Patent application number | Description | Published |
20080259697 | SEMICONDUCTOR MEMORY DEVICE HAVING OUTPUT IMPEDANCE ADJUSTMENT CIRCUIT AND TEST METHOD OF OUTPUT IMPEDANCE - A semiconductor device has an output impedance adjustment circuit for automatically adjusting an output impedance of an output circuit including transistors connected in parallel. The output impedance adjustment circuit comprises: a replica circuit including a circuit portion of the substantially same configuration as the output circuit; a comparator for comparing a magnitude of the output impedance of the replica circuit with a reference resistor and for outputting a comparison result as an internal counter control signal; a switching controller selectively switching between an external counter control signal from outside and the internal counter control signal; and a counter circuit for performing a count operation selectively according to the internal or the external counter control signal and for outputting a count value as an adjustment code which is supplied to the output circuit and the replica circuit so that each transistor is controlled to be on/off based on the adjustment code. | 10-23-2008 |
20090102527 | Semiconductor device including DLL circuit, and data processing system - A DLL circuit includes: a phase determining circuit that compares phases of respective rising edges of CK and LCLK to generate a determining signal R-U/D; a phase determining circuit that compares phases of respective falling edges of CK and LCLK to generate a determining signal F-U/D; a first adjusting circuit that adjusts a position of an active edge of LCLKR based on the determining signal R-U/D; a second adjusting circuit that adjusts a position of an active edge of LCLKF based on the determining signal F-U/D; a clock generating circuit that generates LCLK based on LCLKR and LCLKF; and a stop circuit that stops an adjusting operation by the second adjusting circuit in response to an adjusting direction of the active edge of LCLKR being opposite to each other to an adjusting direction of the active edge of LCLKF. | 04-23-2009 |
20100052751 | DLL CIRCUIT AND CONTROL METHOD THEREFOR - A DLL (delay locked loop) circuit includes a first variable delay circuit, a pair of second variable delay circuits and a first synthesis circuit. The first variable delay circuit outputs signals of different delayed time values from each of first and second clock transitions. The pair of second variable delay circuits receive the signals from the first variable delay circuit, and the first synthesis circuit synthesizes output signals of the pair of second variable delay circuits to output the resulting synthesized signal. Each of the pair of second variable delay circuits includes a pair one-shot pulse generating circuits that generate one-shot pulses from the signals from the first variable delay circuit, a pair latch circuits, and a second synthesis circuit. The second synthesis circuit receives the set outputs of the latch circuits to output a signal which is a synthesis at a preset synthesis ratio. | 03-04-2010 |
20100060334 | DLL CIRCUIT AND CONTROL METHOD THEREFOR - A DLL includes a first variable delay circuit that variably delays a first transition of an external signal, a second variable delay circuit that variably delays a second transition of the external signal, a synthesis circuit that synthesizes output signals of the first variable delay circuit and the second variable delay circuit, a duty change detection circuit that changes and detects the duty of an output signal of the synthesis circuit, and delay control circuits that vary the delay of the first variable delay circuit or the second variable delay circuit in accordance with the result of duty detection by the duty change detection circuit. | 03-11-2010 |
20100320580 | EQUIPOTENTIAL PAD CONNECTION - A conduction member is used to connect in-chip equipotential pads | 12-23-2010 |
20110204942 | CLOCK CONTROL CIRCUIT AND SEMICONDUCTOR DEVICE INCLUDING THE SAME - A clock control circuit includes: a phase determination circuit that generates a phase determination signal based on a phase of an external clock signal; a counter circuit having a count value updated based on a logic level of the phase determination signal; a delay line that generates an internal clock signal by delaying the external clock signal based on the count value; and a pitch adjustment circuit that sets an update pitch of the counter circuit to be twice as high as a minimum pitch in a period in which the phase determination signal has no change, and sets the update pitch of the counter circuit to the minimum pitch in response to a change in the phase determination signal. With this configuration, it is possible to realize quick and highly accurate locking of a DLL circuit. | 08-25-2011 |
20110248756 | SEMICONDUCTOR CIRCUIT - Power consumption in a DLL circuit having a DCC circuit is reduced. Specifically, a semiconductor circuit includes a change-in-duty detection circuit, activation and deactivation of which is controlled based upon a control signal (DCCEN), for comparing duty of a clock signal that has been generated based upon an input clock signal and a preset duty and outputting result of the comparison; and a duty determination circuit for outputting the control signal (DCCEN) for deactivating the change-in-duty detection circuit when the output of the change-in-duty detection circuit indicates that duty of the generated clock signal is in the vicinity of a target value, which is a preset duty, and outputting the control signal (DCCEN) for activating the change-in-duty detection circuit when the duty of the generated clock signal is not in the vicinity of the target value. | 10-13-2011 |
20110249521 | Semiconductor device - A semiconductor device includes: a clock generator generating a first internal clock signal based on an external clock signal; a clock divider generating second and third internal clock signals based on the first internal clock signal and including an edge adjustor adjusting a timing of one of rising and falling edges of the third internal clock signal, an adjustment information holder supplying an edge adjustment signal to the edge adjustor, and a data strobe generator receiving the second and third internal clock signals to generate a first data strobe signal based on the second internal clock signal, and a second data strobe signal with a phase different from that of the first data strobe signal, based on the third internal clock signal. The edge adjustor adjusts the timing of at least one of the rising and falling edges of the third internal clock signal based on the edge adjustment signal. | 10-13-2011 |
Patent application number | Description | Published |
20110150544 | Fixing Device Provided with Temperature Sensor - There is provided a fixing device for thermally fixing a developing agent image to a sheet. The fixing device includes: a tubular flexible member having an inner peripheral surface defining an internal space; a nip member disposed in the internal space and having one surface, the inner peripheral surface being in sliding contact with the one surface; a heater disposed in the internal space: a reflection plate configured to reflect a radiant heat from the heater toward the nip member; a backup member providing a nip region in cooperation with the nip member for nipping the flexible member between the backup member and the nip member; and a temperature sensor disposed in the internal space to detect a temperature of the reflection plate. | 06-23-2011 |
20110158715 | Fixing Device - A fixing device for thermally fixing a developing agent image to a sheet includes a tubular flexible fusing member, a nip plate, a heater, a reflection plate, and a backup member. The tubular flexible fusing member has an inner peripheral surface defining an internal space and an axis defining an axial direction. The nip plate is disposed in the internal space, and the inner peripheral surface is in sliding contact with the nip plate. A heater is disposed in the internal space and confronts the nip plate in a confronting direction. The heater includes a glass tube, a heat source provided in the glass tube, and a gas sealed in the glass tube. The glass tube includes a glass tube body and a tip portion protruding radially outwardly from the glass tube body for sealing the gas in the glass tube body. The tip portion protrudes in a predetermined direction to define a cross-sectional length of the glass tube in the confronting direction greater than a cross-sectional length of the glass tube in a perpendicular direction extending perpendicular to the confronting direction and the axial direction, and the cross-section includes the tip portion. The reflection plate is configured to reflect a radiant heat from the heater toward the nip plate. A backup member is configured to provide a nip region in cooperation with the nip plate for nipping the fusing member between the backup member and the nip plate. | 06-30-2011 |
20110158718 | Fixing Device - A fixing device for thermally fixing a developer image transferred onto a recording sheet, includes: a flexible fusing member which is flexibly deformable; a heating element; a nip member disposed in such a manner as to contact with a surface of the flexible fusing member and to allow the flexible fusing member to slide along the nip member; a reflecting plate configured to reflect radiant heat from the heating element in a direction toward the nip member; a backup member configured to nip the flexible fusing member with the nip member to thereby form a nip portion for the recording sheet between the flexible fusing member and the backup member; and a stay configured to support both end portions of the nip member. The reflecting plate has at least one flange portion, and the flange portion is held and supported between the nip member and the stay. | 06-30-2011 |
20110164906 | Fixing Device - A fixing device for thermally fixing a developing agent image to a sheet fed in a sheet feeding direction includes: a tubular flexible member; a nip member; a heater; a reflection member; a backup member; and a temperature sensor. The tubular flexible member has an inner peripheral surface defining an internal space. The nip member is disposed in the internal space and has one surface and opposite surface. The inner peripheral surface is in contact with the one surface. The heater is disposed in the internal space and confronts the nip member in a confronting direction. The reflection member is configured to reflect a radiant heat from the heater toward the nip member. The backup member is configured to provide a nip region in cooperation with the nip member for nipping the tubular flexible member between the backup member and the nip member. The temperature sensor is disposed in the internal space and is configured to detect a temperature of the nip member. The temperature sensor is positioned outside of the reflection member and in confrontation with the opposite surface. | 07-07-2011 |
20110206406 | Fixing Device with Grounded Fusing Film - There is provided a fixing device for thermally fixing a developing agent image to a sheet. The fixing device includes a tubular flexible member, a heater, a nip member and a backup member. The tubular flexible member has an inner peripheral surface defining an internal space. The heater is disposed within the internal space and is configured to generate a radiant heat. The nip member is disposed within the internal space and is configured to receive the radiant heat from the heater, the inner peripheral surface being in sliding contact with the nip member, and the nip member being electrically conductive and the tubular flexible member being grounded via the nip member. The backup member is configured to provide a nip region in cooperation with the nip member for nipping the tubular flexible member between the backup member and the nip member. | 08-25-2011 |
20110211881 | Fixing Device - There is provided a fixing device for thermally fixing a developing agent image to a sheet. The fixing device includes a tubular flexible member, a nip member, a backup member and a restricting member. The tubular flexible member has an inner peripheral surface defining an internal space and an outer peripheral surface opposite to the inner peripheral surface, the tubular flexible member defining an axis extending in an axial direction. The nip member is disposed within the internal space. The backup member is configured to provide a nip region in cooperation with the nip member for nipping the tubular flexible member between the backup member and the nip member. The restricting member is configured to restrict the tubular flexible member from moving in the axial direction, the restricting member having a base section, an inner guide protruding inward from the base section in the axial direction for guiding the inner peripheral surface and an outer guide protruding inward from the base section in the axial direction for guiding the outer peripheral surface, the inner guide having a portion whose protruding end is positioned inward of a protruding end of the outer guide in the axial direction. | 09-01-2011 |
20110211882 | Fixing Device - There is provided a fixing device for thermally fixing a developing agent image to a sheet. The fixing device includes a tubular flexible member, a nip member, a backup member and a restricting member. The tubular flexible member has an inner peripheral surface defining an internal space and an outer peripheral surface opposite to the inner peripheral surface, the tubular flexible member defining an axis extending in an axial direction. The nip member is disposed within the internal space. The backup member is configured to provide a nip region in cooperation with the nip member for nipping the tubular flexible member between the backup member and the nip member. The restricting member is configured to restrict the tubular flexible member from moving in the axial direction, the restricting member having a base section, an inner guide protruding inward from the base section in the axial direction for guiding the inner peripheral surface and an outer guide protruding inward from the base section in the axial direction for guiding the outer peripheral surface, the inner guide having a portion whose protruding end is positioned inward of a protruding end of the outer guide in the axial direction. | 09-01-2011 |
Patent application number | Description | Published |
20110150543 | Fixing Device - In a fixing device, a nip plate is disposed on an inner surface of a tubular flexible fusing member which is flexibly deformable, and configured to be heated by a heating element disposed inside the fusing member. The fusing member is nipped between the nip plate and a backup member to form a nip portion. First and second portions of the nip plate which are located in positions upstream and downstream, respectively, with respect to a recording sheet conveyance direction and to be supported by a stay are each configured to be a flat plate extending along the recording sheet conveyance direction. A central portion between the first and second portions of the nip plate is in a position shifted from those of the first and second portions in a direction perpendicular to flat surfaces of the first and second portions. | 06-23-2011 |
20110158716 | Fixing Device - In a fixing device for thermally fixing a developer image transferred onto a recording sheet, a nip plate is disposed on an inner surface of a tubular flexible fusing member which is flexibly deformable in such a manner that permits the fusing member to slide along the nip plate, and configured to be heated by a heating element disposed inside the fusing member. The fusing member is nipped between the nip plate and a backup member to form a nip portion between the fusing member and the backup member. The nip plate is bent to form a recessed portion which opens on the inner surface of the fusing member and holds a lubricant. | 06-30-2011 |
20110158719 | Fixing Device Provided with Temperature Sensor - There is provided a fixing device for thermally fixing a developing agent image to a sheet. The fixing device includes a tubular flexible member, a heater, a nip member, a reflection plate, a backup member, a stay and a temperature sensor. The flexible member has an inner peripheral surface defining an internal space. The heater is disposed in the internal space and is configured to generate a radiant heat. The nip member is disposed in the internal space, the inner peripheral surface being in sliding contact with the nip member. The reflection plate is configured to reflect the radiant heat from the heater toward the nip member, the reflection plate having an outer profile. The backup member is configured to provide a nip region in cooperation with the nip member for nipping the flexible member between the backup member and the nip member. The stay covers the reflection plate and supports the nip member, the stay having a profile in conformance with the outer profile of the reflection plate, and the stay being formed with one of a through-hole and a notch. The temperature sensor is disposed in the internal space and extends through the one of the through-hole and the notch. | 06-30-2011 |
20110164905 | Fixing Device - A fixing device includes a heating element disposed inside a flexible fusing member, a nip member disposed to contact with a surface of the flexible fusing member and to allow the flexible fusing member to slide along the nip member, a reflecting plate for reflecting radiant heat from the heating element toward the nip member, and a backup member for nipping the flexible fusing member with the nip member. The reflecting plate includes a central reflecting portion extending along a longitudinal direction of the heating element at least in a region corresponding to along a heat generating portion of the heating element, and end reflecting portions stationarily provided on both ends of the central reflecting portion. The end reflecting portions are disposed in positions longitudinally outward of the heat generating portion and each has a reflecting surface tilted with respect to the longitudinal direction of the heating element. | 07-07-2011 |
20110170919 | Fixing Device - A fixing device includes a tubular fusing film, a heater, a nip member, a backup member, a first supporting member, and a second supporting member. The heater may be disposed inside the tubular shape of the fusing film. The nip member may be disposed so as to be in sliding contact with the inner surface of the fusing film and heated by the heater. The backup member may form a nip portion between the backup member and the fusing film with the fusing film between the backup member and the nip member. The first supporting member may be configured to support the nip member. The second supporting member may be configured to support the heater and movably support the first supporting member so that the nip member moves relative to the backup member and the heater. | 07-14-2011 |
20110170920 | Fixing Device - A fixing device includes a tubular fusing film, a heater, a nip member, a backup member, a backup member, first supporting member, and a second supporting member. The heater may be disposed inside the tubular shape of the fusing film. The nip member may be disposed so as to be in sliding contact with the inner surface of the fusing film and heated by the heater. The backup member may form a nip portion between the backup member and the fusing film with the fusing film between the backup member and the nip member. The first supporting member may be configured to integrally support the heater and the nip member. The second supporting member may be configured to movably support the first supporting member so that the nip member moves relative to the backup member. | 07-14-2011 |
Patent application number | Description | Published |
20090074898 | EXTRUSION FEED DEVICE FOR COMPOSITE RESIN AND COMPOSITE RESIN MASS - An extrusion feed device for a composite resin capable of forming a composite resin extruded material having a variety of layer configurations not necessarily symmetrical. A plurality of cylindrical flow passages ( | 03-19-2009 |
20100062092 | METAL MOLD FOR COMPRESSION FORMING - [Problem] To provide a metal mold for forming a preform decreasing the hitting of metal molds at a portion where a slide insert metal mold and a cavity metal mold undergo the sliding yet maintaining the pressure. | 03-11-2010 |
20100189832 | APPARATUS FOR FEEDING MOLTEN RESIN - [Problems] To provide an apparatus for feeding molten resin capable of preventing the adhesion of matters on the holding units for holding the molten resin, and of shortening the cycle for cleaning the holding units. | 07-29-2010 |
20100209727 | APPARATUS FOR FEEDING RESIN - [Problems] To provide an apparatus for feeding resin capable of extinguishing angular traces formed at both end portions of the cutter mark or of preventing the angular traces from extending up to the side wall of the body portion of the preform at the time of forming a preform. | 08-19-2010 |
20100243597 | PREFORM, BOTTLE AND PREFORM MOLDING APPARATUS - To provide a preform, a bottle and a preform molding apparatus capable of preventing lowering in the mechanical strength of a preform, reducing the amount of a resin material, as well as improving productivity. | 09-30-2010 |
20110146202 | METAL MOLD FOR COMPRESSION-MOLDING PREFORM, PREFORM, SYSTEM FOR ASEPTICALLY FILLING BEVERAGES AND FOODS USING THE SAME AND METHOD OF PRODUCING BLOW-MOLDED CONTAINERS - [Problem] To realize a predetermined “aseptic level of the containers” without introducing a container sterilizing machine and to reduce the burden for adjusting the temperature of the preform. | 06-23-2011 |
Patent application number | Description | Published |
20080213002 | Bubble creating method, bubble creating device, bubbly fixation fluid producing method, bubbly fixation fluid producing device, fixation fluid, image forming method, and image forming appaaratus - A bubbly fluid producing method configured to produce a bubbly fluid containing a bubble with a desired bubble diameter is disclosed, which comprises a step of applying a shear to a bubbly fluid containing a bubble with a bubble diameter larger than a desired bubble diameter so as to produce a bubbly fluid containing a bubble with a desired bubble diameter. A bubbly fluid producing device configured to produce a bubbly fluid containing a bubble with a desired bubble diameter is disclosed, which comprises a first member configured to apply a shear to a bubbly fluid containing a bubble with a bubble diameter larger than a desired bubble diameter so as to produce a bubbly fluid containing a bubble with a desired bubble diameter. | 09-04-2008 |
20090003903 | FIXING DEVICE, AND IMAGE FORMING METHOD AND IMAGE FORMING APPARATUS USING THE SAME - A fixing device, and an image forming method and an image forming apparatus using the fixing device. The fixing device includes an application unit to apply a foam-like fixing agent including a softener to particulates including a resin on a medium, the softener softening the particulates by at least partially dissolving or swelling the resin and a thickness control unit to control a layer thickness of the foam-like fixing agent such that an application time during which the foam-like fixing agent is applied to the particulates is not shorter than a penetration time required for the foam-like fixing agent to penetrate through a layer of the particulates to the medium. | 01-01-2009 |
20090067904 | FIXER, FIXING DEVICE, AND IMAGE FORMING APPARATUS - A disclosed fixing device fixes resin particles onto a medium by applying a fixer including a softening agent onto the resin particles resting on the medium. The softening agent softens the resin particles by dissolving or causing swelling of at least part of resin included in the resin particles. A foamed fixer is generated from the fixer. The foamed fixer whose layer thickness is controlled is applied onto the resin particles resting on the medium. | 03-12-2009 |
20090081571 | FIXING SOLUTION, CAPSULE STRUCTURE, FIXING METHOD, FIXING DEVICE AND IMAGE FORMING APPARATUS - A fixing solution for fixing toner to a recording medium, includes aliphatic ester held by solvent in a soluble manner, and having solubility or swelling property with respect to resin included in the toner. | 03-26-2009 |
20090245896 | Image forming apparatus and method - An image forming apparatus includes a first fixing device that applies heat to a non fixed toner image and a second fixing device arranged downstream of the first fixing device, which applies pressure and fixes the non-fixed toner image onto a recording member. | 10-01-2009 |
20110002718 | FIXING SOLUTION, FIXING METHOD, FIXING DEVICE, IMAGE FORMING METHOD AND IMAGE FORMING APPARATUS - To provide a fixing solution for fixing fine resin particles to a recording medium, the fixing solution including: a diluent which contains water; a foaming agent which allows the fixing solution to be in the form of foam; and a solid plasticizer which is solid at normal temperature and soluble in the diluent, and which softens or swells at least part of the fine resin particles while dissolved in the diluent. | 01-06-2011 |
20110013957 | FIXING LIQUID, FIXING METHOD, FIXING UNIT, IMAGE FORMING METHOD, AND IMAGE FORMING APPARATUS - Disclosed is a fixing liquid containing a softening agent that softens resin-containing fine particles by dissolving or swelling at least a part of the resin; a C12-C18 fatty acid; and a C12-C18 fatty acid salt. The fixing liquid is mixed with water serving as a dilution solvent. | 01-20-2011 |
20110183254 | PHOTOCURABLE LIQUID DEVELOPER, METHOD FOR PRODUCING THE SAME, DEVELOPING DEVICE AND IMAGE FORMING APPARATUS - To provide a photocurable liquid developer including colored resin particles, and an electrically insulating liquid that cures by light, wherein the electrically insulating liquid contains an unsaturated group-containing silicone compound represented by General Formula (1) below, | 07-28-2011 |
20110217098 | Fixing device and image forming apparatus - A disclosed fixing device includes a fixer application unit configured to apply a fixer containing a softener, capable of softening resin by dissolving or swelling at least a part of the resin, and water to resin particles formed on a recording medium such that the resin particles are fixed on the recording medium, and an anti-tack agent application unit configured to apply a liquid anti-tack agent immiscible with the softener to surfaces of the resin particles that are mixed with the softener by the application of the fixer containing the softener. | 09-08-2011 |
20110229231 | FIXATION FLUID, FIXATION METHOD, IMAGE FORMING METHOD, FIXATION DEVICE, AND IMAGE FORMING APPARATUS - Disclosed is a fixation fluid, including a softening agent(s), the softening agent(s) being a saturated aliphatic carboxylic acid ester(s) of a saturated aliphatic alcohol(s) and/or a carbonic acid ester(s) of a dihydric saturated aliphatic alcohol(s), a foaming agent(s), the foaming agent(s) being a non-ionic surfactant(s) and/or an amphoteric surfactant(s), water, a pH adjustor(s), the pH adjustor(s) being an acid(s) and/or a salt(s) of the acid(s), and a pH of the fixation fluid being 6 or more and 7 or less. | 09-22-2011 |
20110268480 | FIXATION DEVICE, IMAGE FORMING APPARATUS, AND FIXATION FLUID STORAGE CONTAINER - Disclosed is, for example, a fixation device of fixing a resin-containing fine particle, the fixation device being configured to foam a fixation fluid including at least a softening agent configured to dissolve or swell at least one portion of a resin to soften the resin-containing fine particle including a resin, a foaming agent, and water, and to provide a foamed fixation fluid to the resin-containing fine particle, the fixation device including a first storage part configured to contain a softening agent fluid including at least the softening agent, a second storage part configured to contain a foaming agent fluid including at least the foaming agent, and a mixed foamed fixation fluid producing part configured to mix and foam both fluids contained in independent states in the storage parts to produce the foamed fixation fluid. | 11-03-2011 |
20120135342 | FIXING SOLUTION, FIXING METHOD, FIXING DEVICE, IMAGE FORMING METHOD AND IMAGE FORMING APPARATUS - To provide a fixing solution for fixing fine resin particles to a recording medium, the fixing solution including: a diluent which contains water; a foaming agent which allows the fixing solution to be in the form of foam; and plasticizers which soften or swell at least part of the fine resin particles, wherein the plasticizers contain a liquid plasticizer which is liquid at normal temperature and soluble in the diluent, and a solid plasticizer which is solid at normal temperature and soluble in the diluent. | 05-31-2012 |
20120283378 | A SILICONE COMPOUND, PHOTOCURABLE LIQUID INK USING THE SILICONE COMPOUND, AND METHOD OF MANUFACTURING THE INK - A silicone compound represented by the following Chemical Structure 1: | 11-08-2012 |
20120295192 | TONER, DEVELOPER, TONER CONTAINER, IMAGE FORMING APPARATUS, IMAGE FORMING METHOD, AND PROCESS CARTRIDGE - To provide a toner which contains a binder resin, a colorant, and capsules, wherein the binder resin contains a thermoplastic elastomer, and wherein the capsules each encapsulate a plasticizer capable of softening the thermoplastic elastomer and the capsules are fractured upon application of predetermined pressure. | 11-22-2012 |
Patent application number | Description | Published |
20080199115 | Oil Impregnated Sintered Bearing and Manufacturing Method Thereof - There is provided an oil-impregnated sintered bearing which enable to prevent oil leakage from an outer peripheral surface | 08-21-2008 |
20090011268 | BEARING FOR MOTORIZED FUEL PUMP - A bearing for a motorized fuel pump is made of a Cu—Ni based sintered alloy, composed of: 21 to 35% by mass of Ni, 5 to 12% by mass of Sn, 3 to 7% by mass of C, 0.1 to 0.8% by mass of P, and the balance of Cu and inevitable impurities. A matrix of the bearing is formed with pores with a porosity of 8 to 18%, and the P component is predominantly included at the grain boundary, and free graphite is distributed along the insides of open pores that are open to the surface and extending into the bearing. In this bearing, a Sn rich alloy layer containing equal to or more than 50% by mass of Sn is formed on the insides of the open pores and near openings of the open pores. | 01-08-2009 |
20090071290 | SLIDING PART AND METHOD OF MANUFACTURING THE SAME - A sliding part in which a surface coverage ratio of copper in the sliding part increases. A bearing which is the sliding part is formed by filling the raw powder into the filling portion of the forming mold, compacting the raw powder to form a powder compact, and sintering the powder compact. A copper-based raw powder is composed of a copper-based flat raw powder having an average diameter smaller than that of an iron-based raw powder and an aspect ratio larger than that of the iron-based raw powder, and a copper-based small-sized raw powder having the average diameter is smaller than that of the copper-based flat raw powder. The copper segregates at the surface of the sliding part. In the bearing in which the copper-based flat powder segregates at the surface, the surface is covered with the copper-based small-sized raw powder that has emerged on the surface, as well as the copper-based flat raw powder, thereby it is possible to increase the surface coverage ratio of copper. Furthermore, containing calcium fluoride improves the seizure resistance. | 03-19-2009 |
20090129963 | Sliding Part and Method of Manufacturing the Same - There is provided a sliding part in which a surface coverage ratio of copper in the sliding part increases. A bearing which is the sliding part is formed by filling the raw powder into the filling portion of the forming mold, compacting the raw powder to form a powder compact | 05-21-2009 |
20090311129 | ABRASION RESISTANT SINTERED COPPER BASE CU-NI-SN ALLOY AND BEARING MADE FROM THE SAME - A Cu—Ni—Sn copper-based sintered alloy has a composition including 10 to 40% by mass of Ni, 5 to 25% by mass of Si, and the remainder containing Cu and inevitable impurities, and if necessary, 0.1 to 0.9% by mass of P, 1 to 10% by mass of C, 0.3 to 6% by mass of calcium fluoride or 0.3 to 6% by mass of molybdenum disulfide. In the structure of the alloy, a phase of a composition containing Cu | 12-17-2009 |
20100307006 | OIL-IMPREGNATED SINTERED BEARING AND MANUFACTURING METHOD THEREOF - There is provided an oil-impregnated sintered bearing which enable to prevent oil leakage from an outer peripheral surface of an bearing body. The oil-impregnated sintered bearing includes a bearing body which is made of a porous sintered alloy containing vacancies and has a bearing hole in which a rotary shaft can be inserted, wherein the vacancies opened on an outer peripheral surface of the bearing body are crushed. The vacancies may be crushed in the state of a green compact, or in the state of a sintered alloy after sintering the green compact. Consequently, the oil leakage from the outer peripheral surface of the bearing can be prevented, and oil pressure in the bearing hole can be preserved. | 12-09-2010 |
20120145284 | Cu-BASED SINTERED SLIDING MEMBER - A Cu-based sintered sliding member that can be used under high-load conditions. The sliding member is age-hardened, including 5 to 30 mass % Ni, 5 to 20 mass % Sn, 0.1 to 1.2 mass % P, and the rest including Cu and unavoidable impurities. In the sliding member, an alloy phase containing higher concentrations of Ni, P and Sn than their average concentrations in the whole part of the sliding member, is allowed to be present in a grain boundary of a metallic texture, thereby achieving excellent wear resistance. Hence, without needing expensive hard particles, there can be obtained, at low cost, a Cu-based sintered sliding member usable under high-load conditions. Even more excellent wear resistance is achieved by containing 0.3 to 10 mass % of at least one solid lubricant selected from among graphite, graphite fluoride, molybdenum disulfide, tungsten disulfide, boron nitride, calcium fluoride, talc and magnesium silicate mineral powders. | 06-14-2012 |
20120204677 | SINTERED SLIDING MEMBER - There is provided a novel sintered sliding member superior in thermal resistance, corrosion resistance and wear resistance. The sintered sliding member of the present invention includes 7.7-30.3% Cu, 2.0-20.0% Sn and 0.3-7.0% boron nitride by mass, with a remainder composed of Ni and unavoidable impurities. The sintered sliding member may further include 0.1-3.0% C or 0.1-0.7% P. A porosity of the sintered sliding member is 5-25%. | 08-16-2012 |
20120244029 | SLIDING PART AND METHOD OF MANUFACTURING THE SAME - There is provided a sliding part in which a surface coverage ratio of copper in the sliding part increases. A bearing which is the sliding part is formed by filling the raw powder into the filling portion of the forming mold, compacting the raw powder to form a powder compact, which is sintered. A copper-based raw powder is composed of a copper-based flat raw powder whose diameter is smaller than that of an iron-based raw powder and an aspect ratio larger than that of the iron-based raw powder, and a copper-based small-sized raw powder whose diameter is smaller than that of the copper-based flat raw powder. The copper is allowed to segregate at the surface of the sliding part. The surface of the bearing is covered with the copper-based small-sized raw powder and the copper-based flat raw powder, thereby the surface coverage ratio of copper can be increased. | 09-27-2012 |
20130104400 | OIL-IMPREGNATED SINTERED BEARING AND METHOD OF PRODUCING THE SAME | 05-02-2013 |
20130189150 | SINTERED BEARING FOR MOTOR-POWERED FUEL INJECTION PUMPS - There is provided a bearing for motor-powered fuel injection pumps, made from Cu—Ni-based sintered alloy, which is able to be obtained at a low cost, having excellent corrosion and abrasion resistances. The bearing contains 10 to 20% by mass of Ni, 5 to 13% by mass of Sn, 0.1 to 0.8% by mass of P, 1 to 6% by mass of C, and a remainder containing Cu and inevitable impurities, and is formed with a Ni—Sn—Cu—P phase containing at least 30% by mass of Sn in a grain boundary, and has a 8 to 18% porosity. The Ni—Sn—Cu—P phase contains 30 to 49% by mass of Ni, 10 to 30% by mass of Cu, 0.5 to 1.5% by mass of P, and a remainder containing Sn and inevitable impurities. | 07-25-2013 |
20150037196 | Cu-BASED SINTERED SLIDING MEMBER - A Cu-based sintered sliding member that can be used under high-load conditions. The sliding member is age-hardened, including 5 to 30 mass % Ni, 5 to 20 mass % Sn, 0.1 to 1.2 mass % P, and the rest including Cu and unavoidable impurities. In the sliding member, an alloy phase containing higher concentrations of Ni, P and Sn than their average concentrations in the whole part of the sliding member, is allowed to be present in a grain boundary of a metallic texture, thereby achieving excellent wear resistance. Hence, without needing expensive hard particles, there can be obtained, at low cost, a Cu-based sintered sliding member usable under high-load conditions. Even more excellent wear resistance is achieved by containing 0.3 to 10 mass % of at least one solid lubricant selected from among graphite, graphite fluoride, molybdenum disulfide, tungsten disulfide, boron nitride, calcium fluoride, talc and magnesium silicate mineral powders. | 02-05-2015 |
Patent application number | Description | Published |
20100115423 | Mobile Terminal Device - Provided is a mobile terminal device that can improve operability for editing a mail with a simple configuration. A cellular telephone device | 05-06-2010 |
20120062564 | MOBILE ELECTRONIC DEVICE, SCREEN CONTROL METHOD, AND STORAGE MEDIUM STORING SCREEN CONTROL PROGRAM - A mobile electronic device includes a first touch sensor on a first face of a housing, a second touch sensor on a second face of the housing different from the first face, a display unit provided on the first face of the housing, and a control unit. When a first touch on the first face is detected by the first touch sensor and a second touch on the second face is detected by the second touch sensor, the control unit selects an object displayed on the display unit based on the first touch on the first face and the second touch on the second face. | 03-15-2012 |
20120133604 | MOBILE ELECTRONIC DEVICE, CONTROL METHOD, AND STORAGE MEDIUM STORING CONTROL PROGRAM - According to an aspect, a mobile electronic device includes a first housing having a first display unit, a second housing having a second display unit, a form detector, and a control unit. The form detector detects a first form in which the second display unit is covered with the first housing while the first display unit is exposed to the outside and a second form in which the first display unit and the second display unit are exposed to the outside. A control unit cause objects for activating a function to be displayed on the first display unit and on the second display unit in an associated manner in conjunction with a change in form detected by the form detector. | 05-31-2012 |
20120274551 | ELECTRONIC DEVICE, SCREEN CONTROL METHOD, AND STORAGE MEDIUM STORING SCREEN CONTROL PROGRAM - According to an aspect, an electronic device includes a first display unit, a second display unit, a detecting unit, and a control unit. The first display unit displays a first object corresponding to a first function. The second display unit displays a second object corresponding to a second function. The detecting unit detects an operation. When the operation is detected by the detecting unit while the first object is displayed on the first display unit, the control unit dismisses the first object from the first display unit and displays information with respect to the first object on the second display unit. | 11-01-2012 |
20120278734 | ELECTRONIC DEVICE, SCREEN CONTROL METHOD, AND STORAGE MEDIUM STORING SCREEN CONTROL PROGRAM - According to an aspect, an electronic device includes a display unit, a detecting unit, and a control unit, and composes a mail that includes an image and a text. The display unit displays a first screen and a second screen in such a manner that the first screen and the second screen do not overlap each other. The first screen displays an overview of the mail, and the second screen edits an image or a text as an element to be added to the mail. The detecting unit detects an operation. When an operation made on the second screen is detected by the detecting unit, the control unit updates the overview of the mail that is displayed on the first screen in accordance with the operation. | 11-01-2012 |
20120293523 | MOBILE ELECTRONIC DEVICE AND DISPLAY CONTROL METHOD - According to an aspect, a mobile electronic device includes an operating, a display unit, a storage unit, and a control unit. The display unit displays an idle screen. The storage unit stores a first object corresponding to first information and a second object corresponding to second information. The control unit executes a first display process for displaying the first object on the idle screen when the idle screen is displayed. The control unit executes a second display process for displaying the second object on the idle screen when a preset condition is satisfied after the first display process is executed. | 11-22-2012 |
20130201144 | ELECTRONIC DEVICE, CONTROL METHOD, AND CONTROL PROGRAM - According to an aspect, an electronic device includes: a first housing having a first display unit; a second housing having a second display unit; a detecting unit; and a control unit. The detecting unit detects a first form in which the first display unit is exposed to the outside and the second display unit is covered by the first housing and a second form in which the first and second display units are exposed to the outside. Then the detecting unit detects a change in the form of the electronic device from the first form to the second form, the control unit activates a function corresponding to a selected object among objects displayed on the first display unit, and displays a screen corresponding to the function on the second display unit. | 08-08-2013 |
Patent application number | Description | Published |
20110042714 | POWER SEMICONDUCTOR DEVICE - According to one embodiment, a power semiconductor device includes an IGBT region, first and second electrodes, and a first-conductivity-type second semiconductor layer. The region functions as an IGBT element. The first electrode is formed in a surface of a second-conductivity-type collector layer opposite to a first-conductivity-type first semiconductor layer in the region. The second electrode is connected onto a first-conductivity-type emitter layer and a second-conductivity-type base layer in a surface of the first-conductivity-type base layer and insulated from a gate electrode in the region. The first-conductivity-type second semiconductor layer extends from the surface of the first-conductivity-type base layer to the first-conductivity-type first semiconductor layer around the IGBT region, and connected to the first electrode. | 02-24-2011 |
20120061724 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a first major electrode, a first semiconductor layer, a first conductivity-type base layer, a second conductivity-type base layer, a second semiconductor layer, a buried layer, a buried electrode, a gate insulating film, a gate electrode, and a second major electrode. The buried layer of the second conductivity type selectively is provided in the first conductivity-type base layer. The buried electrode is provided in a bottom portion of a trench which penetrates the second conductivity-type base layer to reach the buried layer. The buried electrode is in contact with the buried layer. The gate electrode is provided inside the gate insulating film in the trench. The second major electrode is provided on the second semiconductor layer and is electrically connected to the second semiconductor layer and the buried electrode. | 03-15-2012 |
20120074459 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a first major electrode, a first semiconductor layer, a first conductivity type base layer, a second conductivity type base layer, a first conductivity type second semiconductor layer, a gate insulating film, a gate electrode, and a second major electrode. The gate insulating film is provided on a side wall of a trench penetrating the second conductivity type base layer to reach the first conductivity type base layer. The gate electrode is provided inside the gate insulating film in the trench. The second major electrode is provided on the second semiconductor layer and electrically connected with the second semiconductor layer. A maximum impurity concentration in the second semiconductor layer is within ten times a maximum impurity concentration in the second conductivity type base layer. | 03-29-2012 |
20130082302 | SEMICONDUCTOR DEVICE - A semiconductor device comprises: a substrate having a first and second surface; trenches provided on the second surface; a gate electrode provided in each trench; a first-conductive-type emitter layer provided on the second surface and contacting with the trenches; and an emitter electrode provided on the second surface to extend in a longitudinal direction of the trenches, the emitter electrode having a non-contact portion partially provided in the first-conductive-type emitter layer. | 04-04-2013 |
20130221401 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a first electrode, a first conductivity type cathode layer, a first conductivity type base layer, a second conductivity type anode layer, a second conductivity type semiconductor layer, a first conductivity type semiconductor layer, an buried body, and a second electrode. The first conductivity type semiconductor layer is contiguous to the second conductivity type semiconductor layer in a first direction, and extends on a surface of the anode layer in a second direction that intersects perpendicularly to the first direction. The buried body includes a bottom portion and a sidewall portion. The bottom portion is in contact with the base layer. The sidewall portion is in contact with the base layer, the anode layer, the second conductivity type semiconductor layer and the first conductivity type semiconductor layer. The buried body extends in the first direction. | 08-29-2013 |
20130221402 | INSULATED GATE BIPOLAR TRANSISTOR - An insulated gate bipolar transistor includes a first semiconductor layer of a first conductivity type, a first base layer of a second conductivity type, a second base layer of the second conductivity type, a first emitter layer of the first conductivity type, and a second emitter layer of the first conductivity type. The first semiconductor layer has a first surface. A first trench and a second trench extend from the first surface into the first semiconductor layer. The first gate electrode is provided on the first semiconductor layer, on the first base layer, and on the first emitter layer via a first gate insulating film in the first trench. The second gate electrode is provided on the first semiconductor layer, on the second base layer, and on the second emitter layer via a second gate insulating film in the second trench. | 08-29-2013 |
20130248924 | SEMICONDUCTOR DEVICE - A semiconductor device includes a reverse-conducting insulated gate bipolar transistor (IGBT), wherein the thickness of the semiconductor layer underlying the diode region of the device is thinner than the thickness of the semiconductor layer underlying the IGBT portion of the device. In one aspect, the semiconductor layer is a continuous layer, and trenches defining the anodes in the diode region extend further inwardly of the semiconductor layer than does the base regions of the IGBT portion of the device. | 09-26-2013 |
20140061875 | SEMICONDUCTOR DEVICE - According one embodiment, a semiconductor device includes: a first electrode; a second electrode; a first semiconductor layer provided between the first electrode and the second electrode and being in contact with the first electrode; a second semiconductor layer including a first part and a second part, and the second part being contact with the first electrode, and the second semiconductor layer having an effective impurity concentration lower than an effective impurity concentration in the first semiconductor layer; a third semiconductor layer provided between the second semiconductor layer and the second electrode, and having an effective impurity concentration lower than an effective impurity concentration in the second semiconductor layer; and a fourth semiconductor layer provided between the third semiconductor layer and the second electrode, and being in contact with the second electrode. | 03-06-2014 |
20140070266 | POWER SEMICONDUCTOR DEVICE - A power semiconductor device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a pair of conductive bodies, a third semiconductor layer of the second conductivity type, and a fourth semiconductor layer of the first conductivity type. The second semiconductor layer is provided on the first semiconductor layer on the first surface side. The pair of conductive bodies are provided via an insulating film in a pair of first trenches extending across the second semiconductor layer from a surface of the second semiconductor layer to the first semiconductor layer. The third semiconductor layer is selectively formed on the surface of the second semiconductor layer between the pair of conductive bodies and has a higher second conductivity type impurity concentration in a surface of the third semiconductor layer than the second semiconductor layer. | 03-13-2014 |
20140084333 | POWER SEMICONDUCTOR DEVICE - In general, according to one embodiment, a power semiconductor device includes a first, a second, a third, a fourth, and a fifth electrode, and a first, a second, a third, and a fourth semiconductor layer. The first electrode includes a first and a second face. The first semiconductor layer is provided on a side of the first face of the first electrode. The second semiconductor layer is provided on the first semiconductor layer. The third semiconductor layer is provided on the second semiconductor layer. The fourth semiconductor layer is provided on the third semiconductor layer. The second electrode is electrically connected to the fourth semiconductor layer. The third and fourth electrode are provided at the second semiconductor layer and the third semiconductor layer with an insulating film interposed. The fifth electrode is provided between the third electrode and the fourth electrode with an insulating film interposed. | 03-27-2014 |
20140124832 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes: a first electrode; a second electrode; a first semiconductor layer provided between the first electrode and the second electrode; a second semiconductor layer provided between the first semiconductor layer and the second electrode, and the second semiconductor layer having a lower impurity concentration than the first semiconductor layer; a first semiconductor region provided between part of the second semiconductor layer and the second electrode; a second semiconductor region provided between a portion different from the part of the second semiconductor layer and the second electrode, and the second semiconductor region being in contact with the first semiconductor region; and a third semiconductor region provided between at least part of the first semiconductor region and the second electrode. | 05-08-2014 |
20140284658 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a first and second electrode, a first, second, third and fourth semiconductor region, and a first intermediate metal film. The first region is provided above the first electrode and has a first impurity concentration. The second region is provided above the first region and has a second impurity concentration lower than the first impurity concentration. The third region is provided above the second region and has a third impurity concentration. The fourth region is provided above the second region and has a fourth impurity concentration lower than the third impurity concentration. The second electrode is provided above the third region and the fourth region and is in ohmic contact with the third region. The intermediate metal film is provided between the second electrode and the fourth region. The intermediate metal film forms Schottky junction with the fourth region. | 09-25-2014 |
20150021657 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes: first and second electrodes; a first semiconductor region being in ohmic contact with the first electrode; a second semiconductor region being in contact with the first semiconductor region and the first electrode, and the second semiconductor region having a lower impurity concentration than the first semiconductor region; a first semiconductor layer; a second semiconductor layer; a third semiconductor region; a fourth semiconductor region being in contact with the second electrode; and a third electrode in contact with the second semiconductor layer, the third semiconductor region, and the fourth semiconductor region via an insulating film. A peak of impurity concentration profile of the first semiconductor layer in a direction from the first electrode toward the second electrode is located between the first semiconductor region and the second semiconductor layer and located between the second semiconductor region and the second semiconductor layer. | 01-22-2015 |
Patent application number | Description | Published |
20090123717 | PREPREG, INTERMEDIATE MATERIAL FOR FORMING FRP, AND METHOD FOR PRODUCTION THEREOF AND METHOD FOR PRODUCTION OF FIBER-REINFORCED COMPOSITE MATERIAL - An FRP is produced using a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein the matrix resin is impregnated into the sheet-like reinforcing fiber substrate and also covers one surface of the sheet-like reinforcing fiber substrate, and the matrix resin impregnation ratio is within a range of 35% to 95%; a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein the matrix resin exists on both surfaces of the sheet-like reinforcing fiber substrate, and the portion inside the sheet-like reinforcing fiber substrate into which the matrix resin has not been impregnated is continuous; or a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein at least one surface exhibits a sea-and-island-type pattern comprising resin-impregnated portions (island portions) where the matrix resin is present at the surface and fiber portions (sea portions) where the matrix resin is not present at the surface, the surface coverage ratio of the matrix resin on those surfaces with said a sea-and-island-type pattern is within a range of 3% to 80%, and the weave intersection coverage ratio for the island portions, represented by a formula (1) shown below, is at least 40%, displays excellent external appearance, with no internal voids or surface pinholes, even when molded is conducted using only vacuum pressure. | 05-14-2009 |
20110151206 | PREPREG, INTERMEDIATE MATERIAL FOR FORMING FRP, AND METHOD FOR PRODUCTION THEREOF AND METHOD FOR PRODUCTION OF FIBER-REINFORCED COMPOSITE MATERIAL - An FRP is produced using a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein the matrix resin is impregnated into the sheet-like reinforcing fiber substrate and also covers one surface of the sheet-like reinforcing fiber substrate, and the matrix resin impregnation ratio is within a range of 35% to 95%; a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein the matrix resin exists on both surfaces of the sheet-like reinforcing fiber substrate, and the portion inside the sheet-like reinforcing fiber substrate into which the matrix resin has not been impregnated is continuous; or a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein at least one surface exhibits a sea-and-island-type pattern comprising resin-impregnated portions (island portions) where the matrix resin is present at the surface and fiber portions (sea portions) where the matrix resin is not present at the surface, the surface coverage ratio of the matrix resin on those surfaces with said a sea-and-island-type pattern is within a range of 3% to 80%, and the weave intersection coverage ratio for the island portions, represented by a formula (1) shown below, is at least 40%, displays excellent external appearance, with no internal voids or surface pinholes, even when molded is conducted using only vacuum pressure. | 06-23-2011 |
20120276795 | PREPREG, INTERMEDIATE MATERIAL FOR FORMING FRP, AND METHOD FOR PRODUCTION THEREOF AND METHOD FOR PRODUCTION OF FIBER-REINFORCED COMPOSITE MATERIAL - The invention relates to a prepreg containing a reinforcing fiber, a sheet-like reinforcing fiber substrate including the reinforcing fiber, and a matrix resin, wherein the matrix resin is impregnated into the sheet-like reinforcing fiber substrate and also covers one surface of the sheet-like reinforcing fiber substrate, such that the matrix resin impregnation ratio is within a range of 35% to 95%. The invention also relates to a prepreg containing a reinforcing fiber substrate in the form of a sheet and formed from a reinforcing fiber woven fabric, and a matrix resin, wherein at least one surface of the reinforcing fiber substrate displays a sea-and-island-type pattern with resin-impregnated portions (island portions) and fiber portions (sea portions), such that a surface coverage of the matrix resin is within a range of 3% to 80%. | 11-01-2012 |
20140057514 | PREPREG, INTERMEDIATE MATERIAL FOR FORMING FRP, AND METHOD FOR PRODUCTION THEREOF AND METHOD FOR PRODUCTION OF FIBER-REINFORCED COMPOSITE MATERIAL - This invention relates to a prepreg containing a reinforcing fiber, a reinforcing fiber substrate in the form of a sheet and containing the reinforcing fiber, and a matrix resin, such that the matrix resin is impregnated into the reinforcing fiber substrate and also covers one surface of the reinforcing fiber substrate, and an impregnation ratio of the matrix resin is within a range of 35% to 95%. | 02-27-2014 |
Patent application number | Description | Published |
20080251926 | Method of Fabricating Organic Silicon Film, Semiconductor Device Including the Same, and Method of Fabricating the Semiconductor Device - An organic silicon film is formed by carrying out chemical vapor deposition with organic silicon compound being used as a raw material gas. The organic silicon compound contains at least silicon, hydrogen and carbon as a constituent thereof, and contains two or more groups having unsaturated bond, per a molecule thereof. The organic silicon compound is used in mixture with a silicon hydride gas. | 10-16-2008 |
20090039474 | Formation Method of Porous Insulating Film, Manufacturing Apparatus of Semiconductor Device, Manufacturing Method of Semiconductor Device, and Semiconductor Device - In a formation method of a porous insulating film by supplying at least organosiloxane and an inert gas to a reaction chamber and forming an insulating film by a plasma vapor deposition method, a partial pressure of the organosiloxane in the reaction chamber is changed by varying a volume ratio of the organosiloxane and the inert gas to be supplied during deposition. Thus, the dielectric constant of the insulating film in the semiconductor device is reduced while the adhesion of the insulating film with other materials is improved. It is desirable that the organosiloxane be cyclic organosiloxane including at least silicon, oxygen, carbon, and hydrogen, and that the total pressure of the reaction chamber be constant during deposition. | 02-12-2009 |
20090072403 | Wiring Structure, Semiconductor Device and Manufacturing Method Thereof - A semiconductor device with a high-strength porous modified layer having a pore size of 1 nm or less, which is formed, in a multilayer wiring forming process, by forming a via hole and a wiring trench in a via interlayer insulating film and a wiring interlayer insulting film and then irradiating an electron beam or an ultraviolet ray onto the opening side walls. | 03-19-2009 |
20100219512 | Method for Forming Porous Insulating Film and Semiconductor Device - A method for forming porous insulating film using cyclic siloxane raw material monomer is provided, which method suppresses detachment of hydrocarbon and is able to form a low-density film. | 09-02-2010 |
20110318926 | Wiring structure, semiconductor device and manufacturing method thereof - A semiconductor device manufacturing method for manufacturing a semiconductor device having a transistor mounted in a wiring of a plural-layer structure includes in manufacturing the semiconductor device that is formed on a semiconductor element and includes a barrier insulating film, a porous interlayer insulating film, a wiring, a via plug formed by embedding a metal wiring material in a wiring trench, and a via hole formed in the porous interlayer insulating film, irradiating an electron beam or an ultraviolet ray onto at least a portion of the porous interlayer insulating film before forming an opening in the barrier insulating film. | 12-29-2011 |
Patent application number | Description | Published |
20080231703 | FIELD WATCH APPARATUS - A field watch apparatus of vehicular use includes a camera and a mirror-integrated display unit. The mirror-integrated display unit is integrally disposed with a room mirror, and have two surroundings view monitors for displaying surroundings views that are captured by the camera. The mirror-integrated display unit is disposed at a position that is viewable from a driver's seat in a subject vehicle for intuitive recognition of other vehicles in the surroundings through the displayed image of the surroundings views. | 09-25-2008 |
20080246843 | Periphery monitoring system for vehicle - A periphery monitoring system for a vehicle captures an image of a mobile object in a first field of view. The system captures an image of the mobile object in a second field of view that is located on a downstream side of the first field of view in an approaching direction of the vehicle. The first display region of the system displays the captured image along a first trajectory. When the mobile object enters into the second field of view after crossing the first field of view, the image of the mobile object is displayed along a second trajectory in the second display region of the system successively from the first display region. The system causes an auxiliary image to be displayed in the second display region in accordance with the entering of the mobile object into the second field of view. | 10-09-2008 |
20100073291 | IN-VEHICLE MANIPULATION APPARATUS AND IN-VEHICLE INPUT APPARATUS - A two-dimensional operation section includes a stick-shaped rocking shaft having an end having an operation knob. The operation knob is operated within a predetermined two-dimensional operation surface determined as an operation range such that a rocking axis of the rocking shaft tilts from a predetermined neutral angular position to a direction corresponding to an instructed position. A one-dimensional operation section has an operation surface exposed in a main surface of the operation knob, the main surface being an end surface of the rocking shaft. The one-dimensional operation section can be operated in a predetermined one-dimensional operation direction determined within the two-dimensional operation surface relative to the operation surface. | 03-25-2010 |
20100093426 | PATTERN DISPLAY DEVICE AND GAME MACHINE INCLUDING THE SAME - A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player. | 04-15-2010 |
20100317427 | GAME MACHINE INCLUDING VARIABLE PATTERN DISPLAY UNITS - A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player. | 12-16-2010 |
20120149466 | GAME MACHINE INCLUDING VARIABLE PATTERN DISPLAY UNITS - A game machines has a back side display unit composed of reels for displaying back patterns, and a front side display unit composed of transparent EL panels for displaying overlapping patterns overlapping with the back patterns. The back side display unit and the front side display unit are disposed not to produce blind spot regions of the back patterns. The game machine can provide various overlapping patterns with good visibility and a high game selection capability to a player. | 06-14-2012 |
20130109461 | GAMING MACHINE | 05-02-2013 |