Patent application number | Description | Published |
20090229870 | BLOCK COPOLYMERIZED POLYIMIDE INK COMPOSITION FOR PRINTING - The object is to provide a polyimide ink composition having good printing properties and good continuous printing properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low modulus of elasticity, flexibility, resistance to warping, chemical resistance, adhesiveness with substrates, and plating resistance. This object is accomplished by a polyimide ink composition for printing, comprising a mixed solvent containing an benzoic acid ester solvent and a glyme solvent, and a polyimide soluble in the mixed solvent; wherein the polyimide is obtained by polycondensing a polyimide oligomer with a tetracarboxylic dianhydride component(s) and/or a diamine component(s) having no siloxane bond in molecular skeleton thereof, the polyimide oligomer being prepared by polycondensing a tetracarboxylic dianhydride component(s) and a diamine component(s) having siloxane bonds in molecular skeleton thereof in the presence of a base catalyst(s), or a mixed catalyst including a lactone(s) and/or an acidic compound(s) and a base(s); the content of the diamine component(s) having siloxane bonds based on the total diamine components being 15 to 85% by weight. | 09-17-2009 |
20100167022 | COMPOSITION, COATED FILM FORMED OF THE COMPOSITION, LAYERED PRODUCT CONTAINING THE COATED FILM, AND ELECTRONIC DEVICE INCORPORATING THE LAYERED PRODUCT - [Object] To provide a composition that has good viscosity stability and flowability at the time of processing, good shape retention after the processing, and good drying property in a temperature range of not degrading the conductor layer at the time of drying and that enables a coated film excellent in strength of adhesion with metal·polyimide, flame resistance, heat resistance, flexibility, mechanical properties, and chemical resistance to obtained after being dried. | 07-01-2010 |
20110111351 | Photosensitive Ink Composition for Screen Printing and Method of Forming Positive Relief Pattern with Use Thereof - Disclosed is a photosensitive ink which can form a coated film that is excellent in insulation properties, heat resistance, low warping, low elasticity and adhesion with the substrate, when used as an ink for screen printing, and with which clogging of the screen, bleeding, blur, chipping and the like are unlikely to occur even when the screen printing is repeatedly carried out, so that which has an excellent ease of handling in printing. The ink composition comprises 100 parts by weight of an organic solvent-soluble polyimide block copolymer(s), and 1 to 100 parts by weight of a photoacid generator(s). The polyimide block copolymer(s) and the photoacid generator(s) are dissolved in an organic solvent. The polyimide block copolymer(s) contain(s) in its molecular skeleton a diamine having a siloxane bond, and an aromatic diamine having a hydroxyl group(s) and/or carboxyl group(s) at ortho-position with respect to an amino group. | 05-12-2011 |
20110127077 | BLOCK COPOLYMERIZED POLYIMIDE INK COMPOSITION FOR PRINTING - The object is to provide a polyimide ink composition having good printing properties and good continuous priming properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low modulus of elasticity, flexibility, resistance to warping, chemical resistance, adhesiveness with substrates, and plating resistance. This object is accomplished by a polyimide ink composition for printing, comprising a mixed solvent containing an benzoic acid ester solvent and a glyme solvent, and a polyimide soluble in the mixed solvent; wherein the polyimide is obtained by polycondensing a polyimide oligomer with a tetracarboxylic dianhydride component(s) and/or a diamine component(s) having no siloxane bond in molecular skeleton thereof, the polyimide oligomer being prepared by polycondensing a tetracarboxylic dianhydride component(s) and a diamine component(s) having siloxane bonds in molecular skeleton thereof in the presence of a base catalyst(s), or a mixed catalyst including a lactone(s) and/or an acidic compound(s) and a base(s); the content of the diamine component(s) having siloxane bonds based on the total diamine components being 15 to 85% by weight. | 06-02-2011 |
20110213075 | POLYIMIDE RESIN COMPOSITION FOR SEMICONDUCTOR DEVICES, METHOD OF FORMING FILM IN SEMICONDUCTOR DEVICES USING THE SAME AND SEMICONDUCTOR DEVICES - Disclosed is a polyimide composition for semiconductor devices, which has a rheological characteristics suited for screen printing and dispense coating, which has an improved wetting property with various coating bases, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a desired area. A method of forming a film in a semiconductor and semiconductors having the film formed by this method as an insulation film, protective film or the like are also disclosed. The composition for semiconductor devices contains a mixed solvent of a first organic solvent (A) and a second organic solvent (B); and a polyimide resin having at least one group selected from the group consisting of alkyl groups and perfluoroalkyl groups in recurring units, and having thixotropic property, the polyimide resin being dissolved in the mixed solvent. | 09-01-2011 |
20120065310 | COMPOSITION, COATED FILM FORMED OF THE COMPOSITION, LAYERED PRODUCT CONTAINING THE COATED FILM, AND ELECTRONIC DEVICE INCORPORATING THE LAYERED PRODUCT - An object is to provide a composition that has good viscosity stability and flowability at the time of processing, good shape retention after the processing, and good drying property in a temperature range of not degrading the conductor layer at the time of drying and that enables a coated film excellent in strength of adhesion with metal•polyimide, flame resistance, heat resistance, flexibility, mechanical properties, and chemical resistance to obtained after being dried. To meet this object, a composition is prepared containing (A) polyimide and (B) mixed solvent of two kinds or more, and the solubility parameter of the mixed solvent of two kinds or more ranges from 9 to 14. | 03-15-2012 |
20130233381 | POLYIMIDE RESIN COMPOSITION FOR USE IN FORMING INSULATION FILM IN PHOTOVOLTAIC CELL AND METHOD OF FORMING INSULATION FILM IN PHOTOVOLTAIC CELL USED THEREWITH - Disclosed is a polyimide resin composition for forming an insulation layer in a solar cell, which has an optimal rheological characteristics for screen printing and the like, which has an improved wetting property with various coating substrates, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a predetermined area. A method of forming an insulation layer in a solar cell and a solar cell having the insulation layer formed by this method are also disclosed. The polyimide resin composition for forming an insulation layer in a solar cell contains a mixed solvent of a first organic solvent (A) and a second organic solvent (B); and a heat-resistant polyimide resin having at least one group selected from the group consisting of alkyl groups and perfluoroalkyl groups in recurring units, and having thixotropic property, the polyimide resin being dissolved in the mixed solvent. | 09-12-2013 |
20130310482 | POLYIMIDE RESIN COMPOSITION FOR USE IN FORMING REVERSE REFLECTING LAYER IN PHOTOVOLTAIC CELL AND METHOD OF FORMING REVERSE REFLECTING LAYER IN PHOTOVOLTAIC CELL USED THEREWITH - Disclosed are a method of forming a back reflection layer in a solar cell, a composition used therefor, and a solar cell having a back reflection layer formed by the method, which layer has superior heat-resistance and various types of durabilities, and can contribute to improving the conversion rate of solar cells and reliability during long-term use, and which method can form a back reflection layer in a solar cell easily and at low cost. The polyimide resin composition for use in forming a back reflection layer in a solar cell includes an organic solvent, a polyimide resin dissolved in the organic solvent, and light-reflecting particles dispersed in the organic solvent. | 11-21-2013 |