Tsai, Zhongli City
Feng-Hua Tsai, Zhongli City TW
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20140341237 | FIBER LASER - A fiber laser having a ring resonance path comprises a pump light source, a Yb-doped optical fiber and a light modulation unit. The pump light source emits a pump light. The Yb-doped optical fiber is coupled with the pump light. The light modulation unit includes a grating pair, a diaphragm and two reflective elements. The grating pair is coupled with the pump light. The diaphragm includes an aperture. The light transmitted by the grating pair partially passes through the aperture and reaches one of the reflective elements to become a reflective light, and the reflective light passes through the aperture and is transmitted through the grating pair and the other reflective element to be coupled back with the ring resonance path. | 11-20-2014 |
Hsin-Lun Tsai, Zhongli City TW
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20160139703 | STRUCTURE FOR TOUCH ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF - The present invention provides a method for manufacturing a touch electrode substrate, including the steps of (A) selecting a preset substrate for forming a substrate layer; (B) forming a conductive layer on at least one surface of the substrate layer; (C) depositing a photoresist on the conductive layer, performing a first exposure, and forming a first exposure pattern on the conductive layer; (D) performing a second exposure on the conductive layer, and forming a second exposure pattern on the conductive layer; (E) forming a shielding layer that has a circuit pattern, by means of developing the first exposure pattern and the second exposure pattern; and (F) processing the conductive layer and the shielding layer, to enable the conductive layer to form a plurality of metal circuits on at least one surface of the substrate layer. Therefore, the present invention may provide the same or different dimensions of the touch electrode substrate having the same circuit patterns by using a low-cost soft plastic film photomask, and may enable other companies to carry out subsequent processing of the plurality of connection circuits. | 05-19-2016 |
Po-Hoa Tsai, Zhongli City TW
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20120306073 | Connector Design for Packaging Integrated Circuits - A device includes a top dielectric layer having a top surface. A metal pillar has a portion over the top surface of the top dielectric layer. A non-wetting layer is formed on a sidewall of the metal pillar, wherein the non-wetting layer is not wettable to the molten solder. A solder region is disposed over and electrically coupled to the metal pillar. | 12-06-2012 |
Shih-Shu Tsai, Zhongli City TW
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20100193762 | NON-VOLATILE MEMORY CELL AND FABRICATION METHOD THEREOF - A non-volatile memory cell and a fabrication method thereof are provided. The non-volatile memory cell includes an anode; a cathode having a surface facing the anode; a specific structure disposed on the surface; and an ion conductor disposed among the anode, the cathode and the specific structure, wherein the specific structure is one of a bulging area on the surface of the cathode and an insulating layer with an opening. | 08-05-2010 |
20130161786 | CAPACITOR ARRAY AND METHOD OF FABRICATING THE SAME - A capacitor array includes a plurality of capacitors and a support frame. Each capacitor includes an electrode. The support frame supports the plurality of electrodes and includes a plurality of support structures corresponding to the plurality of electrodes. Each support structure may surround the respective electrode. The support frame may include oxide of a doped oxidizable material. | 06-27-2013 |
Tsung-Hsien Tsai, Zhongli City TW
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20150311889 | CIRCUITRY FOR PHASE DETECTOR - A circuit for a phase detector is provided. A first buffer of the circuit receives a data signal and generates a first modified data signal using the data signal. A notifier receives the data signal and determines whether a violation exists. A first multiplexer receives the first modified data signal and transmits a first multiplexer signal to a second multiplexer. The second multiplexer receives the first multiplexer data signal and the first modified data signal, and transmits a second multiplexer data signal to a flip-flop of the phase detector. | 10-29-2015 |
20150311905 | ALL-DIGITAL PHASE-LOCKED LOOP (ADPLL) - An all-digital phase-locked loop (ADPLL) is provided. The ADPLL comprises a first circuit and a second circuit. The first circuit is configured to monitor a first signal and set a voltage of a second signal to a voltage within a first voltage range when a code of fine-tuning is equal to a first specified value. The first circuit is configured to set a voltage of a third signal to a voltage within a second voltage range when the code of fine-tuning is equal to a second specified value. The second circuit is configured to increase a code of coarse-tuning when the voltage of the second signal is within the first voltage range, and decrease the code of coarse-tuning when the voltage of the third signal is within the second voltage range. The ADPLL provides a target frequency despite changes in at least one of process, voltage or temperature. | 10-29-2015 |
Tsung-Sung Tsai, Zhongli City TW
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20110038052 | Prismatic Laminate and Method for Making The Same - A method for making a prismatic laminate includes the steps of: a) forming a back-coating roller having a roller surface with a plurality of recesses arranged in a predetermined pattern and produced by laser holography; b) preparing a prismatic structure including a plate body having a first surface and a second surface opposite to the first surface, and a plurality of prismatic strips formed on the first surface of the plate body; c) applying a coating containing a resin component and an antistatic agent on the second surface of the plate body; and d) embossing the coating with the back-coating roller to form an optical layer including a plurality of microstructures protruding in a direction away from the second surface of the plate body and having a pattern corresponding to that of the recesses in the roller surface. | 02-17-2011 |
Yao-Jun Tsai, Zhongli City TW
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20130087823 | LIGHT EMITTING DIODE CHIP, LIGHT EMITTING DIODE PACKAGE STRUCTURE, AND METHOD FOR FORMING THE SAME - A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than 0. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency. | 04-11-2013 |
20130146936 | LIGHT EMITTING DIODE CHIP, LIGHT EMITTING DIODE PACKAGE STRUCTURE, AND METHOD FOR FORMING THE SAME - A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than O. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency. | 06-13-2013 |