Patent application number | Description | Published |
20080197457 | SILICON WAFER AND ITS MANUFACTURING METHOD - A silicon wafer which achieves a gettering effect without occurrence of slip dislocations is provided, and the silicon wafer is subject to heat treatment after slicing from a silicon monocrystal ingot so that a layer which has zero light scattering defects according to the 90° light scattering method is formed in a region at a depth from the wafer surface of 25 μm or more but less than 100 μm, and a layer which has a light scattering defect density of 1×10 | 08-21-2008 |
20080233717 | SOI WAFER AND MANUFACTURING METHOD THEREOF - An SOI wafer which does not generate slip dislocation even if laser annealing is performed for no more than 0.1 seconds at a maximum temperature of 1200° C. or more is provided. | 09-25-2008 |
20080286565 | Method For Manufacturing Epitaxial wafer - A method for manufacturing an epitaxial wafer includes: a step of pulling a single crystal from a boron-doped silicon melt in a chamber based on a Czochralski process; and a step of forming an epitaxial layer on a surface of a silicon wafer sliced from the single crystal. The single crystal is allowed to grow while passed through a temperature region of 800 to 600° C. in the chamber in 250 to 180 minutes during the pulling step. The grown single crystal has an oxygen concentration of 10×10 | 11-20-2008 |
20080292523 | SILICON SINGLE CRYSTAL WAFER AND THE PRODUCTION METHOD - A production method of a silicon single crystal wafer capable of effectively bringing out a gettering effect also in a thin film device is provided: wherein a thermal treatment with rapid heating up and down is performed for 10 seconds or shorter on a silicon single crystal wafer obtained by processing a single crystal grown by the Czochralski method and having an initial interstitial oxygen density is 1.4×10 | 11-27-2008 |
20090261301 | Method for growing silicon single crystal, and silicon wafer - A silicon single crystal is produced by the CZ process by setting a hydrogen partial pressure in an inert atmosphere within a growing apparatus to 40 Pa or more but 400 Pa or less, and by growing a trunk part of the single crystal as a defect-free area free from the Grown-in defects. Therefore, a wafer the whole surface of which is composed of the defect-free area free from the Grown-in defects and which can sufficiently and uniformly form BMD can be easily produced. Such a wafer can be extensively used, since it can significantly reduce generation of characteristic defectives of integrated circuits to be formed thereon and contribute for improving the production yield as a substrate responding to the demand for further miniaturization and higher density of the circuits. | 10-22-2009 |
20090293799 | Method for growing silicon single crystal, and silicon wafer - A silicon single crystal is produced by the CZ process by setting a hydrogen partial pressure in an inert atmosphere within a growing apparatus to 40 Pa or more but 400 Pa or less, and by growing a trunk part of the single crystal as a defect-free area free from the Grown-in defects. Therefore, a wafer the whole surface of which is composed of the defect-free area free from the Grown-in defects and which can sufficiently and uniformly form BMD can be easily produced. Such a wafer can be extensively used, since it can significantly reduce generation of characteristic defectives of integrated circuits to be formed thereon and contribute for improving the production yield as a substrate responding to the demand for further miniaturization and higher density of the circuits. | 12-03-2009 |
20090302432 | SILICON EPITAXIAL WAFER AND THE PRODUCTION METHOD THEREOF - A silicon epitaxial wafer obtained by growing a silicon epitaxial layer on a surface of a silicon wafer having a diameter of at least 300 mm produced by slicing a silicon single crystal ingot doped with boron and germanium grown by the Czochralski method, wherein boron is doped to be at a concentration of 8.5×10 | 12-10-2009 |
20090305518 | SOI WAFER AND MANUFACTURING METHOD THEREOF - An SOI wafer which does not generate slip dislocation even if laser annealing is performed for no more than 0.1 seconds at a maximum temperature of 1200° C. or more is provided. | 12-10-2009 |
20100025909 | Method and jig for holding silicon wafer - Provided are a method and a jig for holding a silicon wafer, which are applied to the production of the silicon wafer having {110} or {100} plane as its principal surface, in which the silicon wafer is held while a silicon wafer holding positions are properly defined at wafer edge regions relative to the reference direction as being from the center of the silicon wafer toward <110> in crystal orientation in parallel to the wafer surface. In handling the silicon wafer, generation of contact scratches is suppressed as little as possible, and a fracture which is caused by development of the crack initiating from easily generated contact scratches can be prevented in the silicon wafer, particularly in the silicon wafer having {110} plane as its principal surface. | 02-04-2010 |
20100127354 | SILICON SINGLE CRYSTAL AND METHOD FOR GROWING THEREOF, AND SILICON WAFER AND METHOD FOR MANUFACTURING THEREOF - A method for growing a silicon single crystal having a hydrogen defect density of equal to or less than 0.003 pieces/cm | 05-27-2010 |
20100151692 | EPITAXIAL WAFER AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an epitaxial wafer, including a silicon substrate having a surface sliced from single-crystalline silicon and a silicon epitaxial layer deposited on the surface of the silicon substrate, includes an oxygen concentration controlling heat treatment process in which a heat treatment of the epitaxial layer is performed under a non-oxidizing atmosphere after the epitaxial growth such that an oxygen concentration of the surface of the silicon epitaxial layer is set to 1.0×10 | 06-17-2010 |
20100178753 | SILICON WAFER AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a silicon wafer includes a step of annealing a silicon wafer which is sliced from a silicon single crystal ingot, thereby forming a DZ layer in a first surface and in a second surface of the silicon wafer and a step of removing either a portion of the DZ layer in the first surface or a portion of the DZ layer in the second surface. | 07-15-2010 |
20100288184 | SILICON SINGLE CRYSTAL WAFER FOR IGBT AND METHOD FOR MANUFACTURING SILICON SINGLE CRYSTAL WAFER FOR IGBT - A method for manufacturing a silicon single crystal wafer for IGBT, including introducing a hydrogen atom-containing substance into an atmospheric gas at a hydrogen gas equivalent partial pressure of 40 to 400 Pa, and growing a single crystal having an interstitial oxygen concentration of 8.5×10 | 11-18-2010 |
20110052923 | METHOD OF PRODUCING EPITAXIAL WAFER AS WELL AS EPITAXIAL WAFER - An epitaxial wafer is produced by a method comprising steps of growing a silicon single crystal ingot having a given oxygen concentration through Czochralski method, cutting out a wafer from the silicon single crystal ingot, subjecting the wafer to a heat treatment at a given temperature for a given time, and epitaxially growing the wafer. | 03-03-2011 |
20120012983 | SILICON WAFER AND METHOD OF MANUFACTURING SAME - This method of manufacturing a silicon wafer has a step of preparing a wafer, in which a surface of the silicon wafer is surface-treated, a step of setting stress, in which the stress S (MPa) subjected on the wafer is set, a step of inspecting, in which a defect on a surface of the wafer is inspected, and a step of determining, in which the wafer is evaluated if the wafer satisfies a criterion. In this method, it is possible to manufacture a wafer with cracking resistance even if it is subjected to a millisecond annealing by the FLA annealing treatment. | 01-19-2012 |
20120043644 | SILICON WAFER AND MANUFACTURING METHOD - A method of manufacturing a silicon wafer provides a silicon wafer which can reduce the precipitation of oxygen to prevent a wafer deformation from being generated and can prevent a slip extension due to boat scratches and transfer scratches serving as a reason for a decrease in wafer strength, even when the wafer is provided to a rapid temperature-rising-and-falling thermal treatment process. | 02-23-2012 |
20120306052 | SILICON WAFER AND METHOD OF MANUFACTURING THEREOF, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - An object of the present invention is to provide an epitaxial wafer on which dislocation is preventable even when a LSA treatment is performed in device processes. An epitaxial wafer according to the present invention includes a wafer | 12-06-2012 |
20130140752 | METHOD AND JIG FOR HOLDING SILICON WAFER - Provided are a method and a jig for holding a silicon wafer, which are applied to the production of the silicon wafer having {110} or {100} plane as its principal surface, in which the silicon wafer is held while a silicon wafer holding positions are properly defined at wafer edge regions relative to the reference direction as being from the center of the silicon wafer toward <110> in crystal orientation in parallel to the wafer surface. In handling the silicon wafer, generation of contact scratches is suppressed as little as possible, and a fracture which is caused by development of the crack initiating from easily generated contact scratches can be prevented in the silicon wafer, particularly in the silicon wafer having {110} plane as its principal surface. | 06-06-2013 |
20150054134 | SILICON WAFER AND MANUFACTURING METHOD THEREOF - A method of manufacturing a silicon wafer provides a silicon wafer which can reduce the precipitation of oxygen to prevent a wafer deformation from being generated and can prevent a slip extension due to boat scratches and transfer scratches serving as a reason for a decrease in wafer strength, even when the wafer is provided to a rapid temperature-rising-and-falling thermal treatment process. | 02-26-2015 |