Tsai, Taoyuan City
Cheng-Che Tsai, Taoyuan City TW
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20160123570 | SOLID-STATE ILLUMINATING APPARATUS HAVING HEAT DISSIPATING STRUCTURE WITH LARGE SURFACE AREA - The present invention provides a solid state illuminating apparatus comprising at least two metal structures with heat dissipating fins, a lamp housing, at least one solid state light emitting device and a driver. The metal structures are configured to stack in the center of the lamp housing. The solid state light emitting device is configured to be located on the metal structure. The driver is configured to be located in the center of the metal structures. | 05-05-2016 |
Chia Ching Tsai, Taoyuan City TW
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20160047390 | FAN CONTROL DEVICE WITH MULTIPROCESSOR - A fan control device for controlling a fan includes a communication-processing module, a fan-controlling module, and a detection module. The communication-processing module receives a fan-controlling instruction generated by an external system to generate a control signal, generates a detection signal according to a detection request of the external system, and provides state information for the external system. The fan-controlling module controls the speed of the fan according to the control signal and transmits a control result to the communication-processing module. The detection module detects the ambient state and the fan state of the fan according to the detection signal, and generates the state information according to the ambient information and the fan state. The communication-processing module, the fan-controlling module, and the detection module are physically separated from one another. | 02-18-2016 |
Chia-Fang Tsai, Taoyuan City TW
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20140159244 | Process to Achieve Contact Protrusion for Single Damascene Via - The present disclosure relates to a method of forming a back-end-of-the-line metal contact that eliminates RC opens caused by metal dishing during chemical mechanical polishing. The method is performed by depositing a sacrificial UV/thermal decomposition layer (UTDL) above an inter-level dielectric (ILD) layer. A metal contact is formed that extend through the ILD layer and the sacrificial UTDL. A chemical mechanical polishing (CMP) process is performed to generate a planar surface comprising the sacrificial UTDL. The sacrificial UTDL is then removed through an ultraviolet exposure or a thermal anneal, so that the metal contact protrudes from the ILD layer. | 06-12-2014 |
20150115471 | PROCESS TO ACHIEVE CONTACT PROTRUSION FOR SINGLE DAMASCENE VIA - The present disclosure relates to a method of forming a back-end-of-the-line metal contact that eliminates RC opens caused by metal dishing during chemical mechanical polishing. The method is performed by depositing a sacrificial UV/thermal decomposition layer (UTDL) above an inter-level dielectric (ILD) layer. A metal contact is formed that extend through the ILD layer and the sacrificial UTDL. A chemical mechanical polishing (CMP) process is performed to generate a planar surface comprising the sacrificial UTDL. The sacrificial UTDL is then removed through an ultraviolet exposure or a thermal anneal, so that the metal contact protrudes from the ILD layer. | 04-30-2015 |
Chien-Li Tsai, Taoyuan City TW
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20150303688 | POWER SUPPLY APPARATUS AND POWER SUPPLY METHOD - A power supply apparatus including a master power converter and a slave power converter is provided. The master power converter generates a main power having a working voltage level. The slave power converter generates an auxiliary power. According to its operation state, the master power converter provides a corresponding control signal to the slave power converter. If the master power converter determines the operation state is a first operation state, the slave power converter generates the auxiliary power having a voltage level lower than the working voltage level, so that the slave power converter can be operated in a no-load conversion state. If the master power converter determines the operation state is a second operation state, the slave power converter raises the voltage level of the auxiliary power to the working voltage level, so that the auxiliary power replacing the main power is supplied to a load. | 10-22-2015 |
Chih-Chang Tsai, Taoyuan City TW
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20150331468 | Soft Switching Control After Power Interruption - In some implementations, power provided to a computing system, such as a rack system, may be interrupted. This interruption is detected, and in response, power from a battery backup system is directed to the computing system to replace the interrupted power source, which in some implementations may be a main AC power grid source. A signal is received indicating that a backup power source, for example a backup generator system, is online and prepared to deliver power to the computing system. For an initial period of time, this backup power source is prevented from providing power to the computing system. For example, the backup generator system may be providing power to a power supply unit of the computing system, but the power is not allowed to flow to the computing system. After the initial period of time passes, the power provided to the computing system by the battery backup unit is reduced at a particular rate of change while the power from the backup generator system is allowed to flow to the computing system through the power supply unit. | 11-19-2015 |
Chin-Fu Tsai, Taoyuan City TW
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20160026477 | OUT-OF-BAND RETRIEVAL OF NETWORK INTERFACE CONTROLLER INFORMATION - In some implementations, network interface controller (NIC) configuration information can be obtained from a NIC prior to booting up an operating system. For example, a Basic Input Output System (BIOS) can obtain the NIC configuration information from the NIC during the execution of a system check (e.g., Power-On Self-Test). A system controller can receive the NIC configuration information from the BIOS. The system controller can store the NIC configuration information in memory associated with the system controller. A management system can request the NIC configuration information from the system controller using an out-of-band communication channel. For example, the management system can send the request for NIC configuration information to the system controller prior to powering on a server using a dedicated network interface of the system controller. | 01-28-2016 |
Chung Ching Tsai, Taoyuan City TW
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20090274864 | Process for using polyurethane resin to coat a plurality of sequins attached to a material - A method of coating a roll of material with a plurality of sequins comprising steps of (1) passing a roll of material with a plurality of sequins with the sequins on an upper surface of said roll of material through two wooden guards; (2) passing said roll of material with a plurality of sequins with the sequins on said upper surface of said roll of material through a coating device, (3) passing said roll of material with a plurality of sequins with the sequins on said upper surface of said roll of material through a scrapper device to ensure the evenness of said roll of material; (4) passing said roll of material with a plurality of sequins with the sequins on said upper surface of the material through a drying room; and (5) rolling said roll of material into a second roll through a roller. This method is repeated four times to ensure that the material will be able to pass the physical and mechanical tests imposed by the Consumer Product Safety Commission. | 11-05-2009 |
Chun-Huang Tsai, Taoyuan City TW
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20160126559 | HIGH PERMEABLE POROUS SUBSTRATE FOR A SOLID OXIDE FUEL CELL AND THE PRODUCTION METHOD THEREOF - The disclosure provides a high permeable porous substrate for a solid oxide fuel cell. The high permeable porous substrate for a solid oxide fuel cell includes a porous substrate body and a plurality of channels. The plurality of channels penetrate the first surface of the porous substrate body and does not penetrate the second surface of the porous substrate body. In addition, a production method for the high permeable porous substrate of a solid oxide fuel cell is also provided. | 05-05-2016 |
Ding-Guey Tsai, Taoyuan City TW
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20090197014 | Apparatus and method for coating diamond on work pieces via hot filament chemical vapor deposition - There is a disclosed apparatus for coating diamond on work pieces via hot filament chemical vapor deposition. The apparatus includes a chamber, a pump for pumping air from the chamber, a pressure controller for con trolling the pressure in the chamber, a grid disposed in the chamber, a grid-bias power supply for providing a positive bias to the grid, a holder for carrying the work pieces, a holder-bias power supply for providing a negative bias to the holder, filaments provided between the grid and the carrier, a filament power supply for energizing the filaments to heat up, a programmable temperature controller for controlling the temperature in the chamber and a pipe for transferring reaction gas into the chamber. | 08-06-2009 |
Hsin-Chang Tsai, Taoyuan City TW
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20150125995 | METHOD OF FORMING PACKAGE STRUCTURE - A package structure including: a first semiconductor device including a first semiconductor substrate and a first electronic device, the first semiconductor device having a first side and a second side, wherein at least part of the first electronic device being adjacent to the first side, and the first semiconductor device has a via-hole formed through the first semiconductor device, wherein the via-hole has a first opening adjacent to the first side; an interconnection structure disposed in the first semiconductor device, wherein the interconnection structure includes: a via structure disposed in the via-hole without exceeding the first opening; a first pad disposed on the first side of the first semiconductor device and covering the via-hole; and a second semiconductor device vertically integrated with the first semiconductor device. | 05-07-2015 |
20150294910 | INTERCONNECTION STRUCTURE HAVING A VIA STRUCTURE AND FABRICATION THEREOF - A method of forming an interconnection structure is disclosed, including providing a substrate having a first side and a second side opposite to the first side, forming a via hole through the substrate, wherein the via hole has a first opening in the first side and a second opening in the second side, forming a first pad covering the first opening, and forming a via structure in the via hole subsequent to forming the first pad, wherein the via structure includes a conductive material and is adjoined to the first pad. | 10-15-2015 |
Jang-Zern Tsai, Taoyuan City TW
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20160035085 | METHOD FOR DETECTING AND QUANTIFYING CEREBRAL INFARCT - A method for detecting a cerebral infarct includes receiving an image of a brain of a subject from a magnetic resonance imaging scanner, wherein the image has a plurality of voxels, and each of the voxels has a voxel intensity. Then, the voxel intensities are normalized, wherein the normalized voxel intensities have a distribution peak, and the normalized voxel intensity of the distribution peak is I | 02-04-2016 |
Jen-Yu Tsai, Taoyuan City TW
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20140101174 | ELECTRONIC DEVICE AND MULTIMEDIA FILE SORTING METHOD - A multimedia file sorting method for use in an electronic device is provided. The method has the following steps of: retrieving time information and location information of multimedia files stored in the electronic device; filtering the multimedia files according to the retrieved time information and the retrieved location information; and sorting the multimedia files into multiple groups according to similarities within both the retrieved time information and the retrieved location information. | 04-10-2014 |
Jui-An Tsai, Taoyuan City TW
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20130315715 | ENERGY SAVING DEVICE ROTATING HALF CIRCLE AND TURNING BACK WITH HELP OF GRAVITY - An energy saving device rotating a half circle and turning back with the help of gravity is revealed. In the first half cycle of a circle movement, a transmission shaft of a motor rotor is controlled to rotate and further drive a first rotating shaft rotating in one direction by a first speed change gear mechanism. The transmission shaft synchronously drives the motor rotor to rotate a half circle, from a lowest position to a highest position on a circumference of the circle. In the other half cycle, the transmission shaft of the motor rotor stops rotating and the motor rotor returns from the highest position to the lowest position with the help of gravity. Thus the half circle rotation of the motor rotor is completed and the first rotating shaft is driven to rotate in one direction continuously so as to achieve energy saving effect. | 11-28-2013 |
20140159523 | WORK OUTPUT DEVICE - A work output device is revealed. The work output device includes two motor rotors respectively arrange at two ends of a horizontal main rotating shaft. An outer transmission shaft of each motor rotor starts rotating after the power is turned on. The rotating outer transmission shaft drives the main rotating shaft to rotate in one direction through a speed change gear mechanism. The motor rotors are synchronously driven to rotate around the main rotating shaft and move from a lower position to a higher position. At the moment, the power is turned off and the motor rotors turn back from the higher position to the lower position with the help of gravity. Thus a cycle of repetitive up-and-down half circle rotation is completed. Moreover, the main rotating shaft drives a work output shaft to rotate by a torque controller. | 06-12-2014 |
20160117961 | LIQUID ORNAMENT ASSEMBLY - A liquid ornament is revealed. The liquid ornament includes a closed container and a film sheet. A liquid ornament is received in the closed container and is displayed. The liquid ornament consists of combinations of at least two of a first liquid, a second liquid and at least one ornament. The film sheet is formed by a first end surface and a second surface opposite to the first end surface. The first end surface is attached to a connection part of the closed container while the second end surface is attached to a surface of a solid object. | 04-28-2016 |
Lung Sheng Tsai, Taoyuan City TW
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20080243090 | Nozzle assembly for enema kit - A nozzle assembly for enema kit includes an extension tube curved in a predetermined manner, and a plug body connected at a proximal end to a first end of the extension tube. The plug body has a distal end formed into a nozzle, which has a predetermined short length and is provided at a front end with a plurality of nozzle apertures, and includes a rearward flared cup portion. When a user uses the enema kit to do colonic hydrotherapy with the nozzle introduced through the user's anal sphincter, water is supplied to the nozzle assembly and jetted into the user's anus. A rearward flared cup portion is formed behind the nozzle to press against the user's butt, preventing the nozzle from moving too deep into the user's anus, making the enema kit comfortable and safe for use by a non professional person. | 10-02-2008 |
Mao-Chiang Tsai, Taoyuan City TW
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20150200999 | MEDIA DATA PROCESSING METHOD AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM THEREOF - A media data processing method is provided herein. The media data processing method is adapted for a portable mobile device. The media data processing method includes: selecting at least one first media file in a first client; uploading the at least one first media file to a server; mixing and editing the at least one first media file and at least one second media file in the server to generate a video. | 07-16-2015 |
Ming-Han Tsai, Taoyuan City TW
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20150036662 | APPARATUSES AND METHODS FOR WIRELESS FIDELITY (WIFI) NETWORK SELECTION - A wireless communications device is provided with a storage unit and a processor. The storage unit is configured to store signal strengths and throughputs of a plurality of Access Points (APs) which the wireless communications device was previously or is currently connected to. The processor is configured to update the stored signal strength and throughput of the currently connected AP, and scan for available APs nearby in response to detecting a low-throughput condition of the currently connected AP. | 02-05-2015 |
Pei-Shiu Tsai, Taoyuan City TW
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20140091351 | LIGHT EMITTING DIODE CHIP - A Light emitting diode (LED) chip includes a substrate, an N-type semiconductor layer, a luminous layer, a P-type semiconductor layer, an N-type electrode layer and a P-type electrode layer. The N-type semiconductor layer is mounted on the substrate. The luminous layer is mounted on the N-type semiconductor layer. The P-type semiconductor layer is mounted on the luminous layer. The N-type electrode layer is mounted on the N-type semiconductor layer. The P-type electrode layer is mounted on the P-type semiconductor layer, and includes a plurality of enclosed circuit patterns. These enclosed circuit patterns respectively encompass different parts of the N-type electrode layer. | 04-03-2014 |
20140231831 | LED CHIP AND METHOD FOR MANUFACTURING THE SAME - The invention provides a substrate structure used for manufacturing a light-emitting diode and a method for manufacturing the light-emitting diode. The substrate structure includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of grooving structure formed on the first surface of the substrate. The light-emitting diode is formed on the first surface of the substrate. | 08-21-2014 |
Pei-Yuan Tsai, Taoyuan City TW
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20140066792 | BLOOD PRESSURE MEASURING METHOD, BLOOD PRESSURE MEASUREMENT SET AND FLEXIBLE MEASURING ELEMENT THEREOF - A flexible measuring element for use with plural blood pressure measuring cuffs is provided. The flexible measuring element includes a flexible body, an identification block distribution region, and an indicating part. The identification block distribution region is disposed on the flexible body. The identification block distribution region includes at least two different identification blocks matching corresponding identification signs of the plural blood pressure measuring cuffs. When the flexible body is wrapped around an animal limb by a user, the indicating part lies within a specified identification block of the at least two identification blocks for prompting the user to select a specified blood pressure measuring cuff corresponding to the specified identification block. | 03-06-2014 |
Shen-Fu Tsai, Taoyuan City TW
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20160119559 | Color Filter Array and Manufacturing Method thereof - A color filter array for an image sensing device is disclosed. The color filter array includes a plurality of pixels and a control unit. The plurality of pixels is utilized for generating a plurality of pixel data of an image. The control unit is utilized for controlling the plurality of pixels. In addition, each of the plurality of pixels is divided into a plurality of sub-pixels corresponding to the same color. When outputting the plurality of pixel data, each of the plurality of pixels accumulates pixel value of at least one of the plurality of sub-pixels in each of the plurality of pixels as the pixel data outputted by each of the plurality of pixels. | 04-28-2016 |
Sheng-An Tsai, Taoyuan City TW
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20160134335 | ELECTRONIC DEVICE WITH MODULIZATION PARTS - An electronic device with modulization parts includes a first main body, a first wireless transmission port having a first circuit board and a first induction pad, a second main body detachably coupled to the first main body, and a second wireless transmission port having a second circuit board, a second induction pad, an induction cap and an elastic conductive member electrically conducted to the second induction pad and the induction cap. The first circuit board is disposed on the first main body. The first induction pad is electrically connected to the first circuit board. The second circuit board is disposed on the second main body. The elastic conductive member physically supports the induction cap so that the first induction pad induces the second induction pad through the induction cap. | 05-12-2016 |
Tsai-Tsung Tsai, Taoyuan City TW
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20130167373 | Methods for Stud Bump Formation and Apparatus for Performing the Same - An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump. | 07-04-2013 |
20130214431 | Fine-Pitch Package-on-Package Structures and Methods for Forming the Same - A method includes laminating a Non-Conductive Film (NCF) over a first package component, and bonding a second package component on the first package component. The NCF and the second package component are on a same side of the first package component. Pillars of a mold tool are then forced into the NCF to form openings in the NCF. The connectors of the first package component are exposed through the openings. | 08-22-2013 |
20140042622 | Fine Pitch Package-on-Package Structure - A package-on-package (PoP) device including a substrate having an array of contact pads arranged around a periphery of the substrate, a logic chip mounted to the substrate inward of the array of contact pads, and non-solder bump structures mounted on less than an entirety of the contact pads available. | 02-13-2014 |
20140045300 | WARPAGE CONTROL IN A PACKAGE-ON-PACKAGE STRUCTURE - The present disclosure relates to a tool arrangement and method to reduce warpage within a package-on-package semiconductor structure, while minimizing void formation within an electrically-insulating adhesive which couples the packages. A pressure generator and a variable frequency microwave source are coupled to a process chamber which encapsulates a package-on-package semiconductor structure. The package-on-package semiconductor structure is simultaneously heated by the variable frequency microwave source at variable frequency, variable temperature, and variable duration and exposed to an elevated pressure by the pressure generator. This combination for microwave heating and elevated pressure limits the amount of warpage introduced while preventing void formation within an electrically-insulating adhesive which couples the substrates of the package-on-package semiconductor structure. | 02-13-2014 |
20140124955 | PACKAGE-ON-PACKAGE STRUCTURE INCLUDING A THERMAL ISOLATION MATERIAL AND METHOD OF FORMING THE SAME - A semiconductor device includes a first package component and a second package component. The first package component has a first die formed on a first substrate. A second package component has a second die formed on a second substrate. A thermal isolation material is attached on the first die, wherein the thermal isolation material thermally insulates the second die from the first die, and the thermal isolation material has a thermal conductivity of from about 0.024 W/mK to about 0.2 W/mK. A first set of conductive elements couples the first package component to the second package component. | 05-08-2014 |
20150235975 | Methods for Stud Bump Formation and Apparatus for Performing the Same - An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump. | 08-20-2015 |
20160035663 | Semiconductor Package System and Method - A first protective layer is formed on a first die and a second die, and openings are formed within the first protective layer. The first die and the second die are encapsulated such that the encapsulant is thicker than the first die and the second die, and vias are formed within the openings. A redistribution layer can also be formed to extend over the encapsulant, and the first die may be separated from the second die. | 02-04-2016 |
Tsung-Hsuan Tsai, Taoyuan City TW
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20150377825 | CALIBRATION METHOD FOR BLOOD GLUCOSE OF BLOOD SAMPLE - A calibration method for blood glucose of a blood sample includes steps of: applying a first voltage to a blood sample to obtain a first blood glucose level; applying a second voltage to the blood sample to obtain a second blood glucose level; applying a third voltage to the blood sample to obtain a hematocrit index of the blood sample; and processing the hematocrit index and calibrating the second blood glucose level. The third voltage is higher than the first voltage. Through this disclosure, user can obtain a sensing current corresponding to the blood glucose level and a hematocrit index corresponding to blood sample by applying at least three-stage voltages within specific ranges to the blood sample, and further calibrate the blood glucose concentration according to the hematocrit index. | 12-31-2015 |
20160077038 | EXAMINATION METHOD FOR DETECTING ABNORMAL ELECTROCHEMICAL TESTING STRIP - An examination method for detecting abnormal electrochemical testing strip includes the steps of: applying a trigger voltage to a testing strip; injecting a target sample to the testing strip; obtaining a trigger current which is generated by injecting the target sample to the testing strip; comparing the trigger current with a first threshold, and determining whether the trigger current is lager than or equal to the first threshold; and when the trigger current is less than the first threshold, displaying a message for abnormality. | 03-17-2016 |
Tung-Hsien Tsai, Taoyuan City TW
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20160049875 | Transformer and Control method Thereof - A transformer includes a first switch, a first winding, a second winding, a third winding, a first current direction control unit, a second current direction control unit and a loading capacitor. The first switch is coupled between the second winding and the third winding. The first winding is disposed at a primary side and coupled between an input voltage terminal and a first ground. The second winding is disposed at a secondary side and coupled between a second ground and the first switch. The third winding is disposed at the secondary side. The first current direction control unit is coupled between the second winding and an output voltage terminal. The second current direction control unit is coupled between the third winding and the output voltage terminal. The first switch is turned on for adjusting a winding ratio when the transformer is used to output a high voltage. | 02-18-2016 |
Wang-Kun Tsai, Taoyuan City TW
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20080242155 | ELECTRICAL CONNECTOR HAVING INSULATIVE HOUSING AND FLEXIBLE BUS - An electrical connector includes an insulative housing receiving a plurality of terminals therein, an upper cover mounted on the insulative housing, a flexible bus, and a casing shielding the upper cover and fixed to the insulative housing. The insulative housing has a mating portion for mating with a mating connector. The flexible bus has a plurality of contacts on an end thereof. The upper cover presses against the flexible bus in assembly, forcing the contacts to contact the terminals. The casing biases against the upper cover, forcing the contacts of the flexible bus to contact the terminals reliably. The flexible bus of the electrical connector does not contact a mating connector directly, thereby lengthening the life of the flexible bus even after repeated plugging. | 10-02-2008 |
Wen-Chou Tsai, Taoyuan City TW
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20110198732 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - A chip package includes: a substrate having a first and a second surface; a device region and a pad disposed on the first surface; a hole extending from the second surface to the pad; an insulating layer located on a sidewall of the hole; a carrier substrate located on the second surface; a first redistribution layer located between the carrier substrate and the insulating layer and located in the hole to electrically contact with the pad, wherein an edge of the first redistribution layer is exposed on a sidewall formed by the carrier substrate and the insulating layer; a second redistribution layer located on the carrier substrate, extending towards the second surface, and contacting the exposed edge of the first redistribution layer; and a buffer layer located on or below the second surface of the substrate and located between the second redistribution layer and the substrate. | 08-18-2011 |
20130043570 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - A chip package includes: a substrate having a first and a second surface; a device region and a pad disposed on the first surface; a hole extending from the second surface to the pad; an insulating layer located on a sidewall of the hole; a carrier substrate located on the second surface; a first redistribution layer located between the carrier substrate and the insulating layer and located in the hole to electrically contact with the pad, wherein an edge of the first redistribution layer is exposed on a sidewall formed by the carrier substrate and the insulating layer; a second redistribution layer located on the carrier substrate, extending towards the second surface, and contacting the exposed edge of the first redistribution layer; and a buffer layer located on or below the second surface of the substrate and located between the second redistribution layer and the substrate. | 02-21-2013 |
Wen-Fa Tsai, Taoyuan City TW
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20160076143 | VACUUM COATING APPARATUS - A vacuum coating apparatus includes at least a chamber, an arc discharge plasma source, a feeding-reeling unit, and a roller set. The first and second openings are connecting with the feeding or reeling unit so as to allow the substrate to enter and leave the chamber therethrough, respectively. The arc discharge plasma source located inside the chamber generates the plasma, which discharges radially from the arc discharge plasma source as its center. The roller set includes a plurality of the first rollers, which are located in the chamber and enclosing the arc discharge plasma source. A first surface of the substrate is facing the plurality of the first rollers and contacts tightly on the periphery of the first rollers so that the first rollers can rotate by the moving of the substrate. The material evaporated and emitted by the plasma is attached onto the first surface of the substrate. | 03-17-2016 |
Ying-Tsung Tsai, Taoyuan City TW
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20150180472 | DISPLAY DEVICE AND INFRARED TOUCH MODULE THEREOF - A display device includes an infrared touch module, a back casing and a display panel. The infrared touch module includes a light guide member, a circuit board and an infrared transmitter. The circuit board is disposed on the light guide member and the infrared transmitter is disposed on an arrangement plane of the circuit board. The light guide member defines a touch plane and an angle is included between the arrangement plane and the touch plane, wherein the included angle is larger than 0 degree and smaller than or equal to 90 degrees. The back casing and the light guide member are combined with each other so that an accommodating space is formed between the light guide member and the back casing. The display panel is disposed in the accommodating space and has a display plane, wherein the display plane is substantially parallel to the touch plane. | 06-25-2015 |