Patent application number | Description | Published |
20080212093 | PARTICLE MONITOR SYSTEM AND SUBSTRATE PROCESSING APPARATUS - A particle monitor system that can detect fine particles in a substrate processing apparatus. The substrate processing apparatus has a chamber in which a substrate is housed and subjected to processing, a dry pump that exhausts gas out of the chamber, and a bypass line that communicates the chamber and the dry pump together. The particle monitor system has a laser light oscillator that irradiates laser light toward a space in which the particles may be present, and a laser power measurement device that is disposed on an optical path of the laser light having passed through the space and measures the energy of the laser light. | 09-04-2008 |
20080236629 | CLEANING METHOD FOR TURBO MOLECULAR PUMP - A cleaning method for a turbo molecular pump, which enables the exhausting ability of the turbo molecular pump to be restored without bringing about a decrease in the productivity of a substrate processing apparatus. A vaporizing gas that vaporizes foreign matter attached to an internal surface of the turbo molecular pump is supplied toward the foreign matter. | 10-02-2008 |
20080236634 | SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE CLEANING APPARATUS - A substrate processing system that enables foreign matter adhered to a rear surface or a periphery of a substrate to be completely removed. A substrate processing apparatus performs predetermined processing on the substrate. A substrate cleaning apparatus cleans the substrate at least one of before and after the predetermined processing. A jetting apparatus jets a cleaning substance in two phases of a gas phase and a liquid phase and a high-temperature gas towards the rear surface or the periphery of the substrate. | 10-02-2008 |
20080237182 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus that can improve the uniformity of plasma processing carried out on a wafer. The wafer is housed in a chamber of the substrate processing apparatus and subjected to plasma processing using plasma produced in the processing chamber. A temperature control mechanism jets a high-temperature gas toward at least part of an annular focus ring facing the plasma. | 10-02-2008 |
20080240905 | EXHAUST PUMP, COMMUNICATING PIPE, AND EXHAUST SYSTEM - An exhaust pump that prevents particles from entering a processing chamber of a substrate processing apparatus. The exhaust pump connected to the processing chamber has rotary blades and an air intake portion disposed on the processing chamber side of the rotary blades. A shielding unit is disposed inside the air intake portion and shields the rotary blades when the air intake portion is viewed from the processing chamber side. | 10-02-2008 |
20080240910 | TURBO-MOLECULAR PUMP, SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR SUPPRESSING ATTACHMENT OF DEPOSITIONS TO TURBO-MOLECULAR PUMP - A turbo-molecular pump that enables reliable suppression of attachment of depositions onto component parts thereof. The turbo-molecular pump discharges a deposition-causing gas from a processing chamber. A rotor has a rotor shaft aligned with an exhaust stream. A cylindrical casing houses the rotor therein. A plurality of blade-form rotor blades projects from the rotor orthogonally with respect to the rotor shaft and are divided into a plurality of rotor blade groups. A plurality of blade-form stator blades projects orthogonally with respect to the rotor shaft from a rotor-facing surface and are divided into a plurality of stator blade groups. Gas supply ports are located on an upstream side of the rotor blade group that is located furthest downstream in the exhaust stream, and supply a deposition-suppressing gas which includes gas molecules having a large molecular weight. | 10-02-2008 |
20080245387 | METHOD FOR CLEANING ELEMENTS IN VACUUM CHAMBER AND APPARATUS FOR PROCESSING SUBSTRATES - To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere. | 10-09-2008 |
20080245388 | METHOD FOR CLEANING ELEMENTS IN VACUUM CHAMBER AND APPARATUS FOR PROCESSING SUBSTRATES - To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere. | 10-09-2008 |
20080245389 | METHOD FOR CLEANING ELEMENTS IN VACUUM CHAMBER AND APPARATUS FOR PROCESSING SUBSTRATES - To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere. | 10-09-2008 |
20080273893 | SUBSTRATE TRANSFER MEMBER CLEANING METHOD, SUBSTRATE TRANSFER APPARATUS, AND SUBSTRATE PROCESSING SYSTEM - A substrate transfer member cleaning method that enables foreign matter attached to a substrate transfer member to be completely removed without bringing about a decrease in the throughput. A cleaning agent containing a cleaning substance in two phases of a vapor phase and a liquid phase and a high-temperature gas is jetted toward the substrate transfer member that transfers a substrate. | 11-06-2008 |
20080301972 | EVACUATION METHOD AND STORAGE MEDIUM - An evacuation method which can reduce evacuation time without causing moisture-related problems. In a vacuum processing apparatus including a vacuum processing chamber, during the evacuation for the vacuum processing chamber, the pressure in the vacuum processing chamber is maintained at a pressure lower than or equal to the atmospheric pressure but higher than or equal to 6.7×10 | 12-11-2008 |
20090025552 | GAS PURIFICATION APPARATUS AND METHOD - A gas purification apparatus capable of removing fine particles of substantially any size without lowering the efficiency of gas supply. A loader module of a substrate processing apparatus includes a fan filter unit for producing a downward flow of atmospheric air in the internal space of a transfer chamber. The fan filter unit includes a fan for generating an atmospheric air flow, a filter of mesh structure for trapping and removing particles mixed in the atmospheric air flow, an irradiation heater disposed between the fan and the filter, and a high temperature part disposed in the atmospheric air flow and higher in temperature than the filter. | 01-29-2009 |
20090025631 | GAS-TIGHT MODULE AND EXHAUST METHOD THEREFOR - A gas-tight module capable of preventing the collapse of a pattern formed on a principal surface of a substrate, without lowering throughput. A load lock module of a substrate processing system includes a transfer arm, a chamber, and a load lock module exhaust system. A plate-like member is disposed in the chamber such as to face the principal surface of a wafer transferred into the chamber. An exhaust passage isolated from the remaining space in the chamber is defined by the wafer and the plate-like member at a location right above the principal surface of the wafer. The sectional area of the exhaust passage is smaller than that of the remaining space in the chamber. | 01-29-2009 |
20090028672 | SUBSTRATE TRANSFER MODULE AND SUBSTRATE PROCESSING SYSTEM - A substrate transfer module that can prevent corrosion of components, adhesion of particles to the substrate, and increases in the manufacturing cost and the size of the substrate transfer module. A substrate transfer module is connected to a substrate processing module. The substrate processing module implements desired processing on a substrate. A substrate transfer device transfers a substrate and includes a holding unit and a moving unit. The holding unit holds the substrate, and the moving unit moves the holding unit. A transfer chamber houses the substrate transfer device in an interior thereof that is isolated from an external atmosphere. An isolation device isolates at least the holding unit and the substrate held by the holding unit from an interior atmosphere of the transfer chamber. | 01-29-2009 |
20090053835 | VACUUM APPARATUS INCLUDING A PARTICLE MONITORING UNIT, PARTICLE MONITORING METHOD AND PROGRAM, AND WINDOW MEMBER FOR USE IN THE PARTICLE MONITORING - A semiconductor manufacturing apparatus includes a processing chamber for performing a manufacturing processing on a wafer. A gas supply line for introducing a purge gas is connected to an upper portion of the processing chamber, a valve being installed on the gas supply line. A rough pumping line with a valve is connected to a lower portion of the processing chamber. Installed on the rough pumping line are a dry pump for exhausting a gas in the processing chamber and a particle monitoring unit for monitoring particles between the valve and the dry pump. In the semiconductor manufacturing apparatus, after the valve is opened, the purge gas is supplied to apply physical vibration due to shock wave in the processing chamber so that deposits are detached therefrom to be monitored as particles. | 02-26-2009 |
20090064760 | CONTAINER CLEANLINESS MEASUREMENT APPARATUS AND METHOD, AND SUBSTRATE PROCESSING SYSTEM - A container cleanliness measurement apparatus capable of preventing particles from being adhered to substrates, while improving the operation efficiency of a container for housing substrates. An FOUP inspection apparatus includes a particle-separation promoting nozzle for promoting separation of particles adhered to an inner wall of an FOUP and to carries for holding peripheral portions of wafers inside the FOUP, a particle collecting nozzle for collecting particles separated from the inner wall of the FOUP, etc., and a particle counter for measuring an amount of collected particles. The particle-separation promoting nozzle and the particle collecting nozzle constitute a probe nozzle which is adapted to enter inside the FOUP. | 03-12-2009 |
20090104781 | PLASMA PROCESSING APPARATUS, RING MEMBER AND PLASMA PROCESSING METHOD - [Problem to be Solved] In a plasma processing apparatus for executing a process using plasma, promoting the sharing of an apparatus in executing a plurality of different processes and plasma states amongst apparatuses in executing same processes in a plurality of apparatuses are provided. | 04-23-2009 |
20090133717 | CERAMIC SPRAYED MEMBER-CLEANING METHOD, PROGRAM FOR IMPLEMENTING THE METHOD, STORAGE MEDIUM STORING THE PROGRAM, AND CERAMIC SPRAYED MEMBER - A ceramic sprayed member-cleaning method which is capable of reliably suppressing desorption and attachment of water. The surface of a ceramic sprayed member and water are chemically bonded to each other, whereby the water is stabilized. Water physically adsorbed on the surface of the ceramic sprayed member is desorbed. | 05-28-2009 |
20090134121 | PLASMA PROCESSING APPARATUS AND METHOD - There is provided a plasma processing apparatus including a plasma generating unit for generating a plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed. The plasma processing apparatus further includes a particle moving unit for electrostatically driving particles in a region above the substrate to be removed out of the region above the substrate in the processing chamber while the processing on the substrate is performed by using the plasma. In addition, there is provided a plasma processing method of a plasma processing apparatus including the steps of generating plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed; and performing the processing on the substrate by the plasma. | 05-28-2009 |
20090136336 | EXHAUST SYSTEM AND EXHAUSTING PUMP CONNECTED TO A PROCESSING CHAMBER OF A SUBSTRATE PROCESSING APPARATUS - An exhausting system and an exhausting pump connected to a processing chamber of a substrate processing apparatus are provided. The exhausting pump is provided with at least one rotary blade and a cylindrical intake part disposed at the processing chamber side from the rotary blade. The exhausting pump includes a reflecting device disposed inside the intake part and having at least one reflecting surface oriented to the rotary blade. | 05-28-2009 |
20090209108 | SUBSTRATE PROCESSING METHOD - A substrate processing method that can prevent a decrease in the yield of semiconductor devices manufactured from substrates. A gas containing fluorine atoms is supplied into a chamber, and then chlorine gas is supplied into the chamber. Further, a gas containing nitrogen atoms is supplied into the chamber. | 08-20-2009 |
20090246406 | PLASMA PROCESSING APPARATUS, CHAMBER INTERNAL PART, AND METHOD OF DETECTING LONGEVITY OF CHAMBER INTERNAL PART - A plasma processing apparatus that can accurately detect the longevity of a chamber internal part to eliminate the waste of the replacement of the chamber internal part that has not reached its end of longevity and prevent the occurrence of troubles caused by continuously using the chamber internal part that has reached its end of longevity. In the chamber internal part, at least one longevity detecting elemental layer comprised of an element different from a constituent material of the chamber internal part is buried. | 10-01-2009 |
20090301516 | SUBSTRATE TRANSFER DEVICE AND CLEANING METHOD THEREOF AND SUBSTRATE PROCESSING SYSTEM AND CLEANING METHOD THEREOF - A substrate transfer device includes an accommodating chamber for accommodating a substrate; a substrate transfer unit installed in the accommodating chamber for transferring the substrate; a gas exhaust unit for exhausting the accommodating chamber; and a gas introducing unit for introducing a gas into the accommodating chamber. The substrate transfer unit has a mounting subunit for mounting the substrate thereon, an arm subunit one end of which is connected to the mounting subunit to move the mounting subunit, and an electrode installed in the mounting subunit to which a voltage is applied, and a high voltage is applied to the electrode while the gas is being introduced into the accommodating chamber and the accommodating chamber is being exhausted. | 12-10-2009 |
20100018332 | METHOD AND APPARATUS FOR DETECTING FOREIGN MATTER ATTACHED TO PERIPHERAL EDGE OF SUBSTRATE, AND STORAGE MEDIUM - A foreign matter detecting method of detecting foreign matter attached to a peripheral edge of a substrate, which makes it possible to accurately detect foreign matter attached to the peripheral edge of the substrate even if the foreign matter is of a minute size below the detection limit of an existing measuring instrument, and which is highly versatile and suitable for mass production of substrates. The substrate is cooled to condense moisture around the foreign matter attached to the peripheral edge of the substrate, and then the condensed moisture is iced to grow an ice crystal. Then, the foreign matter attached to the peripheral edge of the substrate, which is emphasized by the ice crystal, is detected. | 01-28-2010 |
20100043894 | VALVE ELEMENT, PARTICLE ENTRY PREVENTIVE MECHANISM, EXHAUST CONTROL APPARATUS, AND SUBSTRATE PROCESSING APPARATUS - A valve element that can prevent particles rebounding from an exhausting pump from entering a chamber and also prevent a decrease in exhaust efficiency. The valve element has a through hole that penetrates the valve element along an exhaust flow in an exhaust flow passage between the chamber in which a substrate is subjected to predetermined processing and the exhausting pump having rotary blades rotating at high speed, and a particle trap that covers the through hole. The particle trap has a plurality of preventive members that are arranged such as to obstruct particles rebounding from the exhausting pump. The ratio of openings of the particle trap to the exhaust flow in the exhaust flow passage is not less than a predetermined value. | 02-25-2010 |
20100071732 | SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING SYSTEM, SUBSTRATE CLEANING PROGRAM AND STORAGE MEDIUM - In a substrate cleaning method for cleaning a backside of a substrate on a surface of which a predetermined processing is performed, a two phase substance contacts the backside of the substrate, and a flow of the substance is generated near the backside of the substrate under a specified pressure. The two phase substance is a gas containing aerosol or a supercritical substance, and the specified pressure is higher than or equal to 133 Pa (1 Torr). Further, in the substrate cleaning method, a high-energy light may be irradiated on the backside of the substrate. | 03-25-2010 |
20100153065 | INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND PROGRAM - An information processing device includes a first input receiving unit, a second input receiving unit, a window function processing unit, a correlation calculating unit, and an output unit. The first input receiving unit is configured to receive first information including a first time-series data related to a semiconductor process. The second input receiving unit is configured to receive second information including a second time-series data related to the semiconductor process. The window function processing unit is configured to retrieve window acquiring information from the first information during an intended period using a window function. The correlation calculating unit is configured to calculate a cross-correlation function between the window acquiring information retrieved by the window function processing unit and the second information. The output unit is configured to output information corresponding to the cross-correlation function calculated by the correlation calculating unit. | 06-17-2010 |
20100154995 | SUBSTRATE PROCESSING APPARATUS, PROGRAM FOR PERFORMING OPERATION AND CONTROL METHOD THEREOF, AND COMPUTER READABLE STORAGE MEDIUM STORING THE PROGRAM - A computer readable storage medium storing a program for performing an operation method of a substrate processing apparatus is provided. The operation method includes the steps of introducing a nonreactive gas into the vacuum preparation chamber before the gate valve is opened while the substrate is transferred between the vacuum preparation chamber of the vacuum processing unit and the transfer unit, stopping introducing the nonreactive gas when an inner pressure of the vacuum preparation chamber becomes same as an atmospheric pressure, starting an evacuation process of the corrosive gas in the vacuum preparation chamber and then opening to atmosphere performed by letting the vacuum preparation chamber communicate with an atmosphere, and opening the gate valve after the step of opening to atmosphere. | 06-24-2010 |
20100307687 | INTERNAL MEMBER OF A PLASMA PROCESSING VESSEL - An internal member of a plasma processing vessel includes a base material and a film formed by thermal spraying of ceramic on a surface of the base material. The film is formed of ceramic which includes at least one kind of element selected from the group consisting of B, Mg, Al, Si, Ca, Cr, Y, Zr, Ta, Ce and Nd. In addition, at least a portion of the film is sealed by a resin. | 12-09-2010 |
20110126853 | CLEANING METHOD OF PROCESSING APPARATUS, PROGRAM FOR PERFORMING THE METHOD, AND STORAGE MEDIUM FOR STORING THE PROGRAM - A plasma processing apparatus includes a processing chamber, in which a wafer W is plasma-processed, and a CPU controlling an operation of each component. A processing gas is introduced into the processing chamber under a first condition defined by a flow rate and a molecular weight of the processing gas, specifically based on a magnitude of a product A | 06-02-2011 |
20110162678 | REFLECTING DEVICE, COMMUNICATING PIPE, EXHAUSTING PUMP, EXHAUST SYSTEM, METHOD FOR CLEANING THE SYSTEM, STORAGE MEDIUM STORING PROGRAM FOR IMPLEMENTING THE METHOD, SUBSTRATE PROCESSING APPARATUS, AND PARTICLE CAPTURING COMPONENT - A reflecting device that enables to prevent infiltration of particles into a processing chamber. The reflecting device is disposed in a communicating pipe. The communicating pipe allows the processing chamber of a substrate processing apparatus and an exhaust pump to communicate with each other. The exhaust pump has at least one rotary blade. The reflecting device comprises at least one reflecting surface. The at least one reflecting surface is oriented to the exhausting pump. | 07-07-2011 |
20110216322 | PARTICLE MONITOR SYSTEM AND SUBSTRATE PROCESSING APPARATUS - A particle monitor system that can detect fine particles in a substrate processing apparatus. The substrate processing apparatus has a chamber in which a substrate is housed and subjected to processing, a dry pump that exhausts gas out of the chamber, and a bypass line that communicates the chamber and the dry pump together. The particle monitor system has a laser light oscillator that irradiates laser light toward a space in which the particles may be present, and a laser power measurement device that is disposed on an optical path of the laser light having passed through the space and measures the energy of the laser light. | 09-08-2011 |
20110242510 | SUBSTRATE PROCESSING SYSTEM, SUBSTRATE SURFACE PROCESSING APPARATUS, SUBSTRATE SURFACE INSPECTING APPARATUS, SUBSTRATE SURFACE INSPECTING METHOD, AND STORAGE MEDIUM STORING PROGRAM FOR IMPLEMENTING THE METHOD - A substrate processing system which enables a minute piece of foreign matter attached to a substrate surface to be detected and are suitable for mass production of substrates. The substrate processing system has a substrate processing apparatus that carries out predetermined processing on a substrate. The substrate processing system comprises a substrate surface processing apparatus having a fluid supply unit that supplies onto a surface of the substrate a fluid containing an altering substance that alters a substance exposed at the surface of the substrate, and a substrate surface inspecting apparatus that inspects the surface of the substrate onto which the fluid has been supplied. | 10-06-2011 |
20120012254 | GATE VALVE CLEANING METHOD AND SUBSTRATE PROCESSING SYSTEM - A gate valve cleaning method that can clean a gate valve that brings an atmospheric transfer chamber and an internal pressure variable transfer chamber that transfer a substrate into communication with each other or shuts them off from each other without bringing about a decrease in the throughput of a substrate processing system. Before the gate valve brings the atmospheric transfer chamber and the internal pressure variable transfer chamber into communication with each other, the pressure in the internal pressure variable transfer chamber is increased so that the pressure in the internal pressure variable transfer chamber can become higher than the pressure in the atmospheric transfer chamber. | 01-19-2012 |
20120037182 | PARTICLE REMOVAL APPARATUS AND METHOD AND PLASMA PROCESSING APPARATUS - A particle removal apparatus for removing particles from a chamber of a plasma processing apparatus, wherein the chamber is connected to a gas exhaust port and a plasma of a processing gas is generated in the chamber to plasma process a substrate to be processed, includes a particle charging control member for positively charging particles generated within the chamber by positive ions of an ion sheath region formed in a region other than the vicinity of the substrate to be processed, wherein positively charged particles are discharged from the chamber via the gas exhaust port. Therefore, there is no plasma disturbance or metal contamination, and thus can be applied to a practical use. | 02-16-2012 |
20120037314 | SUBSTRATE PROCESSING APPARATUS AND SIDE WALL COMPONENT - A substrate processing apparatus that enables abnormal electrical discharges and metal contamination to be prevented from occurring. A processing chamber is configured to house and carry out predetermined plasma processing on a substrate. A lower electrode is disposed on a bottom portion of the processing chamber and has the substrate mounted thereon. An upper electrode is disposed in a ceiling portion of the processing chamber. A side wall component covering a side wall of the processing chamber faces onto a processing space between the upper electrode and the lower electrode. The side wall component has at least one electrode layer to which a DC voltage is applied. An insulating portion made of an insulating material is present at least between the electrode layer and the processing space and covers the electrode layer. The insulating portion is formed by thermally spraying the insulating material. | 02-16-2012 |
20120174773 | GAS PURIFICATION APPARATUS AND METHOD - A gas purification apparatus capable of removing fine particles of substantially any size without lowering the efficiency of gas supply. A loader module of a substrate processing apparatus includes a fan filter unit for producing a downward flow of atmospheric air in the internal space of a transfer chamber. The fan filter unit includes a fan for generating an atmospheric air flow, a filter of mesh structure for trapping and removing particles mixed in the atmospheric air flow, an irradiation heater disposed between the fan and the filter, and a high temperature part disposed in the atmospheric air flow and higher in temperature than the filter. | 07-12-2012 |
20120247502 | METHOD FOR CLEANING ELEMENTS IN VACUUM CHAMBER AND APPARATUS FOR PROCESSING SUBSTRATES - To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere. | 10-04-2012 |
20120285623 | PLASMA PROCESSING APPARATUS AND METHOD - There is provided a plasma processing apparatus including a plasma generating unit for generating a plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed. The plasma processing apparatus further includes a particle moving unit for electrostatically driving particles in a region above the substrate to be removed out of the region above the substrate in the processing chamber while the processing on the substrate is performed by using the plasma. In addition, there is provided a plasma processing method of a plasma processing apparatus including the steps of generating plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed; and performing the processing on the substrate by the plasma. | 11-15-2012 |