two electronic components. The versatility, scalability, and stress-relieving properties of the interconnect structure of the present invention make it a desirable structure to utilize in current two-dimensional and ever-evolving three-dimensional IC structures. | 10-17-2013 |
20140347157 | MAGNETIC DEVICE UTILIZING NANOCOMPOSITE FILMS LAYERED WITH ADHESIVES - Exemplary embodiments provide a nanomagnetic structure and method of making the same, comprising a device substrate, a plurality of nanomagnetic composite layers disposed on the device substrate, wherein an adhesive layer is interposed between each of the plurality of nanomagnetic composite layers. Metal windings are integrated within the plurality of nanomagnetic composite layers to form an inductor core, wherein the nanomagnetic structure has a thickness ranging from about 5 to about 100 microns. | 11-27-2014 |
20160111380 | NEW STRUCTURE OF MICROELECTRONIC PACKAGES WITH EDGE PROTECTION BY COATING - Disclosed herein are edge-coated microelectronic packages comprising a microelectronic package having a top, a bottom, and an exposed edge, and a coating comprising a polymer, wherein the microelectronic package comprises a glass substrate, and wherein the coating covers at least a portion of the top, at least a portion of the bottom, and at least a portion of the exposed edge of the microelectronic package. Also disclosed herein are methods of making and using edge-coated microelectronic packages. | 04-21-2016 |
20160113108 | PACKAGE-LEVEL ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURES FOR A SUBSTRATE - A electromagnetic interference shielding device is disclosed having a first substrate one or more surfaces. One or more laminates are operatively attached to the one or more surfaces of the first substrate. A cavity is provided that is defined by the first substrate and its corresponding one or more laminates and at least one inner lateral portion. The cavity is operable to receive one or more microelectromechanical system (MEMS) components. A first conductive structure integrally formed with a trench or via array of the substrate spans a thickness defined by one or more of surfaces of the first substrate, the first conductive structure operable to shield electromagnetic interference between MEMS components assembled with the first substrate. | 04-21-2016 |
Rao R. Tummala, Atlanta, GA US
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20140355931 | Glass-Polymer Optical Interposer - An optical interposer that includes a glass substrate having one or more optical vias extending through the glass substrate. A first optical polymer may be bonded to the substrate and to interior surfaces of the one or more optical vias. Implementations include one or more optical via cores comprising a second optical polymer that has a greater refractive index than the first optical polymer. The one or more optical via cores may be at least partially surrounded by the first optical polymer. Embodiments include encapsulated optical waveguides in communication with the optical vias and/or via cores. Example implementations include layers of electrical insulation, electrical traces, and electrical vias. A method of manufacture includes forming the optical vias by laser ablation. Certain embodiments may include chemically etching the inside of the vias to improve surface roughness. | 12-04-2014 |
Ravikiran Tummala, Andhra Pradesh IN
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20120166655 | METHOD AND APPARATUS FOR INVOKING NATIVE FUNCTIONS OF A MOBILE DEVICE TO CONTROL A SET-TOP BOX - An approach is provided for controlling a user device native function via a web-based application at a user device (e.g., a mobile terminal). The mobile terminal executes a web-based application and a shell application, wherein the shell application provides communication between the web-based application and a native function of the mobile terminal. The mobile terminal registers the web-based application with the shell application for the communication. The mobile terminal invokes the native function of the mobile terminal via the communication based upon a communication protocol that specifies a command of a native function associated with a set top box. | 06-28-2012 |
Seshu Tummala, Groveland, MA US
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20110256606 | Methods and Compositions for Increasing Toxin Production - The invention provides methods and compositions (such as for example, culture media) for culturing | 10-20-2011 |
20160053221 | METHODS AND COMPOSITIONS FOR INCREASING TOXIN PRODUCTION - The invention provides methods and compositions (such as for example, culture media) for culturing | 02-25-2016 |
Srikanth Tummala, Peterborough GB
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20120318371 | Bellows assembly and engaging structure - A gas handling transport assembly includes a bellows assembly together with a bellows engaging structure. The bellows engaging structure includes an engaging surface that engages an outer surface of the bellows assembly to restrain movement thereof. An open first end and an open second end may be provided along a longitudinal axis of the bellows assembly. A method of using the assembly is also provided. | 12-20-2012 |
Srinivas Tummala, Auburn Hills, MI US
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20120296539 | DRIVER ASSISTANCE SYSTEM - A system and method of assisting a driver of a vehicle by providing driver and vehicle feedback control signals is disclosed herein. The system and method includes receiving location data of the vehicle from a GPS unit, receiving the location data of the vehicle and retrieving navigation characteristics relevant to the location data using a processing circuit, generating a most probable future path for the vehicle and determining a location of at least one navigation characteristic with respect to the most probable future path and the vehicle, generating vehicle data at least one vehicle sensor, and transmitting a control signal to a vehicle control area network to warn the driver of an upcoming navigation characteristic on the most probable path. | 11-22-2012 |
Sudhakar Tummala, London CA
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20150201887 | PREDICTIVE INTERVERTEBRAL DISC DEGENERATION DETECTION ENGINE - Systems, methods and computer program products for facilitating the prognosis of degenerative disc disorder (DDD) are provided. In one aspect, intervertebral disc loss is predicted based on receiving image data comprising one or more images of the human spine; segmenting, using a processor, disc regions of said one or more images; generating, using the processor, individual biomarkers based on texture features of said segmented disc regions; generating, using the processor, a predicting intervertebral disc loss based in part on the prognostic marker generated from the individual biomarkers. | 07-23-2015 |
Suryanarayana Tummala, Tirupathi IN
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20090299681 | METHODS AND SYSTEMS FOR GENERATING INFORMATION TO BE USED FOR SELECTING VALUES FOR ONE OR MORE PARAMETERS OF A DETECTION ALGORITHM - Methods and systems for generating information to be used for selecting values for parameter(s) of a detection algorithm are provided. One method includes without user intervention performing a scan of an area of a wafer using an inspection system and default values for parameter(s) of a detection algorithm to detect defects on the wafer. The method also includes selecting a portion of the defects from results of the scan based on a predetermined maximum number of total defects to be used for selecting values for the parameter(s) of the detection algorithm. The method further includes storing information, which includes values for the parameter(s) of the detection algorithm determined for the defects in the portion. The information can be used to select the values for the parameter(s) of the detection algorithm to be used for the inspection recipe without performing an additional scan of the wafer subsequent to the scan. | 12-03-2009 |
Venugopal Tummala, Chennai IN
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20130266307 | DIAGNOSTIC PORT FOR INTER-SWITCH AND NODE LINK TESTING IN ELECTRICAL, OPTICAL AND REMOTE LOOPBACK MODES - A diagnostic testing utility is used to perform single link diagnostics tests including an electrical loopback test, an optical loopback test, a link traffic test, and a link distance measurement test. To perform the diagnostic tests, two ports at each end of a link are identified and then statically configured by a user. The ports will be configured as D_Ports and as such will be isolated from the fabric with no data traffic flowing through them. This configuration can be static or can be on request or on errors. The ports will then be used to send test frames to perform the diagnostic tests. After completion of requested or on error testing the ports can return to normal operation. | 10-10-2013 |