Patent application number | Description | Published |
20090020849 | ELECTRONIC DEVICE INCLUDING A CAPACITOR AND A PROCESS OF FORMING THE SAME - An electronic device can include electronic components and an insulating layer overlying the electronic components. The electronic device can also include a capacitor overlying the insulating layer, wherein the capacitor includes a first electrode and a second electrode. The second electrode can include an opening, wherein from a top view, a defect lies within the opening. In another aspect, a process of forming an electronic device can include forming a first capacitor electrode layer over a substrate, forming a dielectric layer over the first capacitor electrode layer, and forming a second capacitor electrode layer over the dielectric layer. The process can also include detecting a defect and removing a first portion of the second capacitor electrode layer corresponding to the defect, wherein a second portion of the second capacitor electrode layer remains over the dielectric layer. | 01-22-2009 |
20100112779 | METHOD AND APPARATUS FOR INDICATING DIRECTIONALITY IN INTEGRATED CIRCUIT MANUFACTURING - An integrated circuit includes a visually discernable indicator formed as part of the integrated circuit to indicate a directionality of a non-visually discernable characteristic of the integrated circuit. | 05-06-2010 |
20110269300 | Integrated Assist Features for Epitaxial Growth - A method for making a semiconductor device is provided which comprises (a) creating a data set ( | 11-03-2011 |
20130105986 | SEMICONDUCTOR DEVICE WITH VIAS ON A BRIDGE CONNECTING TWO BUSES | 05-02-2013 |
20130147051 | METHOD OF PROTECTING AGAINST VIA FAILURE AND STRUCTURE THEREFOR - A method is for forming a decoy via and a functional via. The method includes forming the functional via between a metal portion of a first interconnect layer and a portion of a second interconnect layer. The method further includes forming the decoy via in a protection region between the metal portion of the first interconnect layer and a metal portion of the third interconnect level. | 06-13-2013 |
20130264698 | SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION - A semiconductor assembly includes a semiconductor device and a connecting structure. The semiconductor device includes an interconnect region over a semiconductor substrate and a pillar layer having a plurality of pillar contacts on the interconnect region. The pillar layer also includes a plurality of radial heat conductors that have at least a portion overlying a heat source that is within and overlies the semiconductor substrate. Each radial heat conductor extends a length radially from the heat source that is at least twice as great as the diameter of the pillars. The connecting structure includes a connecting substrate that supports a first corresponding pillar contact that is in contact with a first pillar contact of the plurality of pillar contacts. The first connecting structure further includes a heat conductor, supported by the substrate, in contact with a first radial heat conductor of the plurality of radial heat conductors. | 10-10-2013 |
20130264700 | SEMICONDUCTOR DEVICE WITH EMBEDDED HEAT SPREADING - A semiconductor device includes a semiconductor substrate and a plurality of clock drivers, wherein the plurality of clock drivers comprises substantially all clock drivers of the semiconductor device, and an interconnect region over the semiconductor substrate, wherein the interconnect region comprises a plurality of heat spreaders, wherein at least 25% of the plurality of clock drivers have a corresponding heat spreader of the plurality of heat spreaders. Each corresponding heat spreader of the plurality of heat spreaders covers at least 50% of a transistor within a corresponding clock driver of the plurality of clock drivers and extends across at least 70% of a perimeter of the transistor within the corresponding clock driver. | 10-10-2013 |
20130305202 | MISMATCH VERIFICATION DEVICE AND METHODS THEREOF - A method can include identifying a device design comprising first and second instantiations of a device, identifying a layer of the device design, identifying a first region of the device design for the first instantiation based on the layer of the first instantiation, and a second region of the device design for the second instantiation based on the layer of the second instantiation. identifying a first compare layer of the device design that comprises a plurality of first compare features including a first compared feature within the first region and a second compared feature within the second region, determining a difference between the first compared feature and the second compared feature, and determining if the difference meets a tolerance to determine if the first instantiation matches the second instantiation. | 11-14-2013 |
20130326446 | TECHNIQUES FOR CHECKING COMPUTER-AIDED DESIGN LAYERS OF A DEVICE TO REDUCE THE OCCURRENCE OF MISSING DECK RULES - A technique for computer-aided design layer checking of an integrated circuit design includes generating a representation of a device (e.g., a parameterized cell). Computer-aided design (CAD) layers are sequentially removed from the parameterized cell and a determination is made as to whether expected errors are detected or missed by an associated deck. The associated deck is then modified to detect the expected errors that are missed. | 12-05-2013 |
20140038317 | METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS - A method forms an electrical connection between a first metal layer and a second metal layer. The second metal layer is above the first metal layer. A first via is formed between the first metal layer and the second metal layer. A first measure of a number of vacancies expected to reach the first via is obtained. A second via in at least one of the first metal layer and the second metal layer is formed if the measure of vacancies exceeds a first predetermined number. | 02-06-2014 |
20140038319 | METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS - A method includes forming a connection between a first metal layer and a second metal layer. The second metal layer is over the first metal layer. A via location for a first via between the first metal layer and the second metal layer is identified. Additional locations for first additional vias are determined. The first additional vias are determined to be necessary for stress migration issues. Additional locations necessary for second additional vias are determined. The second additional vias are determined to be necessary for electromigration issues. The first via and the one of the group consisting of (i) the first additional vias and second additional vias (ii) the first additional vias plus a number of vias sufficient for electromigration issues taking into account that the first additional vias, after taking into account the stress migration issues, still have an effective via number greater than zero. | 02-06-2014 |
20140040839 | METHOD AND SYSTEM FOR DERIVED LAYER CHECKING FOR SEMICONDUCTOR DEVICE DESIGN - A system and method are provided for enabling a systematic detection of issues arising during the course of mask generation for a semiconductor device. IC mask layer descriptions are analyzed and information is generated that identifies devices formed by active layers in the masks, along with a description of all layers in proximity to the found devices. The IC mask information is compared to a netlist file generated from the initial as-designed schematic. Determinations can then made, for example, as to whether all intended devices are present, any conflicting layers are in proximity to or interacting with the intended devices, and any unintended devices are present in the mask layers. Steps can then be taken to resolve the issues presented by the problematic devices. | 02-06-2014 |
20140094029 | METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS - A method includes forming a connection between a first metal layer and a second metal layer. The second metal layer is over the first metal layer. A via location for a first via between the first metal layer and the second metal layer is identified. Additional locations for first additional vias are determined. The first additional vias are determined to be necessary for stress migration issues. Additional locations necessary for second additional vias are determined. The second additional vias are determined to be necessary for electromigration issues. The first via and the one of the group consisting of (i) the first additional vias and second additional vias (ii) the first additional vias plus a number of vias sufficient for electromigration issues taking into account that the first additional vias, after taking into account the stress migration issues, still have an effective via number greater than zero. | 04-03-2014 |
20140239440 | Thin Beam Deposited Fuse - A back-end-of-line thin ion beam deposited fuse ( | 08-28-2014 |
20140258582 | SEMICONDUCTOR DEVICE WITH VIAS ON A BRIDGE CONNECTING TWO BUSES - A semiconductor device comprises conductive buses and conductive bridges. A respective conductive bridge is conductively coupled to at least two portions of at least one of the conductive buses. At least N plus one (N+1) vias are coupled between every one of the conductive bridges and a respective feature in an integrated circuit when: (1) a width of the respective conductive bridge is less than a width of each of the at least two portions of the at least one of the conductive buses to which the respective conductive bridge is coupled, and (2) a distance along the respective conductive bridge and at least one of the vias is less than a critical distance. N is a number of conductive couplings between the respective one of the conductive bridges and the at least one of the conductive buses. | 09-11-2014 |
20140329383 | SEMICONDUCTOR DEVICE WITH EMBEDDED HEAT SPREADING - A semiconductor device includes a semiconductor substrate and a plurality of clock drivers, wherein the plurality of clock drivers comprises substantially all clock drivers of the semiconductor device, and an interconnect region over the semiconductor substrate, wherein the interconnect region comprises a plurality of heat spreaders, wherein at least 25% of the plurality of clock drivers have a corresponding heat spreader of the plurality of heat spreaders. Each corresponding heat spreader of the plurality of heat spreaders covers at least 50% of a transistor within a corresponding clock driver of the plurality of clock drivers and extends across at least 70% of a perimeter of the transistor within the corresponding clock driver. | 11-06-2014 |
20140353797 | FUSE/RESISTOR UTILIZING INTERCONNECT AND VIAS AND METHOD OF MAKING - A semiconductor structure comprising a fuse/resistor structure over a functional layer having a substrate. The fuse/resistor structure includes a via, a first interconnect layer, and a second interconnect layer. The via is over the functional layer and has a first end and a second end vertically opposite the first end, wherein the first end is bounded by a first edge and a second edge opposite the first edge and the second end is bounded by a third edge and a fourth edge opposite the third edge. The first interconnect layer includes a first metal layer running horizontally and contacting the first end and completely extending from the first edge to the second edge. The second interconnect layer includes a second metal layer running horizontally and contacting the second end of the via and extending past the third edge but reaching less than half way to the fourth edge. | 12-04-2014 |
20140353841 | METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS - A method of making a semiconductor device having a substrate includes forming a first interconnect layer over the substrate, wherein a first metal portion of a first metal type is within the first interconnect layer and has a first via interface location. An interlayer dielectric is formed over the first interconnect layer. An opening in the interlayer dielectric is formed over the via interface location of the first metal portion. A second interconnect layer is formed over the interlayer dielectric. A second metal portion and a via of the first metal type is within the second interconnect layer. The via is formed in the opening to form an electrical contact between the first metal portion and the second metal portion. The via is over the first via interface location. A first implant of the first metal type is aligned to the first via interface location. | 12-04-2014 |
20150035151 | Capping Layer Interface Interruption for Stress Migration Mitigation - A semiconductor device includes a substrate, a dielectric layer supported by the substrate, an interconnect adjacent the dielectric layer, the interconnect including a conduction material and a barrier material disposed along sidewalls of the interconnect between the conduction material and the dielectric layer, and a layer disposed over the interconnect to establish an interface between the conduction material, the barrier material, and the layer. A plate is disposed along a section of the interconnect to interrupt the interface. | 02-05-2015 |
20150040092 | Stress Migration Mitigation - A computer-implemented method of configuring a semiconductor device includes identifying an interconnect having an interconnect path length greater than a stress-induced void formation characteristic length of the semiconductor device, and placing, with a processor, a conductive structure adjacent the interconnect to define a pair of segments of the interconnect. Each segment has a length no greater than the stress-induced void formation characteristic length of the interconnect, and the conductive structure is selected from the group consisting of a decoy via connected to the interconnect, a floating tile disposed along the interconnect, a tab that laterally extends outward from the interconnect, and a jumper from a first metal layer in which the interconnect is disposed to a second metal layer. | 02-05-2015 |
20150091178 | 3D DEVICE PACKAGING USING THROUGH-SUBSTRATE PILLARS - A method for 3D device packaging utilizes through-substrate pillars to mechanically and electrically bond two or more dice. The first die includes a set of access holes extending from a surface of the first die to a set of pads at a metal layer of the first die. The second die includes a set of metal pillars. The first die and the second die are stacked such that each metal pillar extends from a surface of the second die to a corresponding pad via a corresponding access hole. The first die and second die are mechanically and electrically bonded via solder joints formed between the metal pillars and the corresponding pads. | 04-02-2015 |
20150091187 | 3D DEVICE PACKAGING USING THROUGH-SUBSTRATE POSTS - A method for 3D device packaging utilizes through-hole metal post techniques to mechanically and electrically bond two or more dice. The first die includes a set of through-holes extending from a first surface of the first die to a second surface of the first die. The second die includes a third surface and a set of metal posts. The first die and the second die are stacked such that the third surface of the second die faces the second surface of the first die, and each metal post extends through a corresponding through-hole to a point beyond the first surface of the first die, electrically coupling the first die and the second die. | 04-02-2015 |
20150137311 | Thin Beam Deposited Fuse - A back-end-of-line thin ion beam deposited fuse ( | 05-21-2015 |
20150178438 | SEMICONDUCTOR MANUFACTURING USING DESIGN VERIFICATION WITH MARKERS - A first circuit design is entered in an electronic design automation (EDA) computer system. The first circuit design includes a first feature with a first node. A marker is associated with the first node and represents a voltage associated with the first node as an algebraic expression of a numerical value representing a property of the circuit design. The marker is used to determine if the component of the circuit design violates a design rule. | 06-25-2015 |
20150249048 | STRESS MIGRATION MITIGATION UTILIZING INDUCED STRESS EFFECTS IN METAL TRACE OF INTEGRATED CIRCUIT DEVICE - An integrated circuit (IC) device includes a plurality of metal layers having metal traces, and a plurality of vias interconnecting the metal traces. The presence of vacancies within the metal layers may disrupt the functionality of the IC device if the vacancies migrate to the vias interconnecting the metal layers. To mitigate vacancy migration, stressor elements are formed at the metal traces to form stress effects in the metal traces that, depending on type, either serve to repel migrating vacancies from the via contact area or to trap migrating vacancies at a portion of the metal trace displaced from the contact area. The stressor elements may be formed as stress-inducing dielectric or conductive material overlying the metal traces, or formed by inducing a stress memory effect in a portion of the metal trace itself. | 09-03-2015 |
20150348898 | APPARATUS AND METHOD FOR PLACING STRESSORS WITHIN AN INTEGRATED CIRCUIT DEVICE TO MANAGE ELECTROMIGRATION FAILURES - A method for selecting locations within an integrated circuit device for placing stressors to manage electromigration failures includes calculating an electric current for an interconnect within the integrated circuit device and determining an electromigration stress profile for the interconnect based on the electric current. The method further includes determining an area on the interconnect for placing a stressor to alter the electromigration stress profile for the interconnect. | 12-03-2015 |
Patent application number | Description | Published |
20090107685 | Wellhead Completion Assembly Capable of Versatile Arrangements - A wellhead completion assembly has a head connected to surface casing. A rotatable flange or the like can be used to connect various components to a threaded end of the head. A casing hanger installs in the head, and the hanger's upper end extends beyond the head's top edge. This exposed end has an external threaded connection to connect to various wellhead components using a rotatable flange or the like. For example, a locking ring can threadably connect to the head's threaded end to support the hanger in the head. Then, a rotatable flange can threadably connect to the hanger's exposed end so that another component, such as a completion spool or gate valve, can nippled up directly to the hanger. When the hanger is fluted, a pack-off assembly can allow testing off inner and outer sealing integrity via a test port accessible through an opening in the locking ring. | 04-30-2009 |
20090205728 | Disc Arrangement for Drilling or Production Choke or Valve - A flow adjusting apparatus having a pair of discs can be used for a drilling or production choke or valve. A stationary disc fixedly positions in a flow passage and defines at least one first bore permitting fluid flow. A rotatable disc positions in the flow passage between the stationary disc and the distal end of a stem. The rotatable disc defines at least one second bore permitting fluid flow. Rotation of the rotatable disc adjusts relative orientation between the first and second bores and adjusts fluid flow through the first and second bores. The stationary disc has a greater length than the rotatable disc to control exiting fluid flow beyond the discs and reduce erosion. In addition, the rotatable disc's bore defines a tapered relief at the disc's front face to control inlet of fluid flow and reduce erosion. | 08-20-2009 |
20090294134 | CAPILLARY HANGER ARRANGEMENT FOR DEPLOYING CONTROL LINE IN EXISTING WELLHEAD - To deploy a capillary string through a wellhead to a downhole safety valve, a control port and a retention port are drilled in an adapter between a casing hanger and a gate valve or elsewhere. The capillary string is connected to a first port of a capillary hanger and installed through the wellhead. The capillary hanger is landed on a tubing hanger, and a side port on the capillary hanger communicates with the control port. Because the side port's location may not align with the control port, operators may need to measure how long the capillary hanger should be. A control line connects to the control port in the wellhead's side to communicate with the capillary line, and a retention rod inserts in the retention port to support the capillary hanger. | 12-03-2009 |
20090294136 | Surface controlled subsurface safety valve having integral pack-off - A safety valve apparatus has a housing with a bore and a projection in the bore. A flapper rotatably disposed on the housing is movable relative to the bore between opened and closed positions, and a packing element disposed on the housing is compressible to engage an inner conduit wall surrounding the housing. An upper sleeve disposed within the bore above the projection is hydraulically movable from a first position to a second position via the hydraulic communication with a port in the projection. The first sleeve when moved to the second position compresses the packing element. A piston disposed in the housing hydraulically communicates with the port and couples to a second sleeve disposed within the bore below the projection. The second sleeve conceals the piston and is hydraulically movable via the hydraulic communication of the port with the piston to open and close the flapper. | 12-03-2009 |
20100084136 | Power Slip Assembly for Wellhead Casing and Wellbore Tubing - A power slip extends a joint from tubing disposed in casing at a well so that a casing head can install on the casing and the tubing can be packed-off from the casing. The joint attaches to an inner sleeve having collet members that fit onto the inner tubing so that the joint extends thereabove. An outer sleeve and interlocking collet assemble together and install onto the inner sleeve. The collet threads onto the inner sleeve and forces the outer sleeve downward onto the inner sleeve. Being forced, the outer sleeve causes the collet members to engage around the inner tubing. The casing head then installs on the casing with the joint extending up through the head's bowl. An H-plate installs in the open bowl around the extended joint, and another pack-off installs on the joint to pack it off from a spool attaching to the casing head. | 04-08-2010 |
20100288483 | Wellhead Completion Assembly Capable of Versatile Arrangements - A wellhead completion assembly has a head connected to surface casing. A rotatable flange or the like can be used to connect various components to a threaded end of the head. A casing hanger installs in the head, and the hanger's upper end extends beyond the head's top edge. This exposed end has an external threaded connection to connect to various wellhead components using a rotatable flange or the like. For example, a locking ring can threadably connect to the head's threaded end to support the hanger in the head. Then, a rotatable flange can threadably connect to the hanger's exposed end so that another component, such as a completion spool or gate valve, can nippled up directly to the hanger. When the hanger is fluted, a pack-off assembly can allow testing off inner and outer sealing integrity via a test port accessible through an opening in the locking ring. | 11-18-2010 |
20110187098 | Hydraulic Tensioning Flange Connector - Hydraulic flange connectors connect two flange components together, and hydraulic pressure applied to ports in connector holes of one of the flanges tension the flange studs and crush the gasket between the flange components. Each connector has a piston that dispose in the connector hole and can move therein when hydraulic pressure is applied through the port by a pump. A first stud connected to the piston extends beyond one open end of the hole for connection to a first nut, while a second stud connected to the piston extending beyond another open end of the to the second flange component for connection to a second nut. A retainer having seals threads in this other open end of the hole and seals between the hole and the second stud. | 08-04-2011 |
20110278021 | Wellhead Control Line Deployment - Wellhead control line deployment involves replacing the seat/retainer plate of a master valve of the wellhead with a modified retainer plate. The retainer plate defines a first port communicating from a central opening of the plate to outside the plate. A modified bonnet installs on the master valve, and the bonnet has two ports, one communicating with the first port in the retainer plate and the second communicating with a needle valve port. The communication ports are linked by a tube with outside diameter seals that inserts between the retainer plate and the bonnet. A control line hanger can be retained by locking into an adapter sleeve or directly in the back-pressure valve threads of a tubing hanger. The adapter sleeve can be attached to the retainer plate or have a collet to snap into the back-pressure valve threads of the tubing hanger. | 11-17-2011 |
20120085552 | Wellhead Rotating Breech Lock - A rotating breech lock rotates tubing to distribute wear caused by a rotating or reciprocating rod of an artificial lift system. The rotating breech lock has a spool that disposes on a wellhead. A bowl element disposes in the spool's bore, and a hanger fits into the spool and lands on the bowl element with a thrust bearing. Above the hanger, a load ring fits against the hanger with a bearing, and a hold-down sleeve and locking pins hold the load ring against the hanger. The spool has a worm that mates with a wheel defined about the hanger so turning the worm by a ratchet or other mechanism rotates the hanger. Internally, the hanger has a bore with opposing shoulders separated by gaps. A mandrel couples to the tubing and disposes up into the hanger. Protrusions or keys on the hanger can selectively align with the gaps and the shoulders depending on how the mandrel is rotated in the hanger bore. | 04-12-2012 |
20120125634 | Emergency Bowl for Deploying Control Line from Casing Head - An assembly supports a control line of a downhole tool, such as a downhole deployment valve. The tool deploys on casing and has a control line extending from the wellhead to the tool. To support the line separately from any casing hanger, a split bowl disposes around the casing and lands on a shoulder in the head. A port in the bowl has one opening that aligns with a side port in the head. Another opening of the bowl's port connects to the control line that extends to the downhole tool. A section of the control line from the split bowl can be flexible to help prevent kinking or breaking of the line during installation procedures. A hanger disposes on another shoulder in the head uphole from the bowl. The hanger supports the casing in the head separate from the bowl's support of the control line. | 05-24-2012 |
20130133898 | CAPILLARY HANGER ARRANGEMENT FOR DEPLOYING CONTROL LINE IN EXISTING WELLHEAD - To deploy a capillary string through a wellhead to a downhole safety valve, a control port and a retention port are drilled in an adapter between a casing hanger and a gate valve or elsewhere. The capillary string is connected to a first port of a capillary hanger and installed through the wellhead. The capillary hanger is landed on a tubing hanger, and a side port on the capillary hanger communicates with the control port. Because the side port's location may not align with the control port, operators may need to measure how long the capillary hanger should be. A control line connects to the control port in the wellhead's side to communicate with the capillary line, and a retention rod inserts in the retention port to support the capillary hanger. | 05-30-2013 |
20130189042 | Adjustable Die - A slip on nut and reverse cut die is provided for dressing the threads of a wellhead or other item. A nut is provided that may be slipped onto a threaded section, past any damaged threads, without engaging the threads of the threaded section. Once positioned on a threaded section the nut may be tightened as desired. When removing the nut the reverse edges of the nut may repair or even cut new threads into the threaded section. | 07-25-2013 |
20130284456 | Wellhead Control Line Deployment - Wellhead control line deployment involves replacing the seat/retainer plate of a master valve of the wellhead with a modified retainer plate. The retainer plate defines a first port communicating from a central opening of the plate to outside the plate. A modified bonnet installs on the master valve, and the bonnet has two ports, one communicating with the first port in the retainer plate and the second communicating with a needle valve port. The communication ports are linked by a tube with outside diameter seals that inserts between the retainer plate and the bonnet. A control line hanger can be retained by locking into an adapter sleeve or directly in the back-pressure valve threads of a tubing hanger. The adapter sleeve can be attached to the retainer plate or have a collet to snap into the back-pressure valve threads of the tubing hanger. | 10-31-2013 |
20140020906 | Cartridge Valve Assembly for Wellhead - A modular assembly for a wellhead has a housing and a plurality of modular cartridges. The housing connects with a studded or flanged connection to the wellhead, which can have a tubing adapter, casing hanger, etc. The modular cartridges can interchangeably stack in the housing's internal pocket so that the bores of the stacked cartridges configure the through-bore of the assembly communicating the wellhead with external components, such as flow lines, capillary lines, etc. The modular cartridges include a spacer cartridge, a hanger cartridge, a valve cartridge, and a cross cartridge. The spacer cartridge can be used to space other cartridges in the internal pocket, and the hanger cartridge can be used to support capillary strings and/or velocity strings in the wellhead. The valve cartridges have valve elements that can be opened and closed by bonnets that affix externally to the housing. The cross cartridge can have one or more cross ports to divert the assembly's through-bore to additional flow components, such as flow lines, wing valves, chokes, and the like. | 01-23-2014 |
20140075741 | Hydraulic Tensioning Flange Connector - Hydraulic flange connectors connect two flange components together, and hydraulic pressure applied to ports in connector holes of one of the flanges tension the flange studs and crush the gasket between the flange components. Each connector has a piston that disposes in the connector hole and can move therein when hydraulic pressure is applied through the port by a pump. A first stud connected to the piston extends beyond one open end of the hole for connection to a first nut, while a second stud connected to the piston extending beyond another open end of the to the second flange component for connection to a second nut. A retainer having seals threads in this other open end of the hole and seals between the hole and the second stud. | 03-20-2014 |
20140238698 | CAPILLARY HANGER ARRANGEMENT FOR DEPLOYING CONTROL LINE IN EXISTING WELLHEAD - To deploy a capillary string through a wellhead to a downhole safety valve, a control port and a retention port are drilled in an adapter between a casing hanger and a gate valve or elsewhere. The capillary string is connected to a first port of a capillary hanger and installed through the wellhead. The capillary hanger is landed on a tubing hanger, and a side port on the capillary hanger communicates with the control port. Because the side port's location may not align with the control port, operators may need to measure how long the capillary hanger should be. A control line connects to the control port in the wellhead's side to communicate with the capillary line, and a retention rod inserts in the retention port to support the capillary hanger. | 08-28-2014 |
20150114626 | Object Launching System for Well - An object launching apparatus for a well has a housing, a flow mandrel, and a cage. The flow mandrel is disposed in the housing's internal chamber, and a flow passage in the mandrel communicates flow from the housing's inlet to the mandrel's flow port, which in turn communicates with the housing's outlet. The cage is disposed in the internal chamber and defines pockets for holding the objects. A motor and shaft move the cage in the housing relative to the mandrel's flow port so the cage's pockets can be selectively positioned in communication between the mandrel's flow port and the housing's outlet. This allows any of the object(s) held in the positioned pocket to be launched into the flow to the well. Preferably, the motor rotates the shaft so the cage can ride linearly along the shaft's thread and the cage can rotate through a cammed engagement with the housing. | 04-30-2015 |